Heat exchanger, heat dissipation device, charging pile and liquid cooling equipment

Abstract

The embodiment of the utility model provides a heat exchanger, a heat dissipation device, a charging pile and liquid cooling equipment, and relates to the technical field of liquid cooling heat dissipation. The heat exchanger comprises a heat dissipation component and a first liquid collection component. The heat dissipation component is provided with a heat dissipation flow channel, the first liquid collection component is provided with a first liquid collection cavity, the first liquid collection component is connected with the heat dissipation component, and the first liquid collection cavity is communicated with the heat dissipation flow channel. Wherein the first liquid collecting component is provided with a pressure control component, and the pressure control component is used for controlling the pressure in the first liquid collecting cavity within a preset range, so that the size of the heat dissipation device can be reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of liquid cooling heat dissipation, and in particular to a heat exchanger, a heat dissipation device, a charging pile and a liquid cooling device. BACKGROUND

[0002] Liquid cooling heat dissipation is a relatively efficient heat dissipation method and is widely used in charging, data centers and other scenarios. A liquid cooling device is a device that can perform liquid cooling heat dissipation. The liquid cooling device includes a heat generating component and a liquid cooling heat exchange component for dissipating heat of the heat generating component. The liquid cooling heat exchange component and the heat dissipation device form a cooling liquid circulation loop. Heat generated by the heat generating component is absorbed by the cooling liquid in the liquid cooling heat exchange component and can be taken to the heat dissipation device for heat dissipation.

[0003] In related technologies, the size of the heat dissipation device for liquid cooling heat dissipation is often large. Therefore, how to reduce the size of the heat dissipation device has become a problem to be solved in the technical field of liquid cooling heat dissipation. UTILITY MODEL CONTENT

[0004] Embodiments of the present application provide a heat exchanger, a heat dissipation device, a charging pile and a liquid cooling device, which can make the size of the heat dissipation device smaller.

[0005] The first aspect of the embodiments of the present application provides a heat exchanger. The heat exchanger includes a heat dissipation component and a first liquid collecting component. The heat dissipation component has a heat dissipation flow channel, and the first liquid collecting component has a first liquid collecting cavity. The first liquid collecting component is connected with the heat dissipation component, and the first liquid collecting cavity is in communication with the heat dissipation flow channel. The first liquid collecting component is provided with a pressure control component. The pressure control component is used to control the pressure in the first liquid collecting cavity within a preset range.

[0006] The heat dissipation flow channel is used to accommodate the cooling liquid, and the first liquid collecting cavity is used to accommodate the cooling liquid and the gas.

[0007] The heat exchanger provided by the embodiments of the present application has the following advantages. The pressure control component can control the pressure in the first liquid collecting cavity within a preset range. The gas accommodated in the first liquid collecting cavity can be compressed or expanded under the control of the pressure control component to balance the pressure in the first liquid collecting cavity. The gas accommodated in the first liquid collecting cavity can be used to realize the buffering function. The first liquid collecting component provided with the pressure control component can buffer the pressure change in the cooling liquid circulation loop. At this time, in addition to being used for the confluence or distribution of the heat dissipation flow channel, the first liquid collecting component can also function as a buffer tank. The buffer tank and the first liquid collecting component of the heat exchanger are integrated into one body. In this way, it is not necessary to provide a buffer tank independent of the heat exchanger, so that the integration degree of the heat dissipation device is high, which is conducive to reducing the size of the heat dissipation device. In addition, since it is not necessary to provide a buffer tank independent of the heat exchanger, the number of structural components of the heat dissipation device can be reduced, which is conducive to reducing the cost of the heat dissipation device.

[0008] In some possible embodiments, the first liquid collecting component is arranged above the heat dissipation component, such that the first liquid collecting cavity is located above the heat dissipation flow channel, and the upper end of the heat dissipation flow channel is in communication with the first liquid collecting cavity. In this way, the flow of the cooling liquid between the first liquid collecting cavity and the heat dissipation flow channel is less likely to be affected by the gas contained in the first liquid collecting cavity, and the flow of the cooling liquid between the first liquid collecting cavity and the heat dissipation flow channel is easier. In addition, the arrangement of the pressure control component or other components or structures on the first liquid collecting component is less likely to be affected by the heat dissipation component, and the arrangement of the pressure control component or other components or structures on the first liquid collecting component is easier. In addition, when the cooling liquid is in the cooling liquid circulation loop, the first liquid collecting component is opened to facilitate the liquid injection into the first liquid collecting cavity or other operations.

[0009] In some possible embodiments, the first liquid collecting component has a pressure relief port, and the pressure control component includes a safety valve arranged at the pressure relief port. In this way, when the pressure in the first liquid collecting cavity is too large, the safety valve can be opened, and then the pressure can be released through the pressure relief port and the safety valve to control the pressure in the first liquid collecting cavity. In this way, the first liquid collecting component can buffer the pressure change in the cooling liquid circulation loop, and the safety of the first liquid collecting component is good, and the first liquid collecting component is less likely to be damaged due to overpressure in the first liquid collecting cavity.

[0010] For example, the pressure relief port is located at the top wall of the first liquid collecting component, such that when the pressure in the first liquid collecting cavity is within a predetermined range, the cooling liquid in the first liquid collecting cavity is less likely to leak at the pressure relief port. In addition, when the safety valve is opened, the cooling liquid is also less likely to be discharged through the pressure relief port.

[0011] In some possible embodiments, the first liquid collecting component has a liquid injection port, a plug is arranged at the liquid injection port, the plug is detachably connected with the first liquid collecting component, and the plug seals the liquid injection port. In this way, when the cooling liquid in the first liquid collecting cavity is less and needs to be injected into the first liquid collecting cavity, the plug can be opened to inject the cooling liquid into the first liquid collecting cavity, which is convenient for supplementing the cooling liquid in the cooling liquid circulation loop. After the liquid injection into the first liquid collecting cavity is completed, the plug can be used to seal the liquid injection port to seal the first liquid collecting cavity, so as to facilitate the circulation of the cooling liquid in the cooling liquid circulation loop and the buffering function.

[0012] In some possible embodiments, the first liquid collecting component further has a liquid level meter for displaying the liquid level of the first liquid collecting cavity, so as to facilitate the user to control the liquid level in the first liquid collecting cavity.

[0013] In some possible implementation manners, the first liquid collecting component is further provided with a liquid level sensor for detecting the liquid level of the first liquid collecting cavity. The liquid level of the first liquid collecting cavity is monitored through the detection of the liquid level sensor, and a corresponding instruction is formed according to the liquid level of the first liquid collecting cavity, so as to facilitate the automatic control.

[0014] In some possible implementation manners, the heat exchanger further includes a second liquid collecting component having a second liquid collecting cavity. The first liquid collecting component and the second liquid collecting component are connected to two ends of the heat dissipation component respectively. One end of the heat dissipation flow channel is in communication with the first liquid collecting cavity, and the other end of the heat dissipation flow channel is in communication with the second liquid collecting cavity. By arranging the second liquid collecting component, the plurality of heat dissipation flow channels can be connected to the liquid cooling heat exchange assembly, so as to facilitate the connection of the plurality of heat dissipation flow channels to the cooling liquid circulating loop.

[0015] In some possible implementation manners, the second liquid collecting component is arranged below the heat dissipation component, so that the lower end of the heat dissipation flow channel is in communication with the second liquid collecting cavity. The heat exchanger has a liquid inlet and a liquid outlet. At least one of the liquid inlet and the liquid outlet is arranged in the second liquid collecting component and in communication with the second liquid collecting cavity. When the liquid inlet of the heat exchanger is arranged in the second liquid collecting component and in communication with the second liquid collecting cavity, the cooling liquid enters the heat exchanger through the second liquid collecting cavity located at the lower part of the heat exchanger, and then flows into the first liquid collecting cavity through the heat dissipation flow channel. In this way, the cooling liquid flowing into the first liquid collecting cavity is less affected by the gas in the first liquid collecting cavity, and the cooling liquid is more easily flowed into the first liquid collecting cavity. When the liquid outlet of the heat exchanger is arranged in the second liquid collecting component and in communication with the second liquid collecting cavity, the cooling liquid in the first liquid collecting cavity flows to the second liquid collecting cavity located at the lower part of the heat exchanger through the heat dissipation flow channel, and then flows out of the heat exchanger through the second liquid collecting cavity located at the lower part of the heat exchanger. In this way, the gas in the first liquid collecting cavity is less likely to be sucked out by the driving pump for driving the circulation of the cooling liquid, so that the driving pump has better efficiency and stability.

[0016] In some possible implementation manners, the volume of the first liquid collecting cavity is greater than the volume of the second liquid collecting cavity. In this way, part of the first liquid collecting cavity can accommodate the cooling liquid circulated in the cooling liquid circulating loop, and part of the first liquid collecting cavity can accommodate the gas, thereby facilitating the buffering of the pressure change in the cooling liquid circulating loop through the first liquid collecting component. In addition, the first liquid collecting cavity with a larger volume can accommodate a larger volume of gas, so that the first liquid collecting component has better buffering effect.

[0017] The second aspect of the embodiments of the present application provides a heat dissipation device, which includes the heat exchanger in any of the above embodiments.

[0018] In some possible embodiments, the heat dissipation device further comprises an electric control box and a controller, the electric control box is arranged at one side of the heat exchanger in the width direction, the controller is configured to control the cooling capacity provided by the heat dissipation device, and the controller is arranged in the electric control box, so that the arrangement of the electric control box and the controller does not easily interfere with the arrangement of the device or component on the top wall of the heat exchanger.

[0019] The electric control box is fixed to the outside of the heat exchanger.

[0020] For example, the electric control box can be directly fixed to the heat exchanger, or the electric control box can be fixed to the heat exchanger through the frame.

[0021] In a third aspect, the present application provides a charging pile, which comprises a pile body and the heat dissipation device according to any one of the above embodiments. The heat dissipation device is arranged in the pile body. The cooling liquid is contained in the heat dissipation flow channel of the heat dissipation device, and the cooling liquid and the gas are contained in the first liquid collecting cavity of the heat dissipation device.

[0022] In a fourth aspect, the present application provides a liquid cooling device, which comprises a liquid cooling heat exchange assembly and the heat dissipation device according to any one of the above embodiments. The liquid cooling heat exchange assembly is configured to form a cooling liquid circulation loop with the heat exchanger of the heat dissipation device. The cooling liquid is contained in the heat dissipation flow channel of the heat dissipation device and the liquid cooling heat exchange assembly, and the cooling liquid and the gas are contained in the first liquid collecting cavity of the heat dissipation device.

[0023] The liquid cooling device further comprises a heat generating assembly, and the liquid cooling heat exchange assembly is configured to dissipate heat of the heat generating assembly. For example, the heat generating assembly can be in direct contact with the liquid cooling heat exchange assembly or in contact with the liquid cooling heat exchange assembly through a heat conducting medium outside the liquid cooling heat exchange assembly, so that the cooling liquid in the liquid cooling heat exchange assembly can absorb heat generated by the heat generating assembly. For another example, the heat generating assembly can be arranged in the liquid cooling heat exchange assembly, and at least part of the heat generating assembly is immersed in the cooling liquid in the liquid cooling heat exchange assembly, so that the cooling liquid in the liquid cooling heat exchange assembly absorbs heat generated by the heat generating assembly.

[0024] For example, the liquid cooling heat exchange assembly comprises a liquid cooling heat exchange component, the liquid cooling heat exchange assembly has a liquid supply passage and a liquid return passage, and the cooling liquid is contained in the liquid cooling heat exchange component, the liquid supply passage and the liquid return passage. The inlet of the liquid cooling heat exchange component is in communication with the outlet of the liquid supply passage, and the outlet of the liquid cooling heat exchange component is in communication with the inlet of the liquid return passage. The heat exchanger has a liquid inlet and a liquid outlet, the liquid inlet of the heat exchanger is in communication with the outlet of the liquid return passage through a liquid return joint, and the liquid outlet of the heat exchanger is in communication with the inlet of the liquid supply passage through a liquid supply joint. The liquid cooling heat exchange component, the liquid return passage, the heat exchanger and the liquid supply passage are configured to form a cooling liquid circulation loop.

[0025] In some examples, the cooling liquid in the liquid cooling heat exchange component can be used to dissipate heat of at least part of the heat generating assembly.

[0026] In some examples, the cooling liquid in the liquid supply passage can be used to dissipate heat from the portion of the heat-generating component.

[0027] In some examples, the cooling liquid in the liquid return passage can be used to dissipate heat from the portion of the heat-generating component.

[0028] In some possible implementations, the liquid cooling device is a server, the heat-generating component includes at least one of a processor and a memory, and the liquid cooling heat exchange component is used to dissipate heat from the at least one of the processor and the memory. For example, the processor can be a central processing unit.

[0029] In some examples in which the liquid cooling device is a server, the cooling liquid in the liquid cooling heat exchange component can be used to dissipate heat from the at least one of the processor and the memory.

[0030] In some possible implementations, the liquid cooling device is a charging host, the heat-generating component is a charging module, and the liquid cooling heat exchange component is used to dissipate heat from the charging module.

[0031] In some examples in which the liquid cooling device is a charging host, the cooling liquid in the liquid cooling heat exchange component can be used to dissipate heat from the charging module.

[0032] In some possible implementations, the liquid cooling device is a charging terminal, the heat-generating component includes at least one of a power terminal and a power line, and the liquid cooling heat exchange component is used to dissipate heat from the at least one of the power terminal and the power line.

[0033] In some examples in which the liquid cooling device is a charging terminal, the cooling liquid in the liquid cooling heat exchange component can be used to dissipate heat from the power terminal, and the cooling liquid in at least one of the liquid supply passage and the liquid return passage can be used to dissipate heat from the power line. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A schematic diagram of a liquid cooling device according to an embodiment of the present application;

[0035] Figure 2 A schematic diagram of another liquid cooling device according to an embodiment of the present application;

[0036] Figure 3 A schematic diagram of a heat dissipation device according to an embodiment of the present application;

[0037] Figure 4 A schematic diagram of a heat dissipation device according to an embodiment of the present application from another perspective;

[0038] Figure 5 A schematic diagram of a heat dissipation device according to an embodiment of the present application from another perspective; Figure 4

[0039] Figure 6 A schematic diagram of a heat dissipation device according to an embodiment of the present application from another perspective;​Figure 4 A schematic view of the heat dissipation device provided in the present application after the cover plate of the electric control box is removed;

[0040] Figure 7 A schematic view of a heat exchanger provided in the present application;

[0041] Figure 8 A schematic view of a heat exchanger provided in the present application; Figure 7 A sectional view of the A-A plane in the present application;

[0042] Figure 9 A sectional view of the B-B plane in the present application; Figure 7 A sectional view of the B-B plane in the present application;

[0043] Legend:

[0044] 10, charging pile; 11, pile body; 12, heat dissipation device; 13, power supply assembly;

[0045] 20, heat generating assembly; 21, power terminal; 22, power line;

[0046] 30, liquid-cooled heat exchange assembly; 31, liquid-cooled heat exchange component; 32, liquid supply channel; 33, liquid return channel;

[0047] 100, heat exchanger;

[0048] 110, first liquid collecting component; 111, first liquid collecting cavity; 112, liquid injection port; 113, plug; 114, pressure control component; 114a, safety valve; 115, pressure relief port; 116, liquid level sensor; 117, liquid level gauge;

[0049] 120, heat dissipation component; 121, heat dissipation flow channel;

[0050] 130, second liquid collecting component; 131, second liquid collecting cavity;

[0051] 140, liquid discharge port; 150, liquid inlet port; 160, liquid outlet port;

[0052] 200, electric control box; 300, controller; 400, frame; 500, fan; 600, drive pump;

[0053] 710, liquid inlet connector; 720, liquid outlet connector; 730, liquid supply connector; 740, first connecting pipe; 750, second connecting pipe; 760, liquid return connector; 770, third connecting pipe;

[0054] 810, first temperature sensor, 820, pressure sensor, 830, second temperature sensor;

[0055] x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0056] The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0057] The liquid cooling device provided by the embodiments of the present application can include, but is not limited to, a device that can be liquid cooled, such as a charging terminal, a charging host, a server, and the like. That is, the liquid cooling device can include, but is not limited to, a liquid cooling charging terminal, a liquid cooling charging host, a liquid cooling server, and the like.

[0058] Figure 1 A schematic diagram of a liquid cooling device provided by the embodiments of the present application. Figure 1 In the figure, the direction of the solid arrow indicates the direction of the flow of the cooling liquid

[0059] As shown in Figure 1 The liquid cooling device includes a heat generating component 20, a liquid cooling heat exchange component 30, and a heat dissipation device 12. The liquid cooling heat exchange component 30 is used to liquid cool and dissipate heat from the heat generating component 20. The inlet of the liquid cooling heat exchange component 30 is in communication with the outlet of the heat dissipation device 12. The outlet of the liquid cooling heat exchange component 30 is in communication with the inlet of the heat dissipation device 12. The liquid cooling heat exchange component 30 and the heat dissipation device 12 form a cooling liquid circulation loop. The cooling liquid circulation loop contains cooling liquid. The cooling liquid in the cooling liquid circulation loop can circulate and flow in the cooling liquid circulation loop. That is, the liquid cooling heat exchange component 30 and the heat dissipation device 12 both contain cooling liquid. The cooling liquid can circulate and flow between the liquid cooling heat exchange component 30 and the heat dissipation device 12. The heat generated by the heat generating component 20 can be absorbed by the cooling liquid in the liquid cooling heat exchange component 30. The cooling liquid in the liquid cooling heat exchange component 30 that has absorbed the heat generated by the heat generating component 20 can flow into the heat dissipation device 12 to dissipate heat.

[0060] In some examples, the liquid cooling heat exchange component 30 can be in direct contact with the heat generating component 20. Alternatively, the liquid cooling heat exchange component 30 can be in contact with the heat generating component 20 through a heat conducting medium. In this case, the heat generating component 20 can be located outside the liquid cooling heat exchange component 30.

[0061] In some examples, the heat generating component 20 can be arranged in the liquid cooling heat exchange component 30. At least part of the heat generating component 20 can be immersed in the cooling liquid in the liquid cooling heat exchange component 30.

[0062] In the example in which the liquid cooling device is a server, the heat generating component 20 can include at least one of a central processing unit (CPU) of the server, a memory, and the like. The liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the central processing unit, the memory, and the like.

[0063] In the example where the liquid cooling device is a charging host, the heat generating component 20 can include a charging module of the charging host, and the like, and the liquid cooling heat exchange component 30 is used to dissipate heat from the charging module and the like.

[0064] In the example where the liquid cooling device is a charging terminal, the heat generating component 20 can include at least one of a power terminal 21, a power line 22, and the like of the charging terminal, and the liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the power terminal, the power line, and the like.

[0065] The following will be described by taking the liquid cooling device as a charging terminal as an example.

[0066] Figure 2 Another schematic diagram of a liquid cooling device provided by the embodiments of the present application.

[0067] As shown in Figure 2 In the example where the liquid cooling device is a charging terminal, the liquid cooling device can include a charging pile 10, the charging pile 10 includes a pile body 11, a power supply component 13, and a heat dissipation device 12, and the power supply component 13 and the heat dissipation device 12 are arranged in the pile body 11.

[0068] For example, the heat generating component 20 includes the power terminal 21 and the power line 22, one end of the power line 22 is electrically connected to the power supply component 13, and the other end of the power line 22 is electrically connected to the power terminal 21, that is, the power supply component 13 is electrically connected to the power terminal 21 through the power line 22. The power supply component 13 can be electrically connected to a commercial power supply through a charging host, the charging host can convert the current provided by the commercial power supply into a current required for charging, and deliver the current to the power terminal 21 through the power supply component 13 and the power line 22, and the power terminal 21 is used to output electric energy.

[0069] For example, the liquid cooling heat exchange component 30 can include a liquid cooling heat exchange part 31, the liquid cooling heat exchange component 30 has a liquid supply channel 32 and a liquid return channel 33, the inlet of the liquid supply channel 32 is in communication with the outlet of the heat dissipation device 12, and the outlet of the liquid supply channel 32 is in communication with the inlet of the liquid cooling heat exchange part 31, so that the inlet of the liquid cooling heat exchange part 31 is in communication with the outlet of the heat dissipation device 12 through the liquid supply channel 32. The inlet of the liquid return channel 33 is in communication with the outlet of the liquid cooling heat exchange part 31, and the outlet of the liquid return channel 33 is in communication with the inlet of the heat dissipation device 12, so that the outlet of the liquid cooling heat exchange part 31 is in communication with the inlet of the heat dissipation device 12 through the liquid return channel 33. The liquid cooling heat exchange part 31 and the heat dissipation device 12 are in communication through the liquid supply channel 32 and the liquid return channel 33 to form a cooling liquid circulation loop, and the liquid cooling heat exchange part 31, the liquid supply channel 32, and the liquid return channel 33 all contain cooling liquid.

[0070] Exemplarily, the liquid cooling heat exchange component 31 is arranged at the power terminal 21, and the cooling liquid provided by the heat dissipation device 12 can flow into the liquid cooling heat exchange component 31 through the liquid supply channel 32. The cooling liquid flowing into the liquid cooling heat exchange component 31 is used to absorb the heat generated by the power terminal 21. After absorbing the heat generated by the power terminal 21, the cooling liquid in the liquid cooling heat exchange component 31 can flow back to the heat dissipation device 12 through the liquid return channel 33 to dissipate heat, thereby realizing liquid cooling heat dissipation of the power terminal 21. At this time, the inlet of the liquid supply channel 32 can serve as the inlet of the liquid cooling heat exchange assembly 30, and the outlet of the liquid return channel 33 can serve as the outlet of the liquid cooling heat exchange assembly 30.

[0071] Exemplarily, the liquid cooling heat exchange component 31 can be in direct contact with the power terminal 21, or the liquid cooling heat exchange component 31 can be in contact with the power terminal 21 through a heat-conducting medium, so that the heat generated by the power terminal 21 can be more efficiently conducted to the cooling liquid in the liquid cooling heat exchange component 31.

[0072] Exemplarily, the liquid cooling heat exchange component 31 can include one or more of a liquid cooling plate, a liquid cooling pipe, etc.

[0073] Exemplarily, the cooling liquid flowing in the liquid supply channel 32 and the liquid return channel 33 can absorb the heat of the power line 22, so as to dissipate heat of the power line 22.

[0074] When the liquid cooling device is a charging terminal, the liquid cooling device includes a charging gun, and the charging gun includes the heat generating assembly 20 and the liquid cooling heat exchange assembly 30, that is, the heat generating assembly 20 and the liquid cooling heat exchange assembly 30 are assemblies used to form the charging gun, and the charging gun is a liquid cooling charging gun. The charging gun can be used to be plugged with a vehicle, and after the charging gun is plugged on the vehicle, the charging pile 10 can charge the vehicle through the charging gun. In some examples, the liquid cooling device can be a super-charging device, and the charging power of a single charging gun of the super-charging device can be greater than or equal to 480 KW.

[0075] Exemplarily, the charging gun includes a gun head and a cable. The power terminal 21 and the liquid cooling heat exchange component 31 are arranged in the gun head. The cable includes the power line 22, and the cable has the liquid supply channel 32 and the liquid return channel 33.

[0076] In some examples, the cable includes a liquid supply pipe and a liquid return pipe, and the inner cavity of the liquid supply pipe forms the liquid supply channel 32, and the inner cavity of the liquid return pipe forms the liquid return channel 33.

[0077] Exemplarily, the liquid supply pipe and the liquid return pipe can be in direct contact with the power line 22 or in contact through a heat-conducting medium.

[0078] In other examples, the cable can have a partition plate therein, and the liquid supply channel 32 and the liquid return channel 33 can be formed in the cable by the partition plate.

[0079] In the example where the liquid cooling device is a server, the cooling liquid in the liquid cooling heat exchange component 31 can be used to dissipate heat generated by at least one of the central processing unit, the memory, etc., and the cooling liquid in the liquid cooling heat exchange component 31 can absorb the heat generated by at least one of the central processing unit, the memory, etc.

[0080] In the example where the liquid cooling device is a charging host, the cooling liquid in the liquid cooling heat exchange component 31 can be used to dissipate heat generated by the charging module, etc., that is, the cooling liquid in the liquid cooling heat exchange component 31 can absorb the heat generated by the charging module, etc.

[0081] Figure 3 A schematic diagram of a heat dissipation device provided by an embodiment of the present application is shown in Figure 3 In the figure, the direction of the solid arrow indicates the direction of the flow of the cooling liquid, the direction of the dashed arrow indicates the direction of the flow of the air, and the two components are connected by the dotted line to indicate that the two components are electrically connected. Figure 3 In the figure, the positions of the various components are only schematically shown, and are only used to illustrate the working principle of the heat dissipation device, Figure 3 The positions of the various components in the figure are not limited.

[0082] As shown in Figure 3 , the heat dissipation device 12 includes a heat exchanger 100 containing the cooling liquid. The heat exchanger 100 has a liquid inlet 150 (as shown in Figure 7 ) and a liquid outlet 160 (as shown in Figure 8 ), the liquid inlet 150 of the heat exchanger 100 is in communication with the outlet of the liquid cooling heat exchange assembly 30, the liquid outlet 160 of the heat exchanger 100 is in communication with the inlet of the liquid cooling heat exchange assembly 30, the heat exchanger 100 is used to form a cooling liquid circulation loop with the liquid cooling heat exchange assembly 30, the cooling liquid can circulate between the heat exchanger 100 and the liquid cooling heat exchange assembly 30, the liquid inlet 150 of the heat exchanger 100 is used for the cooling liquid to flow into the heat exchanger 100, the cooling liquid that has absorbed the heat generated by the heat generating component 20 can flow into the heat exchanger 100 to dissipate heat, the liquid outlet 160 of the heat exchanger 100 is used for the cooling liquid in the heat exchanger 100 to flow out of the heat exchanger 100, and the cooling liquid that has been cooled in the heat exchanger 100 can flow back into the liquid cooling heat exchange assembly 30 after flowing out of the liquid outlet 160 of the heat exchanger 100.

[0083] For example, the liquid inlet 150 of the heat exchanger 100 can be in communication with the outlet of the liquid return channel 33, and the liquid outlet 160 of the heat exchanger 100 can be in communication with the inlet of the liquid supply channel 32, and the heat exchanger 100, the liquid supply channel 32, the liquid cooling heat exchange component 31, and the liquid return channel 33 are used to form a cooling liquid circulation loop.

[0084] Exemplarily, the heat dissipation device 12 further comprises a liquid return joint 760 and a liquid supply joint 730, and the heat exchanger 100 is connected in series between the liquid return joint 760 and the liquid supply joint 730. The liquid inlet 150 of the heat exchanger 100 is communicated with the liquid return joint 760, and the liquid return joint 760 is configured to be connected with the outlet of the liquid cooling heat exchange assembly 30, so that the liquid inlet 150 of the heat exchanger 100 can be communicated with the outlet of the liquid cooling heat exchange assembly 30 through the liquid return joint 760. For example, the liquid inlet 150 of the heat exchanger 100 can be communicated with the outlet of the liquid return channel 33 through the liquid return joint 760. The liquid outlet 160 of the heat exchanger 100 is communicated with the liquid supply joint 730, and the liquid supply joint 730 is configured to be connected with the inlet of the liquid cooling heat exchange assembly 30, so that the liquid outlet 160 of the heat exchanger 100 can be communicated with the inlet of the liquid cooling heat exchange assembly 30 through the liquid supply joint 730. For example, the liquid outlet 160 of the heat exchanger 100 can be communicated with the inlet of the liquid supply channel 32 through the liquid supply joint 730. The liquid return joint 760 can serve as the inlet of the heat dissipation device 12, and the liquid supply joint 730 can serve as the outlet of the heat dissipation device 12, so that the heat dissipation device 12 is convenient to disassemble and assemble with the liquid cooling heat exchange assembly 30.

[0085] In some examples, the liquid inlet 150 of the heat exchanger 100 is provided with a liquid inlet joint 710, and the liquid inlet 150 of the heat exchanger 100 is connected and communicated with the liquid return joint 760 through the liquid inlet joint 710, so that the liquid inlet 150 of the heat exchanger 100 is convenient to disassemble and assemble.

[0086] In other examples, the liquid return joint 760 can be arranged at the liquid inlet 150 of the heat exchanger 100, that is, the liquid return joint 760 can be arranged on the heat exchanger 100.

[0087] Exemplarily, the liquid outlet 160 of the heat exchanger 100 is provided with a liquid outlet joint 720, and the liquid outlet 160 of the heat exchanger 100 is connected and communicated with the liquid supply joint 730 through the liquid outlet joint 720, so that the liquid outlet 160 of the heat exchanger 100 is convenient to disassemble and assemble.

[0088] Exemplarily, the heat dissipation device 12 further comprises a driving pump 600, and the driving pump 600 and the heat exchanger 100 are connected in series between the liquid supply joint 730 and the liquid return joint 760, and the driving pump 600 is configured to drive the cooling liquid to circulate in the cooling liquid circulation loop.

[0089] In some examples, the driving pump 600 can be arranged between the liquid outlet 160 of the heat exchanger 100 and the liquid supply connector 730. For example, the driving pump 600 can be arranged between the liquid outlet connector 720 and the liquid supply connector 730, the liquid outlet connector 720 is connected to the inlet of the driving pump 600, the outlet of the driving pump 600 is connected to the liquid supply connector 730, and the liquid outlet 160 of the heat exchanger 100 is communicated with the liquid supply connector 730 through the liquid outlet connector 720 and the driving pump 600. In this way, the cooling liquid flows to the driving pump 600 after being cooled in the heat exchanger 100, the temperature of the cooling liquid at the driving pump 600 is relatively low, and the cooling liquid is less likely to leak at the driving pump 600, the liquid outlet connector 720 and the liquid supply connector 730, and the reliability of the cooling liquid circulation loop is relatively high. In addition, the temperature of the cooling liquid is relatively low, and the driving efficiency of the driving pump 600 on the cooling liquid is relatively high.

[0090] For example, the inlet of the driving pump 600 can be connected to the liquid outlet connector 720 through the first connecting pipe 740, the outlet of the driving pump 600 can be connected to the liquid supply connector 730 through the second connecting pipe 750, and the liquid outlet 160 of the heat exchanger 100 can be communicated with the liquid supply connector 730 through the liquid outlet connector 720, the first connecting pipe 740, the driving pump 600 and the second connecting pipe 750. In this way, the driving pump 600, the heat exchanger 100 and the liquid supply connector 730 are connected conveniently, and the connection of the driving pump 600 with the heat exchanger 100 and the liquid supply connector 730 is facilitated. In addition, the relative positions of the driving pump 600, the heat exchanger 100 and the liquid supply connector 730 are less likely to be required, and the arrangement of the driving pump 600 and the liquid supply connector 730 is more flexible.

[0091] For example, the first connecting pipe 740 and the second connecting pipe 750 can be flexible pipes, so that the connection and arrangement of the first connecting pipe 740 and the second connecting pipe 750 are more convenient.

[0092] In other examples, the driving pump 600 can also be arranged between the liquid inlet 150 of the heat exchanger 100 and the liquid return connector 760. For example, the driving pump 600 can be arranged between the liquid inlet connector 710 and the liquid return connector 760, the liquid return connector 760 is connected to the inlet of the driving pump 600, the outlet of the driving pump 600 is connected to the liquid inlet connector 710, and the liquid return connector 760 is communicated with the liquid inlet 150 of the heat exchanger 100 through the driving pump 600 and the liquid inlet connector 710.

[0093] Hereinafter, the driving pump 600 arranged between the liquid outlet 160 of the heat exchanger 100 and the liquid supply connector 730 is taken as an example for description.

[0094] For example, the inlet of the driving pump 600 can be connected to the liquid outlet connector 720 through the first connecting pipe 740, the outlet of the driving pump 600 can be connected to the liquid supply connector 730 through the second connecting pipe 750, and the liquid outlet 160 of the heat exchanger 100 can be communicated with the liquid supply connector 730 through the liquid outlet connector 720, the first connecting pipe 740, the driving pump 600 and the second connecting pipe 750. In this way, the driving pump 600, the heat exchanger 100 and the liquid supply connector 730 are connected conveniently, and the connection of the driving pump 600 with the heat exchanger 100 and the liquid supply connector 730 is facilitated. In addition, the relative positions of the driving pump 600, the heat exchanger 100 and the liquid supply connector 730 are less likely to be required, and the arrangement of the driving pump 600 and the liquid supply connector 730 is more flexible. Figure 3As illustrated, the heat dissipation device 12 also includes a fan 500, which drives airflow at the heat exchanger 100 to improve the heat dissipation efficiency of the heat exchanger 100. In some examples, the fan 500 may blow air toward the heat exchanger 100. In other examples, the fan 500 may draw air away from the heat exchanger 100.

[0095] like Figure 3 As shown, in some examples, the heat dissipation device 12 may also include a controller 300. The controller 300 can be used to control the cooling capacity provided by the heat dissipation device 12. Specifically, the controller 300 can be used to control the cooling capacity provided by the heat exchanger 100, so that the heat dissipation device 12 can provide the required cooling capacity to the liquid-cooled heat exchange assembly 30.

[0096] For example, the controller 300 is electrically connected to the drive pump 600. The controller 300 can be used to control the drive pump 600 so as to control the flow rate of the coolant flowing through the heat exchanger 100, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the drive pump 600.

[0097] For example, the controller 300 is electrically connected to the fan 500. The controller 300 can be used to control the fan 500 so as to adjust the airflow speed at the heat exchanger 100 by adjusting the speed of the fan 500, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500.

[0098] For example, the controller 300 can be electrically connected to both the drive pump 600 and the fan 500. The controller 300 can be used to control the drive pump 600 and the fan 500 to control the cooling capacity provided by the heat dissipation device 12 by controlling the speed of the fan 500 and the flow rate of the coolant flowing through the heat exchanger 100. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500 and the drive pump 600.

[0099] For example, controller 300 can be used to obtain the speed of fan 500 and the speed of drive pump 600.

[0100] In some examples, to achieve automatic control of the fan 500 and the driving pump 600, the heat dissipation device 12 can further include a first temperature sensor 810 and a second temperature sensor 830, the first temperature sensor 810 is configured to collect the temperature of the cooling liquid flowing into the inlet 150 of the heat exchanger 100, and the second temperature sensor 830 is configured to collect the temperature of the cooling liquid flowing out of the outlet 160 of the heat exchanger 100. The first temperature sensor 810 and the second temperature sensor 830 are electrically connected to the controller 300, and the controller 300 is configured to obtain the temperature collected by the first temperature sensor 810 and the second temperature sensor 830. The controller 300 is further configured to control at least one of the fan 500 and the driving pump 600 according to the temperature collected by at least one of the first temperature sensor 810 and the second temperature sensor 830.

[0101] For example, the controller 300 can be configured to control the fan 500 and the driving pump 600 according to the temperature collected by the first temperature sensor 810 and the temperature collected by the second temperature sensor 830, so as to adjust the rotating speed of the fan 500 and the flow of the cooling liquid flowing into the liquid cooling heat exchange assembly 30, and then adapt to different working conditions of the liquid cooling device.

[0102] The heat dissipation device 12 further includes a pressure sensor 820, the pressure sensor 820 is configured to collect the pressure in the cooling liquid circulation loop, and the pressure sensor 820 is electrically connected to the controller 300. The controller 300 is configured to obtain the pressure collected by the pressure sensor 820, so as to monitor the pressure in the cooling liquid circulation loop, and then form a corresponding instruction according to the pressure in the cooling liquid circulation loop.

[0103] For example, the controller 300 can be configured to form a state instruction for indicating the working state of the cooling liquid circulation loop according to at least one of the temperature collected by the first temperature sensor 810, the temperature collected by the second temperature sensor 830, the pressure collected by the pressure sensor 820, the rotating speed of the fan 500, and the rotating speed of the driving pump 600. The working state of the cooling liquid circulation loop can include a normal state and a fault state.

[0104] The liquid cooling device further includes a device controller (not shown), for example, the charging pile 10 can include a device controller, and the device controller is a device independent of the heat dissipation device 12. The controller 300 of the heat dissipation device 12 is electrically connected to the device controller, and the controller 300 of the heat dissipation device 12 is further configured to send the state instruction for indicating the working state of the cooling liquid circulation loop to the device controller. The device controller can form a corresponding control instruction according to the obtained state instruction.

[0105] Figure 4 a perspective view of another heat dissipation device provided in an embodiment of the present application, Figure 5 aFigure 4 The diagram shows another perspective of the heat dissipation device provided. In the diagram, the x-direction is the first direction, the y-direction is the second direction, and the z-direction is the third direction. The first direction is the length direction of the heat dissipation device 12, the second direction is the width direction of the heat dissipation device 12, and the third direction is the height direction of the heat dissipation device 12.

[0106] For example, the length direction of the heat exchanger 100 can be the same as the length direction of the heat dissipation device 12, the width direction of the heat exchanger 100 can be the same as the width direction of the heat dissipation device 12, and the height direction of the heat exchanger 100 can be the same as the height direction of the heat dissipation device 12. That is, the first direction can also be the length direction of the heat exchanger 100, the second direction can also be the width direction of the heat exchanger 100, and the third direction can also be the height direction of the heat exchanger 100.

[0107] like Figure 4 , Figure 5 As shown, exemplarily, the heat dissipation device also includes a frame 400, and the heat exchanger 100, fan 500 and drive pump 600 can all be fixedly connected to the frame 400.

[0108] For example, the fan 500 and the drive pump 600 may be respectively located on both sides of the heat exchanger 100 in the first direction.

[0109] For example, the heat dissipation device 12 may include a plurality of fans 500. For instance, the heat dissipation device 12 may include two fans 500 arranged along a third direction.

[0110] In some examples, the inlet connector 710 is connected to the return connector 760 via a third connecting pipe 770. That is, one end of the third connecting pipe 770 is connected to the inlet connector 710, and the other end is connected to the return connector 760. In this case, the inlet 150 of the heat exchanger 100 is connected to the return connector 760 via the inlet connector 710 and the third connecting pipe 770. This allows for more flexible positioning of the inlet 150 of the heat exchanger 100 and facilitates the connection between the heat exchanger 100 and the return connector 760. For example, when the return connector 760 needs to be connected to the heat exchanger 100 from above or at the top, the inlet 150 located at the bottom of the heat exchanger 100 can be connected to the return connector 760 from above or at the top of the heat exchanger 100 via the third connecting pipe 770.

[0111] For example, the third connecting pipe 770 is a flexible hose, which makes the connection and arrangement of the third connecting pipe 770 more convenient.

[0112] For example, the liquid supply connector 730 and the liquid return connector 760 are located on the upper part of the heat dissipation device 12.

[0113] For example, the first temperature sensor 810 can be arranged at the liquid return joint 760, and the liquid return joint 760 can carry the first temperature sensor 810. When the liquid return joint 760 is arranged at the upper portion of the heat dissipation device 12, the arrangement of the first temperature sensor 810 is not easily affected by the load-bearing components of the lower portion of the heat dissipation device 12, the driving pump 600, and the like, and the arrangement of the first temperature sensor 810 is more convenient.

[0114] For example, the second temperature sensor 830 can be arranged at the liquid supply joint 730, and the liquid supply joint 730 can carry the second temperature sensor 830. When the liquid supply joint 730 is arranged at the upper portion of the heat dissipation device 12, the arrangement of the second temperature sensor 830 is not easily affected by the load-bearing components of the lower portion of the heat dissipation device 12, the driving pump 600, and the like, and the arrangement of the second temperature sensor 830 is more convenient.

[0115] For example, the pressure sensor 820 can be arranged at the liquid supply joint 730, and the liquid supply joint 730 can carry the pressure sensor 820. When the liquid supply joint 730 is arranged at the upper portion of the heat dissipation device 12, the arrangement of the pressure sensor 820 is not easily affected by the load-bearing components of the lower portion of the heat dissipation device 12, the driving pump 600, and the like, and the arrangement of the pressure sensor 820 is more convenient.

[0116] In some examples, the liquid return joint 760 has a plurality of ports, and the plurality of ports of the liquid return joint 760 can be respectively communicated with the outlets of the plurality of liquid cooling heat exchange assemblies 30, for example, the plurality of ports of the liquid return joint 760 can be respectively communicated with the plurality of liquid return channels 33, so that the cooling liquid in the plurality of liquid cooling heat exchange assemblies 30 can flow into the heat exchanger 100 for heat dissipation. For example, the liquid return joint 760 has two ports, and the charging pile 10 is provided with two charging guns, and the two ports of the liquid return joint 760 are respectively communicated with the outlets of the liquid return channels 33 of the two charging guns.

[0117] In some examples, the liquid supply joint 730 has a plurality of ports, and the plurality of ports of the liquid supply joint 730 can be respectively communicated with the inlets of the plurality of liquid cooling heat exchange assemblies 30, for example, the plurality of ports of the liquid supply joint 730 can be respectively communicated with the plurality of liquid return channels 33, so that the heat exchanger 100 can supply cooling liquid to the plurality of liquid cooling heat exchange assemblies 30. For example, the liquid supply joint 730 has two ports, and the charging pile 10 is provided with two charging guns, and the two ports of the liquid supply joint 730 are respectively communicated with the inlets of the liquid supply channels 32 of the two charging guns.

[0118] For example, the liquid supply joint 730 and the liquid return joint 760 can be integrated into one adapter. That is, the heat dissipation device 12 can include an adapter including the liquid supply joint 730 and the liquid return joint 760. The adapter can be arranged at the upper portion of the heat dissipation device 12. In this case, the first temperature sensor 810, the second temperature sensor 830, and the pressure sensor 820 can all be arranged in the adapter.

[0119] In some examples, the heat exchanger 100 further has a liquid discharge port 140 arranged at the bottom of the heat exchanger 100. When it is necessary to discharge the cooling liquid in the heat exchanger 100, the cooling liquid in the heat exchanger 100 can be discharged through the liquid discharge port 140.

[0120] Figure 6 For Figure 4 A schematic view of the heat dissipation device of the present application after removing the cover plate of the electric control box.

[0121] As Figure 5 , Figure 6 shown, in some examples, the heat dissipation device 12 further includes an electric control box 200, and the controller 300 is arranged in the electric control box 200. The electric control box 200 can be fixedly arranged on the frame 400 or the heat exchanger 100, and the electric control box 200 can serve to carry and protect the controller 300.

[0122] For example, the controller 300 can be a control board.

[0123] For example, the electric control box 200 can be arranged at one side of the frame 400 and the heat exchanger 100 in the second direction, so that the arrangement of the electric control box 200 and the controller 300 is less likely to interfere with the arrangement of devices or components on the top wall of the heat exchanger 100. The electric control box 200 can be fixedly connected with the frame 400.

[0124] For example, the electric control box 200 can include a box body and a cover plate. The box body is fixedly connected with the frame 400 or the heat exchanger 100, and the cover plate is detachably connected with the box body. The controller 300 is arranged in the space enclosed by the box body and the cover plate, and the controller 300 can be fixedly connected with the box body.

[0125] Figure 7 A schematic view of a heat exchanger provided by an embodiment of the present application, Figure 8 A sectional view of the heat exchanger along the A-A plane, Figure 7 A sectional view of the heat exchanger along the B-B plane. Figure 9 A sectional view of the heat exchanger along the B-B plane. Figure 7 A sectional view of the heat exchanger along the B-B plane.

[0126] As Figures 7-9As shown, in the embodiment of the present application, the heat exchanger 100 comprises a heat radiating component 120, the heat radiating component 120 has heat radiating flow channels 121, the heat radiating flow channels 121 contain cooling liquid, the cooling liquid flowing into the heat radiating flow channels 121 can be radiated by the heat radiating component 120.

[0127] For example, the fan 500 is used to drive the air flow at the heat radiating component 120, so as to improve the heat radiating efficiency of the heat radiating component 120.

[0128] For example, the heat radiating component 120 has a plurality of heat radiating flow channels 121 arranged side by side. For example, the heat radiating component 120 can comprise a plurality of heat radiating pipes arranged side by side, each heat radiating pipe can have one or more heat radiating flow channels 121, and adjacent two heat radiating pipes can be connected by heat radiating fins arranged between the two heat radiating pipes.

[0129] For example, the heat radiating pipe can be a flat pipe.

[0130] For example, the heat radiating component 120 comprises a plurality of heat radiating pipes arranged side by side along a second direction, each heat radiating pipe has a plurality of heat radiating flow channels 121 arranged side by side along a first direction, and both ends of the heat radiating flow channels 121 extend along a third direction.

[0131] The heat exchanger 100 further comprises a first liquid collecting component 110, the first liquid collecting component 110 has a first liquid collecting cavity 111 containing cooling liquid, the first liquid collecting component 110 is connected with the heat radiating component 120, the first liquid collecting cavity 111 is communicated with the heat radiating flow channels 121, the first liquid collecting cavity 111 is used for converging or diverging the plurality of heat radiating flow channels 121, so that the cooling liquid can be radiated in the plurality of heat radiating flow channels 121, in addition, by arranging the first liquid collecting component 110, the communication between the plurality of heat radiating flow channels 121 and the liquid cooling heat exchange assembly 30 is facilitated, so as to connect the plurality of heat radiating flow channels 121 to the cooling liquid circulation loop.

[0132] For example, the first liquid collecting component 110 is arranged at one end of the heat radiating component 120 and is fixedly connected with the one end of the heat radiating component 120, for example, the first liquid collecting component 110 is arranged at one end of the heat radiating pipe and is fixedly connected with the one end of the heat radiating pipe.

[0133] In some examples, the heat exchanger 100 further comprises a second liquid collecting component 130, the second liquid collecting component 130 has a second liquid collecting cavity 131, the second liquid collecting cavity 131 contains cooling liquid, the second liquid collecting component 130 is connected with the heat radiating component 120, one end of the heat radiating flow channel 121 is communicated with the first liquid collecting cavity 111, the other end of the heat radiating flow channel 121 is communicated with the second liquid collecting cavity 131, the second liquid collecting cavity 131 is used for converging or diverging of the plurality of heat radiating flow channels 121, by arranging the second liquid collecting component 130, the plurality of heat radiating flow channels 121 is convenient to be communicated with the liquid cooling heat exchange assembly 30, so as to connect the plurality of heat radiating flow channels 121 into the cooling liquid circulating loop.

[0134] For example, the second liquid collecting component 130 is arranged at the other end of the heat radiating component 120 and is fixedly connected with the other end of the heat radiating component 120, for example, the second liquid collecting component 130 is arranged at the other end of the heat radiating pipe and is fixedly connected with the other end of the heat radiating pipe.

[0135] In the embodiment of the present application, the first liquid collecting component 110 is provided with a pressure control component 114, the pressure control component 114 is used for controlling the pressure in the first liquid collecting cavity 111 within a preset range. In addition to the cooling liquid, the first liquid collecting cavity 111 also contains gas, that is, the first liquid collecting cavity 111 includes a first space for containing the cooling liquid and a second space for containing the gas, and the cooling liquid does not fill the first liquid collecting cavity 111.

[0136] In this way, by arranging the pressure control component 114 in the first liquid collecting component 110, the pressure control component 114 can control the pressure in the first liquid collecting cavity 111 within a preset range, and the gas contained in the first liquid collecting cavity 111 can be compressed or expanded under the control of the pressure control component 114 to balance the pressure in the first liquid collecting cavity 111, so that the gas contained in the first liquid collecting cavity 111 can be used to realize the buffering function, that is, the first liquid collecting component 110 provided with the pressure control component 114 can play a buffering role for the pressure change in the cooling liquid circulating loop. At this time, in addition to being used for converging or diverging of the plurality of heat radiating flow channels 121, the first liquid collecting component 110 can also play a role of a buffer tank, in other words, the buffer tank and the first liquid collecting component 110 of the heat exchanger 100 are integrated, so that it is not necessary to arrange a buffer tank independent of the heat exchanger 100, so that the integration degree of the heat dissipation device 12 is high, which is beneficial to reducing the size of the heat dissipation device 12. In addition, since it is not necessary to arrange a buffer tank independent of the heat exchanger 100, the number of structural parts of the heat dissipation device 12 can be reduced, which is beneficial to reducing the cost of the heat dissipation device 12.

[0137] The size of the first space for containing the cooling liquid and the second space for containing the gas changes with the amount of the cooling liquid contained in the first liquid collecting cavity 111.

[0138] For example, the gas contained in the first liquid-collecting cavity 111 can be air.

[0139] For example, the cooling liquid can be cooling water, cooling oil, fluorinated liquid, etc.

[0140] For example, the volume of the first liquid-collecting cavity 111 can be greater than the volume of the second liquid-collecting cavity 131, so that part of the first liquid-collecting cavity 111 can contain the cooling liquid circulating in the cooling liquid circulating loop, and part of the first liquid-collecting cavity 111 can contain the gas, thereby facilitating the buffering of the pressure change in the cooling liquid circulating loop by the first liquid-collecting component 110. In addition, the first liquid-collecting cavity 111 with a larger volume can contain a larger volume of gas, so that the first liquid-collecting component 110 can have a better buffering effect.

[0141] For example, in the third direction, the size of the first liquid-collecting component 110 is greater than the size of the second liquid-collecting component 130, so that the first liquid-collecting cavity 111 can have a larger volume. In addition, the size of the first liquid-collecting component 110 in the third direction is larger, which facilitates leaving a second space for containing the gas in the upper part of the first liquid-collecting cavity 111.

[0142] For example, in the first direction, the size of the first liquid-collecting component 110 is greater than the size of the second liquid-collecting component 130, and the size of the first liquid-collecting component 110 is greater than the size of the heat-dissipating component 120, so that the first liquid-collecting cavity 111 can have a larger volume. In addition, the size of the first liquid-collecting component 110 in the first direction is larger, which facilitates arranging the pressure control component 114 and other devices or components on the first liquid-collecting component 110.

[0143] In some possible embodiments, the first liquid-collecting component 110 has a pressure relief port 115, and the pressure control component 114 includes a safety valve 114a arranged at the pressure relief port 115.

[0144] In this way, when the pressure in the first liquid-collecting cavity 111 is too large, the safety valve 114a can be opened, and the pressure can be relieved through the pressure relief port 115 and the safety valve 114a, so as to control the pressure in the first liquid-collecting cavity 111. As a result, the first liquid-collecting component 110 can buffer the pressure change in the cooling liquid circulating loop, and the safety of the first liquid-collecting component 110 is better, and the first liquid-collecting component 110 is less likely to be damaged due to overpressure of the first liquid-collecting cavity 111.

[0145] For example, when the safety valve 114a is opened, the gas in the first liquid-collecting cavity 111 can be discharged through the pressure relief port 115 and the safety valve 114a.

[0146] For example, the pressure relief port 115 can be located at the top of the first liquid collecting component 110. For instance, the pressure relief port 115 can be located on the top wall of the first liquid collecting component 110, so that when the pressure in the first liquid collecting chamber 111 is within a preset range, the coolant in the first liquid collecting chamber 111 is less likely to leak at the pressure relief port 115. In addition, when the safety valve 114a is open, the coolant is also less likely to be discharged through the pressure relief port 115.

[0147] In some possible implementations, the pressure control component 114 may include a pressure regulating valve for controlling the pressure of the first liquid collecting chamber 111 based on the pressure switch within the first liquid collecting chamber 111. For example, the pressure regulating valve may close when the pressure in the first liquid collecting chamber 111 is within a preset range, and open when the pressure in the first liquid collecting chamber 111 is too high or too low.

[0148] In some possible implementations, the pressure control component 114 may include an elastic diaphragm or air bladder disposed in the first liquid collection chamber 111, the elastic diaphragm or air bladder dividing the first liquid collection chamber 111 into a first space for containing coolant and a second space for containing gas, the gas pre-filled in the second space can provide a set pressure to control the pressure in the first liquid collection chamber 111 within a preset range.

[0149] like Figures 7-9 As shown, in some possible embodiments, the first liquid collecting component 110 has a liquid injection port 112, and a plug 113 is provided at the liquid injection port 112. The plug 113 is detachably connected to the first liquid collecting component 110, and the plug 113 blocks the liquid injection port 112.

[0150] Thus, when the coolant in the first liquid collection chamber 111 is low and needs to be replenished, the plug 113 can be opened to replenish the first liquid collection chamber 111, making it convenient to replenish the coolant circulation loop. After replenishing the first liquid collection chamber 111, the plug 113 can be used to seal the injection port 112 to achieve a seal on the first liquid collection chamber 111, facilitating the circulation of coolant in the coolant circulation loop and providing a buffering function.

[0151] For example, the injection port 112 can be located at the top of the first liquid collecting component 110. For instance, the injection port 112 can be located on the top wall of the first liquid collecting component 110, so that the liquid in the first liquid collecting chamber 111 is less likely to leak from the injection port 112.

[0152] In some possible embodiments, the first liquid collecting component 110 is further provided with a liquid level meter 117, which is configured to display the liquid level of the first liquid collecting cavity 111, so as to facilitate the user to control the liquid level in the first liquid collecting cavity 111.

[0153] For example, the liquid level meter 117 is in communication with the first liquid collecting cavity 111.

[0154] For example, the liquid level meter 117 can include an upper connector, a lower connector and a transparent tube. The upper connector is arranged at the top of the first liquid collecting component 110 and is in communication with the space at the top of the first liquid collecting cavity 111. The lower connector is arranged at the bottom of the first liquid collecting component 110 and is in communication with the space at the bottom of the first liquid collecting cavity 111. The two ends of the transparent tube are connected with the upper connector and the lower connector respectively. The upper end of the transparent tube is in communication with the space at the top of the first liquid collecting cavity 111 through the upper connector. The lower end of the transparent tube is in communication with the space at the bottom of the first liquid collecting cavity 111 through the lower connector. According to the principle of communicating vessels, the liquid level of the first liquid collecting cavity 111 can be displayed through the transparent tube.

[0155] In some possible embodiments, the first liquid collecting component 110 is further provided with a liquid level sensor 116, which is configured to detect the liquid level of the first liquid collecting cavity 111.

[0156] In this way, through the detection of the liquid level of the first liquid collecting cavity 111 by the liquid level sensor 116, the monitoring of the liquid level of the first liquid collecting cavity 111 and the corresponding instructions according to the liquid level of the first liquid collecting cavity 111 can be realized, which is beneficial to the automatic control.

[0157] For example, the liquid level sensor 116 is electrically connected with the controller 300. The liquid level sensor 116 is configured to form a first signal when the liquid level in the first liquid collecting cavity 111 is lower than a preset liquid level, and form a second signal when the liquid level in the first liquid collecting cavity 111 is higher than or equal to the preset liquid level. The controller 300 is configured to acquire the first signal and the second signal, and form a state instruction for indicating the state of the first liquid collecting cavity 111 according to the first signal and the second signal. The state of the first liquid collecting cavity 111 can include a normal state and a liquid shortage state. In this way, the liquid shortage of the first liquid collecting cavity 111 can be found in time.

[0158] For example, the liquid level sensor 116 can be arranged on the bottom wall or the top wall of the first liquid collecting component 110.

[0159] In some possible embodiments, the first liquid collecting component 110 is arranged above the heat dissipation component 120, that is, the first liquid collecting cavity 111 is located above the heat dissipation flow channel 121, and the upper end of the heat dissipation flow channel 121 is in communication with the first liquid collecting cavity 111.

[0160] In this way, the coolant flowing between the first liquid collecting cavity 111 and the heat dissipation flow channel 121 is less likely to be affected by the gas contained in the first liquid collecting cavity 111, and the coolant is more likely to flow between the first liquid collecting cavity 111 and the heat dissipation flow channel 121. In addition, the pressure control component 114, the liquid injection port 112, the liquid level meter 117, and other components or structures provided on the first liquid collecting component 110 are less likely to be affected by the heat dissipation component 120, and it is easier to provide the pressure control component 114, the liquid injection port 112, the liquid level meter 117, and other components or structures on the first liquid collecting component 110. In addition, the first liquid collecting component 110 is opened when the coolant is in the coolant circulation loop, so that the liquid injection and other operations can be performed on the first liquid collecting cavity 111.

[0161] For example, the gas in the first liquid collecting cavity 111 is located above the coolant in the first liquid collecting cavity 111, and at this time, the first liquid collecting cavity 111 does not need to be provided with a separating component, and the structure of the first liquid collecting component 110 is relatively simple.

[0162] For example, part of the first liquid collecting component 110 protrudes in the first direction from the heat dissipation component 120, so that the liquid level sensor 116 and other devices or components are provided on the bottom wall of the first liquid collecting component 110.

[0163] In some examples, the second liquid collecting component 130 is arranged below the heat dissipation component 120, that is, the second liquid collecting cavity 131 is located below the heat dissipation flow channel 121, and the lower end of the heat dissipation flow channel 121 communicates with the second liquid collecting cavity 131.

[0164] In examples in which the second liquid collecting component 130 is arranged below the heat dissipation component 120, the liquid discharge port 140 is arranged on the second liquid collecting component 130, and the liquid discharge port 140 communicates with the second liquid collecting cavity 131.

[0165] In some examples in which the second liquid collecting component 130 is arranged below the heat dissipation component 120, at least one of the liquid inlet port 150 of the heat exchanger 100 and the liquid outlet port 160 of the heat exchanger 100 is arranged on the second liquid collecting component 130 and communicates with the second liquid collecting cavity 131.

[0166] In this way, when the liquid inlet 150 of the heat exchanger 100 is arranged on the second liquid collecting member 130 and communicates with the second liquid collecting cavity 131, the cooling liquid enters the heat exchanger 100 through the second liquid collecting cavity 131 at the lower part of the heat exchanger 100, and then enters the first liquid collecting cavity 111 through the heat dissipation flow channel 121, so that the cooling liquid flowing into the first liquid collecting cavity 111 is less affected by the gas in the first liquid collecting cavity 111, and the cooling liquid is more easily flowed into the first liquid collecting cavity 111. When the liquid outlet 160 of the heat exchanger 100 is arranged on the second liquid collecting member 130 and communicates with the second liquid collecting cavity 131, the cooling liquid in the first liquid collecting cavity 111 flows to the second liquid collecting cavity 131 at the lower part of the heat exchanger 100 through the heat dissipation flow channel 121, and then flows out of the heat exchanger 100 through the second liquid collecting cavity 131 at the lower part of the heat exchanger 100, so that the gas in the first liquid collecting cavity 111 is less likely to be pumped out by the driving pump 600, and the efficiency and stability of the driving pump 600 are better.

[0167] In some examples, the liquid inlet 150 of the heat exchanger 100 is arranged on the second liquid collecting member 130 and communicates with the second liquid collecting cavity 131, the liquid outlet 160 of the heat exchanger 100 is arranged on the first liquid collecting member 110 and communicates with the first liquid collecting cavity 111, and the liquid outlet 160 of the heat exchanger 100 is located at the bottom of the first liquid collecting member 110, for example, the liquid outlet 160 of the heat exchanger 100 is located at the bottom wall of the first liquid collecting member 110, so as to facilitate the cooling liquid in the first liquid collecting cavity 111 to flow out from the bottom of the first liquid collecting cavity 111. In addition, while the structure of the heat exchanger 100 is relatively simple, the whole first liquid collecting cavity 111 is utilized to buffer the pressure change in the cooling liquid circulating loop, and the buffering effect on the pressure change in the cooling liquid circulating loop is better.

[0168] In other examples, the liquid outlet 160 of the heat exchanger 100 is arranged on the second liquid collecting member 130 and communicates with the second liquid collecting cavity 131, the liquid inlet 150 of the heat exchanger 100 is arranged on the first liquid collecting member 110 and communicates with the first liquid collecting cavity 111, and the liquid inlet 150 of the heat exchanger 100 is located at the bottom of the first liquid collecting member 110, for example, the liquid inlet 150 of the heat exchanger 100 is located at the bottom wall of the first liquid collecting member 110, so as to facilitate the cooling liquid to flow into the first liquid collecting cavity 111 from the bottom of the first liquid collecting cavity 111. In addition, while the structure of the heat exchanger 100 is relatively simple, the whole first liquid collecting cavity 111 is utilized to buffer the pressure change in the cooling liquid circulating loop, and the buffering effect on the pressure change in the cooling liquid circulating loop is better.

[0169] In some examples, the second collecting cavity 131 is provided with a partition, the partition divides the second collecting cavity 131 into a first sub-cavity and a second sub-cavity, the partial heat dissipation flow channel 121 is in communication with the first sub-cavity and the first collecting cavity 111, the partial heat dissipation flow channel 121 is in communication with the second sub-cavity and the first collecting cavity 111, the liquid inlet 150 of the heat exchanger 100 and the liquid outlet 160 of the heat exchanger 100 are both arranged on the second collecting cavity 130, the liquid inlet 150 of the heat exchanger 100 is in communication with the first sub-cavity, and the liquid outlet 160 of the heat exchanger 100 is in communication with the second sub-cavity. After the cooling liquid enters the heat exchanger 100, the cooling liquid first flows into the first sub-cavity, then flows to the first collecting cavity 111 through the heat dissipation flow channel 121 in communication with the first sub-cavity, the cooling liquid in the first collecting cavity 111 flows to the second sub-cavity through the heat dissipation flow channel 121 in communication with the second sub-cavity, and then flows out of the heat exchanger 100 from the liquid outlet 160 of the heat exchanger 100. In this way, the flow path of the cooling liquid in the heat exchanger 100 can be longer, which is beneficial to the sufficient heat dissipation of the cooling liquid in the heat exchanger 100. In addition, the flow rate of the cooling liquid in the cooling liquid circulation loop can also be faster, which is beneficial to the efficient heat dissipation of the heat generating component 20. In addition, the first collecting cavity 111 as a whole can also be used to buffer the pressure change in the cooling liquid circulation loop, and the buffering effect of the pressure change in the cooling liquid circulation loop is better.

[0170] For example, the first sub-cavity and the second sub-cavity can be arranged along the second direction. In the second direction, the partial heat dissipation flow channel 121 and the first sub-cavity are located on the same side of the partition and are in communication with the first sub-cavity, and the partial heat dissipation flow channel 121 and the second sub-cavity are located on the same side of the partition and are in communication with the second sub-cavity.

[0171] In the description of the embodiments of the present application, unless otherwise clearly defined and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixed connection, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0172] The terms "first", "second", "third", "fourth" and the like (if any) in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence.

[0173] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the embodiments of the present application are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat exchanger (100), characterized in that, The heat dissipation component (120) has a heat dissipation flow channel (121). The first liquid collecting component (110) has a first liquid collecting cavity (111), and the first liquid collecting component (110) is connected with the heat dissipation component (120), and the first liquid collecting cavity (111) is communicated with the heat dissipation flow channel (121). The first liquid collecting component (110) is provided with a pressure control component (114) for controlling the pressure in the first liquid collecting cavity (111) within a preset range. The first liquid collecting component (110) is arranged above the heat dissipation component (120).

2. The heat exchanger (100) according to claim 1, characterized in that The first liquid collecting component (110) has a pressure relief port (115), and the pressure control component (114) comprises a safety valve (114a) arranged at the pressure relief port (115).

3. The heat exchanger (100) according to claim 1, characterized in that The first liquid collecting component (110) has a liquid injection port (112), and a plug (113) is arranged at the liquid injection port (112), the plug (113) is detachably connected with the first liquid collecting component (110), and the plug (113) seals the liquid injection port (112).

4. The heat exchanger (100) according to any one of claims 1-3, characterized in that The first liquid collecting component (110) is further provided with a liquid level meter (117) for displaying the liquid level of the first liquid collecting cavity (111).

5. The heat exchanger (100) according to any one of claims 1-3, characterized in that The first liquid collecting component (110) is further provided with a liquid level sensor (116) for detecting the liquid level of the first liquid collecting cavity (111).

6. The heat exchanger (100) according to any one of claims 1-3, characterized in that The heat dissipation component (120) has a heat dissipation flow channel (121).

7. The heat exchanger (100) according to any one of claims 1-3, characterized in that The second liquid collecting component (130) is arranged below the heat dissipation component (120) and connected with the heat dissipation component (120), and the second liquid collecting component (130) has a second liquid collecting cavity (131), one end of the heat dissipation flow channel (121) is communicated with the first liquid collecting cavity (111), and the other end of the heat dissipation flow channel (121) is communicated with the second liquid collecting cavity (131). The heat exchanger (100) has a liquid inlet (150) and a liquid outlet (160), and at least one of the liquid inlet (150) and the liquid outlet (160) is arranged in the second liquid collecting component (130) and communicated with the second liquid collecting cavity (131). The heat exchanger (100) comprises the heat exchanger (100) according to any one of claims 1-7.

8. A heat dissipating device (12) characterized by, The heat dissipation flow channel (121) of the heat exchanger (100) is used for containing cooling liquid, and the first liquid collecting cavity (111) of the heat exchanger (100) is used for containing the cooling liquid and gas. The heat dissipation device (12) according to claim 8 is arranged in the pile body (11).

9. A charging station (10), characterized in that The heat dissipation device (12) according to claim 8 is arranged in the liquid cooling heat exchange assembly (30).

10. A liquid cooling device, characterized by, The liquid cooling heat exchange assembly (30) is used for forming a cooling liquid circulation loop with the heat exchanger (100) of the heat dissipation device (12). ​ The liquid cooling heat exchange component (30) and the heat dissipation flow channel (121) of the heat dissipation device (12) contain cooling liquid, and the first liquid collecting cavity (111) of the heat dissipation device (12) contains the cooling liquid and gas.

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