Capacitive sensing device and equipment adopting FPC (Flexible Printed Circuit)
By adopting a capacitive sensing device with flexible circuit boards and a protective coating, the problems of large size, low sensitivity, and poor anti-interference ability of the sensing module in smart toilets have been solved, achieving improved sensitivity and enhanced stability, adapting to complex environments, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN SIKING TECH CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-04-10
AI Technical Summary
Existing capacitive sensing modules used in smart toilets suffer from problems such as large size, insufficient sensing sensitivity, poor anti-interference ability, inadequate EMC performance, and high production cost, making it difficult to adapt to the space constraints and environmental requirements of smart toilets.
Flexible printed circuit boards (FPCs) are used as the substrate, combined with waterproof membranes, electromagnetic shielding membranes and pressure-sensitive membranes as the covering layers, and copper foil is used as the sensing carrier. Bidirectional Zener diodes are introduced into the capacitive sensing circuit, and the capacitor combination is optimized to improve sensitivity and stability and adapt to complex environments.
This has improved the sensitivity and stability of the sensing device, made it adaptable to complex shapes and spatial layouts, extended its service life, reduced the impact of electromagnetic interference, and lowered production costs.
Smart Images

Figure CN224109659U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of capacitive sensing, and in particular to a capacitive sensing device using FPC and equipment. BACKGROUND
[0002] The current smart home field is developing rapidly, among which the intelligent toilet as a key device to improve the quality of life of users, its automation and sensing function becomes increasingly important. The capacitive sensing module has many applications in intelligent toilets, such as automatic cover opening, automatic flushing and night light illumination, which provides great convenience and health protection for users. However, there are still some technical and design challenges in the actual application of the module.
[0003] Specifically, the existing capacitive sensing module needs a large sensing area to ensure sufficient sensing distance, which often leads to a large sensing module volume, making it difficult to adapt to the limited space inside the intelligent toilet. In addition, in order to improve the anti-interference ability of the module, the sensing sensitivity of the module has to be sacrificed, but this is easy to cause false triggering or sensing failure in the bathroom environment with more static electricity, affecting the user experience. At the same time, the electronic components and control system inside the intelligent toilet have strict requirements on electromagnetic compatibility (EMC, Electro Magnetic Compatibility), and the EMC performance of the existing capacitive sensing module is insufficient, which may interfere with other electronic devices, affecting the stability and reliability of the intelligent toilet.
[0004] Moreover, in the manufacturing process, the existing capacitive sensing module usually needs to combine complex surface mount technology (SMT, Surface Mounted Technology) and manual soldering, which not only increases the production cost, but also limits the production efficiency, which is not conducive to mass production and cost control. CONTENT OF THE INVENTION
[0005] To achieve the above purpose, in the first aspect of the present application, a capacitive sensing device using FPC is provided, comprising: a substrate, a capacitive sensing circuit arranged on the substrate, an sensing carrier and a wiring port, and a covering layer covering at least one side surface of the substrate.
[0006] The substrate is a flexible circuit board;
[0007] One end of the capacitive sensing circuit is connected with the sensing carrier, and the other end is connected with the wiring port.
[0008] In the technical solution, the substrate is a flexible circuit board, so that the induction device can adapt to different installation environments and shape requirements, has better flexibility and bendability, can be installed on some irregular surfaces, and the application range is expanded. The capacitive induction circuit connects the induction carrier and the wiring port, realizes the reception and transmission of the induction signal, and the side of the substrate is covered with a coating layer to protect the internal circuit from external environmental factors (such as dust, moisture, etc.), improve the stability and reliability of the device.
[0009] Specifically, the coating layer includes: a waterproof film, an electromagnetic shielding film, an acrylic double-sided adhesive or a pressure-sensitive film.
[0010] Through the above technical solution, it can prevent moisture from entering the device, protect the internal circuit and components, prolong the service life of the device, and be suitable for humid environments or occasions that may contact water; it can shield external electromagnetic interference, reduce the influence of electromagnetic noise on the induction module and control components, improve the anti-interference ability of the device, and ensure the accuracy and stability of the induction signal; it can generate corresponding electrical signals according to the change of pressure, add the function of pressure sensing to the device, and broaden the application range of the device, such as being used in pressure sensing switches and the like.
[0011] Specifically, the induction carrier includes: a copper foil.
[0012] In the above technical solution, the copper foil has excellent electrical conductivity and can efficiently receive and transmit capacitive induction signals, improving the sensitivity and response speed of the induction device.
[0013] Specifically, the capacitive induction circuit includes: a main control chip, a first resistor, a first capacitor, a second capacitor and a third capacitor; the first resistor is arranged between the induction carrier and the detection input end of the main control chip; the main control chip is connected with the first capacitor, the second capacitor and the third capacitor respectively.
[0014] Specifically, it further includes: a first diode, a second diode and an inductor; one end of the inductor is connected with the third capacitor and the main control chip, and the other end is connected with the first diode; one end of the first diode is connected with a power supply, and the other end is connected with the second diode and grounded.
[0015] Specifically, it further includes a second resistor, and the two ends of the second resistor are respectively connected with the power input end and the output end of the main control chip.
[0016] Specifically, the third capacitor is a decoupling capacitor.
[0017] Specifically, the second capacitor is a charge collection capacitor.
[0018] Specifically, the first capacitor is a sensitivity adjustment capacitor.
[0019] By the technical solution, the capacitor combination of the specific capacity can optimize the frequency response characteristic of the capacitor sensing circuit, reduce the noise and interference of the signal, and improve the detection capability of the sensing module on the weak capacitor change.
[0020] In the second aspect of the application, a capacitive sensing device using FPC is provided, which has the sensing device described above.
[0021] Compared with the prior art, the application has the advantages that:
[0022] (1) Compared with the traditional rigid substrate, the FPC has the characteristics of bendable and foldable. This makes the capacitive sensing device can adapt to various complex shapes and spatial layouts, for example, it can be applied in some devices with special shape, such as wearable devices, curved screen devices, etc., greatly expanding the application scenarios of the sensing device.
[0023] (2) The bidirectional voltage stabilizing diode can stabilize the voltage within a certain range when the voltage is too high or too low, protecting other elements in the capacitor sensing circuit from damage caused by overvoltage or undervoltage. This improves the safety and stability of the capacitor sensing circuit, prolonging the service life of the sensing device.
[0024] (3) The combination of the waterproof film, the electromagnetic shielding film and the pressure sensitive film solves the shortcoming of the traditional FPC in complex environment. BRIEF DESCRIPTION OF DRAWINGS
[0025] The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the application. Other embodiments and many of the intended advantages of the present application will be readily appreciated as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
[0026] Figure 1 is a structural schematic diagram of a capacitive sensing device using FPC according to an embodiment of the application;
[0027] Figure 2 is a connection schematic diagram of a capacitive sensing device using FPC according to an embodiment of the application
[0028] Figure 3 is a circuit schematic diagram of a capacitive sensing circuit of a capacitive sensing device using FPC according to an embodiment of the application;
[0029] Figure 4 is a smart toilet according to an embodiment of the application.
[0030] The meanings of the numbers in the diagram are as follows: 1. Covering layer; 2. Substrate; U1. Main control chip; R1. First resistor; R2. Second resistor; C1. First capacitor; C2. Second capacitor; C3. Third capacitor; D1. First diode; D2. Second diode; L. Inductor; K1. Sensing carrier. Detailed Implementation
[0031] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description and illustrate illustrative specific embodiments in which the present application may be practiced. In this regard, directional terms such as “top,” “bottom,” “left,” “right,” “up,” “down,” etc., are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present application is defined by the appended claims.
[0032] like Figure 1 As shown, a capacitive sensing device using an FPC includes: a substrate 2, a capacitive sensing circuit disposed on the substrate 2, a sensing carrier K1 and a wiring port, and a covering layer 1 covering at least one side of the substrate 2.
[0033] Substrate 2 is a flexible circuit board;
[0034] One end of the capacitive sensing circuit is connected to the sensing carrier K1, and the other end is connected to the wiring port.
[0035] In the above technical solution, the substrate 2 uses a flexible circuit board, which allows the sensing device to adapt to different installation environments and shape requirements, providing better flexibility and bendability. It can be installed on irregular surfaces, expanding its application range. The capacitive sensing circuit connects the sensing carrier K1 and the wiring port, realizing the reception and transmission of the sensing signal. The covering layer 1 on the side of the substrate 2 protects the internal circuitry from external environmental factors (such as dust and moisture), improving the stability and reliability of the device.
[0036] Specifically, the covering layer 1 includes: a waterproof membrane, an electromagnetic shielding membrane, acrylic double-sided adhesive, or a pressure-sensitive membrane.
[0037] By selecting different materials for the covering layer 1, the following different effects can be achieved:
[0038] (1) It can prevent moisture from entering the device, protect the internal circuits and components, extend the service life of the device, and is suitable for humid environments or occasions where it may come into contact with water.
[0039] (2) Can shield the electromagnetic interference of the outside world, reduce the influence of electromagnetic noise on the induction module and control components, improve the anti-interference ability of the device, and ensure the accuracy and stability of the induction signal;
[0040] (3) Can generate corresponding electric signals according to the change of pressure, add the function of pressure induction to the device, and broaden the application range of the device, such as pressure induction switch and the like.
[0041] In a specific embodiment, specifically, the induction carrier K1 includes: a copper foil.
[0042] In the above technical solution, the copper foil has excellent electrical conductivity and can efficiently receive and transmit the capacitive induction signal, improving the sensitivity and response speed of the induction device.
[0043] The capacitive induction circuit includes: a main control chip U1, a first resistor R1, a first capacitor C1, a second capacitor C2, and a third capacitor C3; the first resistor R1 is arranged between the induction carrier and the detection input end of the main control chip U1; the main control chip U1 is connected with the first capacitor C1, the second capacitor C2, and the third capacitor C3 respectively.
[0044] Specifically, it further includes: a first diode D1, a second diode D2, and an inductor L; one end of the inductor L is connected with the third capacitor C3 and the main control chip U1, and the other end is connected with the first diode D1; one end of the first diode D1 is connected with a power supply, and the other end is connected with the second diode D2 and grounded.
[0045] Specifically, it further includes a second resistor R2, and the two ends of the second resistor R2 are connected with the power input end and the output end of the main control chip U1 respectively.
[0046] Specifically, the third capacitor C3 is a decoupling capacitor.
[0047] Specifically, the second capacitor C2 is a charge collection capacitor.
[0048] Specifically, the first capacitor C1 is a sensitivity adjustment capacitor.
[0049] The above capacitive induction circuit is only used as an embodiment for description, and it should be noted that other capacitive circuits with induction function can also achieve the technical effects of the present application.
[0050] In a specific embodiment, as Figure 3As shown, the capacitance induction circuit comprises: a master chip U1, a first resistor R1, a second resistor R2, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first diode D1, a second diode D2 and an inductor L; the first resistor R1 has its two ends connected to the output end of the sensor K1 and the port 4 of the master chip U1 respectively; the second resistor R2 has one end connected to the port 6 of the master chip U1 and one end of the second diode D2, and the other end connected to the port 8 of the master chip U1, the third capacitor C3 and one end of the inductor L; the other end of the third capacitor C3 is connected to the port 1 of the master chip U1, one end of the second capacitor C2, one end of the first capacitor C1 and the ground; the other end of the second capacitor C2 is connected to the port 2 of the master chip U1; the other end of the first capacitor C1 is connected to the port 4 of the master chip U1; one end of the first diode D1 is connected to the other end of the second diode D2 and the ground, and the other end is connected to the inductor L.
[0051] Preferably, the first diode D1 and the second diode D2 are both bidirectional voltage stabilizing diodes.
[0052] In this embodiment, the port 1 is the ground port of the power supply of the master chip U1, and the ports 2-5 are the input and output ports of the master chip U1. Specifically, the port 2 is the input end of the charge collection capacitor, the port 3 is the access end of the sensitive capacitor, and the user can adjust the capacitance value of the first capacitor C1 connected to the port 3 according to the use scene requirement, so as to adjust the induction sensitivity, the port 4 is the input end of the induction carrier induction signal, and the port 5 has the same function as the port 4. Different induction carriers can be connected to the ports 4 and 5 at the same time to meet the needs of different use scenes.
[0053] As shown in the figure, Figure 2 In this embodiment, the substrate 2 is integrated with the induction carrier K1, the capacitance induction circuit and the wiring port. The induction carrier K1 is used to collect the induction signal and transmit the induction signal to the capacitance induction circuit. After the signal is processed by the capacitance induction circuit, it is sent to the upper computer through the wiring port. The upper computer controls the corresponding equipment to perform corresponding actions through the signal.
[0054] At the same time, the wiring port is also responsible for connecting the external power supply, thereby providing the required power supply for the induction device.
[0055] In a specific embodiment, as shown in the figure, Figure 4 In this embodiment, the induction device of the present application is arranged at the lower side of the front end face of the closestool. Compared with the traditional kick-type induction device, the present application has a smaller size, and the cumbersome pressing trigger device is deleted. In addition, the present application adopts a capacitance type induction carrier, which automatically senses whether a person is close, thereby controlling the opening and closing of the closestool cover.
[0056] Further, besides being applied to the intelligent toilet, the application can also be applied to other products which have the use demand of human body induction and kicking, and because the application is made of the flexible circuit board, it can be better applied to various irregular surfaces and has less use restrictions.
[0057] Obviously, various modifications and changes can be made to the embodiments of the application by those skilled in the art without departing from the spirit and scope of the application. In this way, the application also aims to cover these modifications and changes if they are within the scope of the claims of the application and their equivalents. The word "comprising" does not exclude the presence of other elements or steps than those listed in the claims. The simple fact that certain measures are recited in mutually different dependent claims does not mean that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be considered as limiting the scope.
Claims
1. A capacitive sensing device employing an FPC, characterized by, The application relates to an inductive device, comprising: a substrate, a capacitive inductive circuit arranged on the substrate, an inductive carrier and a wiring port, and a covering layer covering at least one side surface of the substrate; the substrate is a flexible circuit board; one end of the capacitive inductive circuit is connected with the inductive carrier, and the other end is connected with the wiring port.
2. A capacitive sensing device employing FPC according to claim 1, wherein, the covering layer comprises a waterproof film, an electromagnetic shielding film, an acrylic double-sided adhesive or a pressure-sensitive film.
3. The capacitive sensing device of claim 1, wherein, the inductive carrier comprises a copper foil.
4. A capacitive sensing device employing FPC according to claim 3, wherein, the capacitive inductive circuit comprises a master control chip, a first resistor, a first capacitor, a second capacitor and a third capacitor; the first resistor is arranged between the inductive carrier and a detection input end of the master control chip; the master control chip is connected with the first capacitor, the second capacitor and the third capacitor respectively.
5. A capacitive sensing device employing FPC according to claim 4, wherein, further comprising: a first diode, a second diode and an inductor; one end of the inductor is connected with the third capacitor and the master control chip, and the other end is connected with the first diode; one end of the first diode is connected with a power supply, and the other end is connected with the second diode and grounded.
6. A capacitive sensing device employing FPC according to claim 5, wherein, further comprising a second resistor, the two ends of the second resistor are respectively connected with a power supply input end and an output end of the master control chip.
7. A capacitive sensing device employing FPC according to claim 4, wherein, the third capacitor is a decoupling capacitor.
8. The capacitive sensing device of claim 4, wherein, the second capacitor is a charge collection capacitor.
9. The capacitive sensing device of claim 4, wherein, the first capacitor is a sensitivity adjustment capacitor.
10. A capacitive sensing device employing an FPC, characterized by, the application further relates to an inductive device as claimed in any one of claims 1 to 9.