Compression structure for MOS packaging production
By designing a MOS package clamping structure that adapts to different pin structures, the problem of easy damage to inverted L-shaped pins during the packaging process was solved, achieving efficient pin protection and improved production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-21
- Publication Date
- 2026-04-07
AI Technical Summary
In the existing MOS packaging process, the inverted L-shaped leads are easily deformed and damaged by pressure during compression packaging, resulting in a decrease in quality and performance. Furthermore, the poor compatibility of different lead structures increases production costs and reduces efficiency.
A clamping structure including a base plate, a housing, a support plate, a cylinder, an adjustment component, and a limiting component is designed. By lifting the second support plate and linking it with the limiting component, different pin structures can be adapted to ensure that the pins are not squeezed during the packaging process. The linkage between the electric telescopic rod and the adjustment component is adopted to achieve adaptation to different MOS pin types.
It enables flexible adaptation to different pin structures, avoids pin damage, improves production efficiency and device usability, and reduces hardware module replacement costs.
Smart Images
Figure CN224098108U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of MOS packaging production technology, and specifically relates to a clamping structure for MOS packaging production. Background Technology
[0002] MOS packaging refers to encapsulating a MOSFET (metal-oxide-semiconductor field-effect transistor) chip in a housing for connection with other electronic components. This housing not only supports and protects the chip but also provides electrical connection and isolation, ensuring that the MOSFET device can form a complete circuit with other components.
[0003] Existing MOSFETs require packaging during production, which involves clamping the MOSFET to the PCB board. Current technologies often suffer from poor compatibility in the clamping structures used for packaging MOSFETs with different pin configurations. While existing clamping structures can adapt well to MOSFET pins that are parallel to the mounting plate, they are insufficient when the MOSFET package has inverted L-shaped pins. During the clamping process, the inverted L-shaped pins are easily deformed and damaged by pressure, affecting the MOSFET's quality and performance, thus increasing production costs and reducing production efficiency. Utility Model Content
[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a clamping structure for MOS packaging production.
[0005] To achieve the above objectives, this utility model provides a clamping structure for MOS packaging production, including a base plate, a housing connected to the upper end of the base plate, a first support plate connected to the upper end of the housing, cylinders connected to both sides of the upper end of the base plate, pressure plates connected to the upper ends of the two cylinders, an adjustment component connected to the middle of one side of the inner wall of the housing, a second support plate rotatably connected to the upper end of the adjustment component, limit components connected to both sides of the lower end of the second support plate, electric telescopic rods connected to both sides of the housing corresponding to the two limit components, and stops connected to the lower end of the first support plate corresponding to the two limit components.
[0006] In the above technical solution, the adjustment component further includes a motor, the output end of which is connected to a lead screw, and two movable blocks are slidably connected to both sides of the outer wall of the lead screw. Push rods are rotatably connected to the upper ends of the two movable blocks, and the upper ends of the two push rods are rotatably connected to the lower ends of the second support plate.
[0007] In the above technical solution, furthermore, a sliding rod is connected to the two sides of the inner wall of the box corresponding to the lower part of the lead screw, and the two moving blocks are slidably connected on both sides of the outer wall of the sliding rod.
[0008] In the above technical solution, an opening is further provided at the upper end of the first support plate corresponding to the second support plate, and the second support plate is located inside the opening.
[0009] In the above technical solution, the limiting component further includes a support plate, a tray is connected to the lower end of the support plate, a support block is connected to the upper end of the tray, and limiting holes are evenly opened on one side of the support block.
[0010] In the above technical solution, one end of each of the two electric telescopic rods extends into the interior of the box, and one end of each of the two electric telescopic rods is connected to a movable plate. A first locking rod is evenly connected to the lower part of one side of the movable plate.
[0011] In the above technical solution, one end of each of the first locking rods is inserted into the corresponding limiting holes, and a second locking rod is connected to one side of the moving plate above the first locking rod.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] The lifting mechanism of the second support plate allows for flexible switching between two working states, adapting to MOS devices with different pin structures. When the second support plate is lowered to be flush with the first support plate, a uniform rigid plane is formed, meeting the direct pressing requirements of conventional pins and avoiding pressure transmission losses caused by structural redundancy. When the second support plate is raised, the pins are suspended around the opening, and with the help of the double lever limiting mechanism, the pins are ensured not to be squeezed during the packaging process. This solves the compatibility problem of traditional structures with irregular pins, thus achieving the goal of adapting to different MOS pin types without replacing hardware modules, through the linkage of the electric telescopic rod and the adjustment component, reducing the investment cost of production line equipment.
[0014] By inserting the first locking rod into the limiting hole below the support block, the radial constraint of the hole-shaft fit eliminates the horizontal wobbling of the second support plate during parallel pin packaging, ensuring that the pressure is evenly transmitted through the first support plate and the pin force error is small. At the same time, the second locking rod is inserted into the limiting hole on the side of the support block, and combined with the lateral abutment of the stop block, a limiting structure is formed, so that the second support plate will not be displaced, avoiding damage to the pin due to contact with the edge of the first support plate caused by the support plate wobbling, thus improving the practical performance of the device. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure proposed in this utility model;
[0016] Figure 2 This is a schematic cross-sectional view of the overall structure proposed in this utility model;
[0017] Figure 3 This is a schematic diagram of the installation structure of the stop block proposed in this utility model;
[0018] Figure 4 This is a schematic diagram of the installation structure of the movable plate proposed in this utility model;
[0019] Figure 5 This is a schematic diagram of the installation structure of the limiting hole proposed in this utility model;
[0020] Figure 6 This is a schematic diagram of the installation structure of the support block proposed in this utility model.
[0021] In the diagram: 1. Base plate; 2. Box body; 3. First support plate; 4. Cylinder; 5. Motor; 6. Lead screw; 7. Moving block; 8. Push rod; 9. Second support plate; 10. Opening; 11. Support plate; 12. Support plate; 13. Support block; 14. Limiting hole; 15. Electric telescopic rod; 16. Moving plate; 17. First locking rod; 18. Second locking rod; 19. Stop block; 20. Pressure plate. Detailed Implementation
[0022] To better understand the above-mentioned objectives, features and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0023] like Figures 1-6 The diagram shows a clamping structure used in MOS package manufacturing.
[0024] Example 1
[0025] Includes a base plate 1, a box body 2 connected to the upper end of the base plate 1, a first support plate 3 connected to the upper end of the box body 2, cylinders 4 connected to both sides of the upper end of the base plate 1, pressure plates 20 connected to the upper ends of the two cylinders 4, an adjustment component connected to the middle of one side of the inner wall of the box body 2, a second support plate 9 rotatably connected to the upper end of the adjustment component, limit components connected to both sides of the lower end of the second support plate 9, electric telescopic rods 15 connected to both sides of the box body 2 corresponding to the two limit components, and stops 19 connected to the lower end of the first support plate 3 corresponding to the two limit components.
[0026] The housing 2 and the base plate 1 are rigidly connected by welding or bolting. The first support plate 3 is fixedly installed on the top of the housing 2, forming the main working platform. Cylinders 4 are symmetrically distributed on both sides of the base plate 1, and are connected to the pressure plate 20 via piston rods to achieve lifting function. The adjustment component adopts a precision transmission mechanism, which can accurately control the lifting height of the second support plate 9. The limiting component is linked with the second support plate 9, and multi-stage positioning is achieved through the electric telescopic rod 15. The stop block 19 is set below the first support plate 3 to limit the downward limit position of the second support plate 9.
[0027] Example 2
[0028] The adjustment assembly includes a motor 5, with a lead screw 6 connected to the output end of the motor 5. Moving blocks 7 are slidably connected to both sides of the outer wall of the lead screw 6. Push rods 8 are rotatably connected to the upper ends of the two moving blocks 7. The upper ends of the two push rods 8 are rotatably connected to the lower ends of the second support plate 9. Slide rods are connected to both sides of the inner wall of the box 2 corresponding to the area below the lead screw 6. The two moving blocks 7 are slidably connected to both sides of the outer wall of the slide rods. An opening 10 is opened at the upper end of the first support plate 3 corresponding to the second support plate 9. The second support plate 9 is located inside the opening 10.
[0029] Motor 5 is a servo motor, which, together with an encoder, achieves closed-loop control to ensure positioning accuracy. Lead screw 6 is a high-precision ball screw, which works with the ball nut inside the moving block 7 to achieve smooth transmission. Push rod 8 is a rigid connection structure that converts the linear motion of the moving block 7 into the vertical lifting and lowering of the second support plate 9. The guide rail uses a linear guide pair to effectively eliminate movement backlash. A sealing strip is provided at the edge of opening 10 to prevent foreign objects from entering the housing 2. A reasonable gap is maintained between the second support plate 9 and opening 10 to ensure smooth movement.
[0030] Example 3
[0031] The limiting component includes a support plate 11, a support plate 12 connected to one side of the lower end of the support plate 11, a support block 13 connected to one side of the upper end of the support plate 12, limiting holes 14 evenly opened on one side of the support block 13, two electric telescopic rods 15 extending through one end into the interior of the housing 2, a moving plate 16 connected to one end of the two electric telescopic rods 15, a first locking rod 17 evenly connected to the lower part of one side of the moving plate 16, one end of multiple first locking rods 17 being inserted into the corresponding multiple limiting holes 14, and a second locking rod 18 connected to one side of the moving plate 16 above the first locking rod 17.
[0032] The support plate 11 is rigidly connected to the second support plate 9 and moves up and down synchronously with it. The support plate 12 adopts an L-shaped structure to enhance support stability. The electric telescopic rod 15 has a built-in position sensor to provide real-time feedback on the telescopic status. The moving plate 16 is provided with a guide groove to ensure the accuracy of linear movement. The first locking rod 17 and the second locking rod 18 are arranged in a stepped manner to meet the positioning requirements of different heights. The head of the locking rod is chamfered to reduce insertion resistance. The support block 13 and the stop block 19 cooperate to form a double limit protection mechanism.
[0033] Working principle: When the device is in use, different operating modes are triggered according to the pin structure type when the MOS device enters the packaging station:
[0034] When packaging parallel-pin devices:
[0035] The second support plate 9 sinks into the opening 10 of the first support plate 3, and the upper surfaces of the two are flush to form a unified support plane. The support plate 11, support plate 12, and support block 13 of the limiting component descend synchronously with the second support plate 9. At this time, the limiting hole 14 of the support block 13 corresponds to the position of the first locking rod 17 of the electric telescopic rod 15.
[0036] The electric telescopic rod 15 extends, pushing the moving plate 16 to insert the first locking rod 17 into the limiting hole 14 below the support block 13, fixing the second support plate 9 at a low position flush with the first support plate 3, while the second locking rod 18 is suspended in the air and does not contact the limiting hole 14.
[0037] After the device is placed on the plane, the cylinder 4 drives the pressure plate 20 to press down vertically. The pressure is evenly transmitted through the first support plate 3. Because the second support plate 9 is locked by the first clamp 17, the overall structure is stable and the parallel pins are not interfered with.
[0038] When packaging inverted L-shaped lead devices:
[0039] The electric telescopic rod 15 retracts first, causing the first locking rod 17 to disengage from the limiting hole 14 and release the low-position lock. The motor 5 of the adjusting component drives the lead screw 6 to rotate. The moving blocks 7 on both sides push the second support plate 9 to rise through the push rod 8, causing the support plate 11, support plate 12, and support block 13 to move upward synchronously. When the second support plate 9 rises to the preset height, the support block 13 moves to contact the stop 19 at the lower end of the first support plate 3. The stop 19 laterally restricts the horizontal displacement of the support block 13 to ensure the accurate position of the support plate 12.
[0040] At this time, the limiting hole 14 of the support block 13 moves to the corresponding height of the second locking rod 18, the electric telescopic rod 15 extends again, pushes the moving plate 16 to insert the second locking rod 18 into the limiting hole 14, forming a high-level lock on the second support plate 9. The stop block 19 restricts lateral displacement through physical contact, and the second locking rod 18 restricts vertical movement through hole insertion. The dual mechanism ensures that the second support plate 9 remains stable under high pressure.
[0041] The device is placed on the second support plate 9, and the inverted L-shaped pins naturally hang down to the perimeter of the opening 10. When the pressure plate 20 descends, the pressure is mainly applied to the device body, and the pins are not squeezed because they are suspended outside the first support plate 3.
[0042] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A clamping structure for MOS packaging manufacturing, comprising a base plate (1), characterized in that, The bottom plate (1) is connected to the upper end of the box body (2), the upper end of the box body (2) is connected to the first support plate (3), the upper ends of the bottom plate (1) are connected to both sides of the upper end of the bottom plate (1) and the upper ends of the two cylinders (4) are connected to the pressure plate (20). The middle of one side of the inner wall of the box body (2) is connected to the adjustment component. The upper end of the adjustment component is rotatably connected to the second support plate (9). The lower ends of the second support plate (9) are connected to both sides of the lower end of the box body (2) and the two limit components are connected to the electric telescopic rod (15). The lower ends of the first support plate (3) are connected to the two limit components.
2. The clamping structure for MOS packaging production according to claim 1, characterized in that, The adjustment assembly includes a motor (5), the output end of which is connected to a lead screw (6), and two movable blocks (7) are slidably connected to both sides of the outer wall of the lead screw (6). The upper ends of the two movable blocks (7) are rotatably connected to push rods (8), and the upper ends of the two push rods (8) are rotatably connected to the lower ends of the second support plate (9).
3. The clamping structure for MOS packaging production according to claim 2, characterized in that, The inner walls of the housing (2) are connected to slide rods on both sides below the lead screw (6), and the two moving blocks (7) are slidably connected on both sides of the outer walls of the slide rods.
4. The clamping structure for MOS packaging production according to claim 1, characterized in that, An opening (10) is provided at the upper end of the first support plate (3) corresponding to the second support plate (9), and the second support plate (9) is located inside the opening (10).
5. The clamping structure for MOS packaging production according to claim 1, characterized in that, The limiting component includes a support plate (11), a support plate (12) is connected to one side of the lower end of the support plate (11), a support block (13) is connected to one side of the upper end of the support plate (12), and limiting holes (14) are evenly opened on one side of the support block (13).
6. The clamping structure for MOS packaging production according to claim 1, characterized in that, One end of each of the two electric telescopic rods (15) extends into the interior of the box (2), and one end of each of the two electric telescopic rods (15) is connected to a movable plate (16). A first locking rod (17) is evenly connected to the lower part of one side of the movable plate (16).
7. The clamping structure for MOS packaging production according to claim 6, characterized in that, One end of each of the first locking rods (17) is inserted into the corresponding limiting holes (14), and a second locking rod (18) is connected to one side of the moving plate (16) above the first locking rod (17).