High-temperature drying device for PCB electroplating

Abstract

The utility model discloses a high-temperature drying device for electroplating a printed circuit board (PCB), which relates to the technical field of heat pump systems and comprises a direct-current variable-frequency compressor, a condensing heat exchanger and a water source heat exchanger, and the direct-current variable-frequency compressor is connected with the condensing heat exchanger through a high-temperature high-pressure pipe at the output end of the direct-current variable-frequency compressor. The output end of the condensing heat exchanger is connected with a water source heat exchanger through a pipeline, a filter and a throttling expansion valve are sequentially arranged on the pipeline between the condensing heat exchanger and the water source heat exchanger, and the input end of the direct-current inverter compressor is connected with a circulating water inlet pipeline. In addition, according to the air energy heating principle, through cooperative work of the direct-current frequency conversion compressor, the condensation heat exchanger, the water source heat exchanger and other components, water and electricity separation is achieved, fire hazards are greatly reduced, the needed drying temperature can be effectively maintained, meanwhile, the energy-saving effect is achieved, and the energy-saving effect is achieved. Therefore, the defects of dry burning and fire hidden danger of a traditional electric heating pipe are overcome.

Description

Technical Field

[0001] This utility model relates to the field of heat pump system technology, specifically a high-temperature drying device for PCB circuit board electroplating. Background Technology

[0002] In the current PCB (Printed Circuit Board), circuit board, and electroplating industries, drying and heating are indispensable parts of the production process. Traditional drying and heating methods mainly rely on electric heating elements. However, this method has significant drawbacks: First, electric heating elements have low heating efficiency and high energy consumption, leading to high energy costs in the long run; second, because the electric heating elements are in direct contact with the medium being heated, they are prone to dry burning due to improper operation or equipment aging, resulting in fire hazards and posing a serious threat to safe production.

[0003] To address these issues, the industry has been seeking more efficient and safer alternatives. For example, some improvements have attempted to introduce heat pump systems for heating purposes, aiming to improve energy efficiency while reducing safety hazards. However, these existing solutions often fail to fully meet the specific requirements of high-temperature drying environments in PCB electroplating processes, particularly in maintaining stable temperature control, avoiding overheating risks, and achieving water-electricity separation, where there is still room for improvement.

[0004] Therefore, a high-temperature drying device for PCB circuit board electroplating is proposed here. Utility Model Content

[0005] Technical problems to be solved

[0006] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a high-temperature drying device for electroplating PCB circuit boards.

[0007] Technical solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature drying device for PCB circuit board electroplating, comprising a DC inverter compressor, a condenser heat exchanger, and a water source heat exchanger. The DC inverter compressor is connected to the condenser heat exchanger through a high-temperature and high-pressure pipe at its output end. The output end of the condenser heat exchanger is connected to the water source heat exchanger through a pipe. A filter and a throttling expansion valve are sequentially installed on the pipe between the condenser heat exchanger and the water source heat exchanger. This utility model uses the principle of air energy heating. Through the coordinated work of components such as the DC inverter compressor, the condenser heat exchanger, and the water source heat exchanger, not only is water and electricity separated, greatly reducing the risk of fire, but it can also effectively maintain the required drying temperature and has energy-saving effects, thereby overcoming many defects of traditional electric heating tubes, such as dry burning and fire hazards.

[0009] The input end of the DC inverter compressor is connected to a circulating water inlet pipe, and the output end of the DC inverter compressor is connected to a circulating water outlet pipe. A proportional regulating valve is installed on the circulating water outlet pipe. This utility model also features key components such as a filter, a throttling expansion valve, and a proportional regulating valve to further optimize the system's operating efficiency and stability, while saving power consumption.

[0010] Preferably, the output end of the water source heat exchanger is connected to the input of the DC inverter compressor via pipe three.

[0011] Preferably, it also includes a DC inverter controller for controlling the frequency of the DC inverter compressor, the DC inverter controller monitoring the set temperature to keep the frequency of the DC inverter compressor constant, so that the temperature is maintained at the required temperature.

[0012] Preferably, the high-temperature gas produced by the DC inverter compressor is transported to the PCB circuit board electroplating production line via a fan and pipeline 2.

[0013] Preferably, the condenser heat exchanger is a toothed plate heat exchanger.

[0014] Preferably, the water source heat exchanger is a plate heat exchanger.

[0015] Beneficial effects:

[0016] Compared with existing technologies, this high-temperature drying device for PCB electroplating has the following advantages:

[0017] This invention utilizes the principle of air-source heat pump heating. Through the coordinated operation of components such as a DC inverter compressor, a condenser heat exchanger, and a water source heat exchanger, it not only achieves water-electricity separation, greatly reducing the risk of fire, but also effectively maintains the required drying temperature while achieving energy-saving effects. This overcomes many defects of traditional electric heating tubes, such as dry burning and fire hazards. In addition, this invention also features key components such as a filter, a throttling expansion valve, and a proportional regulating valve to further optimize the system's operating efficiency and stability, while saving electricity consumption. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the PCB circuit board electroplating production line of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the DC inverter compressor and water source heat exchanger of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the DC inverter compressor of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the DC inverter compressor and condenser heat exchanger of this utility model.

[0024] In the picture:

[0025] 1. DC inverter compressor; 2. Condensing heat exchanger; 3. Water source heat exchanger; 4. High temperature and high pressure pipe; 5. Fan; 6. Pipeline 2; 7. PCB circuit board electroplating production line; 8. Pipeline; 9. Filter; 10. Throttling expansion valve; 11. Circulating water inlet pipe; 12. Circulating water outlet pipe; 13. Proportional regulating valve; 14. Pipeline 3. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-5 As shown, this utility model provides a technical solution: a high-temperature drying device for PCB circuit board electroplating mainly includes a DC inverter compressor 1, a condenser heat exchanger 2, and a water source heat exchanger 3. The DC inverter compressor 1 is connected to the condenser heat exchanger 2 through a high-temperature and high-pressure pipe 4 connected to its output end, thereby transferring high-temperature and high-pressure gas to the condenser heat exchanger 2 to release heat. The condenser heat exchanger 2 adopts a toothed plate design to improve heat exchange efficiency. The medium from the condenser heat exchanger 2 flows to the water source heat exchanger 3 through a pipe 8. A filter 9 and a throttling expansion valve 10 are installed sequentially on this pipe. The filter 9 is used to remove impurities in the medium to ensure stable system operation, while the throttling expansion valve 10 is responsible for regulating the pressure and flow rate of the medium.

[0028] In this system, the input end of the DC inverter compressor 1 receives the medium from the water source heat exchanger 3 through the circulating water inlet pipe 11, while its output end returns to the system through the circulating water outlet pipe 12. A proportional regulating valve 13 is installed on this pipe to precisely control the water flow rate and temperature. In addition, the water source heat exchanger 3 is a plate heat exchanger, which can effectively transfer heat to the medium to be heated, and then send the medium back to the DC inverter compressor 1 through pipe 14, forming a complete circulating heating system.

[0029] Of particular note is that the high-temperature gas generated by the DC inverter compressor 1 is directly delivered to the PCB circuit board electroplating line 7 via the fan 5 and pipe 6, ensuring effective drying of the PCB circuit boards. Simultaneously, the DC inverter controller adjusts the operating frequency of the DC inverter compressor 1 according to a preset temperature value, thereby maintaining the required drying temperature and improving the automation level and energy efficiency of the entire system.

[0030] In summary, by optimizing component configuration (such as using a toothed plate heat exchanger as a condenser heat exchanger 2 and a plate heat exchanger as a water source heat exchanger 3) and introducing key control components (such as a filter 9, a throttling expansion valve 10, and a proportional regulating valve 13), this utility model not only achieves efficient and stable high-temperature drying function, but also significantly reduces energy consumption and safety risks, making it suitable for the high-temperature drying requirements in modern PCB manufacturing processes.

[0031] Working principle: The medium is compressed by the DC inverter compressor 1. The high temperature and high pressure gas is connected to the condenser heat exchanger 2 through the pipeline to dissipate heat. Then it flows back to the water source heat exchanger 3 through the throttling expansion valve 10. The heat exchange medium is heated by the water source heat exchanger 3 and then flows to the DC inverter compressor 1 to achieve the purpose of circulating heating.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-temperature drying apparatus for electroplating PCB circuit boards, characterized in that: The device includes a DC inverter compressor (1), a condenser heat exchanger (2), and a water source heat exchanger (3). The DC inverter compressor (1) is connected to the condenser heat exchanger (2) through a high-temperature and high-pressure pipe (4) at its output end. The output end of the condenser heat exchanger (2) is connected to the water source heat exchanger (3) through a pipe (8). A filter (9) and a throttling expansion valve (10) are sequentially installed on the pipe (8) between the condenser heat exchanger (2) and the water source heat exchanger (3). The input end of the DC inverter compressor (1) is connected to a circulating water inlet pipe (11), and the output end of the DC inverter compressor (1) is connected to a circulating water outlet pipe (12). A proportional regulating valve (13) is installed on the circulating water outlet pipe (12).

2. The high-temperature drying device for PCB circuit board electroplating according to claim 1, characterized in that: The output end of the water source heat exchanger (3) is connected to the input of the DC inverter compressor (1) through pipe three (14).

3. The high-temperature drying device for PCB circuit board electroplating according to claim 1, characterized in that: It also includes a DC inverter controller for controlling the frequency of the DC inverter compressor (1), which monitors the set temperature to keep the frequency of the DC inverter compressor (1) constant so that the temperature is maintained at the required temperature.

4. The high-temperature drying device for PCB circuit board electroplating according to claim 1, characterized in that: The high-temperature gas produced by the DC inverter compressor (1) is transported to the PCB circuit board electroplating production line (7) through the fan (5) and the second pipeline (6).

5. The high-temperature drying device for PCB circuit board electroplating according to claim 1, characterized in that: The condenser heat exchanger (2) is a toothed plate heat exchanger.

6. The high temperature drying device for PCB circuit board electroplating according to claim 1, characterized in that: The water source heat exchanger (3) is a plate heat exchanger.

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