Lightweight heat dissipation airborne computer shell for unmanned aerial vehicle edge AI calculation

Abstract

The utility model relates to the technical field of unmanned aerial vehicles, in particular to a light-weight heat dissipation airborne computer shell used for unmanned aerial vehicle edge AI calculation, low heat resistance transfer from a chip to the outside is achieved through a three-dimensional layered heat conduction structure (microarray copper column-graphene sheet-aluminum alloy fin), a Venturi air channel and a phase change energy storage material are combined, and the heat dissipation performance of the computer shell is improved. Under the design of a certain total weight, the temperature rise of the AI chip is controlled within 22 DEG C, the wind speed of the micro worm wheel fan is dynamically adjusted based on a PID algorithm, and the heat dissipation efficiency of the whole machine reaches 0.35 DEG C / W, which is improved compared with a traditional scheme.

Description

TECHNICAL FIELD

[0001] The utility model relates to unmanned plane technical field, concretely is used for unmanned plane edge AI calculation's lightweight heat dissipation airborne computer casing. BACKGROUND

[0002] Unmanned plane edge AI computer is the special computing device that deploys on unmanned plane platform, has edge calculation ability and artificial intelligence processing function, and it is the embedded computing system integrated in unmanned plane ontology, can treat sensor data and execute AI inference task in time (edge side) in flight process, reduces the dependence on ground station or cloud.

[0003] Unmanned plane edge AI computer in the process of running, because long time high load operation, it is easy to produce a large amount of heat, because of the limited space, the heat emission capacity is limited, especially to the heat dissipation of chip, once unable to release quickly, the damage to chip is great;

[0004] To this, the technical scheme designs lightweight heat dissipation airborne computer casing for unmanned plane edge AI calculation. CONTENT OF UTILITY MODEL

[0005] The utility model aims at providing lightweight heat dissipation airborne computer casing for unmanned plane edge AI calculation to solve the problem raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] Lightweight heat dissipation airborne computer casing for unmanned plane edge AI calculation, including the unmanned plane edge AI computer installation slot of setting in the center of unmanned plane body, the unmanned plane edge AI computer installation slot inside installation is provided with unmanned plane edge AI computer shell, the side wall of unmanned plane edge AI computer shell is evenly provided with a plurality of heat dissipation air ducts, and the gas flow in the unmanned plane edge AI computer shell is kept by utilizing the heat dissipation air duct, so as to accelerate the discharge of heat in the unmanned plane edge AI computer shell, and the chip package is distributed and arranged in the unmanned plane edge AI computer shell, the three-dimensional layered heat conduction shell is arranged on the outside of chip package, and the three-dimensional layered heat conduction shell is used for contact type heat dissipation to the AI chip in the chip package.

[0008] Three-dimensional layered heat conduction shell includes bottom heat management layer, middle conversion and top heat dissipation layer; bottom heat management layer is in direct contact with chip package, cross-section thermal resistance is less than 0.1 cm2 K / W by sintering silver paste, middle conversion layer, utilize its in-plane 3000 W / (m K) high thermal conductivity to construct transverse heat diffusion network, top heat dissipation layer surface adopts micro-nano structure processing, increase turbulent flow contact area, thereby directly improve the heat dissipation efficiency of chip package, cooperate with heat dissipation air duct, realize the efficient heat dissipation of AI chip and three-dimensional layered heat conduction shell internal components.

[0009] Compared with the prior art, the beneficial effects of the utility model are: through the low thermal resistance link design from the chip package surface to the external environment, the heat dissipation is accelerated.

[0010] Through the Venturi air duct to enhance the airflow disturbance, the turbulent flow fin is combined to improve the convective heat transfer efficiency.

[0011] Through the closed-loop adjustment mechanism based on real-time heat load, the optimal allocation of heat dissipation resources is realized.

[0012] Through the integration of composite phase change material and high thermal conductivity element, the transient thermal shock buffer and steady-state heat conduction demand are considered. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the structure schematic view of unmanned plane in lightweight heat dissipation airborne computer shell for unmanned plane edge AI calculation.

[0014] Figure 2 It is the structure schematic view of unmanned plane edge AI computer shell in lightweight heat dissipation airborne computer shell for unmanned plane edge AI calculation.

[0015] Figure 3 It is the connection structure schematic view of chip package and three-dimensional layered heat conduction shell in lightweight heat dissipation airborne computer shell for unmanned plane edge AI calculation.

[0016] Figure 4 It is the structure schematic view of unmanned plane edge AI computer in lightweight heat dissipation airborne computer shell for unmanned plane edge AI calculation. Figure 2 It is the enlarged structure schematic view of A.

[0017] Figure 5 It is the structure schematic view of unmanned plane edge AI computer in lightweight heat dissipation airborne computer shell for unmanned plane edge AI calculation. Figure 3 It is the enlarged structure schematic view of B.

[0018] Wherein: unmanned plane body 10, unmanned plane edge AI computer installation slot 11, unmanned plane edge AI computer shell 13, three-dimensional layered heat conduction shell 14, PCB substrate 15, AI chip 16, chip package 17, heat dissipation air duct 18, phase change energy storage unit layer 19, micro worm gear fan 20, micro array copper column 21, graphene sheet 22, aluminum alloy fin 23. DETAILED DESCRIPTION

[0019] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict.

[0020] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model. The terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0021] In the description of the utility model, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection" and "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0022] The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.

[0023] Please refer to Figures 1-5 , a light weight heat dissipation on-board computer shell for unmanned aerial vehicle edge AI calculation, including unmanned aerial vehicle edge AI computer installation slot 11 opened at the center of unmanned aerial vehicle body 10, unmanned aerial vehicle edge AI computer installation slot 11 is internally provided with unmanned aerial vehicle edge AI computer shell 13, a plurality of heat dissipation air ducts 18 are uniformly arranged on the side wall of unmanned aerial vehicle edge AI computer shell 13, the gas flow in the unmanned aerial vehicle edge AI computer shell 13 is maintained by using the heat dissipation air duct 18, so as to accelerate the discharge of heat in the unmanned aerial vehicle edge AI computer shell 13, the chip package 17 is distributed in the unmanned aerial vehicle edge AI computer shell 13, the three-dimensional layered heat conduction shell 14 is arranged outside the chip package 17, and the three-dimensional layered heat conduction shell 14 is used for contact cooling of the AI chip 16 in the chip package 17;

[0024] The three-dimensional layered heat conduction shell 14 includes a bottom heat management layer, an intermediate conversion layer, and a top heat dissipation layer; the bottom heat management layer is in direct contact with the chip package 17, and the cross-sectional thermal resistance is less than 0.1 cm2·K / W by sintering silver paste, the intermediate conversion layer uses the high thermal conductivity of 3000 W / (m·K) in the plane to build a lateral heat diffusion network, and the surface of the top heat dissipation layer is treated with a micro-nano structure to increase the turbulent flow contact area, thereby directly improving the heat dissipation efficiency of the chip package 17, and cooperating with the heat dissipation air duct 18 to realize efficient heat dissipation of the AI chip 16 and the internal components of the three-dimensional layered heat conduction shell 14.

[0025] In the embodiment of the present application, the way in which the UAV edge AI computer shell 13 is installed into the UAV edge AI computer installation slot 11 can adopt a mechanical interface, an electrical interface, etc., wherein the mechanical interface includes a guide rail sliding groove type: T-shaped guide rails are arranged on both sides of the shell body and matched (tolerance ±0.1 mm) with the corresponding sliding grooves of the installation slot of the fuselage.

[0026] Three-point positioning system: two conical positioning pins (Φ3 mm, hardness HRC60)

[0027] One floating elastic positioning column (absorbing vibration displacement);

[0028] Quick release locking mechanism: knob type eccentric wheel locking;

[0029] The electrical interface includes a waterproof aviation plug:

[0030] Power supply: XT30 type (resistant to current 15A)

[0031] Data: 20-pin waterproof type (including CAN FD / Gigabit Ethernet)

[0032] Magnetic charging contact: pogopin array realizes ground rapid charging.

[0033] In one example of the present application, the heat dissipation air duct 18 is arranged as a Venturi channel structure, which uses the Venturi effect to accelerate the gas flow at the heat dissipation air duct 18; at the same time, the inside of the heat dissipation air duct 18 is embedded with a phase change energy storage unit layer 19, which uses a composite material of paraffin + graphite to ensure that latent heat absorption is started when the temperature inside the heat dissipation air duct 18 is greater than 65°.

[0034] The bottom heat dissipation management layer directly contacts the chip package 17 by using micro-array copper columns 21, which are arranged at a distance of 1 mm and have a diameter of 0.5 mm.

[0035] The surface of the intermediate conversion layer is embedded with five layers of vertically stacked graphene sheets 22, each with a thickness of 50 μm.

[0036] The surface of the top heat dissipation layer is integrated with wavy aluminum alloy fins 23, the aluminum alloy fins 23 with the shape can quickly transfer heat, and the tooth height of the aluminum alloy fins 23 is set to 8 mm and the inclination angle is set to 15°.

[0037] As a preferred embodiment of the present application, the unmanned aerial vehicle edge AI computer shell 13 is further provided with a sensor module, a power management component, a passive element and a communication interface outside, etc.

[0038] The sensor module includes an inertial measurement unit (IMU) including a gyroscope and an accelerometer (usually integrated in the form of a MEMS chip package), which is connected to the main control through an I2C / SPI interface.

[0039] Barometer / GPS: provides height and positioning data, communicates through a serial port (UART);

[0040] Vision / laser radar: requires a high-speed interface (such as MIPI, USB3.0) to connect the processing chip.

[0041] The power management component includes a PMIC (power management chip): providing multiple voltage power supply (such as 3.3V, 5V) for chip packaging;

[0042] Filter capacitor / inductor: suppresses power supply noise and ensures stable operation of the chip.

[0043] The passive element includes resistance / capacitance / inductance: for signal conditioning, decoupling and impedance matching;

[0044] Crystal oscillator: provides a clock signal (such as a 16MHz crystal oscillator) for the chip.

[0045] The communication interface includes a wireless module (Wi-Fi / 4G / data transmission): communicates with the main control chip through UART or USB;

[0046] CAN bus / steering interface: connects ESC and steering, controls motor speed.

[0047] The above-mentioned component modules are placed in the internal position of the unmanned aerial vehicle edge AI computer shell 13 and connected and operated with each other, which can be directly realized according to the existing unmanned aerial vehicle related technology, and will not be described here.

[0048] As a preferred embodiment of the present application, the unmanned aerial vehicle edge AI computer shell 13 is further provided with a plurality of groups of micro worm gear fans 20, which are started to accelerate the gas flow in the unmanned aerial vehicle edge AI computer shell 13, and then cooperate with the three-dimensional layered heat conduction shell 14 and the heat dissipation air duct 18 to further improve the heat emission in the unmanned aerial vehicle edge AI computer shell 13.

[0049] The micro worm wheel fan 20 realizes dynamic rotating speed regulation based on a PID algorithm, and the detailed principle and structure can refer to the prior art.

[0050] The working principle of the utility model is: in the idle place of the device, all the driving elements, the power elements, the electrical devices and the matched power supply are connected through wires, the electrical devices are sequentially connected, the detailed connection means is the known technology in the field, the working principle and the process are mainly introduced below, and the electrical control is not described,

[0051] The preferred embodiments of the application are described in detail above, but the application is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the purpose of the application.

Claims

1. A lightweight and heat-dissipating on-board computer housing for UAV edge AI computing, characterized in that, Comprise: A UAV edge AI computer installation slot (11) on a UAV body (10); A UAV edge AI computer shell (13) integrated with a three-dimensional layered heat conduction shell (14); A heat dissipation air duct (18) and a phase change energy storage unit layer (19).

2. The lightweight and heat-dissipation on-board computer housing for UAV edge AI computing of claim 1, wherein, The three-dimensional layered heat conduction shell (14) comprises: A bottom microarray copper column (21) with a diameter of 0.5 mm and a pitch of 1 mm; Five layers of vertically stacked graphene sheets (22) with a single-layer thickness of 50 μm; A top wave-shaped aluminum alloy fin (23) with a tooth height of 8 mm and an inclination angle of 15°.

3. The lightweight and heat-dissipation on-board computer housing for UAV edge AI computing of claim 1, wherein, The heat dissipation air duct (18) is in a Venturi structure.

4. The lightweight and heat-dissipating on-board computer housing for UAV edge AI computing of claim 1, wherein, The phase change energy storage unit layer (19) is a paraffin-graphite composite material with a phase change temperature of 65℃.

5. The lightweight and heat dissipation on-board computer housing for UAV edge AI computing of claim 1, wherein, Contains at least two groups of micro worm gear fans (20).

6. The lightweight and heat-dissipating on-board computer housing for UAV edge AI computing of claim 1, wherein, The installation method of the UAV edge AI computer shell (13) and the UAV edge AI computer installation slot (11) includes a T-shaped guide rail, a conical positioning pin, and a knob type eccentric wheel locking mechanism.

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