PN wafer separator conveying and overturning mechanism

Abstract

The utility model discloses a PN wafer separator conveying and overturning mechanism, and relates to the technical field of wafer separators. According to the technical scheme, the PN wafer separator conveying and overturning mechanism comprises a three-axis movement mechanism, an adsorption transfer mechanism is installed on the three-axis movement mechanism in a sliding mode, a conveying mechanism is installed below the three-axis movement mechanism, an overturning mechanism is rotatably installed on the conveying mechanism, and a containing table is installed at the tail end of the conveying mechanism; the turnover mechanism comprises an air cylinder, a lower supporting plate is installed at the top end of the air cylinder, an upper cover plate is installed on the lower supporting plate, a connecting block is installed on the upper cover plate, a plurality of sets of springs are installed below the connecting block, a pressing block is installed below the springs, an inclined face is arranged on the pressing block, and an inclined face is arranged on the lower supporting plate. The utility model aims to provide the PN wafer separator conveying and overturning mechanism, so as to achieve the effects of overturning two surfaces of a wafer to be processed and preventing the wafer from falling off in the overturning process.

Description

Technical Field

[0001] This utility model discloses a PN wafer slitting machine conveying and flipping mechanism, which relates to the field of wafer slitting machine technology. Background Technology

[0002] A wafer slicing machine is a device used in semiconductor manufacturing to cut completed chip manufacturing processes into individual chips. It is commonly used in semiconductors, integrated circuits, LEDs, and optoelectronic devices. The main function of a wafer slicing machine is to divide a large circular wafer into multiple smaller chips, facilitating subsequent packaging and testing. The working principle of a wafer slicing machine typically involves cutting the wafer using high-speed rotating blades or a laser. During the operation of a wafer slicing machine, the transport system plays a crucial role. The transport system is primarily responsible for accurately moving the wafer from one position to another, ensuring positioning accuracy and workpiece safety during the cutting process.

[0003] In actual processing, wafers may need to be processed on both sides and placed in baskets. In traditional conveying, one side needs to be processed first and then flipped, which will affect the processing efficiency of the product. Therefore, a PN wafer slitting machine conveying and flipping mechanism is needed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a PN wafer slitting machine conveying and flipping mechanism to achieve the effect of double-sided flipping of the wafer to be processed and preventing it from falling during the flipping process.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a PN slicer conveying and flipping mechanism, comprising a three-axis motion mechanism, an adsorption and transfer mechanism slidably mounted on the three-axis motion mechanism, a conveying mechanism mounted below the three-axis motion mechanism, a flipping mechanism rotatably mounted on the conveying mechanism, and a placement platform mounted at the tail end of the conveying mechanism; the flipping mechanism comprises a cylinder, a lower support plate mounted at the top of the cylinder, an upper cover plate mounted on the lower support plate, a connecting block mounted on the upper cover plate, several sets of springs mounted below the connecting block, a pressure block mounted below the springs, an inclined surface provided on the pressure block, and an inclined surface provided on the lower support plate.

[0006] Preferably, the adsorption and transport mechanism is equipped with a detection head.

[0007] Preferably, a lifting mechanism is provided below the flipping mechanism.

[0008] Preferably, the tilting mechanism is driven by a cylinder.

[0009] Preferably, the pressure block and the connecting block are slidably connected and there is a step between them.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: the wafer is transported and placed on the conveying mechanism by the adsorption and transfer mechanism, that is, below the adsorption and transfer mechanism. Then, the conveying mechanism transports the workpiece to the flipping mechanism. The flipping mechanism flips the workpiece and places it in another section of the conveying mechanism, which then transports it to the tail end placement platform. A special wafer placement basket can be installed on the placement platform. When the wafer enters the flipping mechanism, the inclined surface set on the lower support plate and the pressure block should guide it into the space formed by the upper cover plate and the lower support plate. During this period, the spring contracts and the pressure block moves upward. The elastic force of the spring provides a certain holding force for the wafer, so that it will not fall off due to the flipping speed being too fast. This achieves the effect of double-sided flipping of the wafer to be processed and preventing it from falling off during the flipping process. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the overall conveying and flipping mechanism of a PN slicer;

[0012] Figure 2 for Figure 1 A schematic diagram of the flipping mechanism of a PN slicer conveying flipping mechanism;

[0013] The following are the labeling elements in the figure:

[0014] 1. Three-axis motion mechanism; 2. Adsorption and transfer mechanism; 21. Detection head; 3. Conveying mechanism; 4. Tilting mechanism; 41. Lifting mechanism; 42. Lower support plate; 43. Upper cover plate; 44. Connecting block; 45. Pressing block; 46. Spring; 47. Cylinder; 5. Placement platform. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Specific implementation examples:

[0017] like Figure 1 As shown, a PN slicer conveying and flipping mechanism includes a three-axis motion mechanism 1, an adsorption and transfer mechanism 2 slidably mounted on the three-axis motion mechanism 1, a conveying mechanism 3 mounted below the three-axis motion mechanism 1, a flipping mechanism 4 rotatably mounted on the conveying mechanism 3, and a placement platform 5 mounted at the tail end of the conveying mechanism 3.

[0018] When the mechanism is in operation, the previous workstation is transported by the adsorption transfer mechanism 2 and placed on the conveying mechanism 3, that is, below the adsorption transfer mechanism 2. The conveying mechanism 3 then transports the workpiece to the flipping mechanism 4. The flipping mechanism 4 flips the workpiece and places it in another section of the conveying mechanism 3, which then transports it to the tail placement stage 5. A wafer-specific placement basket can be installed on the placement stage 5. The specific type of placement basket depends on the type of workpiece being processed.

[0019] The adsorption-transfer mechanism 2 is equipped with a detection head 21;

[0020] The function of the detection head 21 is to determine the position of the wafer entering the mechanism and to record or correct its position through electronic control.

[0021] The conveying mechanism 3 is existing technology, and its specific working principle will not be elaborated here. It is driven by a motor and mainly serves to convey the workpiece. It is equipped with a soft protective pad because the wafer is a high-precision product, and it is protected from scratches during transportation.

[0022] A lifting mechanism 41 is provided below the flipping mechanism 4;

[0023] The lifting mechanism 41 is a servo lifting mechanism, which is existing technology. Its specific working principle will not be elaborated here. Its main working principle is that it can adjust the height of the flipping mechanism 4 and the conveying mechanism 3 during operation to meet the needs of various processing environments.

[0024] The flipping mechanism 4 is driven by a cylinder.

[0025] The flipping mechanism 4 is driven by a cylinder to rotate, and can rotate half a turn to flip and transport the wafer from the previous conveying mechanism 3 to the next conveying mechanism 3, flipping the wafer to meet storage and processing requirements.

[0026] like Figure 2 As shown, the flipping mechanism 4 includes a cylinder 47, a lower support plate 42 is installed at the top of the cylinder 47, an upper cover plate 43 is installed on the lower support plate 42, a connecting block 44 is installed on the upper cover plate 43, several sets of springs 46 are installed below the connecting block 44, a pressure block 45 is installed below the springs 46, and an inclined surface (not shown in the figure) is provided on the pressure block 45. An inclined surface is also provided on the lower support plate 42.

[0027] The mechanism exists in an initial state, in which spring 46 is in an expanded state;

[0028] When the wafer enters the flipping mechanism 4, the inclined surfaces provided on the lower support plate 42 and the pressure block 45 should guide it into the space formed by the upper cover plate 43 and the lower support plate 42. During this period, the spring 46 contracts and the pressure block 45 moves upward. The elastic force of the spring 46 provides a certain holding force for the wafer, so that it will not fall off due to the flipping speed being too fast during the flipping.

[0029] The pressure block 45 and the connecting block 44 are slidably connected and there is a step between them;

[0030] The sliding connection can limit the range of motion of the pressure block 45 and enhance the structural strength. The presence of the step allows the pressure block 45 to hold wafer workpieces of different thicknesses.

[0031] In summary, the wafer is transported and placed on the conveying mechanism 3 by the adsorption and transfer mechanism 2, which is located below the adsorption and transfer mechanism 2. The conveying mechanism 3 then transports the workpiece to the flipping mechanism 4. The flipping mechanism 4 flips the workpiece and places it in another section of the conveying mechanism 3, from which it is transported to the tail end placement platform 5. A wafer-specific placement basket can be installed on the placement platform 5. When the wafer enters the flipping mechanism 4, the inclined surfaces set on the lower support plate 42 and the pressure block 45 should guide it into the space formed by the upper cover plate 43 and the lower support plate 42. During this period, the spring 46 contracts and the pressure block 45 moves upward. The elastic force of the spring 46 provides a certain holding force for the wafer, so that it will not fall off due to the excessive flipping speed. This achieves the effect of double-sided flipping of the wafer to be processed and preventing it from falling off during the flipping process.

[0032] The above description is merely a preferred embodiment of this application. The scope of protection of this application is not limited to the above embodiments. All technical solutions within this concept are within the scope of protection of this application. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of this application should also be considered within the scope of protection of this application.

Claims

1. A PN slicer conveying and flipping mechanism, comprising a three-axis motion mechanism (1), characterized in that: An adsorption and transfer mechanism (2) is slidably mounted on the three-axis motion mechanism (1), a conveying mechanism (3) is mounted below the three-axis motion mechanism (1), a flipping mechanism (4) is rotatably mounted on the conveying mechanism (3), and a placement platform (5) is mounted at the tail end of the conveying mechanism (3). The flipping mechanism (4) includes a cylinder (47), a lower support plate (42) is installed at the top of the cylinder (47), an upper cover plate (43) is installed on the lower support plate (42), a connecting block (44) is installed on the upper cover plate (43), several sets of springs (46) are installed below the connecting block (44), a pressure block (45) is installed below the springs (46), an inclined surface is provided on the pressure block (45), and an inclined surface is provided on the lower support plate (42).

2. The PN slicer conveying and flipping mechanism according to claim 1, characterized in that: The adsorption and transport mechanism (2) is equipped with a detection head (21).

3. The PN slicer conveying and flipping mechanism according to claim 1, characterized in that: A lifting mechanism (41) is provided below the flipping mechanism (4).

4. The PN slicer conveying and flipping mechanism according to claim 1, characterized in that: The flipping mechanism (4) is driven by a cylinder.

5. The PN slicer conveying and flipping mechanism according to claim 1, characterized in that: The pressure block (45) and the connecting block (44) are slidably connected and there is a step between them.

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