Rapid cooling and shaping device for low-temperature sintering conductive ceramic

Abstract

The utility model discloses a rapid cooling and shaping device for low-temperature sintering conductive ceramics, and relates to the technical field of conductive ceramic production, a low-temperature sintering furnace is arranged at the upper part of a bracket, and a tray for bearing the conductive ceramics is placed in a hearth. A vacuumizing module and a cooling module are mounted in the equipment bracket, and the vacuumizing module can vacuumize the hearth after sintering, so that the hearth is in a vacuum state; the cooling module can provide liquid nitrogen for the vacuum hearth, and point-to-point cooling is achieved. The bottom of the tray is hollowed out and provided with supporting rods for supporting ceramics, and guide rails on two sides are matched with hearth guide grooves, so that pushing and pulling are convenient. In addition, the furnace top is provided with a vacuum sensor and a temperature sensor for real-time monitoring, and a pressure equalizing module balances internal and external pressures of the furnace. The vacuum environment and liquid nitrogen cooling complement each other, so that the device can quickly and uniformly cool the conductive ceramic, reduce defects and improve the product quality and performance, and is suitable for large-scale production.

Description

Technical Field

[0001] This utility model relates to the field of conductive ceramic production technology, specifically to a rapid cooling and shaping device for low-temperature sintered conductive ceramics. Background Technology

[0002] The preparation process of conductive ceramics is relatively complex, with low-temperature sintering and cooling / shaping playing crucial roles in the performance and quality of the final product. In the low-temperature sintering process, the conductive ceramic blank needs to be sintered under specific temperature and time conditions to allow the internal particles to bond together and achieve the desired physical and chemical properties. However, the sintered conductive ceramic is at a relatively high temperature. If the cooling rate is too fast or uneven, it can lead to internal thermal stress, causing defects such as cracks and deformation, severely affecting the conductivity, mechanical strength, and reliability of the conductive ceramic.

[0003] Traditional cooling methods for conductive ceramics mainly employ natural cooling or slow air cooling. Natural cooling involves placing the sintered conductive ceramic in the air to allow it to dissipate heat naturally. This method is extremely slow, resulting in low production efficiency and failing to meet the demands of large-scale production. Slow air cooling accelerates cooling by blowing air onto the conductive ceramic using a fan, but the cooling rate remains slow, and it is difficult to ensure uniform cooling, which can easily lead to excessive temperature gradients within the conductive ceramic and generate thermal stress. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a rapid cooling and shaping device for low-temperature sintered conductive ceramics, solving the problems mentioned in the background section.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a rapid cooling and shaping device for low-temperature sintered conductive ceramics, comprising a support frame, a low-temperature sintering furnace mounted on the upper part of the support frame, a tray disposed in the furnace chamber of the low-temperature sintering furnace, and several conductive ceramics located in the tray. A vacuum module and a cooling module are respectively installed inside the support frame. The vacuum module can create a vacuum state inside the furnace chamber after the conductive ceramics are sintered in the low-temperature sintering furnace; the cooling module can supply liquid nitrogen to the vacuum furnace chamber to help the conductive ceramics in the furnace chamber cool and shape rapidly.

[0006] Furthermore, the vacuum module includes a vacuum pump installed inside the equipment support, the vacuum pump's suction port is connected to a vacuum tube, the suction port of the vacuum tube extends from the top of the low-temperature sintering furnace into the furnace chamber, and a solenoid valve is installed in a section of the vacuum tube.

[0007] Furthermore, the cooling module includes a liquid nitrogen storage tank installed inside the equipment support. The liquid nitrogen outlet of the liquid nitrogen storage tank is connected to a liquid nitrogen delivery pipe. The liquid nitrogen outlet of the liquid nitrogen delivery pipe extends from the top of the low-temperature sintering furnace into the furnace chamber and is connected to a distribution network. The distribution network has multiple nodes, and each node is equipped with a nozzle. The nozzle corresponds to the position of each conductive ceramic. A second solenoid valve is installed in the section of the liquid nitrogen delivery pipe, and a replenishment connector is provided at the top of the liquid nitrogen storage tank.

[0008] Furthermore, the tray includes a frame with a hollow bottom, and several support rods are connected to the bottom of the frame to support several conductive ceramics; guide rails are installed on both sides of the bottom of the frame, and guide grooves are installed on both sides of the bottom of the furnace, and the guide rails slide inside the guide grooves; handles are installed on the edges of the frame.

[0009] Furthermore, a vacuum sensor and a temperature sensor are respectively installed on the top of the low-temperature sintering furnace. The detection ends of the vacuum sensor and the temperature sensor extend into the furnace chamber to monitor the pressure and temperature inside the furnace chamber in real time and feed them back to the background system.

[0010] Furthermore, a pressure equalization module is installed on the top of the low-temperature sintering furnace. The pressure equalization module includes an air inlet pipe that communicates with the furnace chamber. A solenoid valve is installed in a section of the air inlet pipe, and a filter is installed at the air inlet of the air inlet pipe.

[0011] Furthermore, the nozzles on multiple nodes of the diversion network are evenly distributed to ensure that the liquid nitrogen can fully contact the corresponding conductive ceramic after release, thereby achieving point-to-point uniform cooling.

[0012] This invention provides a rapid cooling and shaping device for low-temperature sintered conductive ceramics. Compared with the prior art, it has the following advantages:

[0013] This rapid cooling and shaping device for low-temperature sintered conductive ceramics operates in a vacuum environment. Air is removed from the furnace, creating a low-pressure state. This not only reduces heat exchange interference between the conductive ceramics and air during cooling but also prevents contamination of the ceramics by air impurities. When liquid nitrogen is injected into the vacuum furnace, its low resistance allows it to rapidly and evenly diffuse throughout the furnace space, ensuring full contact with each conductive ceramic piece. This synergistic effect significantly enhances the cooling efficiency of the liquid nitrogen, quickly removing heat from the conductive ceramics and achieving rapid and uniform cooling and shaping. This effectively avoids thermal stress problems caused by uneven cooling, significantly improving the quality and performance of the conductive ceramic products. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present utility model;

[0015] Figure 2 This is a schematic diagram of the vacuum module in this utility model;

[0016] Figure 3 This is a schematic diagram of the cooling module in this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the tray in this utility model;

[0018] Figure 5 This is a front view of the present invention.

[0019] In the diagram: 1. Equipment support frame; 2. Low-temperature sintering furnace; 3. Vacuum pump module; 31. Vacuum pump; 32. Vacuum pipe; 33. Solenoid valve one; 4. Cooling module; 41. Liquid nitrogen storage tank; 411. Supply connector; 42. Liquid nitrogen delivery pipe; 43. Diversion network; 44. Nozzle; 45. Solenoid valve two; 5. Tray; 51. Frame body; 52. Support rod; 53. Guide rail; 54. Guide groove; 55. Handle; 6. Vacuum sensor; 7. Temperature sensor; 8. Pressure equalization module; 81. Air inlet pipe; 82. Solenoid valve three; 83. Filter; 9. Conductive ceramic. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-5 This utility model provides a technical solution: a rapid cooling and shaping device for low-temperature sintered conductive ceramics, including an equipment support 1 and a low-temperature sintering furnace 2 installed on the upper part of the equipment support 1. The low-temperature sintering furnace 2 adopts existing technology. The specific structure and how to perform low-temperature sintering of conductive ceramics are not shown here. A tray 5 is provided in the furnace chamber of the low-temperature sintering furnace 2, and several conductive ceramics are located in the tray 5. A vacuum module 3 and a cooling module 4 are respectively installed inside the equipment support 1. The vacuum module 3 can make the furnace chamber of the low-temperature sintering furnace 2 into a vacuum state after the conductive ceramics are sintered in the low-temperature sintering furnace 2. The cooling module 4 can provide liquid nitrogen to the vacuum furnace chamber, thereby helping the conductive ceramics in the furnace chamber to cool and shape rapidly.

[0022] The vacuum module 3 includes a vacuum pump 31 installed inside the equipment bracket 1. The air extraction port of the vacuum pump 31 is connected to a vacuum tube 32. The air extraction port of the vacuum tube 32 extends from the top of the low-temperature sintering furnace 2 into the furnace chamber. A solenoid valve 33 is installed in the section of the vacuum tube 32.

[0023] The cooling module 4 includes a liquid nitrogen storage tank 41 installed inside the equipment support 1. The liquid nitrogen outlet of the liquid nitrogen storage tank 41 is connected to a liquid nitrogen delivery pipe 42. The liquid nitrogen outlet of the liquid nitrogen delivery pipe 42 extends from the top of the low-temperature sintering furnace 2 into the furnace chamber and is connected to a distribution network 43. The distribution network 43 has multiple nodes, and a nozzle 44 is installed at each node. The nozzle 44 corresponds to the position of each conductive ceramic, so that the liquid nitrogen can contact the corresponding conductive ceramic after being released, thereby achieving point-to-point cooling. A solenoid valve 45 is installed in the section of the liquid nitrogen delivery pipe 42. A replenishment connector 411 is provided at the top of the liquid nitrogen storage tank 41. When the liquid nitrogen in the liquid nitrogen storage tank 41 is used up, a liquid nitrogen replenishment pipe can be connected to the replenishment connector 411.

[0024] The tray 5 includes a frame 51 with a hollow bottom. Several support rods 52 are connected to the bottom of the frame 51. The support rods 52 can support several conductive ceramics. Guide rails 53 are installed on both sides of the bottom of the frame 51. Guide grooves 54 are installed on both sides of the bottom of the furnace. The guide rails 53 slide inside the guide grooves 54. Handles 55 are installed on the edge of the frame 51 to facilitate push, pull and pick up by the staff.

[0025] Vacuum sensor 6 and temperature sensor 7 are respectively installed on the top of the low-temperature sintering furnace 2. The detection ends of vacuum sensor 6 and temperature sensor 7 extend into the furnace chamber, which can monitor the pressure and temperature in the furnace chamber in real time and feed back to the background system. This is a known technology and will not be described in detail here.

[0026] The top of the low-temperature sintering furnace 2 is equipped with a pressure equalization module 8. The pressure equalization module 8 includes an air inlet pipe 81 that is connected to the furnace chamber. A solenoid valve 82 is installed in a section of the air inlet pipe 81, and a filter 83 is installed at the air inlet of the air inlet pipe 81.

[0027] During operation, the device first needs to push the tray 5 carrying several conductive ceramics 9 into the furnace chamber of the low-temperature sintering furnace 2. During the pushing process, it is necessary to ensure that the guide rail 53 is located in the guide groove 54. After pushing in, the furnace door of the low-temperature sintering furnace 2 is closed, and then the several conductive ceramics 9 in the furnace chamber are sintered through the low-temperature sintering furnace 2.

[0028] After sintering, the conductive ceramic 9 needs to be cooled and shaped. So, first open the solenoid valve 33, then turn on the vacuum pump 31. The negative pressure generated by the vacuum pump 31 will pump out the gas in the furnace through the vacuum tube 32 and put it in a vacuum state. Then close the solenoid valve 33.

[0029] Next, open solenoid valve 45. At this time, the furnace is in a vacuum negative pressure state. So, by slowly opening solenoid valve 45, the flow rate of liquid nitrogen per unit time can be controlled by controlling the opening degree of solenoid valve 45. At the beginning, the opening degree of solenoid valve 45 is small, and the amount of liquid nitrogen in the furnace is not much. After the temperature in the furnace drops, a large amount of liquid nitrogen is supplied. The liquid nitrogen in liquid nitrogen storage tank 41 will enter the distribution network 43 through liquid nitrogen delivery pipe 42. After being distributed, the liquid nitrogen is injected into the furnace through nozzle 44, making full contact with each conductive ceramic 9 in the furnace, thereby ensuring that the conductive ceramic 9 can be cooled and shaped quickly.

[0030] After cooling and setting, close solenoid valve 45 and open solenoid valve 82 to allow external air to enter the furnace through air inlet pipe 81 to equalize the pressure inside and outside the furnace. Before entering, the external air will be filtered by filter 83 to ensure that the air entering the furnace is clean. Finally, open the furnace door and pull out tray 5 and conductive ceramic 9.

[0031] It should be noted that during the liquid nitrogen injection process, the flow rate and injection speed of the liquid nitrogen need to be controlled. The supply of liquid nitrogen should be adjusted according to the characteristics of the product and the cooling requirements in order to achieve the ideal cooling rate.

[0032] Vacuum cooling and liquid nitrogen cooling each have unique cooling mechanisms, and combining the two can fully leverage their advantages. The vacuum environment reduces the obstacles to heat transfer, while liquid nitrogen cooling provides extremely low temperatures, which significantly accelerates the cooling rate of the product and greatly enhances the cooling effect, allowing conductive ceramic 9 to be rapidly cooled to a lower temperature.

Claims

1. A rapid cooling and shaping device for low-temperature sintered conductive ceramics, comprising a support frame (1), a low-temperature sintering furnace (2) mounted on the upper part of the support frame (1), a tray (5) disposed in the furnace chamber of the low-temperature sintering furnace (2), and a plurality of conductive ceramics located in the tray (5), characterized in that, The equipment support (1) is equipped with a vacuum module (3) and a cooling module (4). The vacuum module (3) can make the furnace chamber of the low-temperature sintering furnace (2) a vacuum state after the conductive ceramic is sintered in the low-temperature sintering furnace (2). The cooling module (4) can provide liquid nitrogen to the vacuum furnace chamber to help the conductive ceramic in the furnace chamber cool and solidify quickly.

2. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 1, characterized in that, The vacuum module (3) includes a vacuum pump (31) installed inside the equipment bracket (1). The vacuum pump (31) has an exhaust port connected to a vacuum tube (32). The exhaust port of the vacuum tube (32) extends from the top of the low-temperature sintering furnace (2) into the furnace chamber. A solenoid valve (33) is installed in a section of the vacuum tube (32).

3. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 1, characterized in that, The cooling module (4) includes a liquid nitrogen storage tank (41) installed inside the equipment bracket (1). The liquid nitrogen outlet of the liquid nitrogen storage tank (41) is connected to a liquid nitrogen delivery pipe (42). The liquid nitrogen outlet of the liquid nitrogen delivery pipe (42) extends from the top of the low-temperature sintering furnace (2) into the furnace chamber and is connected to a distribution network (43). The distribution network (43) has multiple nodes, and each node is equipped with a nozzle (44). The nozzle (44) corresponds to the position of each conductive ceramic. A solenoid valve (45) is installed in the section of the liquid nitrogen delivery pipe (42). A supply connector (411) is provided on the top of the liquid nitrogen storage tank (41).

4. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 1, characterized in that, The tray (5) includes a frame (51) with a hollow bottom. Several support rods (52) are connected to the bottom of the frame (51). The support rods (52) are used to support several conductive ceramics. Guide rails (53) are installed on both sides of the bottom of the frame (51). Guide grooves (54) are installed on both sides of the bottom of the furnace. The guide rails (53) slide inside the guide grooves (54). Handles (55) are installed on the edge of the frame (51).

5. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 1, characterized in that, The top of the low-temperature sintering furnace (2) is equipped with a vacuum sensor (6) and a temperature sensor (7). The detection ends of the vacuum sensor (6) and the temperature sensor (7) extend into the furnace chamber to monitor the pressure and temperature inside the furnace chamber in real time and feed them back to the background system.

6. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 1, characterized in that, The top of the low-temperature sintering furnace (2) is equipped with a pressure equalization module (8), which includes an air inlet pipe (81) connected to the furnace chamber. A solenoid valve (82) is installed in a section of the air inlet pipe (81), and a filter (83) is installed at the air inlet of the air inlet pipe (81).

7. The rapid cooling and shaping device for low-temperature sintered conductive ceramics according to claim 3, characterized in that, The nozzles (44) on multiple nodes of the diversion network (43) are evenly distributed to ensure that the liquid nitrogen can fully contact the corresponding conductive ceramic after release, so as to achieve point-to-point uniform cooling.

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