Central control heat dissipation shell structure and vehicle-mounted central control equipment

Abstract

The utility model provides a central control heat dissipation shell structure and vehicle-mounted central control equipment. The center control heat dissipation shell structure comprises a shell and a first heat conduction plate. A hollow window is formed in the first mounting area of the shell; a plurality of heat diffusion holes are formed in the second mounting area of the shell and are communicated with the interior of the shell; the first heat-conducting plate sheet is arranged outside the shell; the first part of the first heat conduction plate sheet is installed in the first installation area and abuts against the power amplifier element through the hollow-out window to absorb yield, and at the moment, heat is enriched in the second installation area, so that a temperature difference is formed between air outside the shell and air inside the shell; the second part of the first heat-conducting plate sheet is mounted in the second mounting area, and heat dissipation holes are formed in the second part of the first heat-conducting plate sheet; and the heat dissipation holes are respectively communicated with the plurality of heat diffusion holes to form a convection channel, so that air inside and outside the shell can be convected through the convection channel under the effect of temperature difference to increase the flowing of the air in the shell, and the heat dissipation of the air in the shell is accelerated.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of new energy vehicles, in particular to a central control heat dissipation shell structure and a vehicle-mounted central control device. BACKGROUND

[0002] With the high integration of devices in new energy vehicles, the volume of central control boxes such as disclosed in Chinese patent document CN105936243A is getting smaller and smaller, which will make the positions of power amplifier elements on the control mainboard in the central control box gradually close, and the over-dense distribution of components in the central control box caused by the close positions of the power amplifier elements and the small volume of the central control box will hinder the flow and diffusion of air in the central control box, and the power amplifier elements used in vehicles usually have high power of over 100W, which makes the heat of the power amplifier elements more easily accumulated in the central control box to cause fluctuations in output voltage and current. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present disclosure is to overcome the deficiencies in the prior art, and to provide a central control heat dissipation shell structure and a vehicle-mounted central control device, which has high air convection efficiency inside and outside the shell and can meet the heat dissipation requirements of power amplifier elements with high power of over 100W.

[0004] The purpose of the present disclosure is achieved by the following technical solutions:

[0005] A central control heat dissipation shell structure comprises:

[0006] a shell, in which a control mainboard is installed;

[0007] The central control heat dissipation shell structure further comprises a first heat-conducting plate;

[0008] The shell has a first mounting area and a second mounting area outside; a hollow window is formed on the first mounting area, which is used to be arranged close to a power amplifier element on the control mainboard; a plurality of heat diffusion holes are formed on the second mounting area, and the plurality of heat diffusion holes are all communicated with the shell; the first heat-conducting plate is arranged outside the shell; a first part of the first heat-conducting plate is mounted in the first mounting area and abuts against the power amplifier element through the hollow window; a second part of the first heat-conducting plate is mounted in the second mounting area, and a heat dissipation hole is formed on the second part of the first heat-conducting plate; the heat dissipation hole and the plurality of heat diffusion holes are communicated to form a convection passage.

[0009] In some embodiments, a heat accumulation cavity is formed between the second part of the first heat-conducting plate and the shell; and each heat diffusion hole is communicated with the heat dissipation hole through the heat accumulation cavity.

[0010] In some embodiments, the plurality of heat dissipation holes are arranged along the edge of the second mounting area.

[0011] In some embodiments, the heat dissipation holes are staggered with the positions of the heat diffusion holes.

[0012] In some embodiments, the first heat-conductive plate is an aluminum plate formed integrally.

[0013] In some embodiments, the central control heat dissipation housing structure further comprises a second heat-conductive plate, which is located in the housing; a first contact portion of the second heat-conductive plate is connected to the inner wall of the housing, and a second contact portion of the second heat-conductive plate is used to abut against the chip on the control mainboard.

[0014] In some embodiments, the second heat-conductive plate comprises the first contact portion, an intermediate support portion and the second contact portion connected integrally in sequence, and the first contact portion is parallel to the second contact portion.

[0015] In some embodiments, the intermediate support portion is perpendicular to the first contact portion and the second contact portion.

[0016] In some embodiments, the first mounting area and the second mounting area are located on different planes on the housing.

[0017] A vehicle-mounted central control device comprises a control mainboard, a power amplifier element and the central control heat dissipation housing structure of any of the above embodiments; the control mainboard is installed in the housing; the power amplifier element is installed on the control mainboard and abuts against the first portion of the first heat-conductive plate through the hollow window.

[0018] Compared with the prior art, the present disclosure has at least the following advantages:

[0019] The central control heat dissipation housing structure described above, by installing the first portion of the first heat-conductive plate in the first mounting area, enables the first portion of the first heat-conductive plate to abut against the power amplifier element through the hollow window to absorb the heat of the power amplifier element, thereby reducing the concentration of heat generated by the power amplifier element with a power of 100W or more inside the housing. At the same time, by installing the second portion of the first heat-conductive plate in the second mounting area, the heat of the power amplifier element can be guided to the outside of the housing through the second portion of the first heat-conductive plate. At this time, the heat is concentrated in the second mounting area, forming a temperature difference between the air outside the housing and the air inside the housing. Then, through the plurality of heat diffusion holes on the second mounting area, a convection channel is formed between the heat dissipation holes on the second portion of the first heat-conductive plate, so that the air inside and outside the housing can flow through the convection channel under the action of the temperature difference, thereby increasing the flow of air inside the housing to accelerate the heat dissipation of the air inside the housing. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some of the embodiments of the present disclosure, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained from these drawings without creative labor.

[0021] Figure 1 The exploded view of the central control heat dissipation shell structure of an embodiment of the present disclosure is shown in the figure.

[0022] Figure 2 The cross-sectional structure diagram of the central control heat dissipation shell structure shown in the figure is shown in the figure. Figure 1 The cross-sectional structure diagram of the central control heat dissipation shell structure shown in the figure is shown in the figure.

[0023] Figure 3 The cross-sectional structure diagram of the central control heat dissipation shell structure shown in the figure is shown in the figure. Figure 1 The cross-sectional structure diagram of the central control heat dissipation shell structure shown in the figure is shown in the figure.

[0024] Reference signs:

[0025] 10, control mainboard; 20, power amplifier element; 30, chip;

[0026] 100, shell; 110, first mounting area; 101, hollow window; 120, second mounting area; 102, heat diffusion hole;

[0027] 200, first heat conduction plate; 210, first part; 220, second part; 201, heat enrichment cavity;

[0028] 300, second heat conduction plate; 310, first contact part; 320, intermediate support part; 330, second contact part; 301, heat dissipation hole. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the related drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right", and the like are merely used for the purpose of illustration and are not intended to be limiting.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0032] For better understanding of the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail below in combination with specific embodiments:

[0033] Please refer to Figure 1 The central control heat dissipation shell structure of an embodiment includes a shell 100 and a first heat conduction plate 200; the shell 100 is used for mounting a control mainboard 10; the shell 100 has a first mounting area 110 and a second mounting area 120 outside; the first mounting area 110 is provided with a hollow window 101, and the hollow window 101 is used for being arranged close to a power amplifier element 20 on the control mainboard 10; the second mounting area 120 is provided with a plurality of heat diffusion holes 102, and the plurality of heat diffusion holes 102 are all communicated in the shell 100; the first heat conduction plate 200 is arranged outside the shell 100; a first part 210 of the first heat conduction plate 200 is mounted in the first mounting area 110 and is used for abutting against the power amplifier element 20 through the hollow window 101; a second part 220 of the first heat conduction plate 200 is mounted in the second mounting area 120, and the second part 220 of the first heat conduction plate 200 is provided with a heat dissipation hole 301; the heat dissipation hole 301 is respectively communicated with the plurality of heat diffusion holes 102 to form a convection passage. The power amplifier element 20 can be a power amplifier tube such as a field effect tube, a bipolar transistor or an electronic tube.

[0034] It can be understood that by installing the first portion 210 of the first heat-conducting sheet 200 in the first mounting area 110, the first portion 210 of the first heat-conducting sheet 200 can abut on the power amplifier element 20 through the hollow window 101 to absorb the heat of the power amplifier element 20, so as to reduce the heat generated by the power amplifier element 20 working at a high power of 100W or above from being concentrated in the shell 100. Meanwhile, by installing the second portion 220 of the first heat-conducting sheet 200 in the second mounting area 120, the heat of the power amplifier element 20 can be guided to the outside of the shell 100 through the second portion 220 of the first heat-conducting sheet 200, at this time, the heat is enriched in the second mounting area 120 to form a temperature difference between the air outside the shell 100 and the air inside the shell 100, and then a convection channel is formed through the heat diffusion holes 102 on the second mounting area 120 and the heat dissipation holes 301 on the second portion 220 of the first heat-conducting sheet 200, so that the air inside and outside the shell 100 flows through the convection channel under the action of the temperature difference to increase the flow of the air inside the shell 100, so as to accelerate the heat dissipation of the air inside the shell 100.

[0035] Please refer to Figure 1 and Figure 2 In some embodiments, a heat enrichment cavity 201 is formed between the second portion 220 of the first heat-conducting sheet 200 and the shell 100, and each heat diffusion hole 102 is communicated with the heat dissipation hole 301 through the heat enrichment cavity 201. It can be understood that by forming the heat enrichment cavity 201 between the second portion 220 of the first heat-conducting sheet 200 and the shell 100, part of the heat diffused from the second portion 220 of the first heat-conducting sheet 200 can be conducted into the air in the heat enrichment cavity 201, and each heat diffusion hole 102 is communicated with the heat dissipation hole 301 through the heat enrichment cavity 201, that is, the heat dissipation hole 301 is kept in communication with each heat diffusion hole 102, so that the air in the heat enrichment cavity 201 flows faster, further reducing the accumulation of heat and accelerating the diffusion of heat.

[0036] Please refer to Figure 1 and Figure 2 In some embodiments, the number of heat dissipation holes 301 is multiple, and the multiple heat dissipation holes 301 are arranged along the edge of the second mounting area 120. It can be understood that since the number of heat dissipation holes 301 opened on the second portion 220 of the first heat-conducting sheet 200 is multiple, each heat diffusion hole 102 is communicated with each heat dissipation hole 301 through the heat enrichment cavity 201, which can effectively increase the path of air convection, thereby improving the efficiency of air convection. And the multiple heat dissipation holes 301 are arranged along the edge of the second mounting area 120, so that the air can diffuse more quickly outside the second mounting area 120 through each heat dissipation hole 301.

[0037] Please refer to Figure 1 and Figure 2In some embodiments, the heat dissipation holes 301 are staggered with the positions of the partial heat diffusion holes 102. It can be understood that, by staggering the heat dissipation holes 301 with the positions of the partial heat diffusion holes 102, the blocking between the heat dissipation holes 301 and the heat diffusion holes 102 can be ensured, that is, the air flow between the heat dissipation holes 301 and the heat diffusion holes 102 can be ensured, while the entry of external dust and particles is reduced.

[0038] Referring to Figure 1 and Figure 2 In some embodiments, the first heat-conducting plate 200 is an aluminum plate formed integrally. It can be understood that, since the first heat-conducting plate 200 is an aluminum plate formed integrally, that is, the first portion 210 of the first heat-conducting plate 200 is formed integrally with the second portion 220 of the first heat-conducting plate 200, the structural strength of the first heat-conducting plate 200 can be enhanced, and the overall heat-conducting effect of the first heat-conducting plate 200 can be improved by using the heat conductivity of aluminum.

[0039] Referring to Figure 3 In some embodiments, the control heat dissipation shell structure further comprises a second heat-conducting plate 300 located in the shell 100; a first contact portion 310 of the second heat-conducting plate 300 is connected to the inner wall of the shell 100, and a second contact portion 330 of the second heat-conducting plate 300 is used to abut against the chip 30 on the control mainboard 10. It can be understood that, by connecting the first contact portion 310 of the second heat-conducting plate 300 to the inner wall of the shell 100, the second heat-conducting plate 300 can be firmly installed in the shell 100, and by abutting the second contact portion 330 of the second heat-conducting plate 300 against the chip 30 on the control mainboard 10, the heat of the chip 30 on the control mainboard 10 can be accepted by the second contact portion 330 of the second heat-conducting plate 300, so that the heat of the chip 30 on the control mainboard 10 can be quickly conducted out, avoiding the accumulation of heat of the chip 30 on the control mainboard 10. Specifically, the second heat-conducting plate 300 is an aluminum plate formed integrally.

[0040] Referring to Figure 3 In some embodiments, the second heat-conducting plate 300 comprises a first contact portion 310, an intermediate support portion 320 and a second contact portion 330 connected integrally in sequence, and the first contact portion 310 is parallel to the second contact portion 330. It can be understood that, since the first contact portion 310 is parallel to the second contact portion 330, by pasting the first contact portion 310 of the second heat-conducting plate 300 to the inner wall of the shell 100 and pasting the second contact portion 330 of the second heat-conducting plate 300 to the chip 30 on the control mainboard 10, a stable contact support structure can be formed.

[0041] Referring to Figure 3In some embodiments, the intermediate support portion 320 is perpendicular to the first contact portion 310 and the second contact portion 330. It can be understood that, due to the perpendicularity of the intermediate support portion 320 to the first contact portion 310 and the second contact portion 330, the force of the first contact portion 310 on the intermediate support portion 320 and the force of the second contact portion 330 on the intermediate support portion 320 can be kept in the same direction, so that the second heat-conducting sheet 300 forms a firm support on the shell 100 and the control mainboard 10, respectively.

[0042] Referring to Figure 1 In some embodiments, the first mounting area 110 and the second mounting area 120 are located on different planes on the shell 100, respectively. It can be understood that, due to the first mounting area 110 and the second mounting area 120 being located on different planes on the shell 100, respectively, heat can be conducted from the first portion 210 of the first heat-conducting sheet 200 to the second portion 220 of the first heat-conducting sheet 200, so that heat is conducted to different planes, thereby reducing the occurrence of excessive heat concentration.

[0043] Referring to Figures 1 to 3 The present disclosure also provides a vehicle-mounted central control device, which comprises the control mainboard 10, the power amplifier element 20, and the central control heat-dissipation shell structure of any of the above embodiments; the control mainboard 10 is installed in the shell 100; the power amplifier element 20 is installed on the control mainboard 10 and abuts against the first portion 210 of the first heat-conducting sheet 200 through the hollow window 101. It can be understood that, by applying the central control heat-dissipation shell structure of the present disclosure to the vehicle-mounted central control device, the first portion 210 of the first heat-conducting sheet 200 is installed in the first mounting area 110, so that the first portion 210 of the first heat-conducting sheet 200 can abut against the power amplifier element 20 through the hollow window 101 to receive the heat of the power amplifier element 20, thereby reducing the concentration of heat generated by the power amplifier element 20 with a power of 100W or more in the shell 100. At the same time, by installing the second portion 220 of the first heat-conducting sheet 200 in the second mounting area 120, the heat of the power amplifier element 20 can be guided to the outside of the shell 100 through the second portion 220 of the first heat-conducting sheet 200, at which time the heat is concentrated in the second mounting area 120 to form a temperature difference between the air outside the shell 100 and the air inside the shell 100, and then the heat diffusion holes 102 on the second mounting area 120 and the heat dissipation holes 301 on the second portion 220 of the first heat-conducting sheet 200 form a convection channel, so that the air inside and outside the shell 100 flows through the convection channel under the action of the temperature difference to increase the flow of air inside the shell 100, thereby accelerating the heat dissipation of the air inside the shell 100.

[0044] Compared with the prior art, the present disclosure has at least the following advantages:

[0045] The central control heat dissipation shell structure described above, by installing the first part 210 of the first heat conduction sheet 200 in the first mounting area 110, the first part 210 of the first heat conduction sheet 200 can be abutted on the power amplifier element 20 through the hollow window 101 to absorb the heat of the power amplifier element 20, so as to reduce the heat generated by the power amplifier element 20 working at high power of 100W or more to the inside of the shell 100. At the same time, by installing the second part 220 of the first heat conduction sheet 200 in the second mounting area 120, the heat of the power amplifier element 20 can be guided to the outside of the shell 100 through the second part 220 of the first heat conduction sheet 200, at this time the heat will be enriched in the second mounting area 120 to form a temperature difference between the air outside the shell 100 and the air inside the shell 100, and then through the heat diffusion holes 102 on the second mounting area 120 and the heat dissipation holes 301 on the second part 220 of the first heat conduction sheet 200 to form a convection channel, so that the air inside and outside the shell 100 flows through the convection channel under the action of the temperature difference to increase the flow of the air inside the shell 100, so as to accelerate the heat dissipation of the air inside the shell 100.

[0046] The above-described embodiments only express several embodiments of the present disclosure, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which are within the scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A central control heat dissipation housing structure, comprising: a housing, in which a control mainboard is installed; characterized in that the central control heat dissipation housing structure further comprises a first heat conduction plate; the housing has a first mounting area and a second mounting area; the first mounting area is provided with a hollow window, which is used for being close to a power amplifier element on the control mainboard; the second mounting area is provided with a plurality of heat diffusion holes, which are all communicated with the housing; the first heat conduction plate is arranged outside the housing; a first part of the first heat conduction plate is mounted in the first mounting area and abuts against the power amplifier element through the hollow window; a second part of the first heat conduction plate is mounted in the second mounting area, and the second part of the first heat conduction plate is provided with a heat dissipation hole; the heat dissipation hole is communicated with the plurality of heat diffusion holes to form a convection passage.

2. The mid-control heat dissipation housing structure according to claim 1, wherein, The second part of the first heat conduction plate and the housing form a heat accumulation cavity; each heat diffusion hole is communicated with the heat dissipation hole through the heat accumulation cavity.

3. The mid-control heat dissipation housing structure according to claim 2, wherein, The number of the heat dissipation holes is multiple, and the multiple heat dissipation holes are arranged along the edge of the second mounting area.

4. The mid-control heat dissipation housing structure according to claim 2, wherein, The positions of the heat dissipation holes and part of the heat diffusion holes are staggered.

5. The mid-control heat dissipation housing structure according to claim 1, wherein, The first heat conduction plate is an integral aluminum plate.

6. The mid-control heat dissipation housing structure according to claim 1, wherein, The central control heat dissipation housing structure further comprises a second heat conduction plate, which is arranged in the housing; a first contact part of the second heat conduction plate is connected to the inner wall of the housing, and a second contact part of the second heat conduction plate abuts against a chip on the control mainboard.

7. The mid-control heat dissipation housing structure according to claim 6, wherein, The second heat conduction plate comprises the first contact part, an intermediate support part and the second contact part which are integrally connected in sequence, and the first contact part is parallel to the second contact part.

8. The mid-control heat dissipation housing structure according to claim 7, characterized in that, The intermediate support part is perpendicular to the first contact part and the second contact part.

9. The mid-control heat dissipation housing structure according to claim 1, wherein, The first mounting area and the second mounting area are located on different planes of the housing, respectively.

10. An in-vehicle head unit, characterized by comprising: The central control heat dissipation housing structure, the control mainboard, the power amplifier element and the central control heat dissipation housing structure according to any one of claims 1 to 9 are provided; the control mainboard is installed in the housing; the power amplifier element is installed on the control mainboard and abuts against the first part of the first heat conduction plate through the hollow window.

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