Bearing disc for wafer semiconductor carrying equipment

Abstract

The utility model belongs to the technical field of wafer semiconductors, and discloses a bearing disc for wafer semiconductor carrying equipment, which comprises a positioning plate, four positioning holes are arranged at the upper end of the positioning plate, and a bearing mechanism is fixedly connected at the upper end of the positioning plate. The five bearing assemblies are arranged, the adsorption assembly is arranged in each bearing assembly, the bearing disc can contain multiple wafer semiconductors at a time, and compared with the condition that only single wafer semiconductors can be contained at a time in the prior art, the carrying efficiency is greatly improved, the carrying frequency is reduced, and then the overall working efficiency is improved; through the bearing assembly, the bearing disc can be kept in a closed state in the transportation process, the bearing disc is prevented from being opened under the action of external force, meanwhile, protection can be provided for the transported wafer semiconductors, the wafer semiconductors are prevented from being contaminated by impurities or being collided or damaged, the protection effect is achieved, and the practicability of the bearing disc is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer semiconductor technical field, concretely relates to a kind of wafer semiconductor handling equipment bearing disc. BACKGROUND

[0002] Semiconductor wafer is the wafer of semiconductor material, such as crystalline silicon, for manufacturing integrated circuits in electronic products, in electronic terminology, the wafer of semiconductor material is called wafer, it can be silicon crystal for manufacturing integrated circuits and other micro devices, wafer is made of very pure single crystal material, cylindrical ingot of high-purity single-crystal semiconductor (such as silicon or germanium) is made by pulling seed from melt, impurity atoms are added to molten intrinsic material in precise amount to ensure the doping of crystal, so as to convert semiconductor into N-type or P-type semiconductor, and then the ingot is sliced to form wafer.

[0003] Chinese patent authorized announcement number: CN222507607U provides a kind of wafer semiconductor handling equipment bearing disc, the scheme is supported by the upper surface of bearing column wafer, with the contact area of wafer is small, reduce the possibility of scratching wafer, while bearing column is symmetrically arranged, improve the stability of wafer bearing, by two kinds of bearing surface to adapt to the functional characteristics of different sizes wafer, without improvement or replacement can be used, while simple structure, low failure rate.

[0004] But there are still the following defects in the specific implementation process: in the process of transporting wafer semiconductor, only a single wafer semiconductor can be received at a time, the carrying capacity is low, which will reduce the transport efficiency.

[0005] Therefore, the utility model designs a kind of wafer semiconductor handling equipment bearing disc to solve above-mentioned problem. Utility model content

[0006] In view of the above-mentioned shortcomings of prior art, the utility model provides a kind of wafer semiconductor handling equipment bearing disc.

[0007] To achieve the above object, the utility model is realized by the following technical scheme:

[0008] A kind of wafer semiconductor handling equipment bearing disc, including positioning plate, the positioning plate upper end is equipped with four positioning holes, the positioning plate upper end is fixedly connected with bearing mechanism, the bearing mechanism includes positioning rod, the positioning rod upper end is fixedly connected with limiting component, the positioning rod outer surface is fixedly connected with five bearing assemblies, five the bearing assembly inside is fixedly connected with adsorption component;

[0009] Further, the limiting assembly comprises a top plate, the lower end of the top plate is fixedly connected with the upper end of the positioning rod, a side guard plate is fixedly connected to the outer surface of the top plate, a plurality of limiting grooves are formed in the outer surface of the side guard plate, and limiting columns are fixedly connected to the upper and lower walls of the inner cavities of the limiting grooves.

[0010] Further, the bearing assembly comprises a connecting ring, two bearings are fixedly connected to the inner surface of the connecting ring, and a bearing piece is fixedly connected to the outer surface of the connecting ring.

[0011] Further, the bearing piece comprises a bearing disc body, a handle is fixedly connected to the outer surface of the bearing disc body, a limiting buckle is fixedly connected to the left end of the handle, a bearing block is fixedly connected to the bottom wall of the inner cavity of the bearing disc body, and a silica gel pad is fixedly connected to the upper end of the bearing block.

[0012] Further, the adsorption assembly comprises a vacuum pump, an output box is fixedly connected to the output end of the vacuum pump, four connecting pipes are fixedly connected to the outer surface of the output box, connecting seats are fixedly connected to the upper ends of the four connecting pipes, suction discs are fixedly connected to the upper ends of the four connecting seats, a supporting plate is fixedly connected to the upper end of the output box, and the inner surfaces of the four suction discs and the inner surface of the supporting plate are fixedly connected.

[0013] Further, the lower ends of the five vacuum pumps are fixedly connected with the bottom walls of the inner cavities of the five bearing disc bodies, and the outer surfaces of the five bearing disc bodies are fixedly connected with the outer surfaces of the five connecting rings.

[0014] Further, the inner surfaces of the bearings are fixedly connected with the outer surface of the positioning rod, and the lower end of the positioning rod is fixedly connected with the upper end of the positioning plate.

[0015] Further, the inner surfaces of the five limiting buckles are respectively and tightly connected with the outer surfaces of the five limiting columns.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] (1) The five bearing assemblies are arranged, and the adsorption assembly is arranged in each bearing assembly, so that multiple wafer semiconductors can be accommodated in the bearing disc at a time, compared with the prior art that only one wafer semiconductor can be accommodated at a time, the carrying efficiency is greatly improved, the carrying frequency is reduced, and the overall working efficiency is improved.

[0018] (2) The vacuum pump, the output box, the connecting pipe, the connecting seat and the suction disc in the adsorption assembly are matched, the wafer semiconductor is fixed in a vacuum adsorption mode, compared with the traditional contact type fixing mode, damage such as scratches on the surface of the wafer semiconductor during carrying can be effectively avoided, and the integrity and performance of the wafer semiconductor are protected.

[0019] (3) The bearing assembly in the scheme, through the cooperation of the bearing disc body, the handle, the limiting buckle in the limiting component, the limiting column, the limiting groove, the side guard plate and the top plate, can keep the bearing disc in a closed state during transportation, prevent it from being opened under the action of external force, and also can provide protection for the transported wafer semiconductor, avoid the wafer semiconductor from being contaminated or damaged by collision, and through the setting of the bearing, the bearing disc body can rotate flexibly, the wafer semiconductor is convenient to place and take out, and the practicability of the bearing disc is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0022] Figure 2 It is a schematic diagram of the bearing mechanism of the present application;

[0023] Figure 3 It is a schematic diagram of the limiting component of the present application;

[0024] Figure 4 It is a schematic diagram of the bearing assembly of the present application;

[0025] Figure 5 It is a schematic diagram of the bearing assembly of the present application;

[0026] Figure 6 It is a schematic diagram of the adsorption assembly of the present application.

[0027] The numbers in the figure represent respectively:

[0028] 1, positioning plate; 2, positioning hole; 3, bearing mechanism; 31, positioning rod; 32, limiting component; 321, top plate; 322, side guard plate; 323, limiting groove; 324, limiting column; 33, bearing assembly; 331, connecting ring; 332, bearing; 333, bearing; 3331, bearing disc body; 3332, handle; 3333, limiting buckle; 3334, bearing block; 3335, silica gel pad; 34, adsorption assembly; 341, vacuum pump; 342, output box; 343, connecting pipe; 344, connecting seat; 345, suction cup; 346, support plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model below. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0030] The utility model will be further described in combination with embodiments below.

[0031] In some embodiments, referring to the drawings attached Figures 1-6 A bearing disc for wafer semiconductor carrying equipment, comprising a positioning plate 1, four positioning holes 2 are formed in the upper end of the positioning plate 1, a bearing mechanism 3 is fixedly connected to the upper end of the positioning plate 1, the bearing mechanism 3 comprises a positioning rod 31, the lower end of the positioning rod 31 is fixedly connected to the upper end of the positioning plate 1, a limiting assembly 32 is fixedly connected to the upper end of the positioning rod 31, five bearing assemblies 33 are fixedly connected to the outer surface of the positioning rod 31, and each of the five bearing assemblies 33 is fixedly connected with a suction assembly 34.

[0032] In the embodiments of the utility model, the positioning plate 1 can be quickly fixed on the carrying equipment through cooperation of the four positioning holes 2 and bolts, so that the connection of the bearing disc and the carrying equipment is realized, the wafer semiconductor can be quickly stored through the bearing mechanism 3, and multiple wafer semiconductors can be stored at a time, so that the carrying efficiency can be improved, the wafer semiconductor can be fixed by using the vacuum suction mode through cooperation of the suction assembly 34 and the bearing assembly 33, so that the wafer semiconductor can be effectively prevented from being damaged in the carrying process, the bearing disc can be kept in a closed state in the transportation process through cooperation of the bearing assembly 33 and the limiting assembly 32, so that the bearing disc can be prevented from being opened under the action of external force, and the wafer semiconductor being transported can also be protected.

[0033] In some embodiments, as shown in Figures 2-6 As a preferred embodiment of the utility model, the limiting assembly 32 comprises a top plate 321, the lower end of the top plate 321 is fixedly connected to the upper end of the positioning rod 31, a side guard plate 322 is fixedly connected to the outer surface of the top plate 321, a plurality of limiting grooves 323 are formed in the outer surface of the side guard plate 322, and a limiting column 324 is fixedly connected to the upper and lower walls in the inner cavity of each of the plurality of limiting grooves 323.

[0034] The bearing assembly 33 comprises a connecting ring 331, two bearings 332 are fixedly connected to the inner surface of the connecting ring 331, the inner surfaces of the plurality of bearings 332 are fixedly connected to the outer surface of the positioning rod 31, and a bearing piece 333 is fixedly connected to the outer surface of the connecting ring 331.

[0035] The bearing piece 333 comprises a bearing disc body 3331, the outer surfaces of the five bearing disc bodies 3331 are fixedly connected with the outer surfaces of the five connecting rings 331 respectively, a handle 3332 is fixedly connected to the outer surface of the bearing disc body 3331, a limiting buckle 3333 is fixedly connected to the left end of the handle 3332, the inner surfaces of the five limiting buckles 3333 are clampedly connected with the outer surfaces of the five limiting columns 324 respectively, a bearing block 3334 is fixedly connected to the bottom wall of the inner cavity of the bearing disc body 3331, and a silica gel pad 3335 is fixedly connected to the upper end of the bearing block 3334.

[0036] The adsorption assembly 34 comprises five vacuum pumps 341, the lower ends of the five vacuum pumps 341 are fixedly connected with the bottom walls of the inner cavities of the five bearing disc bodies 3331 respectively, an output box 342 is fixedly connected to the output end of the vacuum pump 341, four connecting pipes 343 are fixedly connected to the outer surface of the output box 342, connecting seats 344 are fixedly connected to the upper ends of the four connecting pipes 343, suction discs 345 are fixedly connected to the upper ends of the four connecting seats 344, a supporting plate 346 is fixedly connected to the upper end of the output box 342 in a bolted manner, and the inner surface of the supporting plate 346 is fixedly connected with the inner surfaces of the four suction discs 345.

[0037] In the embodiment of the utility model, by holding the handle 3332 of the bearing disc body 3331 in the bearing assembly 33 and rotating to the left, the limiting buckle 3333 is separated from the corresponding limiting column 324, at this time, the bearing disc body 3331 rotates around the positioning rod 31 under the action of the connecting ring 331 and the two bearings 332, until the bearing disc body 3331 is completely exposed, a wafer semiconductor is placed above the silica gel pad 3335, only the wafer semiconductor can cover the bearing block 3334 and not contact the bearing disc body 3331, the vacuum pump 341 located below the bearing disc body 3331 is started, the suction force generated by the working of the vacuum pump 341 is transmitted to the connecting seat 344 through the output box 342 and the connecting pipe 343, and finally the wafer semiconductor is adsorbed and fixed on the silica gel pad 3335 by the four suction discs 345.

[0038] After the wafer semiconductor is adsorbed and fixed, the handle 3332 is held and rotated to the right, the bearing disc body 3331 is reset, the limiting buckle 3333 is buckled on the corresponding limiting column 324 again, and the bearing disc body 3331 is prevented from rotating in the carrying process due to external force, thereby protecting the wafer semiconductor.

[0039] It should be noted that the specific installation method, circuit connection mode and control method of the vacuum pump 341 and the output box 342 in the utility model are all conventional designs, and the utility model will not be described in detail.

[0040] Working principle: when the wafer semiconductor needs to be stored in the bearing disc, the positioning plate 1 is fixed on the carrying equipment by using the bolt to pass through the four positioning holes 2, then the handle 3332 is held and turned to the left, the limiting buckle 3333 is separated from the corresponding limiting column 324, the bearing disc body 3331 can rotate around the positioning rod 31 under the action of the external force, the cooperation of the connecting ring 331 and the two bearings 332, so that the bearing disc body 3331 can be completely exposed, at this time the wafer semiconductor is placed above the silica gel pad 3335, this process does not need to be placed accurately, only the wafer semiconductor can cover the bearing block 3334 and not contact the bearing disc body 3331, then the vacuum pump 341 located at the layer is started, the vacuum pump 341 acts through the output box 342, is transmitted to the four connecting seats 344 through the four connecting pipes 343, and finally cooperates with the four suction cups 345 to adsorb the wafer semiconductor on the silica gel pad 3335.

[0041] After the fixing is completed, the handle 3332 is turned to the right, the bearing disc body 3331 is reset, the limiting buckle 3333 is buckled on the corresponding limiting column 324 again, the bearing disc body 3331 can be prevented from rotating under the action of the external force in the carrying process, so that the wafer semiconductor is exposed and damaged, the wafer semiconductor can be placed in the other layers in the same way, the wafer semiconductor of the first layer is protected by the top plate 321 and the bearing disc body 3331, the wafer semiconductor of the remaining layers is protected by the bearing disc body 3331 of the upper layer and the bearing disc body 3331 of the layer, and the wafer semiconductor can be prevented from being contaminated or damaged.

[0042] The above embodiments are only used to illustrate the technical solutions of the present application, but not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A carrier disk for wafer semiconductor handling equipment, comprising a positioning plate (1), characterized in that: The positioning plate (1) is provided with four positioning holes (2) at the upper end, and a bearing mechanism (3) is fixedly connected to the upper end of the positioning plate (1), the bearing mechanism (3) comprises a positioning rod (31), the upper end of the positioning rod (31) is fixedly connected with a limiting assembly (32), five bearing assemblies (33) are fixedly connected to the outer surface of the positioning rod (31), and each of the five bearing assemblies (33) is fixedly connected with an adsorption assembly (34) inside.

2. The wafer semiconductor handling apparatus support disc of claim 1, wherein: The limiting assembly (32) comprises a top plate (321), the lower end of the top plate (321) is fixedly connected with the upper end of the positioning rod (31), a side guard plate (322) is fixedly connected to the outer surface of the top plate (321), a plurality of limiting grooves (323) are formed in the outer surface of the side guard plate (322), and limiting columns (324) are fixedly connected to the upper and lower walls in the inner cavities of the limiting grooves (323).

3. The wafer semiconductor handling apparatus carrier disk according to claim 2, characterized by: The bearing assembly (33) comprises a connecting ring (331), two bearings (332) are fixedly connected to the inner surface of the connecting ring (331), and a bearing piece (333) is fixedly connected to the outer surface of the connecting ring (331).

4. The wafer semiconductor handling apparatus support disc of claim 3, wherein: The bearing piece (333) comprises a bearing disc body (3331), a handle (3332) is fixedly connected to the outer surface of the bearing disc body (3331), a limiting buckle (3333) is fixedly connected to the left end of the handle (3332), a bearing block (3334) is fixedly connected to the bottom wall in the inner cavity of the bearing disc body (3331), and a silica gel pad (3335) is fixedly connected to the upper end of the bearing block (3334).

5. The wafer semiconductor handling apparatus support disc of claim 4, wherein: The adsorption assembly (34) comprises a vacuum pump (341), an output box (342) is fixedly connected to the output end of the vacuum pump (341), four connecting pipes (343) are fixedly connected to the outer surface of the output box (342), connecting seats (344) are fixedly connected to the upper ends of the four connecting pipes (343), suction discs (345) are fixedly connected to the upper ends of the four connecting seats (344), a supporting plate (346) is fixedly connected to the upper end of the output box (342) through bolts, and the inner surfaces of the supporting plate (346) and the four suction discs (345) are fixedly connected.

6. The wafer semiconductor handling apparatus support disc of claim 5, wherein: The lower ends of the five vacuum pumps (341) are fixedly connected with the bottom walls in the inner cavities of the five bearing disc bodies (3331), and the outer surfaces of the five bearing disc bodies (3331) are fixedly connected with the outer surfaces of the five connecting rings (331).

7. The wafer semiconductor handling apparatus carrier disk according to claim 3, characterized by: The inner surfaces of the plurality of bearings (332) are fixedly connected with the outer surface of the positioning rod (31), and the lower end of the positioning rod (31) is fixedly connected with the upper end of the positioning plate (1).

8. The wafer semiconductor handling apparatus support disc of claim 4, wherein: The inner surfaces of the five limiting buckles (3333) are respectively clampedly connected with the outer surfaces of the five limiting columns (324).

Images