Flexible circuit board with high heat-conducting property

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a flexible circuit board with high thermal conductivity, which comprises a flexible substrate, the bottom of the flexible substrate is movably connected with a fixing plate, the top of the flexible substrate is provided with a heat dissipation mechanism, and two sides of the heat dissipation mechanism are provided with fixing mechanisms. Through the arrangement of the fixing mechanism, an original structure that a heat dissipation device needs to be fixed through screws is changed into a structure that the heat dissipation device needs to be fixed through the buckles and the guide grooves in a matched locking mode, the working efficiency of workers when disassembly and maintenance are needed is improved, meanwhile, through the arrangement of the heat dissipation mechanism, heat can be rapidly dissipated when the flexible substrate generates heat, and the service life of the flexible substrate is prolonged. And the performance and normal work of the flexible substrate are protected.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field, concretely to a flexible circuit board of high heat conduction performance. BACKGROUND

[0002] Flexible circuit board is also called "soft board", which is a printed circuit made of flexible insulating substrate. Flexible circuit provides excellent electrical performance, can meet the design needs of smaller and higher density installation, and also helps to reduce assembly process and enhance reliability. Using flexible circuit board can greatly reduce the volume of electronic products, which meets the needs of the development of electronic products towards high density, miniaturization and high reliability. With the development of high density and miniaturization of internal circuit of flexible circuit board, a large amount of heat is generated during operation. In order to ensure the normal operation of flexible circuit board, the heat needs to be dissipated in time,

[0003] The existing processing mode is to design mounting holes on the flexible circuit board in advance, then punch corresponding holes on the heat dissipation fins, and fix them together by using screws. However, due to the small space, it is difficult to disassemble and maintain after being fixed by screws. Therefore, we propose a flexible circuit board with high heat conduction performance. SUMMARY

[0004] The utility model discloses a flexible circuit board with high heat conduction performance, which solves the problem of large difficulty in disassembly and maintenance after being fixed by screws due to small space in the background technology.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a flexible circuit board with high heat conduction performance, which comprises a flexible substrate, a fixed plate movably connected to the bottom of the flexible substrate, a heat dissipation mechanism provided on the top of the flexible substrate, and a fixed mechanism provided on both sides of the heat dissipation mechanism.

[0006] Among them, the heat dissipation mechanism comprises a heat dissipation plate movably connected to the top of the flexible substrate, and the heat dissipation plate is internally fixedly installed with heat dissipation fins.

[0007] Among them, the fixed mechanism comprises a fixed rod movably connected to both sides of the heat dissipation mechanism, a handle fixedly connected to the top of the fixed rod, a spring fixedly connected to the bottom of the handle, a guide rod fixedly connected to the bottom of the fixed rod, a buckle fixedly connected to the bottom of the guide rod, and the spring is slidably connected to the surface of the fixed rod.

[0008] Among them, the top of the fixed plate is fixedly installed with fixed columns around, the inside of the fixed column is provided with a fixed hole, and the both sides of the fixed hole are provided with guide grooves, and the lower part of the guide groove is reversely provided with symmetrical fixed grooves.

[0009] Among them, the periphery of the heat dissipation plate is provided with a first guide hole, and the first guide hole is arranged in a rectangular shape.

[0010] The second guide holes are arranged in a rectangular shape.

[0011] The utility model at least has following beneficial effects: when using, through the setting of fixed mechanism, the originally need to use screw fixed heat dissipation device's structure is changed into buckle and guide groove cooperation locking, has accelerated staff's work efficiency when needing to dismount maintenance, simultaneously through the setting of heat dissipation mechanism, makes flexible substrate when producing heat can heat dissipation fast, protects the performance and normal work of flexible substrate. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is overall structure schematic diagram of the utility model;

[0013] Fig. 2 It is fixed mechanism structure schematic diagram of the utility model;

[0014] Fig. 3 It is fixed mechanism and fixed plate buckle fixed structure schematic diagram of the utility model;

[0015] Fig. 4 It is fixed plate structure schematic diagram of the utility model.

[0016] In the drawing: 1, flexible substrate;2, fixed plate;3, heat dissipation mechanism;31, heat dissipation plate;32, heat dissipation fin;4, fixed mechanism;41, fixed rod;42, steering handle;43, spring;44, guide rod;45, buckle;5, fixed column;6, fixed hole;7, guide groove;8, fixed groove;9, first guide hole;10, second guide hole;11, round angle. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.

[0018] Embodiment one

[0019] Please refer to Figs. 1 to 4The utility model provides a technical scheme: a flexible circuit board of high heat conduction performance, including flexible substrate 1, the bottom of flexible substrate 1 is movably connected with fixed plate 2, and the top of flexible substrate 1 is equipped with heat dissipation mechanism 3, and the both sides of heat dissipation mechanism 3 are equipped with fixed mechanism 4, and the top of fixed plate 2 is fixedly installed with fixed column 5 all around, and the inside of fixed column 5 is equipped with fixed hole 6, and the both sides of fixed hole 6 are equipped with guide slot 7, and the bottom of guide slot 7 is oppositely equipped with symmetrical fixed slot 8, and the periphery of flexible substrate 1 is equipped with second guide hole 10, and second guide hole 10 is arranged in rectangle, when using, through the setting of fixed mechanism 4, the structure that originally needs to use screw to fix heat dissipation device is changed to cooperate locking between buckle 45 and guide slot 7, and the working efficiency of staff when needing to disassemble and maintain is accelerated, and simultaneously through the setting of heat dissipation mechanism 3, flexible substrate 1 can quickly dissipate heat when generating heat, and the performance and normal work of flexible substrate 1 are protected.

[0020] Heat dissipation mechanism 3 includes the heat dissipation plate 31 movably connected to the top of flexible substrate 1, the heat dissipation plate 31 is fixedly installed with the heat dissipation fin 32 in the inside, the periphery of heat dissipation plate 31 is equipped with first guide hole 9, and first guide hole 9 is arranged in rectangle, when using, make flexible substrate 1 absorb heat when generating heat through heat dissipation plate 31, and heat dissipation plate 31 will heat through the increase of heat dissipation fin 32 and air area, thereby quickly dissipating heat, and the performance and normal work of flexible substrate 1 are protected.

[0021] Fixed mechanism 4 includes the fixed rod 41 movably connected to the both sides of heat dissipation mechanism 3, the top of fixed rod 41 is fixedly connected with the handle 42, the bottom of handle 42 is fixedly connected with the spring 43, the bottom of fixed rod 41 is fixedly connected with the guide rod 44, the bottom of guide rod 44 is fixedly connected with the buckle 45, and the spring 43 is slidably connected to the surface of fixed rod 41, when using, fixed rod 41 is inserted into the fixed column 5 on fixed plate 2 through the first guide hole 9 of heat dissipation plate 31 and the second guide hole 10 of flexible substrate 1, through the fixed hole 6 in fixed column 5, slide into the bottom along guide slot 7, then twist handle 42, and buckle 45 is rotated into fixed slot 8, utilize the elasticity of spring 43, thereby making heat dissipation plate 31 and flexible substrate 1 closely connect, when needing to disassemble and maintain, reverse twist handle 42, and buckle 45 is removed from fixed slot 8, and the fixed rod 41 is pulled out, so that heat dissipation plate 31 and flexible substrate 1 are separated, so that staff can conveniently and quickly disassemble and maintain even in a small space.

[0022] Embodiment two

[0023] In this embodiment two, other structures are unchangeable, and the bottom of guide slot 8 is provided with round angle 11, which is different from embodiment one, and fixed slot 8 with round angle 11 is more labor-saving, when staff twist handle 42, buckle 45 is more smoothly entered or removed from fixed slot 8.

[0024] It should be noted that the relational terms herein, such as first and second, and the like, are used solely to distinguish one from another entity or action without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0025] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A flexible wiring board having high thermal conductivity, comprising: The utility model provides a flexible substrate (1), its characterized in be that the flexible substrate (1) bottom swing joint has fixed plate (2), the flexible substrate (1) top is equipped with heat dissipation mechanism (3), heat dissipation mechanism (3) both sides are equipped with fixed mechanism (4).

2. The flexible wiring board with high thermal conductivity according to claim 1, wherein: The heat dissipation mechanism (3) includes the heat dissipation plate (31) swing joint in the flexible substrate (1) top, the inside fixed mounting of heat dissipation plate (31) has heat dissipation fin (32).

3. The flexible wiring board with high thermal conductivity according to claim 1, wherein: The fixed mechanism (4) includes the fixed rod (41) swing joint in heat dissipation mechanism (3) both sides, the top fixed connection of fixed rod (41) has the handle (42), the bottom fixed connection of handle (42) has the spring (43), the bottom fixed connection of fixed rod (41) has the guide rod (44), the bottom fixed connection of guide rod (44) has the buckle (45), and the spring (43) is slidably connected to the surface of fixed rod (41).

4. The flexible wiring board with high thermal conductivity according to claim 1, wherein: The top of the fixed plate (2) is fixedly installed with a fixed column (5) around the fixed plate (2), a fixed hole (6) is formed in the fixed column (5), guide grooves (7) are formed on both sides of the fixed hole (6), and symmetric fixed grooves (8) are formed below the guide grooves (7).

5. The flexible circuit board of claim 2, wherein: the first and second conductive layers are formed of a copper foil having a thickness of 18 μm or less. The heat dissipation plate (31) is provided with first guide holes (9) around the heat dissipation plate (31), and the first guide holes (9) are arranged in a rectangular shape.

6. The flexible circuit board of claim 1, wherein: The flexible substrate (1) is provided with second guide holes (10) around the flexible substrate (1), and the second guide holes (10) are arranged in a rectangular shape.

Images