Hybrid electronic cigarette packaging structure
By using wafer-level packaging technology and metal shield design, the problems of easy breakage and differences in thermal expansion coefficients of traditional e-cigarette packaging have been solved, achieving stable connection, heat dissipation, and miniaturization of e-cigarettes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-04-14
AI Technical Summary
Traditional electronic cigarette packaging methods are prone to connection breakage due to external impacts or vibrations, and the difference in the thermal expansion coefficient of materials causes stress concentration, leading to connection failure, making it difficult to achieve miniaturization and thinness.
Employing wafer-level packaging technology, combined with the design of a metal shield and substrate, the metal shield covers the MCU chip and electronic components, while heat dissipation fins and support pillars are set up. The chip is then secured to the substrate with fixing claws to achieve stable connection and heat dissipation.
It improves the protective effect and heat dissipation performance of electronic cigarettes, reduces the packaging volume, realizes the miniaturization and thinning of electronic cigarettes, and extends their service life.
Smart Images
Figure CN224112142U_ABST
Abstract
Description
Technical Field
[0001] This utility model specifically relates to the field of electronic cigarette technology, and more specifically to a hybrid electronic cigarette packaging structure. Background Technology
[0002] To perform load suspension on a regular pallet, such as a wooden pallet, and by arranging straps, it can be secured by a single-part strap (also known as an endless strap) by passing the strap under the pallet and then over the load.
[0003] Traditional electronic cigarette packaging typically involves integrating all electronic components onto a single PCB board and using conventional packaging methods. Traditional wire bonding technology is a method of connecting the pads on a semiconductor chip to external pins or a substrate using fine metal wires. This technology is very mature, simple, and direct, providing stable electrical connections and mechanical support at a low cost.
[0004] However, in practice, it has been noted that traditional wire bonding is relatively thin and protrudes from the packaging surface, making it susceptible to breakage or poor contact due to external impacts or vibrations. Differences in the coefficients of thermal expansion between different materials may lead to stress concentration and connection failure. Utility Model Content
[0005] The purpose of this invention is to provide a hybrid electronic cigarette packaging structure that utilizes a wafer-level packaging technology for an MCU chip. This structure allows for direct formation of connection points on the chip surface, enabling higher-density circuit layouts, improved integration, and, by eliminating the need for additional lead frames or substrates, significantly reducing package size. This facilitates the miniaturization and thinning of electronic cigarette products, thereby addressing the technical problems mentioned in the background section.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A hybrid electronic cigarette packaging structure includes a substrate, on which MCU chips and other electronic components are respectively soldered, and a shell is symmetrically mounted on the substrate.
[0008] The outer casing has a metal cover covering the MCU chip and other electronic components. Each metal cover has heat dissipation fins fixedly connected in a rectangular array. The inner side of the metal cover also has an integral support column, which is located on the side of the MCU chip and other electronic components.
[0009] As a further technical solution of this utility model, a through slot is also provided on the substrate, and a fixing claw corresponding to the through slot is provided at the bottom of the metal cover. In addition, two symmetrical fixing claws are provided in each through slot, and a stopper is engaged between the two symmetrical fixing claws.
[0010] As a further technical solution of this utility model, the blocker includes a locking block located between two symmetrical fixed claws, and the end of the locking block is inserted into a through slot. The locking block is provided with a curved through hole and a insertion / removal slot from top to bottom.
[0011] As a further technical solution of this utility model, both sides of the curved through hole are provided with limiting protrusions integrally formed with the card block, and each of the fixed claws has a groove corresponding to the limiting protrusion on the side near the card block, and the limiting protrusion is engaged in the limiting protrusion on the side of the fixed claw.
[0012] As a further technical solution of this utility model, the MCU chip is specifically packaged at the wafer level, the heat sink is specifically made of aluminum sheet, the heat sink is vertically embedded in the metal cover, and the two sides of the heat sink extend to the top of the metal cover and the inside of the metal cover, respectively.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] 1. This utility model protects the MCU chip and other electronic components on the substrate with a metal cover, while the internal support pillars can prevent the metal cover from deforming after being hit, and the heat dissipation fins arranged in a rectangular array on the metal cover can improve the heat dissipation effect during long-term operation and extend the service life.
[0015] 2. In this utility model, a metal cover is placed on a substrate, and a fixing claw at the bottom of the metal cover passes through a slot and engages with the substrate to fix the metal cover on the substrate. In addition, a stopper is engaged between each set of fixing claws to prevent the fixing claws from loosening due to vibration during impact, thereby improving the protective effect.
[0016] 3. In this utility model, the MCU chip adopts wafer-level packaging technology and is directly packaged on the substrate. Compared with traditional wire bonding, the wafer-level packaging solder ball array directly contacts the substrate, increasing the contact area. In addition, the use of low thermal resistance materials greatly increases its heat dissipation performance. Furthermore, no additional lead frame or substrate is required, significantly reducing the packaging volume, which is conducive to the miniaturization and thinning of electronic cigarette products. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of this utility model in use.
[0018] Figure 2 This utility model Figure 1 Another perspective view.
[0019] Figure 3 This utility model Figure 2A magnified schematic diagram of a portion of the image.
[0020] Figure 4 This utility model Figure 1 A partial structural diagram.
[0021] Figure 5 This utility model Figure 4 A magnified view of a portion of the image.
[0022] Figure 6 This is a three-dimensional structural diagram of the outer shell in this utility model.
[0023] Figure 7 This utility model Figure 6 A magnified view of a portion of the image.
[0024] In the picture:
[0025] Substrate-1, through slot-11, MCU chip-2, other electronic components-3, housing-4, metal cover-41, heat sink fins-42, fixing claw-43, support column-44, wire connection strip-5, blocker-6, card block-61, plug-in slot-62, bent through hole-63, limiting protrusion-64. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Please see Figures 1-7 This utility model provides a hybrid electronic cigarette packaging structure, including a substrate 1, on which an MCU chip 2 and other electronic components 3 are respectively soldered, and a shell 4 is symmetrically mounted on the substrate 1;
[0028] The outer casing 4 has a metal cover 41 covering the MCU chip 2 and other electronic components 3. Each metal cover 41 has heat dissipation fins 42 fixedly connected in a rectangular array. The inner side of the metal cover 41 is also integrally provided with a support column 44, and the support column 44 is located on the side of the MCU chip 2 and other electronic components 3.
[0029] By adopting the above technical solution, the MCU chip 2 and other electronic components 3 on the substrate 1 are protected by the metal cover 41, while the internal support pillars 44 can prevent the metal cover 41 from deforming after being hit. Furthermore, the heat dissipation fins 42 arranged in a rectangular array on the metal cover 41 can improve the heat dissipation effect during long-term operation and extend the service life.
[0030] Furthermore, the substrate 1 is provided with a through slot 11, and the bottom of the metal cover 41 is provided with a fixing claw 43 corresponding to the through slot 11. In addition, each through slot 11 is provided with two symmetrical fixing claws 43, and a stopper 6 is engaged between the two symmetrical fixing claws 43.
[0031] Furthermore, the blocker 6 includes a locking block 61 located between two symmetrical fixed claws 43, and the end of the locking block 61 is inserted into the through slot 11. The locking block 61 is provided with a curved through hole 63 and a insertion / removal slot 62 from top to bottom.
[0032] More specifically, both sides of the curved through hole 63 are provided with limiting protrusions 64 integrally formed with the locking block 61, and each of the fixed claws 43 has a groove corresponding to the limiting protrusions 64 on the side near the locking block 61, and the limiting protrusions 64 are engaged in the limiting protrusions 64 on the side of the fixed claws 43.
[0033] By adopting the above technical solution, the metal cover 41 is placed on the substrate 1, and the fixing claw 43 at the bottom of the metal cover 41 passes through the through slot 11 and engages with the substrate 1 to fix the metal cover 41 on the substrate 1. Moreover, each set of fixing claws 43 is also engaged with a stopper 6 to prevent the fixing claws 43 from loosening due to vibration during impact, thereby improving the protective effect.
[0034] Furthermore, the MCU chip 2 is specifically packaged at the wafer level, the heat sink 42 is specifically made of aluminum sheet, the heat sink 42 is vertically embedded in the metal cover 41, and the two sides of the heat sink 42 extend to the top of the metal cover 41 and the inside of the metal cover 41, respectively.
[0035] By adopting the above technical solution, the MCU chip 2 is directly packaged on the substrate 1 using wafer-level packaging technology. Compared with traditional wire bonding, the wafer-level packaging solder ball array directly contacts the substrate 1, increasing the contact area. Furthermore, the use of low thermal resistance materials greatly enhances its heat dissipation performance.
[0036] Furthermore, the other electronic components 3 include, but are not limited to, sensors, batteries, heating elements, etc., and the other electronic components 3 are soldered onto the substrate 1 using conventional packaging methods.
[0037] The working principle of this utility model is as follows: In use, the MCU chip 2 is first installed on the substrate 1 using wafer-level packaging technology. Then, other electronic components 3 in conventional packaging are soldered onto the substrate 1. Next, metal covers 41 are symmetrically placed on the substrate 1. The metal covers 41 cover the MCU chip 2 and other electronic components 3 to improve the protection effect. The heat dissipation fins 42 on the metal covers 41 can improve the internal heat dissipation effect. At the same time, the symmetrically arranged fixing claws 43 penetrate through the slot 11 and engage with the substrate 1. Finally, the locking block 61 is inserted between the two symmetrical fixing claws 43. At this time, the locking block 61 engages with the groove on the fixing claw 43 through the limiting protrusions 64 on both sides, improving the stability of the connection and preventing the fixing claws 43 from loosening due to vibration caused by impact.
[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or substrate characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A hybrid electronic cigarette packaging structure, characterized in that: The substrate (1) is provided with an MCU chip (2) and other electronic components (3) respectively, and a housing (4) is symmetrically mounted on the substrate (1). The outer casing (4) has a metal cover (41) covering the MCU chip (2) and other electronic components (3). Each of the metal covers (41) has heat dissipation fins (42) fixedly connected in a rectangular array. The inner side of the metal cover (41) is also integrally provided with a support column (44), and the support column (44) is located on the side of the MCU chip (2) and other electronic components (3).
2. The hybrid electronic cigarette packaging structure according to claim 1, characterized in that: The substrate (1) is also provided with a through slot (11), and the bottom of the metal cover (41) is provided with a fixing claw (43) corresponding to the through slot (11). In addition, each through slot (11) is provided with two symmetrical fixing claws (43), and a stopper (6) is also engaged between the two symmetrical fixing claws (43).
3. The hybrid electronic cigarette packaging structure according to claim 2, characterized in that: The blocker (6) includes a block (61) located between two symmetrical fixed claws (43), and the end of the block (61) is inserted into a through slot (11). The block (61) is provided with a curved through hole (63) and a insertion slot (62) from top to bottom.
4. The hybrid electronic cigarette packaging structure according to claim 3, characterized in that: Both sides of the curved through hole (63) are provided with limiting protrusions (64) integrally formed with the card block (61).
5. The hybrid electronic cigarette packaging structure according to claim 4, characterized in that: Each of the fixed claws (43) has a groove on the side near the block (61) that corresponds to the limiting protrusion (64), and the limiting protrusion (64) is engaged in the limiting protrusion (64) on the side of the fixed claw (43).
6. The hybrid electronic cigarette packaging structure according to claim 5, characterized in that: The MCU chip (2) is specifically packaged at the wafer level, and the heat sink (42) is specifically made of aluminum sheet. The heat sink (42) is vertically embedded in the metal cover (41), and the two sides of the heat sink (42) extend to the top of the metal cover (41) and the inside of the metal cover (41) respectively.