Cylinder and pit composite enhanced heat exchange channel heat dissipation structure

Abstract

The utility model provides a cylinder and pit composite enhanced heat transfer channel heat dissipation structure, which comprises a plurality of cylinder structures (2) arranged on at least one inner wall surface (1) of a channel, the plurality of cylinder structures (2) are arranged in an array form, a plurality of first pit structures (3) are arranged on the inner wall surface (1) between two adjacent columns of cylinder structures (2), and the first pit structures (3) are arranged on the inner wall surface (1) between two adjacent columns of cylinder structures (2). Each column of cylindrical structures (2) and the first pit structures (3) located on the downstream portion of the cylindrical structures (2) are arranged in a staggered mode in the fluid flowing direction, and at least one second pit structure (4) is formed in the side face of each cylindrical structure (2). The cylindrical microstructure not only increases the heat dissipation area, but also promotes rapid transfer of heat as a boiling vaporization core; the concave pit structure increases the convective heat transfer coefficient by increasing fluid disturbance, and further enhances the heat dissipation effect. The heat dissipation structure has the advantages of being compact in structure, high in heat dissipation efficiency and the like.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, specifically a channel heat dissipation structure designed to improve cooling efficiency by combining cylindrical and concave elements to enhance heat transfer. Background Technology

[0002] Chips are the core components of electronic devices. With technological advancements, chips exhibit characteristics such as high power density and high performance, resulting in the generation of significant heat during operation. Overheating of chips can have numerous adverse effects, such as reduced efficiency and lifespan. Therefore, constructing and implementing efficient chip packaging heat dissipation mechanisms is crucial for ensuring their performance and lifespan.

[0003] Microchannel cooling technology utilizes the high specific surface area and small size of tiny channels to improve heat transfer efficiency. These microchannels typically range in size from a few micrometers to hundreds of micrometers, resulting in a relatively large heat exchange area between the fluid and the heat source. This allows for faster heat transfer to the fluid, achieving highly efficient heat dissipation. Therefore, microchannel cooling technology has received widespread attention in the field of chip packaging.

[0004] Traditional cooling channel designs often employ simple geometries, such as straight channels or simple corrugated channels. These designs, to some extent, limit heat exchange efficiency and fluid dynamic performance. In recent years, while attempts have been made to enhance convective heat transfer by introducing structures such as fins and turbulence columns, these methods, while improving heat transfer efficiency, may also lead to increased flow resistance and energy consumption. Therefore, developing a novel cooling channel structure that can effectively improve heat transfer efficiency while reasonably controlling flow resistance is particularly important. Utility Model Content

[0005] The purpose of this invention is to provide a channel heat dissipation structure that combines a cylinder and a recess to enhance heat exchange. By cleverly combining the two geometric features of a cylinder and a recess, it effectively disturbs the fluid flow, increases the contact area and turbulence between the fluid and the channel wall, thereby improving heat exchange efficiency while maintaining relatively low flow resistance.

[0006] The above-mentioned objective of this utility model is achieved through the following technical solution: a channel heat dissipation structure for enhanced heat transfer by a combination of cylinders and pits, comprising a plurality of cylindrical structures and a plurality of first pit structures disposed on at least one inner wall surface of the channel, wherein the plurality of cylindrical structures are arranged in an array, and a plurality of first pit structures are disposed on the inner wall surface between two adjacent rows of cylindrical structures to induce fluid to generate vortices and turbulence, thereby enhancing the convective heat transfer effect; each row of cylindrical structures and a plurality of first pit structures located downstream of it are staggered in the direction of fluid flow to form a curved flow channel; and each cylindrical structure has at least one second pit structure on its side.

[0007] Furthermore, a cylindrical structure is provided directly downstream of each first recessed structure.

[0008] Furthermore, each cylindrical structure has two second recessed structures on its side.

[0009] Furthermore, the two second recessed structures are arranged opposite each other on the side of the cylindrical structure, and the line connecting the centers of the two second recessed structures is perpendicular to the direction of fluid flow.

[0010] Furthermore, the channel is made of copper, which has high thermal conductivity.

[0011] Furthermore, the protrusion height of the cylindrical structure is between 0.5 mm and 0.8 mm, and the diameter is between 0.1 mm and 0.3 mm. The spacing between adjacent cylindrical structures in each row is between 0.5 mm and 1.5 mm, and a predetermined spacing is maintained between adjacent cylindrical structures to increase the contact area between the fluid and the inner wall of the channel and promote boiling heat transfer.

[0012] Furthermore, the geometry of the first recess structure and / or the second recess structure includes a circle, an ellipse, a rectangle, or a hexagon, with a depth between 0.1 mm and 0.3 mm, and a diameter or equivalent diameter between 0.5 mm and 1 mm.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The composite structure of ribbed cylindrical structure and recesses in the channel greatly expands the heat exchange area. When the cooling medium flows through, there is more area available for heat exchange. When the cooling medium flows through the recesses, it forms local eddies. These eddies interact with the ribbed cylindrical structure to promote turbulent flow of the cooling medium. Turbulence can break the thermal boundary layer and make the hot and cold fluids mix more fully, so that heat can be transferred from the heat-generating equipment to the cooling medium at a faster speed, ultimately achieving a significant improvement in heat dissipation efficiency.

[0015] 2. The rational design of the spacing of the ribbed cylindrical structure is crucial. Similarly, the distribution of the recesses also needs careful consideration. By selecting the optimal spacing, the flow path of the cooling medium is optimized, the flow resistance is significantly reduced, and the power required by the pump to drive the circulation of the cooling medium is correspondingly reduced. This not only saves energy but also improves the energy efficiency ratio of the entire cooling system, making the cooling system more economical and efficient during operation. Simulation experiments in this invention show that, taking a circular recess as an example, when its depth is between 0.1 mm and 0.3 mm, its diameter is between 0.5 mm and 1 mm, and the height of the ribbed cylindrical structure is between 0.5 mm and 0.8 mm, its diameter is between 0.1 mm and 0.3 mm, and the interval between adjacent ribbed cylindrical structures is between 0.5 mm and 1.5 mm, the heat exchange effect of this structure is effectively improved.

[0016] 3. Enhanced mechanical strength of the rectangular channel: The ribbed cylindrical structure and the recesses together enhance the overall structural stability of the rectangular channel. When facing vibration and impact, this composite structure can effectively disperse stress and avoid channel damage due to excessive local stress. It can ensure that the cooling structure remains intact in complex and ever-changing environments and continuously provide reliable heat dissipation for the equipment.

[0017] 4. Wide range of applications: This utility model is applicable to a variety of cooling needs. It not only has a huge advantage in the field of chip heat dissipation, but also shows great potential in the application of heat dissipation for high-power devices. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation channel.

[0019] Figure 2 for Figure 1 A schematic diagram showing the distribution of the cylindrical structure and the recessed structure.

[0020] Figure 3 for Figure 2 A top-view cross-section.

[0021] Figure 4 This is a comparison of the surface temperature of the heat flow between the traditional smooth structure and this structure. Detailed Implementation

[0022] The specific content of this utility model will be further explained in detail below with reference to the accompanying drawings.

[0023] like Figure 1As shown, the rectangular channel heat dissipation structure of this utility model includes a rectangular channel wall 1 and a first recess structure 3 disposed on the wall. The rectangular channel has a top wall, a bottom wall, and two side walls, forming a closed fluid channel. Rib-shaped cylindrical structures 2 are distributed in an array on the wall 1, and the first recess structure 3 is distributed on the wall 1 in a certain arrangement. Compared with smooth cylindrical ribs, the recess design on the cylinder can increase the contact area with the fluid. According to the principle of heat transfer, with an increased heat transfer area, the heat transfer will increase accordingly under the condition that other factors remain unchanged. At the same time, the second recess 4 on the cylindrical rib changes the flow state of the fluid, causing the fluid flowing through this area to generate more eddies and turbulence. The increase in turbulence can reduce the thickness of the fluid boundary layer. Since the boundary layer is a region with high thermal resistance, thinning the boundary layer helps to reduce thermal resistance, thereby enhancing heat transfer.

[0024] exist Figure 2 The distribution of the ribbed cylindrical structure 2 and the first recessed structure 3 on the wall surface can be seen more clearly in the image. The height of the ribbed cylindrical structure 2 is between 0.5 mm and 0.8 mm, the diameter is between 0.1 mm and 0.3 mm, and the spacing between them is between 0.5 mm and 1.5 mm to optimize heat dissipation. The first recessed structure 3 and / or the second recessed structure 4 are circular in shape, with a depth between 0.1 mm and 0.3 mm and a diameter between 0.5 mm and 1 mm.

[0025] exist Figure 3The diagram illustrates more intuitively the arrangement of the first recessed structure 3 and the cylindrical structure 2. The cylindrical structure 2 and the first recessed structure 3 are arranged alternately, and their staggered arrangement forms a curved flow channel. This design effectively enhances the convective heat transfer mechanism. When the fluid flows in the channel, a relatively stable boundary layer forms near the wall, which has a high thermal resistance, limiting the effective transfer of heat. At the cylindrical structure 2, the fluid is forced to change direction to bypass it; at the first recessed structure 3, the flow space and velocity distribution of the fluid also change. From a microscopic perspective, the boundary layer disturbance increases the heat exchange opportunities between fluid particles and the wall, allowing heat to be transferred more efficiently from the wall to the fluid. Simultaneously, the arrangement of the cylindrical structure 2 and the first recessed structure 3 increases the surface area of ​​the channel wall. The cylindrical structure 2 protrudes from the wall, while the first recessed structure 3 forms a depression within the wall; both create additional heat exchange areas on the originally flat wall surface. When fluid flows through a curved channel, it comes into contact with more wall surface area, thus providing more heat transfer paths. Under the same fluid flow rate and temperature conditions, a larger heat exchange area means more heat can be carried away, which directly improves the cooling capacity of the entire heat dissipation structure. Furthermore, the presence of the curved channel promotes the fluid flow to gradually develop into a turbulent state. The multiple disturbances to the fluid by the cylindrical structure 2 and the first recessed structure 3 enhance the fluid velocity pulsation and increase the Reynolds number, thereby promoting the formation and development of turbulence. The strong mixing characteristics of turbulence allow heat to diffuse rapidly in the fluid, reducing the temperature gradient between the wall and the fluid, further improving heat dissipation efficiency.

[0026] The inner surface of the rectangular channel is optimized, such as by adjusting the surface roughness, plating, or coating, to further improve heat exchange efficiency and durability.

[0027] The heat dissipation structure is integrated into the chip's heat dissipation module to efficiently transfer the heat generated by the chip to the cooling fluid flowing through the rectangular channel. The cylindrical microstructure not only increases the heat dissipation area but also acts as a boiling vaporization nucleus, promoting rapid heat transfer; the recessed structure further enhances the heat dissipation effect by increasing fluid turbulence and improving the convective heat transfer coefficient. This heat dissipation structure boasts advantages such as compact structure and high heat dissipation efficiency, providing strong support for the stable operation and performance improvement of the chip.

[0028] exist Figure 4 The image shows a comparison of the temperature (T) along the centerline of the fluid flow path on the heat flow surface between a conventional smooth structure and this new structure. The conventional structure is a smooth cylindrical structure without the second recess structure 4 and the first recess structure 3. The vertical axis represents the temperature of the heat flow surface, and the horizontal axis represents the distance of the heat flow surface along the centerline of the fluid flow path. Because the cylindrical structure 2 of this invention has a strong heat transfer effect, Figure 4The temperature curve along the fluid development centerline on the heat flow surface of the channel containing the cylindrical structure 2 is wavy, with lower temperatures corresponding to flow through the cylindrical structure 2 and higher temperatures corresponding to flow through the first concave structure 3. In contrast, the smooth channel experiences a gradual temperature increase as the fluid flows forward, reducing the temperature difference with the heat flow surface and thus decreasing its heat exchange capacity. This leads to heat accumulation, resulting in an upward-sloping temperature curve along the fluid development centerline on the heat flow surface. It can be seen that compared to the traditional smooth structure, this structure significantly reduces the surface temperature of the heat flow and exhibits a more uniform temperature distribution.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A channel heat dissipation structure combining a cylinder and a recess to enhance heat transfer, characterized in that, The passage includes a plurality of cylindrical structures (2) and a plurality of first recess structures (3) disposed on at least one inner wall surface (1) of the passage. The plurality of cylindrical structures (2) are arranged in an array. A plurality of first recess structures (3) are disposed on the inner wall surface (1) between two adjacent rows of cylindrical structures (2). Each row of cylindrical structures (2) and the plurality of first recess structures (3) located downstream of it are staggered in the direction of fluid flow. Each cylindrical structure (2) has at least one second recess structure (4) on its side.

2. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer as described in claim 1, characterized in that, A cylindrical structure (2) is provided directly downstream of each first recess structure (3).

3. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer as described in claim 1, characterized in that, Each cylindrical structure (2) has two second recessed structures (4) on its side.

4. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer as described in claim 3, characterized in that, Two second recessed structures (4) are arranged opposite each other on the side of the cylindrical structure (2), and the line connecting the centers of the two second recessed structures (4) is perpendicular to the direction of fluid flow.

5. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer according to any one of claims 1-4, characterized in that, The material of the channel is copper.

6. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer according to any one of claims 1-4, characterized in that, The protrusion height of the cylindrical structure (2) is between 0.5 mm and 0.8 mm, and the diameter is between 0.1 mm and 0.3 mm. The interval between adjacent cylindrical structures (2) in each column is between 0.5 mm and 1.5 mm.

7. The channel heat dissipation structure with composite enhancement of cylindrical and recessed heat transfer according to claim 6, characterized in that, The geometry of the first recess structure (3) and / or the second recess structure (4) includes circular, elliptical, rectangular or hexagonal shapes, with a depth between 0.1 mm and 0.3 mm and a diameter or equivalent diameter between 0.5 mm and 1 mm.

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