Semiconductor particle cleaning device and semiconductor equipment
By combining electrostatic adsorption components and a driving mechanism, impurities such as silicon wafer fragments are automatically cleaned, solving the problems of low efficiency, poor quality, and safety hazards in existing technologies, and achieving efficient and safe cleaning results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-04-10
AI Technical Summary
In existing technologies, manual cleaning of silicon wafer fragments and other impurities is inefficient, of poor quality, harmful to human health, and can easily damage equipment.
It employs an electrostatic adsorption assembly and a driving mechanism. An electrostatic generator causes the electrostatic adsorption plate to carry static electricity, and the driving mechanism drives the electrostatic adsorption plate close to the equipment to be cleaned, automatically adsorbing and removing impurities.
It achieves efficient, unmanned impurity cleaning, avoids harm to the human body, reduces cleaning costs, and protects equipment.
Smart Images
Figure CN224101397U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of cleaning, in particular to a semiconductor particle cleaning device and a semiconductor device. BACKGROUND
[0002] Plasma enhanced chemical vapor deposition is a technology for depositing thin films on the surface of a silicon wafer in the field of semiconductor manufacturing technology. During the operation of the technology, silicon wafer fragments and other impurities are easily accumulated on the inner wall of the furnace tube, which eventually affects the quality of the deposition and the stability of the equipment. In the related art, the silicon wafer fragments and other impurities accumulated on the inner wall of the furnace tube are cleaned manually. This way of cleaning silicon wafer fragments and other impurities has low cleaning efficiency, poor cleaning quality, is harmful to human health, and is easy to damage the equipment. CONTENT OF THE UTILITY MODEL
[0003] Therefore, it is necessary to provide a semiconductor particle cleaning device and a semiconductor device to solve the problems of low cleaning efficiency, poor cleaning quality, harm to human health, and easy damage to the equipment in the current manual cleaning of silicon wafer fragments and other impurities.
[0004] A semiconductor particle cleaning device comprises:
[0005] An electrostatic adsorption assembly comprising an electrostatic generator and an electrostatic adsorption plate electrically connected to each other.
[0006] A driving mechanism connected to the electrostatic adsorption plate, configured to drive the electrostatic adsorption plate to move.
[0007] In one embodiment, the driving mechanism comprises a first driving member and a connecting member.
[0008] The fixed end of the first driving member is slidingly connected to the connecting member in a first direction, and the movable end of the first driving member is connected to the electrostatic adsorption plate. The first driving member is configured to drive the electrostatic adsorption plate to move in the first direction.
[0009] In one embodiment, the driving mechanism comprises a sliding platform slidingly connected to the connecting member, and the fixed end of the first driving member is arranged on the sliding platform.
[0010] In one embodiment, the driving mechanism comprises a second driving member.
[0011] The second driving member is connected to the connecting member, and the second driving member is configured to drive the connecting member to move in a second direction. The first direction and the second direction are arranged intersectingly.
[0012] In one embodiment, one end of the connecting member in the first direction is connected to the second driving member.
[0013] In one of the embodiments, the driving mechanism comprises a mounting plate, which is arranged on the side of the first driving member away from the second driving member along the first direction and is spaced apart from the connecting member along the second direction, and the mounting plate is connected with the movable end of the first driving member;
[0014] The side of the mounting plate along the second direction is provided with a bearing surface, and the other side is connected with the electrostatic adsorption plate;
[0015] The electrostatic adsorption plate is located between the mounting plate and the connecting member and is connected with the mounting plate.
[0016] In one of the embodiments, the side of the electrostatic adsorption plate away from the mounting plate is provided with an adsorption surface, and the adsorption surface is used for adsorbing impurities;
[0017] The adsorption surface is spaced apart from the side of the connecting member close to the mounting plate along the second direction.
[0018] In one of the embodiments, the semiconductor particle cleaning device comprises a dust collection box, which is arranged on the side of the connecting member away from the second driving member along the first direction;
[0019] The dust collection box is used for accommodating the impurities adsorbed by the electrostatic adsorption plate.
[0020] In one of the embodiments, the semiconductor particle cleaning device comprises a controller, which is communicatively connected with the electrostatic generator.
[0021] Compared with the traditional way of manually cleaning the accumulated silicon wafer fragments and other impurities on the inner wall of the furnace tube, the cleaning efficiency is low, the cleaning quality is poor, the human health is harmed, and the equipment is easily damaged. In the semiconductor particle cleaning device in the embodiment, the electrostatic generator is electrically connected with the electrostatic adsorption plate, the electrostatic generator makes the surface of the electrostatic adsorption plate carry static electricity, the driving mechanism drives the electrostatic adsorption plate with static electricity to approach the equipment to be cleaned, so that the electrostatic adsorption plate adsorbs and transfers the impurities in the equipment to be cleaned, and then the electrostatic cleaning of the equipment to be cleaned is performed. The whole cleaning process is fully automated and does not require manual participation. The electrostatic adsorption plate does not directly contact the equipment to be cleaned. In summary, the semiconductor particle cleaning device in the embodiment can efficiently and high-quality clean the impurities by electrically connecting the electrostatic generator with the electrostatic adsorption plate and driving the electrostatic adsorption plate to move by the driving mechanism, which prevents the harm to the body of the staff, reduces the cleaning cost, and avoids damaging the equipment to be cleaned.
[0022] The application also provides a semiconductor equipment comprising the semiconductor particle cleaning device and a process machine.
[0023] Compared with the traditional way of manually cleaning the accumulated impurities such as silicon wafer fragments on the inner wall of the furnace tube, the cleaning efficiency is low, the cleaning quality is poor, it is harmful to human health, and it is easy to damage the equipment. The semiconductor equipment in the embodiment, the electrostatic generator is electrically connected with the electrostatic adsorption plate, the electrostatic generator makes the surface of the electrostatic adsorption plate carry static electricity, the driving mechanism drives the electrostatic adsorption plate with static electricity close to the to-be-cleaned equipment on the process machine, so that the electrostatic adsorption plate adsorbs and transfers the impurities in the to-be-cleaned equipment, and then electrostatically cleans the to-be-cleaned equipment. The whole cleaning process is fully automated and does not require manual intervention. The electrostatic adsorption plate does not directly contact the to-be-cleaned equipment. In summary, the semiconductor equipment in the embodiment, by electrically connecting the electrostatic generator with the electrostatic adsorption plate, the driving mechanism drives the electrostatic adsorption plate to move, which can efficiently and effectively clean the impurities, prevent the body of the worker from being injured, reduce the cleaning cost, and avoid damaging the to-be-cleaned equipment. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings needed to be used in the description of the embodiments or exemplary embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0025] Figure 1 The structure diagram of the semiconductor particle cleaning device in an embodiment of the present application.
[0026] Reference signs:
[0027] The semiconductor particle cleaning device 1000;
[0028] The electrostatic adsorption assembly 1100, the electrostatic generator 1110, the electrostatic adsorption plate 1120, and the adsorption surface 1121;
[0029] The driving mechanism 1200, the first driving member 1210, the sliding platform 1220, the connecting member 1230, the second driving member 1240, the mounting plate 1250, and the bearing surface 1251;
[0030] The dust collection box 1300;
[0031] The controller 1400;
[0032] The tubular furnace 2000. DETAILED DESCRIPTION
[0033] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit and scope of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application. It should be understood that the use of the terms "include", "comprise" or "contain" herein should not be understood as limiting the present application to the features or steps described herein, but rather the use of these terms is intended to cover the presence of the features or steps described herein as well as the presence of other features or steps not described herein.
[0034] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0035] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.
[0036] In the present application, unless otherwise specifically defined and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0037] In the present application, unless specifically stated and limited otherwise, if there is a description of a first feature "on" or "under" a second feature, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "on", "above" and "over" the second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.
[0038] It should be noted that if an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.
[0039] Please refer to Figure 1 , Figure 1 A structure diagram of a semiconductor particle cleaning device in an embodiment of the present application is shown. An embodiment of the present application provides a semiconductor particle cleaning device 1000, which comprises an electrostatic adsorption assembly 1100 and a driving mechanism 1200. The electrostatic adsorption assembly 1100 comprises an electrostatic generator 1110 and an electrostatic adsorption plate 1120 which are electrically connected to each other. The driving mechanism 1200 is connected to the electrostatic adsorption plate 1120, and is configured to drive the electrostatic adsorption plate 1120 to move.
[0040] Compared with the traditional way of "manually cleaning the accumulated silicon wafer fragments and other impurities on the inner wall of the furnace tube", the cleaning efficiency is low, the cleaning quality is poor, it is harmful to human health, and it is easy to damage the equipment. The semiconductor particle cleaning device 1000 in the embodiment, the electrostatic generator 1110 is electrically connected with the electrostatic adsorption plate 1120, the electrostatic generator 1110 makes the surface of the electrostatic adsorption plate 1120 carry static electricity, the driving mechanism 1200 drives the electrostatic adsorption plate 1120 with static electricity close to the equipment to be cleaned (not shown), so that the electrostatic adsorption plate 1120 adsorbs and transfers the impurities in the equipment to be cleaned, and then electrostatically cleans the equipment to be cleaned. The whole cleaning process is fully automated and does not require manual intervention. The electrostatic adsorption plate 1120 does not directly contact the equipment to be cleaned. As described above, the semiconductor particle cleaning device 1000 in the embodiment, by electrically connecting the electrostatic generator 1110 with the electrostatic adsorption plate 1120, the driving mechanism 1200 drives the electrostatic adsorption plate 1120 to move, which can efficiently and effectively clean the impurities, prevent damage to the body of the worker, reduce the cleaning cost, and avoid damage to the equipment to be cleaned.
[0041] Please refer to Figure 1 In some embodiments, the driving mechanism 1200 includes a first driving member 1210 and a connecting member 1230. The fixed end of the first driving member 1210 is slidingly connected to the connecting member 1230 in a first direction. The movable end of the first driving member 1210 is connected to the electrostatic adsorption plate 1120. The first driving member 1210 is configured to drive the electrostatic adsorption plate 1120 to move in the first direction.
[0042] In the embodiment, the fixed end of the first driving member 1210 is slidingly connected to the connecting member 1230 in the first direction. On the one hand, it is convenient for the worker to push the first driving member 1210 to slide relative to the connecting member 1230, thereby driving the electrostatic adsorption plate 1120 to preliminarily approach the equipment to be cleaned in the first direction, and then adsorbing and removing the impurities in the equipment to be cleaned. On the other hand, when the cleaning equipment is a pipeline extending in the first direction, the electrostatic adsorption plate 1120 can extend into the pipeline to adsorb and remove the impurities located inside the pipeline.
[0043] By setting the first driving member 1210 to drive the electrostatic adsorption plate 1120 to move in the first direction, the electrostatic adsorption plate 1120 can further approach the equipment to be cleaned in the first direction, or further extend into the equipment to be cleaned.
[0044] In some embodiments, the first driving member 1210 can be a common linear motion driving module such as a linear motor or a linear cylinder.
[0045] Please refer to Figure 1In some embodiments, the driving mechanism 1200 comprises a sliding platform 1220, the sliding platform 1220 is slidingly connected to a connecting member 1230, and a fixed end of the first driving member 1210 is arranged on the sliding platform 1220.
[0046] In this embodiment, the staff pushes the sliding platform 1220 to move relative to the connecting member 1230, so that the first driving member 1210 moves relative to the connecting member 1230 in the first direction.
[0047] Please refer to Figure 1 In some embodiments, the driving mechanism 1200 comprises a second driving member 1240, the second driving member 1240 is connected to the connecting member 1230, and the second driving member 1240 is configured to drive the connecting member 1230 to move in a second direction; the first direction and the second direction are arranged intersectingly.
[0048] In this embodiment, the second driving member 1240 drives the connecting member 1230 to move relative to the to-be-cleaned equipment in the second direction, the connecting member 1230 drives the first driving member 1210 to move synchronously, the first driving member 1210 drives the electrostatic adsorption plate 1120, the electrostatic adsorption plate 1120 moves relative to the to-be-cleaned equipment in the second direction, and the impurities in the to-be-cleaned equipment are adsorbed and removed.
[0049] It should be noted that when the to-be-cleaned equipment is a pipeline extending in the first direction, the second direction is parallel to the gravity direction of the pipeline itself, the electrostatic adsorption plate 1120 moves in the second direction to approach the inner wall of the pipeline in the pipeline, and the impurities on the inner wall of the pipeline are adsorbed and removed.
[0050] In some embodiments, the second driving member 1240 can be a common linear motion driving module such as a linear motor or a linear cylinder.
[0051] Please refer to Figure 1 In some embodiments, one end of the connecting member 1230 in the first direction is connected to the second driving member 1240.
[0052] In this embodiment, by arranging one end of the connecting member 1230 in the first direction to be connected to the second driving member 1240, the electrostatic adsorption plate 1120 can move in the first direction to a position farther away from the second driving member 1240, thereby facilitating the electrostatic adsorption plate 1120 to clean the to-be-cleaned equipment located farther away from the second driving member 1240 in the first direction, or when the to-be-cleaned equipment is a pipeline extending in the first direction, the electrostatic adsorption plate 1120 extends to a deeper position in the pipeline to clean the impurities in the pipeline.
[0053] In some embodiments, the connecting member 1230 extends in the first direction.
[0054] Please refer to Figure 1In some embodiments, the driving mechanism 1200 comprises a mounting plate 1250 located on the side of the first driving member 1210 away from the second driving member 1240 along the first direction and spaced apart from the connecting member 1230 along the second direction, the mounting plate 1250 is connected with the movable end of the first driving member 1210, one side of the mounting plate 1250 along the second direction is provided with a bearing surface 1251, and the other side of the mounting plate 1250 is connected with the electrostatic adsorption plate 1120, the electrostatic adsorption plate 1120 is located between the mounting plate 1250 and the connecting member 1230 and connected with the mounting plate 1250.
[0055] In the embodiment, when the device to be cleaned is the PECVD tube furnace 2000 extending along the first direction, the worker first places a graphite boat (not shown) on the bearing surface 1251 of the mounting plate 1250, drives the mounting plate 1250 to move in the tube furnace 2000 along the first direction by the first driving member 1210, so that the mounting plate 1250 drives the graphite boat and the electrostatic adsorption plate 1120 to move synchronously in the tube furnace 2000 until the graphite boat moves to the predetermined position in the tube furnace 2000 and is lapped on the support (not shown) at the predetermined position in the tube furnace 2000, and the first driving member 1210 stops working; then, the connecting member 1230 is driven to move in the tube furnace 2000 along the second direction by the second driving member 1240, the connecting member 1230 drives the sliding platform 1220 and the first driving member 1210 to move synchronously by the sliding platform 1220, so that the mounting plate 1250 connected with the first driving member 1210 moves along the second direction relative to the graphite boat on the support until the bearing surface 1251 of the mounting plate 1250 is separated from the graphite boat on the support, and the second driving member 1240 stops working; finally, the mounting plate 1250 is driven to move in the tube furnace 2000 along the first direction by the first driving member 1210 to drive the electrostatic adsorption plate 1120 to move away from the tube furnace 2000 along the first direction, in the process, the electrostatic generator 1110 generates static electricity on the electrostatic adsorption plate 1120, the electrostatic adsorption plate 1120 adsorbs and removes the impurities in the tube furnace 2000, and carries the adsorbed impurities away from the tube furnace 2000 along the first direction.
[0056] Please refer to Figure 1 In some embodiments, the electrostatic adsorption plate 1120 is provided with an adsorption surface 1121 on the side away from the mounting plate 1250, the adsorption surface 1121 is used for adsorbing impurities, and the adsorption surface 1121 is spaced apart from the side of the connecting member 1230 close to the mounting plate 1250 along the second direction.
[0057] In the embodiment, during the process that the first driving member 1210 drives the mounting plate 1250 to move in the first direction in the tube furnace 2000 and drives the electrostatic adsorption plate 1120 to move in the first direction away from the tube furnace 2000, the electrostatic generator 1110 generates electrostatic on the adsorption surface 1121 of the electrostatic adsorption plate 1120, adsorbs and removes the impurities in the tube furnace 2000 through the adsorption surface 1121, and carries the adsorbed impurities away from the tube furnace 2000 in the first direction.
[0058] Referring to Figure 1 In some embodiments, the semiconductor particle cleaning device 1000 comprises a dust collection box 1300, which is located on the side of the connecting member 1230 away from the second driving member 1240 in the first direction, and is used to collect the impurities adsorbed by the electrostatic adsorption plate 1120.
[0059] In the embodiment, when the electrostatic adsorption plate 1120 adsorbed with the impurities moves in the first direction away from the tube furnace 2000 under the driving of the first driving member 1210 and moves to the side of the dust collection box 1300 in the second direction, the electrostatic generator 1110 stops working, the electrostatic on the electrostatic adsorption plate 1120 disappears, and the impurities adsorbed by the electrostatic adsorption plate 1120 fall into the dust collection box 1300 under the action of the gravity of the electrostatic adsorption plate 1120.
[0060] Referring to Figure 1 In some embodiments, the semiconductor particle cleaning device 1000 comprises a controller 1400, which is in communication connection with the electrostatic generator 1110.
[0061] In the embodiment, the controller 1400 controls the electrostatic generator 1110 to generate electrostatic on the electrostatic adsorption plate 1120.
[0062] The application further provides a semiconductor equipment (not shown), which comprises the aforementioned semiconductor particle cleaning device 1000 and a process machine (not shown). Specifically, the process machine comprises a tube furnace 2000 having a process cavity, and the cleaning device 1000 is used to clean the semiconductor particles in the process cavity.
[0063] Compared with the traditional way of manually cleaning the accumulated silicon wafer fragments and other impurities on the inner wall of the furnace tube, the semiconductor equipment in the embodiment has the problems of low cleaning efficiency, poor cleaning quality, harm to human health, and easy damage to the equipment. In the semiconductor equipment in the embodiment, the electrostatic generator 1110 is electrically connected with the electrostatic adsorption plate 1120. The electrostatic generator 1110 makes the surface of the electrostatic adsorption plate 1120 carry static electricity. The driving mechanism 1200 drives the electrostatic adsorption plate 1120 with static electricity to approach the to-be-cleaned equipment on the process machine table, so that the electrostatic adsorption plate 1120 adsorbs and transfers the impurities in the to-be-cleaned equipment, and then electrostatically cleans the to-be-cleaned equipment. The whole cleaning process is fully automated and does not require manual participation. The electrostatic adsorption plate 1120 does not directly contact the to-be-cleaned equipment. In summary, the semiconductor equipment in the embodiment can efficiently and high-quality clean the impurities by electrically connecting the electrostatic generator 1110 with the electrostatic adsorption plate 1120 and driving the electrostatic adsorption plate 1120 to move by the driving mechanism 1200. This prevents harm to the body of the worker, reduces the cleaning cost, and avoids damage to the to-be-cleaned equipment.
[0064] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not conflict, they should be considered within the scope of the present disclosure.
[0065] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A cleaning device for semiconductor particles, characterized in that, The semiconductor particle cleaning device comprises: An electrostatic adsorption assembly comprising an electrostatic generator and an electrostatic adsorption plate electrically connected to each other; A driving mechanism connected to the electrostatic adsorption plate, the driving mechanism being configured to drive the electrostatic adsorption plate to move.
2. The semiconductor particle cleaning apparatus according to claim 1, wherein The driving mechanism comprises a first driving member and a connecting member; A fixed end of the first driving member is slidingly connected to the connecting member in a first direction, and a movable end of the first driving member is connected to the electrostatic adsorption plate, the first driving member being configured to drive the electrostatic adsorption plate to move in the first direction.
3. The semiconductor particle cleaning apparatus according to claim 2, wherein The driving mechanism comprises a sliding platform slidingly connected to the connecting member, and the fixed end of the first driving member is arranged on the sliding platform.
4. The semiconductor particle cleaning apparatus according to claim 2, wherein The driving mechanism comprises a second driving member; The second driving member is connected to the connecting member, and the second driving member is configured to drive the connecting member to move in a second direction; the first direction and the second direction are arranged in intersecting manner.
5. The semiconductor particle cleaning apparatus according to claim 4, wherein An end of the connecting member in the first direction is connected to the second driving member.
6. The semiconductor particle cleaning apparatus according to claim 5, wherein The driving mechanism comprises a mounting plate, the mounting plate being arranged on a side of the first driving member away from the second driving member in the first direction and being spaced apart from the connecting member in the second direction, and the mounting plate is connected to the movable end of the first driving member; A bearing surface is arranged on one side of the mounting plate in the second direction, and the other side of the mounting plate is connected to the electrostatic adsorption plate; The electrostatic adsorption plate is arranged between the mounting plate and the connecting member and is connected to the mounting plate.
7. The semiconductor particle cleaning apparatus according to claim 6, wherein An adsorption surface is arranged on a side of the electrostatic adsorption plate away from the mounting plate, and the adsorption surface is used for adsorbing impurities; The adsorption surface and the connecting member are arranged in spaced apart manner on a side of the connecting member close to the mounting plate in the second direction.
8. The semiconductor particle cleaning apparatus according to claim 7, wherein The semiconductor particle cleaning device comprises a dust collection box, the dust collection box being arranged on a side of the connecting member away from the second driving member in the first direction; The dust collection box is used for accommodating the impurities adsorbed by the electrostatic adsorption plate.
9. The semiconductor particle cleaning apparatus according to claim 1, wherein The semiconductor particle cleaning device comprises a controller, the controller being communicatively connected to the electrostatic generator.
10. A semiconductor device, characterized by comprising: The semiconductor particle cleaning device comprises a controller, the controller being communicatively connected to the electrostatic generator.