PCB (printed circuit board) capable of reducing LED (light-emitting diode) heat attenuation
By optimizing the PCB board structure design and adopting double-sided copper plating and partitioned heat dissipation zone insulation gaps, the problem of heat accumulation in LED lights was solved, achieving a more efficient heat dissipation effect and extending the lifespan of LED lights.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-04
- Publication Date
- 2026-04-10
AI Technical Summary
Traditional LED PCB designs often result in concentrated heat buildup areas, leading to excessively high local temperatures that affect the luminous efficacy and lifespan of LED lights.
Design a double-sided copper-clad PCB board, setting up an LED assembly area, a heat-generating component assembly area, and a low-heat component assembly area, and using first and second heat dissipation areas, thermal insulation gaps, and thermally conductive vias to separate and dissipate heat, thereby optimizing the thermal channel design.
It effectively reduces the temperature rise rate of LED lights, improves heat dissipation efficiency, reduces thermal decay, and ensures the reliability and lifespan of LED lights.
Smart Images
Figure CN224108159U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of LED heat dissipation, and particularly relates to a PCB capable of reducing LED thermal decay. BACKGROUND
[0002] LED lighting is light emitting diode lighting, which is a kind of semiconductor solid-state lighting device. It is a solid-state semiconductor chip as a light emitting material, and the light emitting material is directly emitted in the semiconductor by the carrier composite emission of excess energy and the emission of photons. On this basis, by using the three primary color principle, adding fluorescent powder, any color light can be emitted. The lighting appliance manufactured by using LED as light source is LED lamp. When the LED lamp works, about 60%-80% of electric energy will be converted into heat energy, if the heat cannot be dissipated in time, the junction temperature will be increased, which will cause the problems of light efficiency decrease, color temperature deviation and service life shortening, i.e. thermal decay. In the prior art, the heat dissipation performance of PCB as the carrier of LED directly affects the degree of thermal decay. The traditional LED PCB design has the following problems: heat accumulation area is concentrated, i.e. LED arrangement is dense or power supply circuit design is improper, which leads to local temperature rise being too high. The heat channel design is unreasonable. SUMMARY
[0003] The utility model solves the technical problems that: provide a simple structure, the heat dissipation effect is good, can effectively reduce the PCB of LED thermal decay.
[0004] The utility model adopts the technical scheme in the technical problems that the above-mentioned technical problems are solved: a kind of PCB of reducing LED thermal decay, including:
[0005] PCB plate body, the PCB plate body double-sided copper, and is equipped with LED assembly area, heating element assembly area and low heat element assembly area;
[0006] The LED assembly area is used to install LED lamp, and the one side of the LED assembly area is provided with first heat dissipation area, and the other side is provided with second heat dissipation area and is connected with heating element assembly area;
[0007] The heating element assembly area is used to install the heating element of large heat dissipation, and the heating element assembly area is densely provided with heat dissipation through hole;
[0008] The low heat element assembly area is used to assemble low heat resistance, diode and capacitor;
[0009] Heat insulation gap is provided between the first heat dissipation area and the second heat dissipation area, and the first heat dissipation area and the second heat dissipation area are densely provided with heat conduction through hole.
[0010] Preferably, the first heat dissipation area is provided with a heat insulation gap on the circumferential side; the advantage is that the heat insulation gap arranged around the first heat dissipation area can effectively reduce the heat transfer from the surrounding to the first heat dissipation area, thereby reducing the temperature rise speed of the LED assembly area and ensuring the reliability of the LED lamp.
[0011] Preferably, the second heat dissipation area is provided with an auxiliary heat insulation groove between the heat generating element assembly area; the advantage is that the auxiliary heat insulation groove can reduce the rapid heat transfer from the heat generating element assembly area to other areas.
[0012] Preferably, the LED assembly area is arranged on the upper side of the PCB body, and the heat generating element assembly area is arranged on the lower side of the PCB body; the advantage is that the LED assembly area and the heat generating element assembly area are arranged in an up-down manner, thereby maximizing the distance between the LED lamp and the heat generating element in a limited space and effectively reducing the influence of the heat released by the heat generating element on the LED lamp.
[0013] Further, the heat generating element is a triode, and the heat generating element and the LED lamp are arranged on the same side of the PCB body; the advantage is that the heat generating element and the LED lamp are arranged on the same side, which can effectively reduce the space occupation of the components on the other side, thereby reducing the volume after assembly.
[0014] Preferably, the PCB body is provided with a low-heat element assembly area on both sides; the advantage is that the components arranged in the low-heat assembly area have a small volume, and the low-heat assembly areas arranged on both sides can facilitate circuit wiring while reducing the thickness of the components after assembly.
[0015] Preferably, the heat dissipation through hole and the heat conduction through hole are via holes, the hole diameter is 0.4mm, and the pad hole diameter is 0.6mm.
[0016] Compared with the prior art, the PCB body with double-sided copper foil can quickly transfer the heat released by the heat generating element in the heat generating element assembly area to the other side, and the heat generating element assembly area and the LED assembly area are separated by the first heat dissipation area, the second heat dissipation area and the heat insulation gap, thereby reducing the influence of the heat released by the heat generating element on the LED lamp, and further reducing the heat decay of the LED lamp caused by the accumulation of heat. The heat dissipation through hole and the heat conduction through hole arranged at the same time can increase the ventilation area, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.
[0018] Fig. 1 It is the top view of the PCB body of the present application.
[0019] Fig. 2 It is the bottom view of the PCB body of the present application. DETAILED DESCRIPTION
[0020] The present application will be further described in detail below with reference to the drawings.
[0021] The following description is used to disclose the present application so that those skilled in the art can implement the present application. The preferred embodiments in the following description are only used as examples, and other obvious modifications can be thought by those skilled in the art. The basic principles defined in the following description can be used in other embodiments, modifications, improvements, equivalent schemes and other technical schemes without departing from the spirit and scope of the present application.
[0022] As shown in the accompanying drawings, Figs. 1-2 A PCB for reducing LED heat decay, comprising: a PCB body 100, the PCB body is double-sided copper-clad, and is provided with an LED assembly area 1, a heat element assembly area 4 and a low-heat element assembly area 5, the LED assembly area 1 is used for mounting an LED lamp, one side of the LED assembly area 1 is provided with a first heat dissipation area 2, the other side is provided with a second heat dissipation area 3 and is connected with the heat element assembly area 4, the heat element assembly area 4 is used for mounting a heat element with large heat dissipation, and the heat element assembly area 4 is densely provided with heat dissipation through holes 8, the low-heat element assembly area 5 is used for assembling a low-heat resistor, a diode and a capacitor, a heat insulation gap 6 is arranged between the first heat dissipation area 2 and the second heat dissipation area 3, and the first heat dissipation area 2 and the second heat dissipation area 3 are both densely provided with heat conduction through holes 9.
[0023] The effect of the above technical scheme is that the double-sided copper-clad PCB body can quickly transfer and dissipate the heat released by the heat elements in the heat element assembly area 4 to the other side, and at the same time, the heat element assembly area 4 and the LED assembly area 1 are distinguished and separated by the first heat dissipation area 2, the second heat dissipation area 3 and the heat insulation gap 6, so as to reduce the influence of the heat released by the heat elements on the LED lamp, and further reduce the heat decay of the LED lamp caused by the accumulation of heat. The heat dissipation through holes 8 and the heat conduction through holes 9 arranged at the same time can increase the ventilation area, and further improve the heat dissipation efficiency.
[0024] On the basis, the first heat dissipation area 2 is provided with heat insulation gap 6 on the side, the heat insulation gap 6 that is arranged around the first heat dissipation area 2 can effectively reduce the heat transmission of surrounding towards the first heat dissipation area 2, thereby reducing the temperature rise speed of LED assembly area 1, guarantee the reliability of LED lamp work.
[0025] It is worth mentioning that, between the second heat dissipation area 3 and the heat element assembly area 4, there is also an auxiliary heat insulation groove 7, which can reduce the heat of the heat element assembly area 4 to other areas too fast.
[0026] The LED assembly area 1 of the utility model is arranged on the upper side of the PCB body, the heat element assembly area 4 is arranged on the lower side of the PCB body, the LED assembly area 1 and the heat element assembly area 4 are arranged in an up-down separation mode, so that the distance between the LED lamp and the heat element in the limited space is set to be the longest, and the influence of the heat released by the heat element on the LED lamp is effectively reduced.
[0027] In order to improve the space volume occupied by the PCB after welding and assembly, the two side surfaces of the PCB body are provided with low-heat element assembly areas 5, and the low-heat assembly areas arranged on both sides can reduce the thickness of the components after assembly while facilitating circuit wiring.
[0028] The heat dissipation through hole 8 and the heat conduction through hole 9 are via holes, the hole diameter is 0.4mm, and the pad hole diameter is 0.6mm.
[0029] Those skilled in the art should understand that the embodiments of the utility model shown in the above description and the drawings are only as examples and do not limit the utility model. The purpose of the utility model has been completely and effectively realized. The function and structural principle of the utility model have been shown and explained in the embodiments, and the embodiments of the utility model can have any deformation or modification without departing from the principle.
Claims
1. A PCB board for reducing thermal degradation of LEDs, characterized by, Include: PCB board body, the PCB board body is double-sided copper, and is equipped with LED assembly area, heating element assembly area and low heat element assembly area; The LED assembly area is used for installing LED lamp, and one side of the LED assembly area is provided with a first heat dissipation area, and the other side is provided with a second heat dissipation area and is connected with the heating element assembly area; The heating element assembly area is used for installing heating element with large heat dissipation, and the heating element assembly area is densely provided with heat dissipation through holes; The low heat element assembly area is used for assembling low heat resistance, diode and capacitor; The first heat dissipation area and the second heat dissipation area are provided with heat insulation gaps, and the first heat dissipation area and the second heat dissipation area are densely provided with heat conduction through holes.
2. The PCB board for reducing thermal decay of LEDs according to claim 1, wherein, The first heat dissipation area is provided with heat insulation gaps on the circumferential side.
3. The PCB board of claim 1, wherein, The second heat dissipation area and the heating element assembly area are provided with auxiliary heat insulation grooves.
4. The PCB board of claim 1, wherein, The LED assembly area is arranged on the upper side of the PCB board body, and the heating element assembly area is arranged on the lower side of the PCB board body.
5. The PCB board of claim 4, wherein, The heating element is a triode, and the heating element and the LED lamp are assembled on the same side of the PCB board body.
6. The PCB board of claim 1, wherein, The two side surfaces of the PCB board body are provided with low heat element assembly areas.
7. The PCB board of claim 1, wherein, The heat dissipation through hole and the heat conduction through hole are via holes, the hole diameter is 0.4mm, and the pad hole diameter is 0.6mm.