Heat dissipation plate, power conversion device and electric vehicle

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation plate, a power conversion device and an electric vehicle. The heat dissipation plate comprises a bottom plate and a plurality of heat dissipation teeth. The bottom plate comprises a first surface and a second surface which are opposite to each other, the first surface is used for arranging the plurality of radiating teeth, and the second surface is used for connecting a to-be-radiated device; the bottom end of each heat dissipation tooth is fixed to the first surface, the top end of each heat dissipation tooth extends in the thickness direction of the bottom plate in the direction away from the first surface, and any two adjacent heat dissipation teeth are distributed at intervals so as to form a flow channel for circulation of a cooling working medium; wherein the heat dissipation teeth comprise at least two first heat dissipation teeth which are adjacently arranged, and the distance between the top ends of every two adjacent first heat dissipation teeth is smaller than the distance between the bottom ends of every two adjacent first heat dissipation teeth in the direction parallel to the first surface. The flow channel formed by the heat dissipation plate can increase the flow close to one side of a to-be-dissipated device, and the heat dissipation capability can be improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat sink, a power conversion device, and an electric vehicle. Background Technology

[0002] Power modules play a vital role in power electronic devices and power conversion devices. Their ability to support high current and high voltage enables them to perform multiple functions such as voltage transformation, power amplification, frequency conversion, rectification, and power control. They can be widely used in consumer electronics, industrial control, network communication, power energy, automotive electronics, and many other fields.

[0003] For high-power modules, due to the limitation of safe operating junction temperature, heat sinks are needed to remove the heat generated by the components in a timely manner to ensure the module's performance. Liquid cooling heat sinks can provide good heat dissipation for power modules, but the heat dissipation capacity of liquid cooling in current technologies is limited. Utility Model Content

[0004] This application provides a heat sink, a power conversion device, and an electric vehicle. The flow channel formed by the heat sink can increase the flow rate near the device to be cooled, thereby improving the heat dissipation capacity.

[0005] In a first aspect, this application provides a heat sink, which includes a base plate and a plurality of heat dissipation teeth; the base plate includes a first surface and a second surface opposite to each other, the first surface is used to provide the plurality of heat dissipation teeth, and the second surface is used to connect to the device to be cooled; the bottom end of each heat dissipation tooth is fixed to the first surface, and the top end of each heat dissipation tooth extends away from the first surface along the thickness direction of the base plate, and any two adjacent heat dissipation teeth are spaced apart to form a flow channel for the cooling working fluid to flow; wherein, the plurality of heat dissipation teeth includes at least two adjacent first heat dissipation teeth, and along a direction parallel to the first surface, the distance between the top ends of two adjacent first heat dissipation teeth is smaller than the distance between the bottom ends of two adjacent first heat dissipation teeth.

[0006] In the aforementioned heat sink, the space between the tops of two adjacent first heat dissipation fins is smaller than the space between their bottoms. This allows the bottoms of the two adjacent first heat dissipation fins to hold more coolant, resulting in a greater flow rate of coolant closer to the base plate. This enhances heat exchange between the coolant and the device being cooled, thereby improving the cooling effect. In practical applications, placing at least two of these first heat dissipation fins in areas with higher heat dissipation requirements allows for targeted cooling of high-heat-dissipation devices. It also enables the rational configuration of the coolant, improving the overall system's energy efficiency and stability.

[0007] In one embodiment, along a direction parallel to the first surface, the cross-sectional area of ​​the tip of at least one of two adjacent first heat dissipation teeth is greater than the cross-sectional area of ​​the bottom end. Within a unit height range, the space occupied by the tip of the first heat dissipation tooth is greater than the space occupied by the bottom end. Therefore, the flow channel formed by the first heat dissipation tooth has less space at the tip than at the bottom, which is beneficial for increasing the cooling fluid flow rate at the bottom of the first heat dissipation tooth.

[0008] In one embodiment, along the thickness direction of the base plate, the projection of the tip of at least one of two adjacent first heat dissipation teeth on the first surface overlaps the projection of the bottom end on the first surface. Along a direction parallel to the first surface, the tip of the first heat dissipation tooth extends beyond the bottom end, such that the space occupied by the tip of the first heat dissipation tooth is greater than the space occupied by the bottom end, which is beneficial for increasing the cooling fluid flow rate at the bottom end of the first heat dissipation tooth.

[0009] In one embodiment, along the direction from the tip to the bottom of the first heat dissipation tooth, at least one of two adjacent first heat dissipation teeth has a circumferential side inclined towards the center of the first heat dissipation tooth. The circumferential side can be an inclined surface or a concave surface. The space occupied by the tip of the first heat dissipation tooth is larger than the space occupied by the bottom, which is beneficial for increasing the cooling fluid flow rate at the bottom of the first heat dissipation tooth.

[0010] In one embodiment, along the direction from the top end to the bottom end of the first heat dissipation tooth, at least one of two adjacent first heat dissipation teeth includes a first sidewall and a second sidewall on its circumferential side surface. The distance between the first sidewall and the first surface is greater than the distance between the second sidewall and the first surface. Along the direction parallel to the first surface, the distance between the first sidewall and the center of the first heat dissipation tooth is greater than the distance between the second sidewall and the center of the first heat dissipation tooth. The space occupied by the first heat dissipation tooth at the first sidewall is greater than the space occupied by the second sidewall, which is beneficial to increasing the cooling fluid flow rate at the bottom end of the first heat dissipation tooth.

[0011] In one embodiment, at least one of two adjacent first heat dissipation fins includes a first structural segment and a second structural segment. Along the thickness direction of the base plate, the second structural segment connects the first structural segment and the first surface, and the projection of the first structural segment on the first surface overlaps the projection of the second structural segment on the first surface. The first sidewall is a portion of the circumferential side surface of the first structural segment, and the second sidewall is a portion of the circumferential side surface of the second structural segment. The first and second structural segments of the first heat dissipation fins are distributed in a stepped manner, such that the space occupied by the first structural segment is larger than the space occupied by the second structural segment, which is beneficial to increasing the cooling fluid flow rate at the bottom end of the first heat dissipation fin.

[0012] In one embodiment, the second structural segment and the base plate are integrally formed. The second structural segment can be formed on the base plate using an integral molding process, and then the first structural segment can be fixed to the end of the second structural segment facing away from the base plate, which simplifies the manufacturing process.

[0013] In one embodiment, along a direction parallel to the first surface, the base plate includes a first portion and a second portion, the thickness of the first portion being less than the thickness of the second portion; at least two first heat dissipation fins are distributed on the first surface corresponding to the first portion. When cooling medium flows through the first surface of the base plate, the distance between the cooling medium at the first portion and the second surface of the base plate is less than the distance between the cooling medium at the second portion and the second surface of the base plate, which can reduce the thermal path length between the cooling medium and the device to be cooled through the base plate. Combined with the aforementioned first heat dissipation fins, the heat sink has a higher heat dissipation capacity at the first portion of the base plate.

[0014] In one embodiment, the plurality of heat dissipation teeth includes a plurality of second heat dissipation teeth arranged sequentially adjacent to each other. The second heat dissipation teeth are distributed on the first surface corresponding to the second portion. Along a direction parallel to the first surface, the distance between the top ends of two adjacent second heat dissipation teeth is less than or equal to the distance between the bottom ends of two adjacent second heat dissipation teeth. Compared with the first heat dissipation teeth, the flow channel formed by the second heat dissipation teeth of the cooling medium has a smaller flow rate on the side near the bottom plate, which can reasonably distribute the cooling medium, allowing more of the cooling medium to flow through areas with higher heat dissipation requirements, thereby improving the energy efficiency of the system.

[0015] In one embodiment, the top ends of each heat dissipation dent are located in the same plane away from the first surface. When the heat sink is used, an external housing can be used to relatively enclose the flow channels formed by the multiple heat dissipation dents to form a cooling chamber. The end of each heat dissipation dent facing away from the base plate can be connected to the housing. Cooling medium is circulated into this cooling chamber, and the cooling medium can provide liquid cooling for the device to be cooled through the heat sink.

[0016] Secondly, this application provides a power conversion device, which includes a circuit board, a power module, and any of the heat sinks provided in the first aspect; the power module is disposed on the circuit board, and a second surface of a base plate is fixed to the surface of the power module facing away from the circuit board. When the heat sink is used to dissipate heat from the power module, it can improve the heat dissipation efficiency of the system.

[0017] In one embodiment, along the thickness direction of the base plate, the projections of the at least two first heat dissipation fins on the substrate overlap with the projections of the electronic components on the substrate. The at least two first heat dissipation fins of the heat sink can provide targeted heat dissipation for high-heat-dissipating electronic components, thereby improving the system's heat dissipation efficiency.

[0018] Thirdly, this application provides an electric vehicle including a power source, wheels, and a powertrain. The powertrain includes the power conversion device provided in the second aspect above. The powertrain receives direct current (DC) from the power source and converts it into alternating current (AC) for output to a drive motor, which is connected to the wheels. Electric vehicles including the aforementioned power conversion device offer higher safety and performance.

[0019] The technical effects that can be achieved by the second and third aspects mentioned above can be referred to the corresponding effect descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0020] Figure 1 This application provides a schematic diagram of the structure of an electric vehicle.

[0021] Figure 2 This is a schematic diagram of the structure of a powertrain provided in an embodiment of this application;

[0022] Figure 3 This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application;

[0023] Figure 4 This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0024] Figure 5a This is a partial structural diagram of a heat sink provided in an embodiment of this application;

[0025] Figure 5b This is a partial structural diagram of a heat sink provided in an embodiment of this application;

[0026] Figure 5c This is a partial structural diagram of a heat sink provided in an embodiment of this application;

[0027] Figure 6a This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0028] Figure 6b This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0029] Figure 7a This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0030] Figure 7b This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0031] Figure 8a This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0032] Figure 8b This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0033] Figure 8c This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0034] Figure 8d This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0035] Figure 9 This is a schematic diagram of the structure of the first heat dissipation tooth of a heat sink provided in an embodiment of this application;

[0036] Figure 10a This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0037] Figure 10b This is a schematic diagram illustrating an application scenario of a heat sink provided in an embodiment of this application;

[0038] Figure 11a This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0039] Figure 11b This is a schematic diagram illustrating an application scenario of a heat sink provided in an embodiment of this application;

[0040] Figure 12a This is a schematic diagram of the structure of a heat sink provided in an embodiment of this application;

[0041] Figure 12b A top view of a heat sink provided in an embodiment of this application;

[0042] Figure 13 This is a schematic diagram illustrating an application scenario of a heat sink provided in an embodiment of this application.

[0043] Figure label:

[0044] 1000 - Powertrain; 2000 - Transmission; 3000 - Wheels; 4000 - Battery;

[0045] 100 - Power conversion device; 200 - Drive motor;

[0046] 1-Power module; 11-Substrate; 111-Insulating layer; 112-First metal layer; 113-Second metal layer; 12-Electronic component; 13-Terminal; 14-Package; 2-Heat sink; 21-Base plate; 22-Heat sink fins; 221-First heat sink fins; 2211-First structural segment; 2212-Second structural segment; 222-Second heat sink fins; 2213-Third structural segment; 3-Circuit board;

[0047] b1 - First surface; b2 - Second surface; c1 - First sidewall; c2 - Second sidewall; d1 - Top; d2 - Bottom; D - Flow channel; R1 - First section; R2 - Second section; Q - Space. Detailed Implementation

[0048] The heat generated by the chips in a power module during operation affects the module's performance. Prolonged high-temperature operation accelerates device aging and shortens its lifespan. In traditional technologies, equipping the power module with a heatsink for effective heat dissipation can improve device reliability and performance. For liquid cooling technology, heatsinks include plate-shaped liquid cooling plates and pin fin heatsinks. In the latter, the surface of the heatsink facing away from the power module consists of an array of pin fins, with channels formed between adjacent pin fins for the cooling medium to flow. However, the heat dissipation capacity of existing pin fin heatsink technologies is limited.

[0049] Based on this, embodiments of this application provide a heat sink, a power conversion device, and an electric vehicle. The flow channel formed by the heat sink can increase the flow rate near the device to be cooled, thereby improving the heat dissipation capacity and effectively cooling the power module.

[0050] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0051] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0052] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0053] Figure 1 A schematic diagram of the structure of an electric vehicle provided in this application embodiment, such as... Figure 1As shown, the vehicle is a wheeled device driven or towed by a power unit, specifically it can be a pure electric vehicle (pure EV / battery EV), a hybrid electric vehicle (HEV), a range-extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV), etc. The electric vehicle includes a powertrain 1000, a transmission mechanism 2000, and wheels 3000. The powertrain 1000 is connected to the wheels 3000 via the transmission mechanism 2000. The electric vehicle also includes a battery 4000, which supplies power to the powertrain 1000. The powertrain 1000 converts electrical energy into kinetic energy, which drives the wheels 3000 to rotate via the transmission mechanism 2000, thus enabling the electric vehicle to move.

[0054] Figure 2 This is a schematic diagram illustrating the connection relationship between the battery 4000 and the powertrain 1000 provided in an embodiment of this application. Figure 2 As shown, the powertrain 1000 includes a drive motor 200 and a power conversion device 100. The power conversion device 100 is used to convert the direct current supplied by the battery into alternating current and to deliver the alternating current to the drive motor 200.

[0055] Figure 3 This is a partial structural cross-sectional schematic diagram of a power conversion device 100 provided in an embodiment of this application. Figure 3 As shown, the power conversion device 100 includes a power module 1, a heat sink 2, and a circuit board 3. The power module 1 is disposed on the circuit board 3, and the heat sink 2 is fixed to the surface of the power module 1 facing away from the circuit board 3. The power module 1 can dissipate heat by contacting the heat sink 2. The signal terminals of the power module 1 are interconnected with the control terminals of the circuit board 3. The power conversion device 100 may include multiple power modules 1 connected in parallel, and these multiple power modules 1 can be electrically connected to form a power conversion circuit.

[0056] Power module 1 is a circuit package structure comprising semiconductor devices, also known as a power module. These semiconductor devices can be insulated-gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), diodes, etc. Power module 1 can be used in various applications... Figure 1 and Figure 2 The powertrain of the electric vehicle shown can also be applied to new energy, photovoltaic, wind power and other fields, and can achieve excellent performance such as high voltage, high current, stable temperature and low electromagnetic radiation.

[0057] In the consumer electronics field, power modules are mainly used in devices such as power adapters, inverters, and frequency converters. Power adapters are power conversion devices for small portable electronic devices and appliances. Power modules are used for power conversion and amplification, converting AC to DC to provide a stable and reliable power supply for these devices, ensuring their normal operation. Inverters are power electronic devices composed of semiconductor switching devices. Power modules can convert DC to AC, achieving efficient power conversion within the inverter to provide power support for homes, offices, and other locations.

[0058] In the field of power energy, power modules are mainly used in equipment such as solar inverters and wind power converters. Solar inverters convert direct current (DC) generated by solar panels into alternating current (AC) and feed it into the power grid. Power modules are responsible for achieving efficient power conversion and reliable grid connection, providing power support for homes, businesses, and other applications. Wind power converters are devices used in wind power systems to control generator speed, regulate output power, and ensure stable grid operation. Power modules can adjust the generator speed and output power according to wind speed and load changes, playing a role in power conversion and control, ensuring the safe and stable operation of the wind power system.

[0059] Please continue to refer to Figure 3 As shown, the power module 1 is exemplified as a single-sided cooling (SSC) module. The power module 1 includes a substrate 11, electronic components 12, multiple terminals 13, and a package 14. The substrate 11 is, in an example, a double-sided copper-clad laminate, including an insulating layer 111, a first metal layer 112, and a second metal layer 113. The first and second metal layers 112 are deposited along the thickness direction of the substrate 11 on the two surfaces of the insulating layer 111. The electronic components 12 are fixed to the first metal layer 112 of the substrate 11 by solder or solder balls and connected to the first metal layer 112 via traces to form a power conversion circuit. The multiple terminals 13 are connected to the first metal layer 112 and connected to the power conversion circuit through the first metal layer 112. The multiple terminals 13 include input terminals for input and output terminals for output. The package 14 encapsulates and protects most of the electronic component 12, the substrate 11, and multiple terminals 13. The second metal layer 113 of the substrate 11 is exposed in the package 14, and the ends of the terminals 13 away from the first metal layer 112 are exposed in the package 14. The package 14 may include materials such as silicone gel, epoxy molding compound, and epoxy potting compound.

[0060] The electronic component 12 can be one or a combination of a chip, a power component, and a passive component. For example, the chip can be an integrated circuit (IC) chip. The power component can be a diode, a transistor, etc., wherein the transistor can be an insulated-gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), etc. The passive component can be a capacitor, a resistor, an inductor, etc. Furthermore, the electronic component 12 can also be a fan-in or fan-out structure chip or a complete pre-packaged structure derived from the chip, power component, or passive component. The heat generated by the electronic component 12 during operation can be transferred to the liquid-cooled heat sink 20 for heat dissipation through the substrate 11.

[0061] Please continue to refer to Figure 3 As shown, in one embodiment, the heat sink 2 is fixed to the side of the power module 1 substrate 11 facing away from the electronic component 12, specifically, it can be fixed to the second metal layer 113. The side of the heat sink 2 facing away from the substrate 11 includes a flow channel D. In specific application scenarios, the heat sink 2 can cooperate with other structures such as an electric motor housing to allow the cooling medium to flow within the flow channel D. When the cooling medium flows through the flow channel D of the heat sink 2, the cooling medium can exchange heat with the substrate 11 through the heat sink 2, thereby achieving heat dissipation for the power module 1.

[0062] Figure 4 This application provides a structure for a heat sink 2 according to an embodiment. For example... Figure 4 As shown, the heat sink 2 includes a base plate 21 and multiple heat dissipation teeth 22. The base plate 21 is a continuous rectangular plate. For ease of understanding, a three-dimensional coordinate system is established with the shape of the base plate 21 as a reference. This three-dimensional coordinate system includes a first direction X, a second direction Y, and a third direction Z. The third direction Z is the thickness direction of the base plate 21, the first direction X is one of the length and width directions of the base plate 21, and the second direction Y is the other of the length and width directions of the base plate 21. Along the third direction Z, the base plate 21 includes a first surface b1 and a second surface b2. The first surface b1 is used to set the multiple heat dissipation teeth 22, and the second surface b2 is used to connect the power module 1 or other devices to be cooled.

[0063] In the heat sink 2 provided in this embodiment, each heat dissipation tooth 22 can be formed on the side of the base plate 21 away from the second surface b2 by etching, engraving or other processes, and each heat dissipation tooth 22 has an integral structure with the base plate 21. Alternatively, each heat dissipation tooth 22 can be made independently relative to the base plate 21 and fixed to the first surface b1 of the base plate 21 by welding, bonding or other methods.

[0064] like Figure 4 As shown, the second surface b2 of the base plate 21 is a plane parallel to the first direction X and the second direction Y. The second surface b2 of the base plate 21 can be fixed to the power module 1 in a close contact manner, and a large contact surface can be formed between the base plate 21 and the power module 1. In the heat dissipation path of the power module 1, the contact surface between the base plate 21 and the power module 1 is a heat exchange surface. A larger heat exchange surface can improve the heat exchange rate and improve the heat dissipation effect.

[0065] In some embodiments, the second surface b2 of the base plate 21 and the power module 1 can be connected by a thermal interface material to further improve the heat conduction rate and enhance the heat dissipation effect.

[0066] Please continue to refer to Figure 4 As shown, along the third direction Z, each heat dissipation fin 22 has a top end d1 and a bottom end d2. The bottom end d2 of each heat dissipation fin 22 is fixed to the first surface b1 of the base plate 21, and the top end d1 of each heat dissipation fin 22 extends away from the first surface b1 along the third direction Z. In some embodiments, each heat dissipation fin 22 is columnar or needle-shaped, and the heat dissipation plate 2 with such heat dissipation fins 22 can be referred to as a pin fin plate. A plurality of heat dissipation fins 22 are arranged at intervals on the first surface b1 of the base plate 21, and there is a gap between any two adjacent heat dissipation fins 22 to form a flow channel D for the cooling working fluid to flow.

[0067] In one embodiment, such as Figure 5a The heat sink 2 shown has a partial structure where the heat sink 2 has multiple heat dissipation teeth 22, including at least two adjacent first heat dissipation teeth 221. These at least two first heat dissipation teeth 221 can be arranged in a spaced-apart manner on a portion of the first surface b1 of the base plate 21. Specifically, along a direction parallel to the first surface b1, the distance H1 between the top ends d1 of any two adjacent first heat dissipation teeth 221 is less than the distance H2 between the bottom ends d2 of the two first heat dissipation teeth 221. The direction parallel to the first surface b1 includes a first direction X and a second direction Y. Figure 5a Example: Two first heat dissipation teeth 221 arranged along the first direction X.

[0068] Figure 5bThis refers to a portion of the structure of the heat sink 2, including a base plate 21 and an enlarged structure of two first heat dissipation fins 221 arranged along the first direction X. For example... Figure 5b As shown, along the first direction X, the space Q between the two first heat dissipation teeth 221 is used for the flow of cooling medium. The space Q is shown in shaded area. When the cooling medium flows through the space Q between the two first heat dissipation teeth 221, it can exchange heat by contacting the first surface b1 of the base plate 21 or by contacting the first heat dissipation teeth 221. The distance H1 between the top ends d1 of the two first heat dissipation teeth 221 is smaller than the distance H2 between the bottom ends d2 of the two first heat dissipation teeth 221. A larger area of ​​the first surface b1 of the base plate 21 can be exposed between the bottom ends d2 of the two first heat dissipation teeth 221, increasing the contact area between the cooling medium and the first surface b1 and enhancing the heat exchange effect.

[0069] Please continue to refer to Figure 5b As shown, along the third direction Z, the space Q between the two first heat dissipation teeth 221 varies. Within the same unit height, the amount of cooling medium that can be accommodated between the top ends d1 of the two first heat dissipation teeth 221 is less than the amount that can be accommodated between the bottom ends d2 of the two first heat dissipation teeth 221. When the cooling medium flows through the space Q between the two first heat dissipation teeth 221, a larger amount of cooling medium will pass through the bottom ends d2 of the two first heat dissipation teeth 221. The base plate 21 is used to contact the device to be cooled. Along the third direction Z, due to the simultaneous effect of convection and heat conduction, the temperature of the first heat dissipation teeth 221 is higher the closer they are to the base plate 21. Therefore, with the cooling medium flow rate remaining constant, distributing a larger amount of cooling medium in the space closer to the base plate 21 can improve the cooling effect. When the heat sink 2 with the first heat dissipation teeth 221 is used to dissipate heat for other devices, applying the at least two first heat dissipation teeth 221 to areas with higher heat dissipation requirements can provide targeted heat dissipation for devices with high heat consumption. Under the same liquid supply flow rate, it is possible to achieve a reasonable configuration of the cooling working fluid, thereby improving the energy efficiency ratio and stability of the entire heat dissipation system.

[0070] It should be understood that when the two first heat dissipation teeth 221 are arranged along the second direction Y, the distance H1 between the top ends d1 of the two first heat dissipation teeth 221 is smaller than the distance H2 between the bottom ends d2 of the two first heat dissipation teeth 221. This can also increase the contact area between the cooling medium and the first surface b1, and increase the flow rate of the cooling medium through the bottom ends d2 of the two first heat dissipation teeth 221, thereby enhancing the heat exchange effect.

[0071] In one embodiment, such as Figure 5bAs shown, the two first heat dissipation teeth 221 have similar structures. Along the third direction Z, the projection of the circumferential side of any one first heat dissipation tooth 221 toward the other first heat dissipation tooth 221 onto the first surface b1 is a plane. That is, the circumferential side of any one first heat dissipation tooth 221 toward the other first heat dissipation tooth 221 is inclined to the third direction Z, and the distance H1 between the top ends d1 of the two first heat dissipation teeth 221 is smaller than the distance H2 between the bottom ends d2 of the two first heat dissipation teeth 221, thereby increasing the amount of cooling medium flowing through the bottom ends d2 of the two first heat dissipation teeth 221.

[0072] In another embodiment, such as Figure 5c As shown, the two first heat dissipation teeth 221 have different structures. Along the third direction Z, the projection of the circumferential side of the right first heat dissipation tooth 221 towards the left first heat dissipation tooth 221 onto the first surface b1 is a plane. This circumferential side of the right first heat dissipation tooth 221 towards the left first heat dissipation tooth 221 is inclined with respect to the third direction Z. The projection of the circumferential side of the left first heat dissipation tooth 221 towards the right first heat dissipation tooth 221 onto the first surface b1 is a line. This makes the distance H1 between the top ends d1 of the two first heat dissipation teeth 221 smaller than the distance H2 between the bottom ends d2 of the two first heat dissipation teeth 221, increasing the amount of cooling medium flowing through the bottom ends d2 of the two first heat dissipation teeth 221. This is a specific structural illustration. Figure 5c In the diagram, the cross-section of the first heat dissipation tooth 221 on the left remains constant along the third direction Z, and the shape of the first heat dissipation tooth 221 on the left is a square column with a rectangular cross-section. The cross-section of the first heat dissipation tooth 221 on the right changes along the third direction Z, and the shape of the first heat dissipation tooth 221 is an inverted cone with a rectangular cross-section.

[0073] It should be understood that there may be other structural forms between any two adjacent first heat dissipation teeth 221, which can satisfy the condition that the distance between the bottom ends d2 of the two first heat dissipation teeth 221 is greater than the distance between the top ends d1, so that the space between the bottom ends d2 of the two first heat dissipation teeth 221 is greater than the space between the top ends d1 of the two first heat dissipation teeth 221, so that the cooling working fluid can flow through the bottom end d2 position of the first heat dissipation teeth 221 at a larger flow rate, thereby improving the cooling effect.

[0074] Figure 6a An example of the structure of a first heat dissipation fin 221 is provided. Figure 6a As shown, along a direction parallel to the first surface b1, the cross-sectional area of ​​the top end d1 of the first heat dissipation tooth 221 is larger than the cross-sectional area of ​​the bottom end d2. Along the third direction Z, within the same unit height, the volume on the top end d1 side of the first heat dissipation tooth 221 is larger than the volume on the bottom end d2 side. (The last sentence appears to be incomplete and possibly refers to a different topic.) Figure 6aWhen the first heat dissipation teeth 221 shown are arranged adjacently, the amount of cooling medium that can be accommodated between the top ends d1 of the two first heat dissipation teeth 221 is less than the amount of cooling medium that can be accommodated between the bottom ends d2 of the two first heat dissipation teeth 221.

[0075] Taking the cross-sectional shape of the first heat dissipation tooth 221 as a rectangle as an example, along the third direction Z, any side length of the rectangle at the top end d1 of the first heat dissipation tooth 221 is greater than the corresponding side length of the rectangle at the bottom end d2, such that the cross-sectional area of ​​the top end d1 is greater than the cross-sectional area of ​​the bottom end d2. Along the third direction Z, the projection t1 of the top end d1 of the first heat dissipation tooth 221 on the first surface b1 covers the projection t2 of the bottom end d2 of the first heat dissipation tooth 221 on the first surface b1. Figure 6a The shadow of the dashed border in the middle illustrates the shadow t1 of the top d1 of the first heat dissipation tooth 221 on the first surface b1.

[0076] In one embodiment, such as Figure 6a As shown, along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, at least one circumferential side of the first heat dissipation tooth 221 is inclined towards the center of the first heat dissipation tooth. Along the third direction Z, the cross-section of the first heat dissipation tooth 221 from the top end d1 to the bottom end d2 tends to decrease in size. Taking a rectangular cross-sectional shape as an example, along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, all four circumferential side surfaces of the first heat dissipation tooth 221 are inclined towards the center of the first heat dissipation tooth 221.

[0077] As a specific example, the first heat dissipation tooth 221 is an axisymmetric structure distributed about the third direction Z. Along the third direction Z, the cross-section of the first heat dissipation tooth 221 gradually decreases from the top end d1 to the bottom end d2, and the reduction range of the cross-section per unit height is the same.

[0078] Figure 6b An example of a structural deformation of the first heat dissipation tooth 221 is shown. (Compared to...) Figure 6a The structural difference of the first heat dissipation tooth 221 shown is that, along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, at least one of the four circumferential sides of the first heat dissipation tooth 221 is inclined towards the center of the first heat dissipation tooth 221. When two first heat dissipation teeth 221 are arranged adjacently, at least one of the first heat dissipation teeth 221 satisfies the condition of inclination towards the circumferential side of the other first heat dissipation tooth 221. This can be used to ensure that the amount of cooling medium that can be accommodated between the top ends d1 of the two first heat dissipation teeth 221 is less than the amount of cooling medium that can be accommodated between the bottom ends d2 of the two first heat dissipation teeth 221.

[0079] Figure 7a and 7b An example of a structural deformation of the first heat dissipation tooth 221 is shown. (Compared to...) Figure 6aThe structural difference of the first heat dissipation tooth 221 shown is that the cross section of the first heat dissipation tooth 221 perpendicular to the third direction Z is circular. The projection t1 of the top end d1 of the first heat dissipation tooth 221 on the first surface b1 covers the projection t2 of the bottom end d2 of the first heat dissipation tooth 221 on the first surface b1. The shadow of the top end d1 of the first heat dissipation tooth 221 on the first surface b1 is illustrated by the shadow of the dashed border.

[0080] like Figure 7a As shown, the first heat dissipation tooth 221 has a shape similar to an inverted cone. Along the third direction Z, the circumferential side surface of the first heat dissipation tooth 221 is an inclined surface. Along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, the circumferential side surface of the first heat dissipation tooth 221 is inclined towards the center of the first heat dissipation tooth 221, and its circumferential side surface is set at an angle with the third direction Z.

[0081] like Figure 7b As shown, with Figure 7a The difference is that, along the third direction Z, the circumferential side of the first heat dissipation tooth 221 is concave. Along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, the circumferential side of the first heat dissipation tooth 221 is concave towards the center of the first heat dissipation tooth 221, and its circumferential side smoothly transitions from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221.

[0082] by Figure 6a The shape of the first heat dissipation tooth 221 shown is for reference. Figures 8a to 8d Another structure of the first heat dissipation tooth 221 is shown. (Compared to...) Figure 6a The structural difference of the first heat dissipation tooth 221 shown is that, Figures 8a to 8d The circumferential side surface of the first heat dissipation tooth 221 shown is stepped. Along the direction from the top end d1 to the bottom end d2 of the first heat dissipation tooth 221, the circumferential side surface includes a first sidewall c1 and a second sidewall c2, which are arranged along a third direction Z. The distance between the first sidewall c1 and the first surface b1 is greater than the distance between the second sidewall c2 and the first surface b1. Along a direction parallel to the first surface b1, i.e., perpendicular to the third direction Z, the distance between the center of the first sidewall c1 and the center of the first heat dissipation tooth 221 is greater than the distance between the center of the second sidewall c2 and the center of the first heat dissipation tooth 221.

[0083] like Figure 8aAs shown, as an example, along the third direction Z, the first heat dissipation tooth 221 includes a first structural segment 2211 and a second structural segment 2212. One end of the second structural segment 2212 is fixed to the first surface b1 of the base plate 21, and the other end of the second structural segment 2212 is connected to the first structural segment 2211. The distance between the first structural segment 2211 and the first surface b1 is greater than the distance between the second structural segment 2212 and the first surface b1. The end of the first structural segment 2211 facing away from the second structural segment 2212 is the top end d1 of the first heat dissipation tooth 221, and the end of the second structural segment 2212 facing away from the first structural segment 2211 is the bottom end d2 of the first heat dissipation tooth 221. The projection of the first structural segment 2211 onto the first surface b1 covers the projection of the second structural segment 2212 onto the first surface b1. Along the direction perpendicular to the third direction Z, the first structural segment 2211 fans out the circumferential side of the second structural segment 2212, and the first structural segment 2211 and the second structural segment 2212 are distributed in an inverted step shape. The first sidewall c1 is a portion of the circumferential side surface of the first structural segment 2211, and the second sidewall c2 is a portion of the circumferential side surface of the second structural segment 2212. Two Figure 8a When the first heat dissipation fins 221 shown are arranged adjacently, the first sidewalls c1 of the two first heat dissipation fins 221 face each other, and the second sidewalls c2 of the two first heat dissipation fins 221 face each other. The space between the first sidewalls c1 of the two first heat dissipation fins 221 is smaller than the space between the two second sidewalls c2, and more cooling fluid can be accommodated between the second sidewalls c2 of the two first heat dissipation fins 221. Figure 8a When the first heat dissipation tooth 221 shown is arranged adjacent to another first heat dissipation tooth 221, the first sidewall c1 and the second sidewall c2 face the other first heat dissipation tooth 221, and the distance between the first sidewall c1 and the other first heat dissipation tooth 221 is smaller than the distance between the second sidewall c2 and the other first heat dissipation tooth 221. This makes the space between the top d1 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221 smaller than the space between the bottom d2. More cooling medium can be accommodated between the bottom d2 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221.

[0084] like Figure 8b Another type of first heat dissipation tooth 221 is shown, oriented Z. The first heat dissipation tooth 221 includes a first structural segment 2211 and a second structural segment 2212. One end of the second structural segment 2212 is fixed to the first surface b1 of the base plate 21, and the other end of the second structural segment 2212 is connected to the first structural segment 2211. The distance between the first structural segment 2211 and the first surface b1 is greater than the distance between the second structural segment 2212 and the first surface b1. The projection of the first structural segment 2211 onto the first surface b1 overlaps the projection of the second structural segment 2212 onto the first surface b1. Figure 8aThe difference in the first heat dissipation tooth 221 shown is that, along a direction perpendicular to the third direction Z (in this example, the first direction X), a portion of the first structural segment 2211 fans out onto the circumferential side of the second structural segment 2212, and the portion of the first structural segment 2211 and the second structural segment 2212 are distributed in an inverted stepped shape. The first sidewall c1 is a portion of the circumferential side of the first structural segment 2211 fanning out onto the second structural segment 2212, and the second sidewall c2 is a portion of the circumferential side of the second structural segment 2212. Two... Figure 8b When the first heat dissipation fins 221 shown are arranged adjacently, the first sidewalls c1 of the two first heat dissipation fins 221 face each other, and the second sidewalls c2 of the two first heat dissipation fins 221 face each other. The space between the first sidewalls c1 of the two first heat dissipation fins 221 is smaller than the space between the two second sidewalls c2, and more cooling fluid can be accommodated between the second sidewalls c2 of the two first heat dissipation fins 221. Figure 8c When the first heat dissipation tooth 221 shown is arranged adjacent to another first heat dissipation tooth 221, the first sidewall c1 and the second sidewall c2 of the first heat dissipation tooth 221 are made to face the other first heat dissipation tooth 221, and the distance between the first sidewall c1 and the other first heat dissipation tooth 221 is smaller than the distance between the second sidewall c2 and the other first heat dissipation tooth 221. This makes the space between the top d1 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221 smaller than the space between the bottom d2. The space between the bottom d2 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221 can accommodate more cooling medium.

[0085] like Figure 8c Another type of first heat dissipation tooth 221 shown, and Figure 8aThe difference in the first heat dissipation tooth 221 shown is that, along the third direction Z, the first heat dissipation tooth 221 includes a first structural segment 2211, a second structural segment 2212, and a third structural segment 2213. One end of the second structural segment 2212 is fixed to the first surface b1 of the base plate 21, and the other end of the second structural segment 2212 is connected to the third structural segment 2213. The end of the third structural segment 2213 facing away from the second structural segment 2212 is connected to the first structural segment 2211. The distance between the first structural segment 2211 and the first surface b1 is greater than the distance between the second structural segment 2212 and the first surface b1. The end of the first structural segment 2211 facing away from the third structural segment 2213 is the top end d1 of the first heat dissipation tooth 221, and the end of the second structural segment 2212 facing away from the third structural segment 2213 is the bottom end d2 of the first heat dissipation tooth 221. The projection of the first structural segment 2211 on the first surface b1 overlaps the projections of the second structural segment 2212 and the third structural segment 2213 on the first surface b1. Along a direction perpendicular to the third direction Z, the first structural segment 2211 fan out the circumferential side of the third structural segment 2213, and the third structural segment 2213 fan out the circumferential side of the second structural segment 2212. The first structural segment 2211, the third structural segment 2213, and the second structural segment 2212 are distributed in an inverted stepped pattern. The first sidewall c1 is a portion of the circumferential side of the first structural segment 2211, and the second sidewall c2 is a portion of the circumferential side of the second structural segment 2212. Alternatively, the first sidewall c1 is a portion of the circumferential side of the third structural segment 2213, and the second sidewall c2 is a portion of the circumferential side of the second structural segment 2212. Alternatively, the first sidewall c1 is a portion of the circumferential side of the first structural segment 2211, and the second sidewall c2 is a portion of the circumferential side of the third structural segment 2213. Two Figure 8c When the first heat dissipation fins 221 shown are arranged adjacently, the first sidewalls c1 of the two first heat dissipation fins 221 face each other, and the second sidewalls c2 of the two first heat dissipation fins 221 face each other. The space between the first sidewalls c1 of the two first heat dissipation fins 221 is smaller than the space between the two second sidewalls c2, and more cooling fluid can be accommodated between the second sidewalls c2 of the two first heat dissipation fins 221. Figure 8c When the first heat dissipation tooth 221 shown is arranged adjacent to another first heat dissipation tooth 221, the first sidewall c1 and the second sidewall c2 face the other first heat dissipation tooth 221, and the distance between the first sidewall c1 and the other first heat dissipation tooth 221 is smaller than the distance between the second sidewall c2 and the other first heat dissipation tooth 221. This makes the space between the top d1 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221 smaller than the space between the bottom d2. More cooling medium can be accommodated between the bottom d2 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221.

[0086] like Figure 8d Another type of first heat dissipation tooth 221 is shown, and Figure 8cThe difference in the first heat dissipation tooth 221 shown is that the projection of the first structural segment 2211 onto the first surface b1 covers the second structural segment 2212, and the projection of the third structural segment 2213 onto the first surface b1 covers the first structural segment 2211. Along the direction perpendicular to the third direction Z, the third structural segment 2213 fans out a portion of the circumferential side surface of the first structural segment 2211 and the second structural segment 2212. Alternatively, the first sidewall c1 is a portion of the circumferential side surface of the third structural segment 2213, and the second sidewall c2 is a portion of the circumferential side surface of the second structural segment 2212. Two Figure 8d When the first heat dissipation fins 221 shown are arranged adjacently, the first sidewalls c1 of the two first heat dissipation fins 221 face each other, and the second sidewalls c2 of the two first heat dissipation fins 221 face each other. The space between the first sidewalls c1 of the two first heat dissipation fins 221 is smaller than the space between the two second sidewalls c2, and more cooling fluid can be accommodated between the second sidewalls c2 of the two first heat dissipation fins 221. Figure 8d When the first heat dissipation tooth 221 shown is arranged adjacent to another first heat dissipation tooth 221, the first sidewall c1 and the second sidewall c2 face the other first heat dissipation tooth 221, and the distance between the first sidewall c1 and the other first heat dissipation tooth 221 is smaller than the distance between the second sidewall c2 and the other first heat dissipation tooth 221. This makes the space between the top d1 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221 smaller than the space between the bottom d2. More cooling medium can be accommodated between the bottom d2 of the first heat dissipation tooth 221 and the other first heat dissipation tooth 221.

[0087] The structure of the first heat dissipation tooth 221 can be formed by etching the base plate 21. Alternatively, the first heat dissipation tooth 221 can be made independently relative to the base plate 21 and then fixed to the first surface b1 of the base plate 21.

[0088] Figure 9 Another configuration of the base plate 21 and the first heat dissipation fin 221 is illustrated. For example... Figure 9As shown, the base plate 21 is engraved to form a second structural segment 2212 on the side of the base plate 21 facing away from the second surface b2. The second structural segment 2212 and the base plate 21 have an integral structure. The plane containing the end of the second structural segment 2212 facing the second surface b2 can be considered as the first surface b1 of the base plate 21. The first structural segment 2211 is independently manufactured relative to the base plate 21 and fixed to the side of the second structural segment 2212 away from the base plate 21. The first structural segment 2211 and the second structural segment 2212 are connected to form the first heat dissipation tooth 221. The shape of the second structural segment 2212 is relatively simple and can be manufactured on the base plate 21 more cheaply. Manufacturing the first structural segment 2211 and the second structural segment 2212 of the first heat dissipation tooth 221 separately can simplify the manufacturing process. The integral structure of the first structural segment 2211 and the base plate 21 can ensure good thermal conductivity and structural strength.

[0089] In some embodiments, each of the plurality of first heat dissipation teeth 221 adopts Figure 9 The fabrication process shown allows for the engraving of multiple second structural segments 2212 on the side of the base plate 21 facing away from the second surface b2, with each second structural segment 2212 being integrally formed with the base plate 21. Multiple first structural segments 2211 are formed through independent processes, and these segments can be interconnected. During assembly, each second structural segment 2212 is aligned with a corresponding first structural segment 2211 at its end facing away from the base plate 21, ultimately allowing each second structural segment 2212 to connect with a first structural segment 2211 to form a first heat dissipation tooth 221. Assembling multiple first structural segments 2211 together improves alignment accuracy and reduces assembly difficulty.

[0090] Figure 9 The structure of the first heat dissipation tooth 221 prepared by the process shown is similar to... Figure 8a The structures are similar, which is understandable. Figures 8b to 8c It can also be used partially or in full. Figure 9 Prepared using the process shown.

[0091] Figure 10a This refers to the structure of a heat sink 2, which has different heat dissipation fins 22 in different parts. For example... Figure 10a As shown, in one embodiment, the heat sink 2 has a plurality of heat dissipation teeth 22, including a plurality of first heat dissipation teeth 221 and a plurality of second heat dissipation teeth 222. The base plate 21 includes a first portion R1 and a second portion R2, which are arranged along a direction Z perpendicular to the third direction. The plurality of first heat dissipation teeth 221 are disposed on the first surface b1 corresponding to the first portion R1, and the plurality of second heat dissipation teeth 222 are disposed on the first surface b1 corresponding to the second portion R2.

[0092] Among them, the first heat dissipation tooth 221 is Figure 6a The structure shown is an example. The distance between the top ends d1 of any two adjacent first heat dissipation teeth 221 is smaller than the distance between their bottom ends d2. This allows for more cooling medium to be accommodated between the bottom ends d2 of two adjacent first heat dissipation teeth 221. The bottom of the flow channel D formed by the distribution of multiple first heat dissipation teeth 221 in the first part R1 can accommodate more cooling medium, and a greater flow rate of cooling medium can pass through the bottom ends d2 of the multiple first heat dissipation teeth 221, allowing more cooling medium to exchange heat with the first surface b1 and improving the cooling effect.

[0093] The second heat dissipation tooth 222 is schematically represented as a regular prism. Along the third direction Z, the cross-sectional size of the top d1 to the bottom d2 of the second heat dissipation tooth 222 is the same. The distance between the top d1 of any two adjacent second heat dissipation teeth 222 is equal to the distance between the bottom d2. The space between two adjacent second heat dissipation teeth 222 is the same along the third direction Z. The amount of cooling medium passing through the space between the top d1 of two second heat dissipation teeth 222 per unit height is the same as the amount passing through the space between the bottom d2 of two second heat dissipation teeth 222. When the distance between any two adjacent second heat dissipation teeth 222 is equal to the distance between the top d1 of any two adjacent first heat dissipation teeth 221, the flow rate of cooling medium passing through the space between the two adjacent first heat dissipation teeth 221 is greater than the flow rate of cooling medium passing through the space between the two adjacent second heat dissipation teeth 222. This makes the heat exchange effect of the cooling medium in the first part R1 better than that in the second part R2.

[0094] In some embodiments, the distance between the top end d1 of any two adjacent second heat dissipation teeth 222 is less than or equal to the bottom end d2, which reduces the flow rate of the cooling medium through the second part R2, optimizes the flow of the cooling medium, and makes a smaller amount of cooling medium pass through the second part R2.

[0095] for Figure 10aAs shown in the heat sink 2, when the cooling medium flows through the first surface b1 corresponding to the first part R1, the flow distribution of the cooling medium in the third direction Z is different. This allows a larger amount of cooling medium to flow through the bottom d2 side of the multiple first heat dissipation teeth 221, increasing the heat exchange between the cooling medium and the first surface b1. When the cooling medium flows through the second part R2, the flow distribution in the third direction Z is the same. When the spacing between any two adjacent heat dissipation teeth 22 is equal, compared to the second heat dissipation teeth 222, the structure of the first heat dissipation teeth 221 can distribute more cooling medium closer to the first surface b1, improving the heat exchange effect between the cooling medium and the device to be cooled via the base plate 21. Therefore, the heat sink 2 has a higher heat dissipation capacity in the first part R1 where the first heat dissipation teeth 221 are arranged. When using this heat sink 2 to dissipate heat from power modules and other structures, the first part R1 can be designed to correspond to structures with higher heat dissipation requirements. This allows more cooling fluid to flow through the first part R1, which has higher heat dissipation demands. This satisfies the high heat dissipation requirements of certain areas while saving cooling fluid flow and improving the effective utilization of the cooling fluid. Under the same liquid supply flow rate, a reasonable configuration of the cooling fluid can be achieved, improving the energy efficiency ratio and stability of the entire heat dissipation system.

[0096] In one embodiment, the base plate 21 of the heat sink 2 has two second portions R2 and one first portion R1, with the first portion R1 arranged between the two second portions R2 along a first direction X. Figure 10b This example illustrates how the heat sink 2 dissipates heat from the power module 1. The heat sink 2 includes a base plate 21 and multiple first heat dissipation teeth 221 and multiple second heat dissipation teeth 222. The base plate 21 is fixed to the side of the second metal layer 113 facing away from the insulating layer 111. The multiple first heat dissipation teeth 221 and multiple second heat dissipation teeth 222 are distributed on the side of the base plate 21 facing away from the second metal layer 113. Along the thickness direction of the base plate 21, the projection of the electronic component 12 of the power module 1 onto the first surface b1 of the base plate 21 falls on a first portion R1. When the cooling medium flows across the first surface b1 of the heat sink 2, the amount of cooling medium flowing through the multiple first heat dissipation teeth 221 near the bottom d2 of the first surface b1 is greater than the amount flowing through the multiple first heat dissipation teeth 221 away from the top d1 of the first surface b1. This allows for better heat exchange between the base plate 21 and the substrate 11, resulting in effective and targeted heat dissipation for the electronic component 12.

[0097] In one specific implementation, the first surface b1 of the base plate 21, the first portion R1 and the second portion R2 are arranged adjacent to each other along the first direction X. Along the first direction X, the edge of the first portion R1 is parallel to the edge of the second portion R2, and the boundary between the first portion R1 and the second portion R2 is parallel to the second direction Y.

[0098] Figure 11aAnother type of heat sink 2 has a structure in which different areas have different heat dissipation fins 22. For example... Figure 11a As shown, in one embodiment, the first surface b1 is not a continuous plane, and the distance between the first surface b1 corresponding to the first portion R1 and the second surface b2 is smaller than the distance between the first surface b1 corresponding to the second portion R2 and the second surface b2. Along the third direction Z, the thickness of the base plate 21 at the first portion R1 is less than the thickness at the second portion R2. When the cooling medium flows through the first surface b1 of the base plate 21, the cooling medium is closer to the second surface b2 of the base plate 21 at the first portion R1 than at the second portion R2. Therefore, the heat conduction path of the cooling medium through the base plate 21 to the device to be cooled is shorter, resulting in better heat dissipation capacity of the heat sink 2 at the first portion R1.

[0099] Combination Figure 11b As shown, the first part R1 and the second part R2 of the base plate 21 are arranged in a stepped manner. Multiple first heat dissipation teeth 221 are provided on the first surface b1 corresponding to the first part R1, and multiple second heat dissipation teeth 222 are provided on the first surface b1 corresponding to the second part R2. When the ends of the multiple heat dissipation teeth 22 that are away from the first surface b1 remain on the same plane, the distance between the multiple first heat dissipation teeth 221 distributed in the first part R1 and the first surface b1 is greater than the distance between the multiple second heat dissipation teeth 222 distributed in the second part R2 and the first surface b1. Along the third direction Z, the height of the first heat dissipation teeth 221 is greater than the height of the second heat dissipation teeth 222. When the cooling medium flows through the first surface b1 of the base plate 21, it is easier to accumulate at the first part R1. The amount of cooling medium distributed at the first part R1 is greater than the amount of cooling medium distributed at the second part R2, thus the heat dissipation capacity of the heat sink 2 is better at the first part R1.

[0100] Figure 11b This example illustrates how the heat sink 2 dissipates heat from the power module 1. Along the thickness direction of the base plate 21, the projection of the electronic component 12 of the power module 1 onto the first surface b1 of the base plate 21 falls on the first portion R1. When the cooling medium flows across the first surface b1 of the heat sink 2, more cooling medium can flow across the first surface b1 corresponding to the first portion R1, allowing more cooling medium to exchange heat with the substrate 11 through the first portion R1, thus effectively and specifically dissipating heat from the electronic component 12. Furthermore, by combining the fact that the amount of cooling medium flowing through the multiple first heat dissipation teeth 221 near the bottom d2 of the first surface b1 is greater than the amount flowing through the multiple first heat dissipation teeth 221 away from the top d1 of the first surface b1, the cooling effect can be further improved.

[0101] Figure 12a Another type of heat sink 2 is shown. Figure 12b This is a top view of the heat sink 2. See also... Figure 12a and Figure 12b The heat sink 2 and Figure 11a The difference in heat sink 2 shown is that, Figure 12a and Figure 12b The boundary between the first part R1 and the second part R2 in the diagram is not a continuous straight line. As an example, the boundary between the first part R1 and the second part R2 is a broken line. Figure 11b The first portion R1 is illustrated by a dashed line, within which multiple first heat dissipation teeth 221 are distributed. Along the second direction Y, the width of the middle portion R1 is greater than the width at both ends. Along the first direction X, the width of the middle portion R1 is greater than the width at both ends.

[0102] In practical implementation, the first part R1 and the second part R2 can be divided according to the distribution location of the high heat-dissipating devices to be cooled. This allows the first part R1, with its stronger heat dissipation capacity, to meet the heat dissipation requirements of the high heat-dissipating devices and optimize the liquid distribution of the cooling medium in different areas. This also optimizes the rational configuration of the cooling medium and improves the energy efficiency ratio and stability of the entire heat dissipation system. In one embodiment, under the same cooling medium flow rate, the heat sink 2 provided in this application embodiment can improve the heat dissipation effect by at least 10% compared to the heat sink in the conventional technology.

[0103] Figure 13 This example illustrates the working state of the heat sink 2 dissipating heat for the power module 1. For example... Figure 13 As shown, in a specific application, the base plate 21 of the heat sink 2 is fixed to the side of the second metal layer 113 of the power module 1 away from the insulating layer 111. Multiple first heat dissipation teeth 221 and multiple second heat dissipation teeth 222 are disposed on the side of the base plate 21 away from the power module 1. Other structures in the application scenario are used as a housing to cooperate with the heat sink 2. The housing contacts the end of each first heat dissipation tooth 221 away from the base plate 21 and the end of each second heat dissipation tooth 222 away from the base plate 21. The edge connection between the housing and the base plate 21 relatively closes the flow channel D, forming a cooling cavity. Cooling medium is circulated into the cooling cavity. The cooling medium can exchange heat through the multiple first heat dissipation teeth 221, the multiple second heat dissipation teeth 222, and the first surface b1 of the base plate 21, thereby achieving heat dissipation for the power module 1. In this configuration, multiple first heat dissipation teeth 221 correspond to electronic components 12 in the power module 1 along the thickness direction of the base plate 21, such that the projection of the electronic components 12 on the base plate 21 at least partially overlaps with the multiple second heat dissipation teeth 222. Furthermore, the base plate 21 corresponding to the distribution portion of the multiple first heat dissipation teeth 221 is relatively thin, allowing more cooling medium to flow through the multiple first heat dissipation teeth 221. This also enables the cooling medium passing through the distribution portion of the multiple first heat dissipation teeth 221 to achieve flow distribution closer to the base plate 21, providing more cooling medium flow to the portion closer to the power module 1 and improving the heat dissipation effect.

[0104] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat sink, characterized in that, The heat sink includes a base plate and multiple heat dissipation teeth; The base plate includes a first surface and a second surface opposite to each other. The first surface is used to provide the plurality of heat dissipation teeth, and the second surface is used to connect the device to be cooled. The bottom end of each heat dissipation tooth is fixed to the first surface, and the top end of each heat dissipation tooth extends away from the first surface along the thickness direction of the base plate. Any two adjacent heat dissipation teeth are spaced apart to form a flow channel for the cooling working fluid to flow. The plurality of heat dissipation teeth include at least two first heat dissipation teeth arranged adjacent to each other. Along a direction parallel to the first surface, the distance between the top ends of two adjacent first heat dissipation teeth is less than the distance between the bottom ends of two adjacent first heat dissipation teeth.

2. The heat sink as described in claim 1, characterized in that, Along a direction parallel to the first surface, the cross-sectional area of ​​the top end of at least one of two adjacent first heat dissipation teeth is greater than the cross-sectional area of ​​the bottom end.

3. The heat sink as described in claim 2, characterized in that, Along the thickness direction of the base plate, the projection of the top end of at least one of two adjacent first heat dissipation teeth on the first surface overlaps the projection of the bottom end on the first surface.

4. The heat sink as described in claim 1, characterized in that, Along the direction from the top end to the bottom end of the first heat dissipation tooth, at least one of the two adjacent first heat dissipation teeth has its circumferential side inclined toward the center of the first heat dissipation tooth.

5. The heat sink as described in claim 1, characterized in that, Along the direction from the top end to the bottom end of the first heat dissipation tooth, at least one of the two adjacent first heat dissipation teeth includes a first sidewall and a second sidewall on its circumferential side surface, and the distance between the first sidewall and the first surface is greater than the distance between the second sidewall and the first surface. Along a direction parallel to the first surface, the distance between the center of the first sidewall and the center of the first heat dissipation tooth is greater than the distance between the center of the second sidewall and the center of the first heat dissipation tooth.

6. The heat sink as described in claim 5, characterized in that, At least one of the two adjacent first heat dissipation teeth includes a first structural segment and a second structural segment. Along the thickness direction of the base plate, the second structural segment is connected between the first structural segment and the first surface, and the projection of the first structural segment on the first surface covers the projection of the second structural segment on the first surface. The first sidewall is a part of the circumferential side surface of the first structural segment, and the second sidewall is a part of the circumferential side surface of the second structural segment.

7. The heat sink as described in claim 6, characterized in that, The second structural segment and the base plate have an integral structure.

8. The heat sink as described in claim 1, characterized in that, Along a direction parallel to the first surface, the base plate includes a first portion and a second portion, wherein the thickness of the base plate in the first portion is less than the thickness of the base plate in the second portion; The at least two first heat dissipation teeth are distributed on the first surface corresponding to the first part.

9. The heat sink as described in claim 8, characterized in that, The plurality of heat dissipation teeth include a plurality of second heat dissipation teeth arranged sequentially adjacent to each other, and the plurality of second heat dissipation teeth are distributed on the first surface corresponding to the second part; Along a direction parallel to the first surface, the distance between the top ends of two adjacent second heat dissipation teeth is less than or equal to the distance between the bottom ends of two adjacent second heat dissipation teeth.

10. The heat sink as described in any one of claims 1-9, characterized in that, Each of the heat dissipation teeth lies in the same plane away from the top of the first surface.

11. A power conversion device, characterized in that, The power conversion device includes a circuit board, a power module, and a heat sink as described in any one of claims 1-10; The power module is mounted on the circuit board; The second surface of the base plate is fixed to the surface of the power module that is away from the circuit board.

12. An electric vehicle, characterized in that, The electric vehicle includes a power source, wheels, and a powertrain, the powertrain including a drive motor and a power conversion device as described in claim 11; The powertrain is used to receive DC power from the power source and convert the DC power into AC power for output to the drive motor, which is connected to the wheels.

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