Wafer grinding machine loading disc transmission mechanism

Abstract

The utility model relates to a carrier disc transmission mechanism of a wafer grinding machine. The carrier disc transmission mechanism comprises a first-stage transmission assembly, a second-stage transmission assembly and a third-stage transmission assembly. The primary transmission assembly comprises a primary gear and a main shaft, and the primary gear is arranged on the circumferential outer side of the main shaft in a sleeving mode. The second-stage transmission assembly comprises a second-stage gear and an unpowered gear shaft, the second-stage gear is meshed with the first-stage gear, and the second-stage gear is arranged on the outer side of the unpowered gear shaft in the circumferential direction in a sleeving mode. The third-stage transmission assembly comprises a third-stage gear and a rotating shaft, the third-stage gear is meshed with the second-stage gear, the third-stage gear is arranged on the circumferential outer side of the rotating shaft in a sleeving mode, and the rotating shaft is connected with the carrying disc. According to the technical scheme, the problems that in the prior art, during wafer grinding, the efficiency is low, and operation is not stable enough are effectively solved.

Description

Technical Field

[0001] This application relates to the technical field of wafer processing, and more specifically, to a wafer grinding machine disk drive mechanism. Background Technology

[0002] A wafer grinding machine is a device used for grinding and polishing silicon wafers, semiconductor wafers, and other optical components. It typically consists of a frame, worktable, grinding head, polishing head, cooling system, and feed system. It is a specialized grinding machine. The main function of wafer thinning grinding equipment is to remove a portion of the material from the back side of the wafer using mechanical or chemical-mechanical methods to achieve thinning. Wafer thinning, or wafer back-side grinding, is a semiconductor manufacturing process designed to control wafer thickness to meet the requirements of chip packaging thickness and surface roughness, improving device heat dissipation performance and product reliability. Through mechanical grinding, it removes saw marks caused by the dicing process on the silicon wafer surface, reduces the depth of the damaged layer on the silicon wafer surface, and improves the flatness and surface roughness of the silicon wafer.

[0003] Existing wafer grinding machines (e.g., application number 202510012220.4, entitled "A Glass Wafer Processing Device and Its Usage Method") include: a grinding box, a grinding mechanism, a support mechanism, and a storage and fixing assembly; a lifting support assembly is installed on one side of the grinding box; the grinding mechanism includes a driving grinding motor, a fixed transmission shaft is mounted on the driving grinding motor, a grinding disc is rotatably connected to the fixed transmission shaft, a fixed connecting column is fixed on the grinding disc, and the fixed transmission shaft is threadedly connected to the fixed connecting column; the support mechanism includes a rotating boss, a glass wafer body is mounted on the rotating boss, a driving arc rod is fixed on one side of the rotating boss, and an anti-clogging scraper is fixedly connected to the other end of the driving arc rod. The driving rotary motor drives the driving support shaft to rotate, which in turn drives the rotating disc to rotate, which in turn drives the rotating boss to rotate through multiple linkages, thus rotating the glass wafer body. Then, the driving grinding motor drives the grinding disc to rotate, achieving the grinding of the glass wafer body by the grinding disc. However, this single-stage transmission method results in low rotational efficiency and unstable operation of the rotating boss, making it unsuitable for high-precision requirements. Utility Model Content

[0004] This application provides a wafer grinding machine disk drive mechanism to solve the problems of low efficiency and unstable operation in the prior art when grinding wafers.

[0005] A wafer grinding machine disk drive mechanism according to this application includes: a primary drive assembly, a secondary drive assembly, and a tertiary drive assembly. The primary drive assembly includes a primary gear and a main shaft, with the primary gear sleeved on the circumferential outer side of the main shaft. The secondary drive assembly includes a secondary gear and a non-powered gear shaft, with the secondary gear meshing with the primary gear and sleeved on the circumferential outer side of the non-powered gear shaft. The tertiary drive assembly includes a tertiary gear and a rotating shaft, with the tertiary gear meshing with the secondary gear and sleeved on the circumferential outer side of the rotating shaft, and the rotating shaft connected to the disk.

[0006] In some embodiments, four sets of secondary gears and four sets of tertiary gears are provided, with the four sets of tertiary gears and the four sets of secondary gears being arranged in a one-to-one correspondence and meshing with each other. Four sets of rotating shafts and four sets of carrier disks are also provided, with the four sets of rotating shafts and the four sets of tertiary gears being arranged in a one-to-one correspondence and connected with each other. The four sets of carrier disks and the four sets of rotating shafts are arranged in a one-to-one correspondence and connected with each other.

[0007] In some embodiments, the spindle has a first shaft segment, a second shaft segment, and a third shaft segment. The first end of the first shaft segment is connected to the drive motor via a coupling. The second end of the first shaft segment is connected to the first end of the second shaft segment. The second end of the second shaft segment is connected to the third shaft segment. The diameter of the second shaft segment is larger than the diameter of the third shaft segment. A primary gear is sleeved on the circumferential outer side of the third shaft segment.

[0008] In some embodiments, the primary transmission assembly further includes a gear plate, a first bearing, and a bearing ring. The gear plate, the first bearing, and the bearing ring are sequentially sleeved on the circumferential outer side of the third shaft segment. The gear plate and the first bearing are located on both sides of the primary gear, and the gear plate and the primary gear are connected.

[0009] In some embodiments, the primary transmission assembly further includes a support disc and a flange bearing housing, the flange bearing housing and the support disc being connected, the bearing pressure ring and the flange bearing housing being connected, and the third shaft segment being installed inside the flange bearing housing.

[0010] In some embodiments, the primary transmission assembly further includes a gland, a support plate having a mounting hole, and a portion of the flange bearing housing being located within the mounting hole and connected to the gland.

[0011] In some embodiments, the support disk has a through hole, the three-stage gear and the carrier disk are located on both sides of the support disk, and the rotating shaft passes through the through hole.

[0012] In some embodiments, the support plate has an annular groove for discharging grinding fluid.

[0013] In some embodiments, the primary gear and the secondary gear are misaligned when meshing, and the secondary gear and the tertiary gear are misaligned when meshing.

[0014] In some embodiments, the non-powered gear shaft and housing are fixed.

[0015] The wafer grinding machine pallet transmission mechanism, applying the technical solution of this application, includes: a primary transmission assembly, a secondary transmission assembly, and a tertiary transmission assembly. The primary transmission assembly includes a primary gear and a main shaft. The primary gear is sleeved on the circumferential outer side of the main shaft, which receives driving force to rotate the primary gear. The secondary transmission assembly includes a secondary gear and a non-powered gear shaft. The secondary gear meshes with the primary gear, and is sleeved on the circumferential outer side of the non-powered gear shaft, thus rotating the secondary gear. The tertiary transmission assembly includes a tertiary gear and a rotating shaft. The tertiary gear meshes with the secondary gear, rotating the tertiary gear, which is sleeved on the circumferential outer side of the rotating shaft. The rotating shaft is connected to the pallet, thus rotating the pallet, which is used to place wafers. This multi-stage design, compared to a single-stage design, better balances gear size and precision, reducing cumulative errors. Simultaneously, multi-stage meshing enables precise transmission ratio control, improves transmission efficiency, balances inertial forces, and reduces impact and vibration, resulting in smoother operation. The technical solution of this application effectively solves the problems of low efficiency and unstable operation in the prior art when grinding wafers. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the wafer grinding machine carrier drive mechanism according to an embodiment of this application is shown;

[0019] Figure 2 The diagram shows the meshing of the first-stage gear, the second-stage gear, and the third-stage gear according to an embodiment of this application.

[0020] The above figures include the following reference numerals:

[0021] 10. Primary transmission assembly; 11. Primary gear; 12. Main shaft; 121. First shaft segment; 122. Second shaft segment; 123. Third shaft segment; 13. Gear pressure plate; 14. First bearing; 15. Bearing pressure ring; 16. Support plate; 161. Annular groove; 17. Flange bearing seat; 18. Pressure cap; 20. Secondary transmission assembly; 21. Secondary gear; 22. Unpowered gear shaft; 30. Tertiary transmission assembly; 31. Tertiary gear; 32. Rotating shaft; 100. Carrier disk; 200. Wafer. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0025] like Figure 1 and Figure 2 As shown, the embodiment relates to a wafer polishing machine tray transmission mechanism, including: a primary transmission assembly 10, a secondary transmission assembly 20, and a tertiary transmission assembly 30. The primary transmission assembly 10 includes a primary gear 11 and a main shaft 12, with the primary gear 11 sleeved on the circumferential outer side of the main shaft 12. The secondary transmission assembly 20 includes a secondary gear 21 and a non-powered gear shaft 22, with the secondary gear 21 meshing with the primary gear 11 and sleeved on the circumferential outer side of the non-powered gear shaft 22. The tertiary transmission assembly 30 includes a tertiary gear 31 and a rotating shaft 32, with the tertiary gear 31 meshing with the secondary gear 21 and sleeved on the circumferential outer side of the rotating shaft 32, which is connected to the tray 100.

[0026] The wafer grinding machine pallet transmission mechanism, using the technical solution of this embodiment, includes: a primary transmission assembly 10, a secondary transmission assembly 20, and a tertiary transmission assembly 30. The primary transmission assembly 10 includes a primary gear 11 and a main shaft 12. The primary gear 11 is sleeved on the circumferential outer side of the main shaft 12, which receives driving force to rotate the primary gear 11. The secondary transmission assembly 20 includes a secondary gear 21 and a non-powered gear shaft 22. The secondary gear 21 meshes with the primary gear 11 and is sleeved on the circumferential outer side of the non-powered gear shaft 22, thus enabling the secondary gear 21 to rotate. The tertiary transmission assembly 30 includes a tertiary gear 31 and a rotating shaft 32. The tertiary gear 31 meshes with the secondary gear 21, enabling the tertiary gear 31 to rotate. The tertiary gear 31 is sleeved on the circumferential outer side of the rotating shaft 32, which is connected to the pallet 100, thereby driving the pallet 100 to rotate. The pallet 100 is used to hold the wafer 200. Compared to single-stage designs, this multi-stage design better balances gear size and precision, reducing cumulative errors. Simultaneously, multi-stage meshing enables precise transmission ratio control, improving transmission efficiency, balancing inertial forces, and reducing impact and vibration for smoother operation. The technical solution in this embodiment effectively solves the problems of low efficiency and unstable operation in existing technologies when grinding wafers of size 200.

[0027] It should be noted that the first-stage gear 11 meshes with the second-stage gear 21, causing the second-stage gear 21 to rotate, and the third-stage gear 31 meshes with the second-stage gear 21, causing the third-stage gear 31 to rotate. During the meshing process, the first-stage gear 11 and the third-stage gear 31 are misaligned, so there will be no interference. The four sets of carrier disks 100 are selected with appropriate sizes to avoid interference. During the rotation of the carrier disks 100, the wafers 200 placed on them can achieve high-precision grinding.

[0028] like Figure 1 As shown, in some embodiments, four sets of secondary gears 21 and four sets of tertiary gears 31 are provided. The four sets of tertiary gears 31 and the four sets of secondary gears 21 are arranged in a one-to-one correspondence and mesh with each other. The angles formed by adjacent secondary gears 21 are the same. This arrangement makes the operation more stable. Four sets of rotating shafts 32 and four sets of carrier disks are also provided. The four sets of rotating shafts 32 and the four sets of tertiary gears 31 are arranged in a one-to-one correspondence and connected with each other. The four sets of carrier disks and the four sets of rotating shafts 32 are arranged in a one-to-one correspondence and connected with each other.

[0029] It should be noted that the module of the first-stage gear is 4 and the number of teeth is 44, the module of the second-stage gear is 4 and the number of teeth is 24, and the module of the third-stage gear is 4 and the number of teeth is 20.

[0030] The total transmission ratio is (Z1 / Z2)*(Z2 / Z3)=2.2;

[0031] In the calculation of involute cylindrical spur gears, we know that d = mZ, therefore:

[0032] d1=2R1=mZ1=4*44, R1=88;

[0033] d2=2R2=mZ2=4*24, R2=48;

[0034] d3=2R3=mZ3=4*20, R3=40.

[0035] For the same output torque, the corresponding torque is reduced by 1.55 times, that is, (R1+R2) / (R2+R3)=1.55.

[0036] d is the pitch circle diameter, and R is the pitch circle radius.

[0037] The drive shaft of the drive motor and the main shaft 12 are connected by a coupling to provide driving force.

[0038] δT1: Reflects a small change in the output torque of the drive motor; δn: Reflects a small change in the speed of the drive motor; δT1 / δn: Reflects the matching relationship between the torque adjustment speed and the speed adjustment speed of the drive motor. When δT1 / δn≥1, the drive motor suppresses speed fluctuations by rapidly increasing torque, maintaining the stable speed of the carrier 100. The first-stage gear 11 needs to transmit a constant torque to the carrier 100, suitable for high-precision scenarios. When δT1 / δn<1, the drive motor torque adjustment lags and cannot completely suppress speed changes. The carrier 100 speed responds quickly, and the first-stage gear 11 only needs to transmit the instantaneous torque of the carrier 100. The torque of the first-stage gear 11 decreases, suitable for high-speed scenarios. The appropriate output torque and speed of the drive motor should be selected according to different application scenarios.

[0039] like Figure 2 As shown, in some embodiments, the main shaft 12 has a first shaft segment 121, a second shaft segment 122, and a third shaft segment 123. The first end of the first shaft segment 121 is connected to the drive motor via a coupling, and the drive motor drives the first shaft segment 121 to rotate. The second end of the first shaft segment 121 is connected to the first end of the second shaft segment 122, causing the second shaft segment 122 to rotate synchronously. The second end of the second shaft segment 122 is connected to the third shaft segment 123, causing the third shaft segment 123 to rotate synchronously. The diameter of the second shaft segment 122 is larger than the diameter of the third shaft segment 123, which can limit the movement of the gear pressure plate 13. The primary gear 11 is sleeved on the circumferential outer side of the third shaft segment 123, and the primary gear 11 and the third shaft segment 123 are keyed together so that the primary gear 11 can rotate synchronously with the third shaft segment 123.

[0040] like Figure 2As shown, in some embodiments, the primary transmission assembly 10 further includes a gear plate 13, a first bearing 14, and a bearing ring 15. The gear plate 13, the first bearing 14, and the bearing ring 15 are sequentially sleeved on the circumferential outer side of the third shaft segment 123. The gear plate 13 and the first bearing 14 are located on both sides of the primary gear 11. This arrangement aims to achieve axial limiting of the primary gear 11, making the rotation of the primary gear 11 more stable. The gear plate 13 is connected to the primary gear 11, and the gear plate 13 can support the primary gear 11 to prevent the primary gear 11 from tilting. At the same time, the gear plate 13 and the first bearing 14 together form an axial limiting of the primary gear 11. The gear plate 13 rotates synchronously with the rotation of the primary gear 11.

[0041] like Figure 2 As shown, in some embodiments, the primary transmission assembly 10 further includes a support plate 16 and a flange bearing seat 17. The flange bearing seat 17 and the support plate 16 are connected, and the bearing pressure ring 15 and the flange bearing seat 17 are connected. The bearing pressure ring 15, the flange bearing seat 17 and the support plate 16 are sequentially fixed together by long bolts. The third shaft segment 123 is rotatably installed in the flange bearing seat 17, and the flange bearing seat 17 provides support for the third shaft segment 123.

[0042] It should be noted that the first-stage transmission assembly 10 also includes a second bearing and a shaft retaining ring. The shaft retaining ring is installed between the third shaft section 123 and the flange bearing housing 17. The second bearing is sleeved on the circumferential outer side of the third shaft section 123 and is located close to the flange bearing housing 17.

[0043] like Figure 2 As shown, in some embodiments, the primary transmission assembly 10 further includes a pressure cap 18. A mounting hole is provided on the support plate 16, and a portion of the flange bearing seat 17 is located within the mounting hole and connected to the pressure cap 18. The size of the pressure cap 18 is larger than the size of the mounting hole, allowing the pressure cap 18 to abut against the support plate 16, making the support plate 16 more stable. The circumferential direction of the support plate 16 can be connected to the inner wall of the housing, further improving the stability of the support plate 16.

[0044] like Figure 2 As shown, in some embodiments, the support disk 16 has a through hole, the third-stage gear 31 and the carrier disk 100 are located on both sides of the support disk 16, and the rotating shaft 32 passes through the through hole. The purpose of this arrangement is that the rotation of the support disk 16 can match the revolution of the third-stage gear 31. The revolution of the third-stage gear 31 drives the carrier disk 100 to rotate synchronously. The design of the support disk 16 can make the rotation of the carrier disk 100 more stable and can limit the third-stage gear 31 to prevent it from disengaging from the second-stage gear 21. A plane bearing is provided between the carrier disk 100 and the support disk 16 to make the rotation of the carrier disk 100 smoother.

[0045] like Figure 2 As shown, in some embodiments, the support plate 16 has an annular groove 161 for draining the grinding fluid and for facilitating the cleaning of fine abrasive deposits after shutdown.

[0046] like Figure 2 As shown, in some embodiments, the first-stage gear 11 and the second-stage gear 21 are misaligned during meshing, and the second-stage gear 21 and the third-stage gear 31 are also misaligned during meshing. The misalignment can be set to one-third. Misaligned meshing allows for multi-point contact during meshing, improving positioning accuracy. Furthermore, the load distribution during gear meshing is more uniform, resulting in stronger impact resistance. Simultaneously, misaligned meshing changes single-point contact to line contact, reducing impact and vibration.

[0047] In some embodiments, the unpowered gear shaft 22 is fixed to the housing, which is not shown in the figure. The housing is the one that houses the entire wafer polishing machine tray drive mechanism. The housing is designed according to the shape of the wafer polishing machine tray drive mechanism to match it. The unpowered gear shaft is fixed to the inner wall of the housing, and the secondary gear 21 rotates around the unpowered gear shaft.

[0048] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0049] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0050] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer grinding machine tray transmission mechanism, characterized in that, include: A primary transmission assembly (10) includes a primary gear (11) and a main shaft (12), wherein the primary gear (11) is sleeved on the circumferential outer side of the main shaft (12); A secondary transmission assembly (20) includes a secondary gear (21) and a non-powered gear shaft (22). The secondary gear (21) meshes with the primary gear (11), and the secondary gear (21) is sleeved on the circumferential outer side of the non-powered gear shaft (22). The three-stage transmission assembly (30) includes a three-stage gear (31) and a rotating shaft (32). The three-stage gear (31) meshes with the two-stage gear (21). The three-stage gear (31) is sleeved on the circumferential outer side of the rotating shaft (32). The rotating shaft (32) is connected to the carrier disk (100).

2. The wafer grinding machine carrier disk transmission mechanism according to claim 1, characterized in that, The secondary gears (21) are provided in four sets, and the tertiary gears (31) are provided in four sets. The four sets of tertiary gears (31) and the four sets of secondary gears (21) are provided in a one-to-one correspondence and mesh with each other. The rotating shaft (32) and the carrier disk (100) are each provided in four sets. The four sets of rotating shafts (32) and the four sets of tertiary gears (31) are provided in a one-to-one correspondence and are connected to each other. The four sets of carrier disks (100) and the four sets of rotating shafts (32) are provided in a one-to-one correspondence and are connected to each other.

3. The wafer grinding machine carrier disk transmission mechanism according to claim 1, characterized in that, The main shaft (12) has a first shaft segment (121), a second shaft segment (122) and a third shaft segment (123). The first end of the first shaft segment (121) is connected to the drive motor through a coupling. The second end of the first shaft segment (121) is connected to the first end of the second shaft segment (122). The second end of the second shaft segment (122) is connected to the third shaft segment (123). The diameter of the second shaft segment (122) is larger than the diameter of the third shaft segment (123). The first-stage gear (11) is sleeved on the circumferential outer side of the third shaft segment (123).

4. The wafer grinding machine carrier disk transmission mechanism according to claim 3, characterized in that, The primary transmission assembly (10) further includes a gear plate (13), a first bearing (14), and a bearing ring (15). The gear plate (13), the first bearing (14), and the bearing ring (15) are sequentially sleeved on the circumferential outer side of the third shaft segment (123). The gear plate (13) and the first bearing (14) are located on both sides of the primary gear (11), and the gear plate (13) and the primary gear (11) are connected.

5. The wafer grinding machine disk drive mechanism according to claim 4, characterized in that, The primary transmission assembly (10) further includes a support plate (16) and a flange bearing seat (17). The flange bearing seat (17) is connected to the support plate (16), the bearing pressure ring (15) is connected to the flange bearing seat (17), and the third shaft segment (123) is installed inside the flange bearing seat (17).

6. The wafer grinding machine carrier disk transmission mechanism according to claim 5, characterized in that, The primary transmission assembly (10) also includes a pressure cap (18), and the support plate (16) has an installation hole. A portion of the flange bearing seat (17) is located in the installation hole and connected to the pressure cap (18).

7. The wafer grinding machine disk drive mechanism according to claim 5, characterized in that, The support disk (16) has a through hole, the three-stage gear (31) and the carrier disk (100) are located on both sides of the support disk (16), and the rotating shaft (32) passes through the through hole.

8. The wafer grinding machine disk drive mechanism according to claim 5, characterized in that, The support plate (16) has an annular groove (161) for discharging grinding fluid.

9. The wafer grinding machine disk drive mechanism according to claim 1, characterized in that, The first-stage gear (11) and the second-stage gear (21) are misaligned when meshing, and the second-stage gear (21) and the third-stage gear (31) are misaligned when meshing.

10. The wafer grinding machine carrier disk transmission mechanism according to claim 1, characterized in that, The non-powered gear shaft (22) is fixed to the housing.

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