High-pressure chamber for tearing gold and removing photoresist

Abstract

The utility model discloses a high-pressure chamber for tearing gold and removing photoresist in the field of semiconductor processing equipment, and aims to solve the problems of mist overflow, air duct blockage, low metal recovery rate and the like in the existing gold tearing and photoresist removing process. The high-pressure chamber is based on a bottom plate and is provided with a fixed splash-proof chamber, the outer side of the splash-proof chamber is provided with a plurality of exhaust outlets communicated with the inside, the splash-proof chamber is communicated with the bottom of the bottom plate through exhaust pipes, and a water outlet and a filter screen are arranged in the chamber. The splash-proof chamber is circumferentially connected with a liftable lifting splash-proof ring, and the inner wall of the splash-proof chamber is provided with an inner splash-proof ring for shielding the exhaust outlet to form an interlayer. A cleaning disc used for positioning and placing silicon wafers is arranged in the cavity and is controlled by a driving assembly at the bottom of the bottom plate to rotate. In the process, fog enters the interlayer from the lower end of the inner splash-proof ring and then leads to the exhaust outlet, the exhaust flow field is optimized, fog accumulation is avoided, the exhaust efficiency is improved, meanwhile, metal chippings are intercepted, the air duct blocking risk is reduced, and the metal recovery rate is effectively increased.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically a high-pressure chamber for removing gold and adhesive. Background Technology

[0002] In the current booming semiconductor industry, silicon wafers, as the core substrate material for chip manufacturing, play an irreplaceable and crucial role. After undergoing multiple complex and precise front-end processing steps, a metal layer and photoresist are formed on the surface of the silicon wafer. These metal layers and photoresist need to be precisely and efficiently removed in subsequent chip manufacturing processes to enable critical operations such as etching circuit patterns and interconnection, thereby realizing the construction of chip functions. The gold-removal and photoresist removal process is an important step developed to meet this need, and its process effect directly affects chip performance, yield, and the efficiency and cost of the entire semiconductor production line.

[0003] However, a series of problems exist in the actual application of the gold stripping and adhesive removal process. The mist generated during the process is prone to uncontrolled overflow, not only polluting the clean production environment but also potentially damaging other precision equipment and affecting the stable operation of the production line. Simultaneously, the internal air ducts of the equipment are often blocked by the accumulation of metal scraps and other impurities, leading to poor ventilation and making it difficult to maintain stable process conditions. Furthermore, the low metal recovery rate results in a significant waste of metal resources, increases production costs, and runs counter to the current green and sustainable industrial development philosophy. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a high-pressure chamber for gold stripping and adhesive removal, which can effectively solve the technical problems of mist overflow, air duct blockage and low metal recovery rate in the existing stripping chamber in the gold stripping and adhesive removal process.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A high-pressure chamber for removing gold and adhesive includes a base plate, on which a fixed splash-proof chamber is provided. Several exhaust vents communicating with the interior are opened on the outside of the splash-proof chamber. The exhaust vents are connected to the bottom of the base plate through exhaust pipes. A drain outlet located on the base plate is also provided in the splash-proof chamber, and a filter screen for filtration is installed in the drain outlet.

[0007] The splash-proof chamber is circumferentially connected to a liftable splash-proof ring, and the inner wall of the liftable splash-proof ring is provided with an inner splash-proof ring extending towards the center to block the exhaust vent.

[0008] The splash-proof chamber is equipped with a cleaning tray for positioning and placing silicon wafers. The cleaning tray is located inside the inner splash-proof ring, and its rotation is controlled by a drive assembly installed at the bottom of the base plate.

[0009] The base plate is provided with a resist remover cleaning assembly, a cleaning fluid cleaning assembly, and a cleaning fluid cleaning assembly for cleaning silicon wafers. The resist remover cleaning assembly, the cleaning fluid cleaning assembly, and the cleaning fluid cleaning assembly are circumferentially arranged around the periphery of the splash-proof chamber.

[0010] Furthermore, the lifting splash guard slides close to the inner wall of the splash guard chamber, and a lifting control component for controlling the movement of the lifting splash guard is provided on the base plate.

[0011] Furthermore, the lifting control assembly includes a guide rod, a connecting block, and a lifting cylinder inserted into the base plate. One end of the guide rod is fixed to the outside of the lifting splash guard via the connecting block, and the other end of the guide rod is connected to the output end of the lifting cylinder.

[0012] Furthermore, the drive assembly includes a spindle, a spindle motor, and a timing belt. One end of the spindle is coaxially connected to the bottom of the cleaning tray, and the other end of the spindle extends downward through the base plate and is linked to the output end of the spindle motor via the timing belt.

[0013] Furthermore, the output ends of the main spindle and the main spindle motor are respectively equipped with synchronous pulleys, and the synchronous belt is closed-loop sleeved on the outside of the two synchronous pulleys.

[0014] Furthermore, the adhesive removal cleaning assembly includes an adhesive removal cleaning nozzle and an adhesive removal cleaning swing arm. One end of the adhesive removal cleaning swing arm is connected to the adhesive removal cleaning nozzle, and the other end of the adhesive removal cleaning swing arm is connected to the base plate and is controlled to rotate horizontally by a first rotary motor installed at the bottom of the base plate.

[0015] Furthermore, the cleaning fluid cleaning assembly includes a cleaning fluid cleaning nozzle and a cleaning fluid cleaning swing arm. One end of the cleaning fluid cleaning swing arm is connected to the cleaning fluid cleaning nozzle, and the other end of the cleaning fluid cleaning swing arm is connected to the base plate and is controlled to rotate horizontally by a second rotary motor installed at the bottom of the base plate.

[0016] Furthermore, a detection lens for detecting silicon wafers is provided above the cleaning tray, and the detection lens is fixed by a support rod.

[0017] Furthermore, the outer side of the lifting splash guard is provided with a viewing window that allows visibility into the interior, and one side of the splash guard chamber is open, with a removable baffle installed at the opening.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] This invention incorporates an inner splash guard ring that blocks the exhaust vent on the splash guard chamber, creating a sandwich layer between the two. During the process, mist enters the sandwich layer from the lower end of the inner splash guard ring and then flows orderly to the exhaust vent, optimizing the exhaust flow field and ensuring smoother mist discharge. This prevents mist accumulation within the chamber and improves overall exhaust efficiency. During filtration, it effectively intercepts metal debris, making it difficult for it to enter the air duct, reducing the risk of duct blockage and effectively improving metal recovery rate. Attached Figure Description

[0020] Figure 1 This is a front view schematic diagram of the overall structure of this utility model embodiment;

[0021] Figure 2 This is a rear view of the overall structure of an embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the overall structure from the bottom direction of an embodiment of the present utility model;

[0023] Figure 4 This is a top view of the overall structure of an embodiment of the present utility model;

[0024] Figure 5 This is a schematic diagram of the adhesive removal cleaning component according to an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the cleaning fluid cleaning component structure according to an embodiment of the present invention;

[0026] Numbering on the map:

[0027] 1-Base plate, 2-Splash-proof chamber, 3-Exhaust pipe, 4-Filter screen, 5-Lifting splash-proof ring, 6-Cleaning tray, 7-Drive assembly, 8-Adhesive removal cleaning assembly, 9-Baffle, 10-Cleaning fluid cleaning assembly, 11-Lifting control assembly, 12-Detection lens, 13-Support rod, 14-Viewing window;

[0028] 101 - Drainage outlet;

[0029] 201 - Exhaust vent;

[0030] 501 - Inner splash guard ring;

[0031] 701-Main spindle, 702-Main spindle motor, 703-Synchronous belt, 704-Synchronous pulley;

[0032] 801 - Adhesive removal cleaning nozzle, 802 - Adhesive removal cleaning swing arm, 803 - First rotary motor;

[0033] 901 - Cleaning fluid tubing; 902 - Tubing mounting bracket;

[0034] 1001-Cleaning fluid cleaning nozzle, 1002-Cleaning fluid cleaning swing arm, 1003-Second rotary motor;

[0035] 1101-Guide rod, 1102-Connecting block, 1103-Lifting cylinder. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] like Figure 1-6 As shown, this utility model provides a high-pressure chamber for gold stripping and adhesive removal, mainly to solve the problems of mist overflow, air duct blockage, and low metal recovery rate that occur in the existing stripping chamber in the gold stripping and adhesive removal process. The high-pressure chamber is installed on the base plate 1, and its structure mainly includes a splash-proof chamber 2, a lifting splash-proof ring 5, a cleaning plate 6, and related cleaning and purging components.

[0038] The splash-proof chamber 2 is fixed on the base plate 1, and two exhaust ports 201 are symmetrically opened on its outer side. The exhaust ports 201 are connected to the bottom of the base plate 1 through the exhaust pipe 3, and then connected to the plant exhaust system to discharge the mist and other air in the chamber.

[0039] The splash-proof chamber 2 is equipped with a drain outlet 101 located on the base plate 1, and a filter screen 4 for filtration is installed on the drain outlet 101. The filter screen 4 is made of metal filter screen, and two are installed. The filter screen 4 has a handle in the middle for easy disassembly and assembly for regular cleaning and metal recovery. The filter screen 4 is mainly used to concentrate the filtration solution and collect the metal membrane layer after the membrane layer is peeled off. At the same time, as a primary filtration device, it can prevent metal debris from entering the air duct to a certain extent, reduce the risk of air duct blockage, and increase the metal recovery rate.

[0040] The splashproof chamber 2 has an opening on one side, and a removable baffle 15 is installed at the opening. The baffle 15 serves as the chamber inlet baffle and the outlet for the arm to enter and exit the chamber. It is only opened when the wafer is being entered or exited, and remains closed in other states to prevent fog and metal shavings from spilling out.

[0041] The lifting splash guard 5 is circumferentially connected to the splash guard chamber 2 and slides tightly against the inner wall of the splash guard chamber 2. An inner splash guard 501 extending towards the center is provided on the inner wall of the lifting splash guard 5, which is used to block the exhaust vent 201. An annular gap is left between the inner splash guard 501 and the splash guard chamber 2, allowing mist to enter the annular gap through the lower end of the inner splash guard 501 and then flow to the exhaust vent 201, thus optimizing the exhaust airflow.

[0042] A lifting control assembly 11 for controlling the movement of the lifting splash guard 5 is provided on the base plate 1. The lifting control assembly 11 includes a guide rod 1101, a connecting block 1102, and a lifting cylinder 1103 inserted into the base plate 1. One end of the guide rod 1101 is fixed to the outside of the lifting splash guard 5 through the connecting block 1102, and the other end of the guide rod 1101 is connected to the output end of the lifting cylinder 1103. The lifting cylinder 1103 drives the lifting splash guard 5 to move up and down by extending and retracting the guide rod 1101.

[0043] The lifting splash guard 5 is equipped with a glass viewing window 14, through which the operator can conveniently observe the cleaning status inside the chamber.

[0044] The cleaning tray 6 is located inside the splash-proof chamber 2 for positioning and placing silicon wafers, and is located inside the inner splash-proof ring 501. The cleaning tray 6 is controlled to rotate by the drive assembly 7 installed at the bottom of the base plate 1.

[0045] The drive assembly 7 includes a spindle 701, a spindle motor 702, and a timing belt 703. One end of the spindle 701 is coaxially connected to the bottom of the cleaning tray 6, and the other end of the spindle 701 extends downward through the base plate 1 and is linked to the output end of the spindle motor 702 via the timing belt 703.

[0046] Specifically, the output ends of the spindle 701 and the spindle motor 702 are respectively equipped with synchronous pulleys 704, and the synchronous belt 703 is closed-loop sleeved on the outside of the two synchronous pulleys 704. The spindle motor 702 drives the spindle 701 to rotate through the synchronous belt 703 and the synchronous pulleys 704, thereby driving the cleaning disc 6 to rotate, so that the silicon wafer can be cleaned evenly.

[0047] The base plate 1 is provided with a resist remover cleaning assembly 8 and a cleaning fluid cleaning assembly 9 for cleaning silicon wafers. The resist remover cleaning assembly 8 and the cleaning fluid cleaning assembly 9 are located on the periphery of the splash-proof chamber 2.

[0048] The adhesive removal cleaning assembly 8 includes an adhesive removal cleaning nozzle 801 and an adhesive removal cleaning swing arm 802. One end of the adhesive removal cleaning swing arm 802 is connected to the adhesive removal cleaning nozzle 801, and the other end is connected to the base plate 1. It is controlled to rotate horizontally by a first rotary motor 803 installed at the bottom of the base plate 1 so as to perform comprehensive two-fluid cleaning on the silicon wafer.

[0049] The cleaning fluid cleaning assembly 10 includes a cleaning fluid cleaning nozzle 1001 and a cleaning fluid cleaning swing arm 1002. One end of the cleaning fluid cleaning swing arm 1002 is connected to the cleaning fluid cleaning nozzle 1001, and the other end is connected to the base plate 1. It is controlled to rotate horizontally by a second rotary motor 1003 installed at the bottom of the base plate 1, so as to purge the cleaned silicon wafer with nitrogen gas to remove residual moisture on the surface.

[0050] Above the cleaning tray 6 is a detection lens 12 for detecting silicon wafers. The detection lens 12 is fixed by a support rod 13 and can detect the status of the silicon wafers in real time.

[0051] During the gold-removing and adhesive-removing process, the silicon wafer is first placed on the cleaning tray 6, which is then rotated by the drive assembly 7. Next, the adhesive-removing cleaning assembly 8 and the cleaning fluid cleaning assembly 10 sequentially clean and purge the silicon wafer. During the cleaning process, the lifting anti-splash ring 5 can be raised or lowered as needed via the lifting control assembly 11 to adjust the degree of obstruction of the inner anti-splash ring 501 to the exhaust port 201, optimizing the exhaust airflow. The mist generated during cleaning and purging enters the annular gap between the inner anti-splash ring 501 and the anti-splash chamber 2 through the lower end of the inner anti-splash ring 501, and is then discharged to the plant exhaust system through the exhaust port 201 and exhaust pipe 3. Simultaneously, the peeled film and chemicals enter the filter screen 4 through the drain port 101 for filtration. The metal film is collected, and the chemicals are discharged, thus achieving the gold-removing and adhesive-removing process on the silicon wafer and effectively solving problems such as mist overflow, air duct blockage, and low metal recovery rate.

[0052] Compared to traditional technologies, this solution incorporates an inner splash guard 501 that blocks the exhaust vent 201 on the splash guard chamber 2, creating a sandwich layer between them. During the process, mist enters the sandwich layer from the lower end of the inner splash guard 501 and then flows orderly to the exhaust vent 201, optimizing the exhaust flow field and ensuring smoother mist discharge. This prevents mist accumulation within the chamber and improves overall exhaust efficiency. During filtration, it effectively intercepts metal debris, making it difficult for it to enter the air duct, reducing the risk of duct blockage and significantly improving metal recovery rate.

[0053] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-pressure chamber for removing gold plating and adhesive, comprising a base plate, characterized in that: The base plate is provided with a fixed splash-proof chamber. Several exhaust vents communicating with the interior are opened on the outside of the splash-proof chamber. The exhaust vents are connected to the bottom of the base plate through exhaust pipes. The splash-proof chamber is also provided with a drain outlet located on the base plate. The drain outlet is equipped with a filter screen for filtration. The splash-proof chamber is circumferentially connected to a liftable splash-proof ring, and the inner wall of the liftable splash-proof ring is provided with an inner splash-proof ring extending towards the center to block the exhaust vent. The splash-proof chamber is equipped with a cleaning tray for positioning and placing silicon wafers. The cleaning tray is located inside the inner splash-proof ring, and the cleaning tray is controlled to rotate by a drive assembly installed at the bottom of the base plate. The base plate is equipped with a resist remover cleaning assembly and a cleaning fluid cleaning assembly for cleaning silicon wafers, which are located around the splash-proof chamber.

2. The high-pressure chamber for removing gold plating and adhesive according to claim 1, characterized in that: The lifting splash guard slides close to the inner wall of the splash guard chamber, and a lifting control component for controlling the movement of the lifting splash guard is provided on the base plate.

3. A high-pressure chamber for removing gold plating and adhesive according to claim 2, characterized in that: The lifting control assembly includes a guide rod, a connecting block, and a lifting cylinder inserted into the base plate. One end of the guide rod is fixed to the outside of the lifting splash guard by the connecting block, and the other end of the guide rod is connected to the output end of the lifting cylinder.

4. A high-pressure chamber for removing gold plating and adhesive according to claim 1, characterized in that: The drive assembly includes a spindle, a spindle motor, and a timing belt. One end of the spindle is coaxially connected to the bottom of the cleaning tray, and the other end of the spindle extends downward through the base plate and is linked to the output end of the spindle motor via the timing belt.

5. A high-pressure chamber for removing gold plating and adhesive according to claim 4, characterized in that: The output ends of the main spindle and the main spindle motor are respectively equipped with synchronous pulleys, and the synchronous belt is closed-loop sleeved on the outside of the two synchronous pulleys.

6. A high-pressure chamber for removing gold plating and adhesive according to claim 1, characterized in that: The adhesive removal cleaning assembly includes an adhesive removal cleaning nozzle and an adhesive removal cleaning swing arm. One end of the adhesive removal cleaning swing arm is connected to the adhesive removal cleaning nozzle, and the other end of the adhesive removal cleaning swing arm is connected to the base plate and is controlled to rotate horizontally by a first rotary motor installed at the bottom of the base plate.

7. A high-pressure chamber for removing gold plating and adhesive according to claim 1, characterized in that: The cleaning fluid cleaning assembly includes a cleaning fluid nozzle and a cleaning fluid swing arm. One end of the cleaning fluid swing arm is connected to the cleaning fluid nozzle, and the other end of the cleaning fluid swing arm is connected to the base plate and is controlled to rotate horizontally by a second rotary motor installed at the bottom of the base plate.

8. A high-pressure chamber for removing gold plating and adhesive according to claim 1, characterized in that: A detection lens for inspecting silicon wafers is installed above the cleaning tray, and the detection lens is fixed by a support rod.

9. A high-pressure chamber for removing gold plating and adhesive according to any one of claims 1-8, characterized in that: The outer side of the lifting splash guard is provided with a viewing window that allows visibility into the interior. The splash guard chamber has an opening on one side, and a removable baffle is installed at the opening.

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