Integrated circuit packaging structure with high heat dissipation performance

Abstract

The utility model relates to the technical field of integrated circuit packaging, in particular to an integrated circuit packaging structure with high heat dissipation performance, which comprises a shell, an integrated circuit board arranged in an inner cavity of the shell, a heat dissipation plate arranged at the top of the integrated circuit board and a packaging plate arranged at the top of the heat dissipation plate. According to the utility model, through the heat conduction assembly composed of the heat conduction plate and the metal conduction band, a high-efficiency and multi-path heat conduction network from the chip to the heat dissipation plate is established, heat is rapidly transferred, and the stepped design of the support assembly is matched with the sealing ring, so that stable support is provided, stress relief and radial sealing are realized, and the heat dissipation efficiency is improved. The trapezoid heat dissipation blocks and the sealing heat dissipation channels formed by the partition plates work cooperatively, the effective heat dissipation area is increased to the maximum extent, efficient convection heat dissipation airflow is guided to be formed, the whole structure ensures that the interior of the package is clean and reliable through multiple sealing measures while the heat dissipation performance is remarkably improved, the structure is compact, and practicability is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit packaging technical field especially relates to a high heat dissipation's integrated circuit packaging structure. BACKGROUND

[0002] With the rapid development of integrated circuit technology, the integration and power consumption of chips are continuously improved, and the heat generated during operation also increases sharply. Excessive heat can seriously affect the performance, reliability and service life of the chip, therefore, efficient heat dissipation has become a key challenge in modern integrated circuit packaging design.

[0003] At present, the common integrated circuit packaging heat dissipation mode depends on the heat dissipation fin on the top of the chip or the heat conduction through the packaging shell, however, these modes often have problems such as long heat conduction path, large contact thermal resistance, limited heat dissipation area, etc., which cause the heat to be unable to be dissipated in time and uniformly, and easily form hot spots in local. SUMMARY

[0004] The utility model discloses a high heat dissipation's integrated circuit packaging structure, through the cooperation of support assembly and heat conduction component, the integrated circuit packaging structure in prior art, the problem of low heat dissipation efficiency and thermal stress concentration is solved.

[0005] The utility model discloses a high heat dissipation's integrated circuit packaging structure, including the casing, sets up in the integrated circuit board of casing inner chamber, sets up the heat dissipation board on the top of integrated circuit board, sets up the packaging board on the top of heat dissipation board, the top fixed connection of integrated circuit board has support assembly, the bottom of heat dissipation board is provided with heat conduction component, and the bottom of heat dissipation board is provided with mounting hole.

[0006] As preferred, the support assembly includes a first support column fixedly connected to the top of the integrated circuit board, and a second support column fixedly connected to the top of the first support column, wherein the diameter of the second support column is smaller than that of the first support column.

[0007] As preferred, the top of the first support column is provided with an annular groove, and a sealing ring is arranged in the inner cavity of the annular groove.

[0008] As preferred, the number of mounting holes is four, and each mounting hole is located at a corner of the heat dissipation plate.

[0009] As preferred, the heat conduction component includes a heat conduction plate fixedly connected to the bottom of the heat dissipation plate, and a metal strip connected to one side of the heat conduction plate.

[0010] As preferred, the top of the heat dissipation plate is provided with a sealing groove, and a sealing strip is arranged in the inner cavity of the sealing groove.

[0011] Preferably, the top of the heat dissipation plate is provided with a heat dissipation block in the shape of a trapezoid.

[0012] Preferably, the packaging plate is fixedly connected with a partition plate on one side, and the housing is provided with heat dissipation holes at both ends.

[0013] The heat dissipation assembly composed of the heat conduction plate and the metal conducting band establishes an efficient and multi-path heat conduction network from the chip to the heat dissipation plate, quickly transfers heat, and the stepped design of the support assembly cooperates with the sealing ring to provide stable support and realize stress relief and radial sealing. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used for the embodiment description.

[0015] Figure 1 It is a perspective view of a high-heat-dissipation integrated circuit packaging structure.

[0016] Figure 2 It is a cooperation diagram of a support assembly and a sealing ring in a high-heat-dissipation integrated circuit packaging structure.

[0017] Figure 3 It is a cooperation diagram of a heat dissipation block and a partition plate in a high-heat-dissipation integrated circuit packaging structure.

[0018] Figure 4 It is an exploded view of a heat dissipation plate and a packaging plate in a high-heat-dissipation integrated circuit packaging structure.

[0019] Figure 5 It is a bottom view of a heat dissipation plate in a high-heat-dissipation integrated circuit packaging structure.

[0020] Reference signs: 1, housing; 2, integrated circuit board; 3, heat dissipation plate; 4, packaging plate; 5, support assembly; 51, first support column; 52, second support column; 6, heat conduction assembly; 61, heat conduction plate; 62, metal conducting band; 7, mounting hole; 8, annular groove; 9, sealing ring; 10, sealing groove; 11, sealing strip; 12, heat dissipation block; 13, partition plate; 14, heat dissipation hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model, and the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Embodiment 1

[0022] Please refer to Figures 1-5 , the first embodiment of the utility model provides a kind of integrated circuit package structure of high heat dissipation, including shell 1, the integrated circuit board 2 of being arranged in the cavity of shell 1, the heat sink plate 3 of being arranged in the top of integrated circuit board 2, the package plate 4 of being arranged in the top of heat sink plate 3, integrated circuit board 2 top is fixedly connected with support assembly 5, heat sink plate 3 bottom is provided with heat conducting component 6, heat sink plate 3 bottom is provided with mounting hole 7, heat conducting component 6 includes the heat conducting plate 61 of being fixedly connected in the bottom of heat sink plate 3, the metal guide band 62 connected with one side of heat conducting plate 61, heat sink plate 3 top is provided with heat dissipation block 12, heat dissipation block 12 shape is trapezoidal, package plate 4 one side is fixedly connected with partition 13, shell 1 both ends are provided with heat dissipation hole 14.

[0023] When working, the power chip on integrated circuit board 2 generates heat, which is efficiently conducted to the main body of heat sink plate 3 above it through direct contact heat conducting plate 61, while metal guide band 62 dispersed in the gap absorbs the heat of chip peripheral elements and air, which is also conducted to heat sink plate 3, and the temperature of heat sink plate 3 rises, and the trapezoidal heat dissipation block 12 on it greatly increases the heat dissipation area.

[0024] The heat is transferred to the air flowing through the sealed channel formed by partition 13, and discharged from the heat dissipation hole 14 at one end of the channel to shell 1, and the cooler air outside is naturally sucked in from the heat dissipation hole 14 at the other end of the channel to form a stable chimney effect convection circulation to continuously discharge heat, and in the whole process, the sealing ring 9 on the support assembly 5 and the sealing strip 11 at the edge of the heat sink plate 3 work together to ensure the sealing of the package inner cavity, so that the convection heat dissipation is only carried out in the specified channel, and the internal circuit is protected from the influence of the external environment. Embodiment 2

[0025] Please refer to Figure 2 , the second embodiment of the utility model is based on the previous embodiment.

[0026] Specifically: support assembly 5 includes first support column 51 fixedly connected to the top of integrated circuit board 2, second support column 52 fixedly connected to the top of first support column 51, the diameter of second support column 52 is smaller than the diameter of first support column 51, the number of mounting holes 7 is four, and they are respectively located at the four corners of heat sink plate 3.

[0027] The stepped support column ensures structural stability, the small-diameter top and the sealing ring 9 design achieve reliable radial dynamic sealing, adapt to thermal expansion and cold shrinkage, the precise positioning design of the mounting hole 7 ensures the flatness and stability of the heat dissipation plate 3 after installation, the heat conduction plate 61 can maintain good contact with the chip on the integrated circuit board 2, reduce the contact thermal resistance, and meanwhile ensure that the sealing ring 9 and the sealing strip 11 are uniformly pressed everywhere, so that the best sealing effect is achieved. Example 3

[0028] Please refer to Figure 2 With Figure 3 As the third embodiment of the utility model, the embodiment is based on the previous two embodiments.

[0029] Specifically, the first support column 51 has an annular groove 8 at the top, the annular groove 8 has a sealing ring 9 in the inner cavity, the heat dissipation plate 3 has a sealing groove 10 at the top, and the sealing groove 10 has a sealing strip 11 in the inner cavity.

[0030] When the heat dissipation plate 3 is sleeved on the second support column 52 through the mounting hole 7 and is pressed tightly, the sealing ring 9 is compressed, effective radial sealing can be formed between the support column and the heat dissipation plate 3, external gas is prevented from penetrating into the packaging inner cavity along this path, the sealing strip 11 forms reliable end face sealing between the heat dissipation plate 3 and the packaging plate 4, and the combined action of the sealing ring 9 and the sealing strip 11 builds a double-sealing barrier for the entire integrated circuit board 2 area, effectively isolating harmful gases and impurities from the outside.

[0031] It should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model and not to limit, although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the utility model can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the utility model, and all should be covered in the scope of the claims of the utility model.

Claims

1. A high heat dissipation integrated circuit packaging structure, comprising a housing (1), an integrated circuit board (2) disposed within the cavity of the housing (1), a heat sink (3) disposed on top of the integrated circuit board (2), and a packaging board (4) disposed on top of the heat sink (3), characterized in that: The integrated circuit board (2) is fixedly connected to the top of a support assembly (5), the heat sink (3) is provided with a heat conduction assembly (6) at the bottom, and the heat sink (3) is provided with mounting holes (7) at the bottom.

2. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: The support assembly (5) includes a first support column (51) fixedly connected to the top of the integrated circuit board (2), and a second support column (52) fixedly connected to the top of the first support column (51), wherein the diameter of the second support column (52) is smaller than the diameter of the first support column (51).

3. The high heat dissipation integrated circuit packaging structure according to claim 2, characterized in that: The top of the first support column (51) is provided with an annular groove (8), and a sealing ring (9) is provided in the inner cavity of the annular groove (8).

4. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: The number of mounting holes (7) is four, and they are located at the four corners of the heat sink (3).

5. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: The heat-conducting component (6) includes a heat-conducting plate (61) fixedly connected to the bottom of the heat sink (3) and a metal guide strip (62) connected to one side of the heat-conducting plate (61).

6. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: The top of the heat sink (3) is provided with a sealing groove (10), and the inner cavity of the sealing groove (10) is provided with a sealing strip (11).

7. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: The heat sink (3) is provided with a heat sink block (12) on top, and the heat sink block (12) is trapezoidal in shape.

8. The high heat dissipation integrated circuit packaging structure according to claim 1, characterized in that: A partition (13) is fixedly connected to one side of the encapsulation plate (4), and heat dissipation holes (14) are provided at both ends of the housing (1).

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