High-precision XY mobile platform for wafer detection

Abstract

The utility model relates to the technical field of wafer detection, and discloses a high-precision XY mobile platform for wafer detection, which comprises a base body, U-shaped grooves are arranged on one side of the base body close to the upper end and the lower end, X-axis linear guide rails are arranged on one side of the base body close to the two U-shaped grooves, and X-axis linear guide rails are arranged on the other side of the base body close to the two U-shaped grooves. An X-axis guide rail sliding block is slidably mounted on the side, away from the base body, of the X-axis linear guide rail, an X platform base is fixedly mounted on one side of the X-axis guide rail sliding block, and a Y platform base is connected to the side, away from the base body, of the X platform base through a connecting block; through the adjusting frame, the X-axis grating ruler ruler and the Y-axis grating ruler ruler, the current coordinate positions of the X-axis guide rail sliding block and the Y-axis linear sliding block can be accurately obtained, high-precision movement is facilitated, the rapidity and stability of movement are improved, and during detection, the angle of the wafer body can be adjusted according to needs, so that the thickness and the reverse side of the wafer body can be photographed and detected.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, specifically a high-precision XY moving platform for wafer inspection. Background Technology

[0002] Silicon wafers are made by purifying silicon and forming these pure silicon into long silicon rods, which become the quartz semiconductor material used to manufacture integrated circuits. Through processes such as photolithography, grinding, polishing, and slicing, polycrystalline silicon is melted and pulled into single-crystal silicon rods, which are then cut into thin wafers. During the wafer production process, an image acquisition camera needs to be aligned with the wafer for inspection to ensure its quality. During inspection, a moving platform is needed to place the wafer.

[0003] A Chinese patent provides a semiconductor wafer inspection platform, publication number CN215727630U, which includes a platform, an XY moving platform, a camera lens mounting beam, a vacuum adsorption fixture, an air flotation shock absorber, and feet, with the XY moving platform set on the platform.

[0004] The above-mentioned device uses an air flotation shock absorber between the bottom of the platform and the foot to reduce vibration and automatically level the platform, XY moving platform and camera lens mounting beam as a whole. The vacuum adsorption fixture has a groove that works with the fork-shaped robot to pick up and put in wafers, preventing the robot arm from scratching or hitting the wafers.

[0005] However, its mobile platform structure is relatively simple. Although it can provide shock absorption and cushioning, its adjustment accuracy is poor, which affects the detection effect. In addition, a small number of wafers need to be tested for their overall thickness during production, and the mobile platform only plays a supporting role, resulting in poor flexibility of use. Utility Model Content

[0006] The purpose of this invention is to provide a high-precision XY moving platform for wafer inspection, which can effectively solve the problems in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A high-precision XY moving platform for wafer inspection includes a base body. A U-shaped groove is provided on one side of the base body near the upper and lower ends. An X-axis linear guide is installed on one side of the base body near both U-shaped grooves. An X-axis guide slider is slidably installed on the side of the X-axis linear guide away from the base body. An X-platform base is fixedly installed on one side of the X-axis guide slider. A Y-platform base is connected to the side of the X-platform base away from the base body through a connecting block.

[0009] The top of the X platform base and the Y platform base are equipped with Y platform bases. Y-axis linear guides are installed at the front and rear ends of the top of the Y platform base. Y-axis linear sliders are slidably installed at the top of the two Y-axis linear guides. A wafer stage is installed at the top of the Y-axis linear slider. A stage base is provided at the top of the wafer stage. An adjustment frame is detachably installed on one side of the stage base by connecting bolts. A micro stepper motor is installed at the upper part of the side of the adjustment frame away from the stage base. The drive shaft of the micro stepper motor passes through both sides of the adjustment frame and is fixedly connected to the adjustment rod. A wafer support frame is installed at the end of the adjustment rod. A wafer body is provided at the top of the wafer support frame.

[0010] Preferably, a support rod is fixedly connected to the lower part of the interior of the wafer support frame, and both the stage base and the support rod are provided with air channels and vacuum adsorption holes.

[0011] Preferably, a rotating roller is rotatably mounted on one side of the wafer support frame near the wafer body via several rotating rods. A micro motor is mounted at the bottom end of the wafer support frame, and the drive shaft of the micro motor is connected to the rotating rod of one of the rotating rollers. The outer ring of the wafer body is in contact with the outer ring of the rotating roller.

[0012] Preferably, an X-axis linear motor stator is provided inside the U-shaped groove, and an X-axis linear motor mover is movably installed inside the X-axis linear motor stator. The side of the X-axis linear motor mover away from the base body is connected to the X-platform base.

[0013] Preferably, an X-axis grating ruler is mounted on one side of the base body via an X-axis mounting flange, and an X-axis grating ruler reading head is slidably mounted inside the X-axis grating ruler. The side of the X-axis grating ruler reading head away from the base body is connected to the X-platform base.

[0014] Preferably, a sealing end cap is provided on one side of the X-axis guide rail slider, X-axis limiting blocks are provided at the front and rear ends of the two X-axis linear guide rails, and X-axis rubber buffer heads are provided at one end of the four X-axis limiting blocks near the center line of the base body.

[0015] Preferably, a Y-axis grating ruler is mounted on the rearmost position of the top of the Y-platform base via a Y-axis mounting flange. A Y-axis grating ruler reading head is slidably mounted inside the Y-axis grating ruler, and one end of the Y-axis grating ruler reading head extending out of the Y-axis grating ruler is connected to the wafer stage.

[0016] Preferably, a plurality of Y-axis linear motor stators are mounted at the top center of the Y-platform base via a stator base, and a Y-axis linear motor mover adapted to the Y-axis linear motor stators is provided at the bottom of the wafer stage. Y-axis limiting blocks are provided on the sides of the two Y-axis linear guides that are far apart from each other. The two Y-axis limiting blocks are arranged in an "L" shape, and a Y-axis rubber buffer head is provided on the side of the Y-axis limiting block that is close to the Y-axis linear slider.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention sends position feedback signals by setting X-axis and Y-axis grating rulers to accurately obtain the coordinate positions of the current X-axis guide slider and Y-axis linear slider. At the same time, it can use closed-loop feedback to accurately control the X-axis guide slider and Y-axis linear slider, which facilitates high-precision movement and improves the speed and stability of movement.

[0019] By setting up a platform base, a micro stepper motor, a wafer support frame, and support rods in conjunction with the wafer body, the angle of the wafer body can be adjusted as needed during inspection to allow for the imaging and inspection of its thickness and reverse side, providing high flexibility in use. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a high-precision XY moving platform for wafer inspection in an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the X-axis linear guide rail in an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the connecting block in an embodiment of the present utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the Y-axis linear guide rail in an embodiment of this utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the platform base in an embodiment of this utility model;

[0025] Figure 6 This is a schematic diagram of the wafer support frame in an embodiment of the present invention.

[0026] In the diagram: 1. Base body; 2. U-shaped groove; 3. X-axis linear guide; 4. Wafer stage; 5. X-axis limiting block; 6. X-axis rubber buffer head; 7. X-axis linear motor stator; 8. X-axis linear motor mover; 9. X-axis grating ruler scale; 10. X-axis grating ruler reading head; 11. X-platform base; 12. Y-platform base; 13. Connecting block; 14. Y-platform base; 15. Y-axis linear guide; 16. Y-axis linear slider; 17. Y-axis limiting block; 18. Y-axis rubber buffer head; 19. Y-axis linear motor stator; 20. Y-axis linear motor mover; 21. Y-axis grating ruler scale; 22. Y-axis grating ruler reading head; 23. X-axis guide rail slider; 24. Sealed end cap; 25. Platform base; 2501. Adjustment frame; 2502. Micro stepper motor; 2503. Adjustment rod; 2504. Wafer support frame; 2505. Wafer body; 2506. Rotary roller; 2507. Micro motor; 2508. Support rod; 2509. Vacuum adsorption hole; 26. X-axis mounting flange; 27. Y-axis mounting flange; 28. Stator base. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1

[0029] Combination Figures 1-6 A high-precision XY moving platform for wafer inspection includes a base body 1. A U-shaped groove 2 is provided on one side of the base body 1 near the upper and lower ends. An X-axis linear guide rail 3 is installed on one side of the base body 1 near both U-shaped grooves 2. An X-axis guide rail slider 23 is slidably installed on the side of the X-axis linear guide rail 3 away from the base body 1. An X-platform base 11 is fixedly installed on one side of the X-axis guide rail slider 23. A Y-platform base 12 is connected to the side of the X-platform base 11 away from the base body 1 through a connecting block 13.

[0030] See Figure 2 , Figure 3 , Figure 4Furthermore, it is found that a Y-platform base 14 is installed on the top of the X-platform base 11 and the Y-platform base 12. Y-axis linear guides 15 are installed at the front and rear ends of the top of the Y-platform base 14. Y-axis linear sliders 16 are slidably installed on the top of the two Y-axis linear guides 15. A wafer stage 4 is installed on the top of the Y-axis linear slider 16. A stage base 25 is provided on the top of the wafer stage 4. An X-axis linear motor stator 7 is arranged inside the U-shaped groove 2. An X-axis linear motor mover 8 is movably installed inside the X-axis linear motor stator 7. The X-axis linear motor mover 8 is located away from the base. One side of the base body 1 is connected to the X platform base 11. An X-axis grating ruler 9 is installed in the center of one side of the base body 1 via an X-axis mounting flange 26. An X-axis grating ruler reading head 10 is slidably installed inside the X-axis grating ruler 9. The side of the X-axis grating ruler reading head 10 away from the base body 1 is connected to the X platform base 11. A sealing end cover 24 is provided on one side of the X-axis guide rail slider 23. X-axis limit blocks 5 are provided at the front and rear ends of the two X-axis linear guide rails 3. An X-axis rubber buffer head 6 is provided at one end of the four X-axis limit blocks 5 near the center point of the base body 1.

[0031] A Y-axis grating ruler 21 is mounted on the rear of the top of the Y-platform base 14 via a Y-axis mounting flange 27. A Y-axis grating ruler reading head 22 is slidably mounted inside the Y-axis grating ruler 21. One end of the Y-axis grating ruler reading head 22, which extends out of the Y-axis grating ruler 21, is connected to the wafer stage 4. Several Y-axis linear motor stators 19 are mounted on the center of the top of the Y-platform base 14 via a stator base 28. A Y-axis linear motor mover 20, which is compatible with the Y-axis linear motor stators 19, is provided at the bottom of the wafer stage 4. Y-axis limit blocks 17 are provided on the sides of the two Y-axis linear guides 15 that are far apart from each other. The two Y-axis limit blocks 17 are arranged in an "L" shape. A Y-axis rubber buffer head 18 is provided on the side of the Y-axis limit block 17 that is close to the Y-axis linear slider 16.

[0032] Specifically, using existing technology, a target position signal can be sent to the X-axis and Y-axis moving components at the base body 1 through an external control system. The target signal is automatically resolved into XY coordinates in the external control system. After the target signal is received by the X-axis moving component, the X-axis linear drive motor can be started because the platform base 25 is mounted on the U-shaped groove 2 through multiple components. The X-axis linear motor mover 8 drives the X-axis guide rail slider 23 and the X-axis linear guide rail 3 to slide, so as to move the platform base 25 to the appropriate position on the X-axis.

[0033] After the target signal is received by the Y-axis moving component, the Y-axis linear drive motor is started. The Y-axis linear motor mover 20 drives the Y-axis linear slider 16 and the Y-axis linear guide rail 15 to slide, thereby moving the stage base 25 to a suitable position on the Y-axis. After all the movement is completed, the stage base 25 stops moving and waits for the next signal. At this time, the wafer body 2505 on the stage base 25 can be detected by the existing detection device.

[0034] Example 2

[0035] See Figure 5 and Figure 6 Furthermore, based on Embodiment 1, an adjustment frame 2501 is detachably mounted on one side of the stage base 25 via connecting bolts. A micro stepper motor 2502 is mounted on the upper part of the side of the adjustment frame 2501 away from the stage base 25. The drive shaft of the micro stepper motor 2502 passes through both sides of the adjustment frame 2501 and is fixedly connected to an adjustment rod 2503. A wafer support frame 2504 is mounted at the end of the adjustment rod 2503. A wafer body 2505 is provided at the top of the wafer support frame 2504. A support rod 2508 is fixedly connected to the lower part of the interior of the wafer support frame 2504. Both the stage base 25 and the support rod 2508 are provided with air channels and vacuum adsorption holes 2509. A rotating roller 2506 is rotatably mounted on the side of the wafer support frame 2504 near the wafer body 2505 via several rotating rods. A micro motor 2507 is installed at the bottom of the wafer support frame 2504, and the drive shaft of the micro motor 2507 is connected to the rotating rod of one of the rotating rollers 2506. The outer ring of the wafer body 2505 is in contact with the outer ring of the rotating roller 2506.

[0036] Specifically, when it is necessary to inspect the thickness of the wafer body 2505, the adjustment frame 2501 can be installed on the stage base 25 using connecting bolts. Then, the wafer body 2505 can be placed on the wafer support frame 2504. At the same time, the vacuum adsorption tube can be pre-connected to the air channel set at the support rod 2508 so that the vacuum adsorption hole 2509 is in a negative pressure state. The wafer body 2505 is fixed by vacuum adsorption. Then, the micro stepper motor 2502 can be started to drive the wafer body 2505 to rotate, thereby adjusting its angle for side or reverse side imaging inspection. It has high flexibility of use. During inspection, the micro stepper motor 2502 needs to be controlled to intermittently rotate forward and reverse to avoid excessive pulling on the vacuum adsorption tube.

[0037] In actual operation, the target position signal is sent to the X-axis moving component and Y-axis moving component at the base body 1 by using the existing technology external control system. The target signal is automatically resolved into XY coordinates in the external control system. After the target signal is received by the X-axis moving component, the X-axis linear drive motor can be started because the platform base 25 is mounted on the U-shaped groove 2 by multiple components. The X-axis linear motor mover 8 drives the X-axis guide rail slider 23 and the X-axis linear guide rail 3 to slide, so as to move the platform base 25 to the appropriate X-axis position.

[0038] After the target signal is received by the Y-axis moving component, the Y-axis linear drive motor is started. The Y-axis linear motor mover 20 drives the Y-axis linear slider 16 and the Y-axis linear guide rail 15 to slide, thereby moving the stage base 25 to the appropriate position on the Y-axis. After all the movement is completed, the stage base 25 stops moving and waits for the next signal. At this time, the wafer body 2505 on the stage base 25 can be detected by the existing detection device.

[0039] When the thickness of the wafer body 2505 needs to be inspected, the adjustment frame 2501 can be installed on the stage base 25 using connecting bolts. Then, the wafer body 2505 can be placed on the wafer support frame 2504. At the same time, the vacuum adsorption tube can be pre-connected to the air channel set at the support rod 2508 so that the vacuum adsorption hole 2509 is in a negative pressure state. The wafer body 2505 is fixed by vacuum adsorption. Then, the micro stepper motor 2502 can be started to drive the wafer body 2505 to rotate, thereby adjusting its angle for side or reverse side inspection. It has high flexibility of use. During inspection, the micro stepper motor 2502 needs to be controlled to intermittently rotate forward and reverse to avoid excessive pulling on the vacuum adsorption tube.

[0040] Furthermore, the information receiving and transmission devices, control components, and modules used in the aforementioned control components are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve improvements to the software and power supply.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision XY moving platform for wafer inspection, characterized in that: Includes a base body (1), a U-shaped groove (2) is provided on one side of the base body (1) near the upper and lower ends, an X-axis linear guide (3) is installed on one side of the base body (1) near the two U-shaped grooves (2), an X-axis guide slider (23) is slidably installed on the side of the X-axis linear guide (3) away from the base body (1), an X-platform base (11) is fixedly installed on one side of the X-axis guide slider (23), and a Y-platform base (12) is connected to the side of the X-platform base (11) away from the base body (1) through a connecting block (13); The top of the X platform base (11) and the Y platform base (12) are equipped with Y platform bases (14). Y-axis linear guides (15) are installed at the front and rear ends of the top of the Y platform base (14). Y-axis linear sliders (16) are slidably installed on the top of the two Y-axis linear guides (15). A wafer stage (4) is installed on the top of the Y-axis linear slider (16). A stage base (25) is provided on the top of the wafer stage (4). One side of the stage base (25) is connected by a connecting... An adjustment frame (2501) is detachably installed with bolts. A micro stepper motor (2502) is installed on the upper side of the adjustment frame (2501) away from the platform base (25). The drive shaft of the micro stepper motor (2502) passes through both sides of the adjustment frame (2501) and is fixedly connected to an adjustment rod (2503). A wafer support frame (2504) is installed at the end of the adjustment rod (2503). A wafer body (2505) is provided at the top of the wafer support frame (2504).

2. The high-precision XY moving platform for wafer inspection according to claim 1, characterized in that: A support rod (2508) is fixedly connected to the lower part of the interior of the wafer support frame (2504). Both the stage base (25) and the support rod (2508) are provided with air channels and vacuum adsorption holes (2509).

3. A high-precision XY moving platform for wafer inspection according to claim 2, characterized in that: The wafer support frame (2504) has a rotating roller (2506) mounted on one side near the wafer body (2505) via several rotating rods. A micro motor (2507) is mounted at the bottom of the wafer support frame (2504), and the drive shaft of the micro motor (2507) is connected to the rotating rod of one of the rotating rollers (2506). The outer ring of the wafer body (2505) is in contact with the outer ring of the rotating roller (2506).

4. A high-precision XY moving platform for wafer inspection according to claim 1, characterized in that: The U-shaped groove (2) is provided with an X-axis linear motor stator (7), and an X-axis linear motor mover (8) is movably installed inside the X-axis linear motor stator (7). The side of the X-axis linear motor mover (8) away from the base body (1) is connected to the X-platform base (11).

5. A high-precision XY moving platform for wafer inspection according to claim 4, characterized in that: An X-axis grating ruler (9) is mounted on one side of the base body (1) via an X-axis mounting flange (26), and an X-axis grating ruler reading head (10) is slidably mounted inside the X-axis grating ruler (9). The side of the X-axis grating ruler reading head (10) away from the base body (1) is connected to the X-platform base (11).

6. A high-precision XY moving platform for wafer inspection according to claim 1, characterized in that: A sealing end cap (24) is provided on one side of the X-axis guide rail slider (23), and X-axis limiting blocks (5) are provided at the front and rear ends of the two X-axis linear guide rails (3). An X-axis rubber buffer head (6) is provided at one end of the four X-axis limiting blocks (5) near the center point of the base body (1).

7. A high-precision XY moving platform for wafer inspection according to claim 1, characterized in that: The Y-axis grating ruler (21) is mounted on the rear of the top of the Y-platform base (14) via the Y-axis mounting flange (27). The Y-axis grating ruler reading head (22) is slidably mounted inside the Y-axis grating ruler (21). One end of the Y-axis grating ruler reading head (22) extending out of the Y-axis grating ruler (21) is connected to the wafer stage (4).

8. A high-precision XY moving platform for wafer inspection according to claim 7, characterized in that: Several Y-axis linear motor stators (19) are mounted on the top center of the Y-platform base (14) via the stator base (28), and a Y-axis linear motor mover (20) adapted to the Y-axis linear motor stator (19) is provided at the bottom of the wafer stage (4). Y-axis limiting blocks (17) are provided on the side of the two Y-axis linear guides (15) that are far apart from each other. The two Y-axis limiting blocks (17) are arranged in an "L" shape, and a Y-axis rubber buffer head (18) is provided on the side of the Y-axis limiting block (17) that is close to the Y-axis linear slider (16).

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