Positioning alignment sheet of bonding machine
By designing a positioning alignment plate for the bonding machine and utilizing the alignment of the upper and lower cross sections, the problem of wafer performance degradation and low yield caused by large positioning deviations in semiconductor chip processing was solved. This achieved high-precision positioning and alignment, improving the quality of chip processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2026-04-07
AI Technical Summary
Large positioning deviations during semiconductor chip manufacturing lead to problems such as decreased wafer performance and low yield.
A bonding machine positioning alignment plate was designed, including an upper wafer and a lower wafer. The two are precisely positioned by aligning the cross-shaped parts of the upper wafer and the lower wafer. The positive and negative correspondence design of the patterned parts of the upper wafer and the lower wafer is combined to improve the positioning accuracy.
By designing upper and lower cross frames, rapid positioning and high-precision alignment of the upper and lower wafers are achieved, improving the positioning accuracy and yield of chip processing.
Smart Images
Figure CN224098120U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to positioning sheet technical field, especially for the positioning alignment sheet of bonding machine. BACKGROUND
[0002] The manufacture of semiconductor chip needs to pass through multiple steps, including raw material preparation, wafer preparation, chip manufacturing, packaging test etc., and needs high-precision equipment and materials, and strict quality control and environmental control; the volume of semiconductor chip is small, and the installation precision is high, and the positioning deviation is big in the present stage semiconductor chip processing process, which can cause wafer performance decline, low yield, and thus affect the performance of chip. SUMMARY
[0003] The utility model discloses a positioning alignment sheet of bonding machine, which solves the problem of large positioning deviation in the present stage semiconductor chip processing process, which can cause wafer performance decline, low yield, and thus affect the performance of chip.
[0004] In order to realize the above-mentioned purpose, according to one aspect of the utility model, a positioning alignment sheet of bonding machine is provided, which comprises a wafer upper sheet and a wafer lower sheet, the wafer upper sheet is provided with an upper sheet cross part in the middle, the wafer upper sheet is provided with an upper sheet connecting ring at the outer circle, the upper sheet connecting ring is connected with the upper sheet cross part, the upper sheet cross part is provided with an upper sheet pattern part in the inside, the wafer lower sheet is provided with a lower sheet cross part in the middle, the wafer lower sheet is provided with a lower sheet connecting ring at the outer circle, the lower sheet connecting ring is connected with the lower sheet cross part, the lower sheet cross part is provided with a lower sheet pattern part in the inside, when the upper sheet pattern part coincides with the lower sheet pattern part, the wafer upper sheet is aligned with the wafer lower sheet.
[0005] Further, the upper sheet cross part comprises an upper sheet cross frame and an upper sheet center cross, the upper sheet center cross is fixedly arranged in the middle of the upper sheet cross frame, and the upper sheet cross frame is fixedly connected with the upper sheet connecting ring.
[0006] Further, the lower sheet cross part comprises a lower sheet cross frame and a lower sheet center cross, the lower sheet center cross is fixedly arranged in the middle of the lower sheet cross frame, and the lower sheet cross frame is fixedly connected with the lower sheet connecting ring.
[0007] Further, the upper sheet pattern part is fixedly arranged in the upper sheet cross frame, the upper sheet pattern part comprises a plurality of first column upper sheet pattern groups and a plurality of second column upper sheet pattern groups, the first column upper sheet pattern group comprises a first column upper sheet negative part pattern and a first column upper sheet positive part pattern, and the second column upper sheet pattern group comprises a second column upper sheet negative part pattern and a second column upper sheet positive part pattern.
[0008] Further, the first column of upper piece female part patterns and the first column of upper piece male part patterns are located on the same straight line, the second column of upper piece female part patterns and the second column of upper piece male part patterns are located on the same straight line, the first column of upper piece female part patterns is located above the second column of upper piece female part patterns, and the first column of upper piece male part patterns is located above the second column of upper piece male part patterns.
[0009] Further, the lower piece pattern part is fixed in the lower piece cross frame, the lower piece pattern part comprises a plurality of first column of lower piece pattern groups and a plurality of second column of lower piece pattern groups, the first column of lower piece pattern group comprises a first column of lower piece female part pattern and a first column of lower piece male part pattern, and the second column of lower piece pattern group comprises a second column of lower piece female part pattern and a second column of lower piece male part pattern.
[0010] Further, the first column of lower piece female part patterns and the first column of lower piece male part patterns are located on the same straight line, the second column of lower piece female part patterns and the second column of lower piece male part patterns are located on the same straight line, the first column of lower piece female part patterns is located above the second column of lower piece female part patterns, and the first column of lower piece male part patterns is located above the second column of lower piece male part patterns.
[0011] Further, the first column of upper piece female part patterns, the second column of upper piece female part patterns, the first column of lower piece female part patterns and the second column of lower piece female part patterns are all fixed with a plurality of female triangular alignment strips, and the first column of upper piece male part patterns, the second column of upper piece male part patterns, the first column of lower piece male part patterns and the second column of lower piece male part patterns are all fixed with a plurality of male triangular alignment strips.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] The upper piece cross frame and the lower piece cross frame occupy a large area of the wafer upper piece and the wafer lower piece, are easy to identify and position, and can quickly position the wafer upper piece and the wafer lower piece through the upper piece cross frame and the lower piece cross frame; the upper piece center cross and the lower piece center cross can roughly position the wafer upper piece and the wafer lower piece; each upper piece pattern part and lower piece pattern part has six alignment patterns with different precisions, so that the positioning precision can be improved, and the device and product requirements with different precisions can also be met. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a whole schematic view of the utility model positioning and aligning the wafer upper piece;
[0015] Figure 2 It is a whole schematic view of the utility model positioning and aligning the wafer lower piece;
[0016] Figure 3 It is a schematic view of the utility model upper piece pattern unit structure;
[0017] Figure 4The alignment piece lower piece pattern unit structure schematic diagram of the utility model discloses a;
[0018] Figure 5 The utility model discloses a female part pattern structure schematic diagram;
[0019] Figure 6 The utility model discloses a male part pattern structure schematic diagram.
[0020] Reference signs:
[0021] 1, wafer upper piece;2, upper piece connecting ring;3, upper piece cross frame;4, upper piece pattern part;5, upper piece center cross;6, wafer lower piece;7, lower piece connecting ring;8, lower piece cross frame;9, lower piece pattern part;10, lower piece center cross;41A, 41B, 41C, first column upper piece female part pattern;42A, 42B, 42C, second column upper piece female part pattern;41a, 41b, 41c, first column upper piece male part pattern;42a, 42b, 42c, second column upper piece male part pattern;91A, 91B, 91C, first column lower piece female part pattern;92A, 92B, 92C, second column lower piece female part pattern;91a, 91b, 91c, first column lower piece male part pattern;92a, 92b, 92c, second column lower piece male part pattern;11, female triangular alignment strip;12, male triangular alignment strip. Specific embodiments
[0022] In order to further illustrate the technical means and effects adopted by the utility model to achieve the predetermined utility model purposes, the specific embodiments, structures, features and effects according to the utility model will be described in detail as follows in combination with the drawings and preferred embodiments.
[0023] The embodiment provides a bonding machine positioning alignment piece, which comprises a wafer upper piece 1 and a wafer lower piece 6. Figure 1 As shown in the figure, the wafer upper piece 1 is fixedly provided with an upper piece connecting ring 2 outside the circle, and the upper piece connecting ring 2 is connected with the upper piece cross part. Figure 2 As shown in the figure, the wafer lower piece 6 is fixedly provided with a lower piece connecting ring 7 outside the circle, and the lower piece connecting ring 7 is connected with the lower piece cross part.
[0024] When the patterns of the upper and lower wafer pieces are correspondingly coincident or correspondingly embeddedly coincident, the product in the equipment is positioned.
[0025] The upper connecting ring 2 and the lower connecting ring 7 are 4 mm wide. The upper connecting ring 2, the lower connecting ring 7, the upper pattern part 4, and the lower pattern part 9 are all chromium-plated.
[0026] The upper wafer 1 and the lower wafer 6 are made of 8-inch quartz wafers with a diameter of 200mm and a thickness of 725um±25um.
[0027] The upper cross section includes an upper cross frame 3 and an upper central cross 5. The upper central cross 5 is fixedly located in the middle of the upper cross frame 3, and the upper cross frame 3 is fixedly connected to the upper connecting ring 2. The intersection point of the upper central cross 5 coincides with the intersection point of the upper cross frame 3. The upper cross frame 3 is provided with a scale, the starting point of which is at the center point of the upper cross frame 3, and the unit is millimeters.
[0028] The lower wafer cross section includes a lower wafer cross frame 8 and a lower wafer center cross 10. The lower wafer center cross 10 is fixedly located in the middle of the lower wafer cross frame 8, and the lower wafer cross frame 8 is fixedly connected to the lower wafer connecting ring 7. The cross intersection point of the lower wafer center cross 10 coincides with the cross intersection point of the lower wafer cross frame 8. The lower wafer cross frame 8 is provided with a scale, the starting point of which is at the center point of the lower wafer cross frame 8, and the unit is millimeters. This scale is used for the alignment and deviation calculation and reading of the upper wafer 1 and the lower wafer 6 with different precisions. When the upper wafer 1 and the lower wafer 6 coincide, if the scale of the upper wafer cross frame 3 is completely aligned with the scale of the lower wafer cross frame 8, then there is no deviation between the upper wafer 1 and the lower wafer 6. If the scale of the upper wafer cross frame 3 is not completely aligned with the scale of the lower wafer cross frame 8, then the deviation between the upper wafer 1 and the lower wafer 6 is calculated by measuring the scale of the deviation between the two.
[0029] The upper pattern section 4 is fixedly disposed within the upper cross frame 3. The upper pattern section 4 includes several first column upper pattern groups and several second column upper pattern groups. The first column upper pattern groups include first column upper negative patterns 41A, 41B, 41C and first column upper positive patterns 41a, 41b, 41c. The second column upper pattern groups include second column upper negative patterns 42A, 42B, 42C and second column upper positive patterns 42a, 42b, 42c.
[0030] like Figure 3 As shown, the upper shadow patterns 41A, 41B, and 41C of the first column are aligned with the upper convex patterns 41a, 41b, and 41c of the first column. The upper shadow patterns 42A, 42B, and 42C of the second column are aligned with the upper convex patterns 42a, 42b, and 42c of the second column. The upper shadow patterns 41A, 41B, and 41C of the first column are above the upper shadow patterns 42A, 42B, and 42C of the second column, while the upper convex patterns 41a, 41b, and 41c of the first column are above the upper convex patterns 42a, 42b, and 42c of the second column.
[0031] The lower pattern section 9 is fixedly disposed within the lower cross frame 8. The lower pattern section 9 includes several first column lower pattern groups and several second column lower pattern groups. The first column lower pattern groups include first column lower negative patterns 91A, 91B, 91C and first column lower positive patterns 91a, 91b, 91c. The second column lower pattern groups include second column lower negative patterns 92A, 92B, 92C and second column lower positive patterns 92a, 92b, 92c.
[0032] like Figure 4 As shown, the lower shadow patterns 91A, 91B, 91C and the upper shadow patterns 91a, 91b, 91c of the first column are on the same straight line. The lower shadow patterns 92A, 92B, 92C and the upper shadow patterns 92a, 92b, 92c of the second column are on the same straight line. The lower shadow patterns 91A, 91B, 91C of the first column are above the lower shadow patterns 92A, 92B, 92C of the second column, and the upper shadow patterns 91a, 91b, 91c of the first column are above the upper shadow patterns 92a, 92b, 92c of the second column.
[0033] The upper pattern section 4 and the lower pattern section 9 adopt a yin-yang corresponding filling method. After the two are aligned, a complete pattern is formed, which is convenient for observation. The upper pattern section 4 and the lower pattern section 9 adopt a cyclic arrangement method for the alignment of the upper wafer 1 and the lower wafer 6 with different precision.
[0034] The alignment accuracy of the upper negative pattern 41A in the first column, the upper negative pattern 42A in the second column, the lower negative pattern 91A in the first column, and the lower negative pattern 92A in the second column is 1µm. The alignment accuracy of the upper negative pattern 41B in the first column, the upper negative pattern 42B in the second column, the lower negative pattern 91B in the first column, and the lower negative pattern 92B in the second column is 0.5µm. The alignment accuracy of the outer frame of the upper negative pattern 41C in the first column, the upper negative pattern 42C in the second column, the lower negative pattern 91C in the first column, and the lower negative pattern 92C in the second column is 0.1µm, and the alignment accuracy of the inner frame is 0.05µm.
[0035] The upper cross frame 3 and the lower cross frame 8 are the same size, aligned with the cross shape with a horizontal length of 20mm and a vertical length of 10mm. The width of the cross-shaped filling area is 0.6mm and the width of the cross shape is 0.4mm. They are used for coarse positioning of the upper wafer 1 and the lower wafer 6.
[0036] like Figure 5 As shown, the upper negative patterns 41A, 41B, and 41C in the first column, the upper negative patterns 42A, 42B, and 42C in the second column, the lower negative patterns 91A, 91B, and 91C in the first column, and the lower negative patterns 92A, 92B, and 92C in the second column are all fixedly provided with several negative triangular alignment strips 11, such as...Figure 6 As shown, the first column of the upper piece male part pattern 41a, 41b, 41c, the second column of the upper piece male part pattern 42a, 42b, 42c, the first column of the lower piece male part pattern 91a, 91b, 91c and the second column of the lower piece male part pattern 92a, 92b, 92c are all fixed with a plurality of male part triangular alignment strips 12. The first column of the upper piece male part pattern 41a, 41b, 41c corresponds to the first column of the lower piece female part pattern 91A, 91B, 91C respectively, the first column of the upper piece female part pattern 41A, 41B, 41C corresponds to the first column of the lower piece male part pattern 91a, 91b, 91c respectively, the second column of the upper piece male part pattern 42a, 42b, 42c corresponds to the second column of the lower piece female part pattern 92A, 92B, 92C respectively, and the second column of the upper piece female part pattern 42A, 42B, 42C corresponds to the second column of the lower piece male part pattern 92a, 92b, 92c respectively. After all the patterns are sequentially matched, the female part triangular alignment strip 11 is inserted into the gap of the corresponding male part triangular alignment strip 12, further improving the positioning accuracy of the wafer upper piece 1 and the wafer lower piece 6.
[0037] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any modification, equivalent change and modification of the above embodiments, which does not depart from the technical solution of the present application, is still within the scope of the present application.
Claims
1. A bonding machine positioning and alignment wafer, comprising an upper wafer (1) and a lower wafer (6), characterized in that, The upper wafer (1) is fixedly provided with an upper cross portion in the middle, and an upper connecting ring (2) is fixedly provided on the outer ring of the upper wafer (1). The upper connecting ring (2) is connected to the upper cross portion. An upper pattern portion (4) is fixedly provided inside the upper cross portion. The lower wafer (6) is fixedly provided with a lower cross portion in the middle, and a lower connecting ring (7) is fixedly provided on the outer ring of the lower wafer (6). The lower connecting ring (7) is connected to the lower cross portion. A lower pattern portion (9) is fixedly provided inside the lower cross portion. When the upper pattern portion (4) and the lower pattern portion (9) overlap, the upper wafer (1) and the lower wafer (6) are aligned.
2. The bonding machine positioning alignment plate according to claim 1, characterized in that, The upper cross section includes an upper cross frame (3) and an upper central cross (5). The upper central cross (5) is fixedly disposed in the middle of the upper cross frame (3). The upper cross frame (3) is fixedly connected to the upper connecting ring (2).
3. The bonding machine positioning alignment plate according to claim 2, characterized in that, The lower cross section includes a lower cross frame (8) and a lower central cross (10). The lower central cross (10) is fixedly disposed in the middle of the lower cross frame (8), and the lower cross frame (8) is fixedly connected to the lower connecting ring (7).
4. The bonding machine positioning alignment plate according to claim 3, characterized in that, The upper pattern section (4) is fixedly disposed within the upper cross frame (3). The upper pattern section (4) includes several first column upper pattern groups and several second column upper pattern groups. The first column upper pattern group includes the first column upper negative pattern (41A, 41B, 41C) and the first column upper positive pattern (41a, 41b, 41c). The second column upper pattern group includes the second column upper negative pattern (42A, 42B, 42C) and the second column upper positive pattern (42a, 42b, 42c).
5. The bonding machine positioning alignment plate according to claim 4, characterized in that, The upper negative patterns (41A, 41B, 41C) of the first column and the upper positive patterns (41a, 41b, 41c) of the first column are on the same straight line. The upper negative patterns (42A, 42B, 42C) of the second column and the upper positive patterns (42a, 42b, 42c) of the second column are on the same straight line. The upper negative patterns (41A, 41B, 41C) of the first column are above the upper negative patterns (42A, 42B, 42C) of the second column. The upper positive patterns (41a, 41b, 41c) of the first column are above the upper positive patterns (42a, 42b, 42c) of the second column.
6. The bonding machine positioning alignment plate according to claim 5, characterized in that, The lower pattern section (9) is fixedly disposed within the lower cross frame (8). The lower pattern section (9) includes several first column lower pattern groups and several second column lower pattern groups. The first column lower pattern group includes a first column lower negative pattern (91A, 91B, 91C) and a first column lower positive pattern (91a, 91b, 91c). The second column lower pattern group includes a second column lower negative pattern (92A, 92B, 92C) and a second column lower positive pattern (92a, 92b, 92c).
7. The bonding machine positioning alignment plate according to claim 6, characterized in that, The first column of lower shadow patterns (91A, 91B, 91C) and the first column of lower yang patterns (91a, 91b, 91c) are on the same straight line. The second column of lower shadow patterns (92A, 92B, 92C) and the second column of lower yang patterns (92a, 92b, 92c) are on the same straight line. The first column of lower shadow patterns (91A, 91B, 91C) is above the second column of lower shadow patterns (92A, 92B, 92C). The first column of lower yang patterns (91a, 91b, 91c) is above the second column of lower yang patterns (92a, 92b, 92c).
8. The bonding machine positioning alignment plate according to claim 7, characterized in that, The upper negative patterns (41A, 41B, 41C) of the first column, the upper negative patterns (42A, 42B, 42C) of the second column, the lower negative patterns (91A, 91B, 91C) of the first column, and the lower negative patterns (92A, 92B, 92C) of the second column are all fixedly provided with a number of negative triangular alignment strips (11). The upper positive patterns (41a, 41b, 41c) of the first column, the upper positive patterns (42a, 42b, 42c) of the second column, the lower positive patterns (91a, 91b, 91c) of the first column, and the lower positive patterns (92a, 92b, 92c) of the second column are all fixedly provided with a number of positive triangular alignment strips (12).