Jig and testing machine for testing three-temperature performance of DIP packaging chip
By designing a fixture for DIP packaged chips, and utilizing a pressure head assembly and test socket to achieve contact between the spring and the pins, the problem of DIP packaged chips being unable to be directly tested is solved, enabling low-cost three-temperature performance testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-04-14
AI Technical Summary
In the existing technology, DIP packaged chips cannot be directly installed on a test bench for three-temperature performance testing, and modifying the test bench is costly and may affect the testing of other chips.
Design a fixture for DIP packaged chips, including a pressure head assembly and a test socket. The intermediate transmission component is driven by the movement of the pressure head assembly and the downward pressure column group to make the spring contact the chip pins, thereby realizing the three-temperature performance test of the chip.
It achieves three-temperature performance testing of DIP packaged chips without requiring modification of the testing equipment, reducing costs, and without affecting the testing of other chips.
Smart Images
Figure CN224122620U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of DIP packaged chip manufacturing technology, and in particular to a fixture and testing machine for testing the three-temperature performance of DIP packaged chips. Background Technology
[0002] During testing, the chip is placed on a testing machine and then tested. The testing process involves contacting the chip's pins with a contact spring to achieve three-temperature performance testing.
[0003] However, DIP-packaged chips cannot be directly mounted on a testing machine for testing. To facilitate the placement of DIP-packaged chips in a testing machine, modifications are required, such as adding solenoid valves and cylinders. This necessitates adding power components and other electronic components to the testing machine, increasing costs and potentially affecting the testing of other chips. Therefore, a fixture that can be mounted on the testing machine is needed. During testing, the DIP-packaged chip can be placed in this fixture without affecting the rest of the testing machine's structure, allowing the testing machine to be used for testing different chips. Utility Model Content
[0004] Therefore, the technical problem to be solved by this utility model is to overcome the above-mentioned problems existing in the prior art.
[0005] To solve the above-mentioned technical problems, this utility model provides a fixture and testing machine for three-temperature performance testing of DIP packaged chips, comprising:
[0006] The pressure head assembly moves up and down; the pressure head assembly includes a pressure head body, a chip pickup component, and two sets of downward pressure posts; the chip pickup component is connected to the middle position of the pressure head body and is used to pick up the DIP packaged chip to be tested; the two sets of downward pressure posts are located at the bottom of the pressure head body and are symmetrically arranged on both sides of the chip pickup component.
[0007] The test socket is located below the pressure head assembly. The test socket includes a test socket body, a mounting base, and two contact components. The top of the test socket body has a mounting chamber. The mounting base is located within the mounting chamber. The top of the mounting base has a positioning slot for placing the DIP packaged chip under test, located directly below the chip pickup component. The two contact components are located within the mounting chamber and symmetrically positioned on both sides of the mounting base. Each contact component includes an intermediate transmission component and a spring inside the intermediate transmission component. The intermediate transmission component is located directly below the lower pressure post assembly.
[0008] The pressure head assembly moves up and down, and the chip pickup component is configured to place the DIP packaged chip under test in the positioning slot; at the same time, the pressure column group moves down to drive the intermediate transmission component to move toward the mounting base in the mounting chamber until the intermediate transmission component abuts against the spring and contacts the pin.
[0009] In one embodiment of the present invention, the intermediate transmission component includes a first wedge block and a second wedge block that cooperates with the first wedge block; the first wedge block moves up and down in the mounting chamber, and the lower pressure column assembly is connected to the top of the first wedge block; the second wedge block is located between the first wedge block and the spring sheet; the second wedge block translates towards the mounting base in the mounting chamber to drive the spring sheet to deform so that the spring sheet contacts the pin.
[0010] In one embodiment of the present invention, the test socket body is further provided with a first guide groove and a second guide groove; the first wedge block moves up and down in the first guide groove; and the second wedge block moves horizontally in the second guide groove.
[0011] In one embodiment of this utility model, the chip pickup component includes an adsorption head and two claws; the two claws are symmetrically arranged on both sides of the adsorption head; and the claws correspond to the side of the DIP packaged chip under test that has pins; a vent hole is provided in the middle of the pressure head body, and the vent hole is connected to the adsorption head.
[0012] In one embodiment of this utility model, the pressure column assembly includes two pressure columns spaced apart.
[0013] In one embodiment of this utility model, the pressure head assembly is provided with a pressure plate hole and a connecting hole that are interconnected from top to bottom; a pressure plate is installed in the pressure plate hole; the lower pressure column slides up and down in the connecting hole; a spring is installed in the connecting hole, and the spring is connected between the pressure plate and the lower pressure column.
[0014] In one embodiment of this utility model, the bottom end of the spring is fixedly connected to the test socket body, and the top end is located in the mounting chamber; the intermediate transmission component drives the top end of the spring to approach the pin until the top end of the spring contacts the pin.
[0015] In one embodiment of the present invention, a protrusion is provided on the side of the second wedge block near the mounting base; the pressure head assembly presses down so that the protrusion abuts against the top of the spring sheet.
[0016] In one embodiment of this utility model, the spring includes a spring body and a plurality of spring heads connected to one end of the spring body; one end of the spring body is fixedly connected to the test socket body, and the plurality of spring heads are spaced apart and connected to the other end of the spring body, with each spring head corresponding to a pin.
[0017] On the other hand, this utility model also provides a testing machine, comprising:
[0018] The testing machine body includes a floating head that can move up and down;
[0019] In any of the above embodiments, the fixture for testing the three-temperature performance of DIP packaged chips has a pressure head assembly connected to the bottom of a floating head; a docking plate connected to the test machine body and disposed between the pressure head assembly and the test socket; the docking plate has a through hole; and a chip pickup component extends into the mounting chamber through the through hole.
[0020] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:
[0021] The fixture and testing machine for three-temperature performance testing of DIP packaged chips described in this utility model are equipped with a mounting base for placing the DIP packaged chip under test. The pressure head assembly of this application moves with the floating head of the original testing machine to pick up the DIP packaged chip under test, and then presses down with the floating head to place the DIP packaged chip under test into the positioning slot. Simultaneously, during the pressing process, the pressure column group drives the intermediate transmission component to move and abut against the outside of the spring contactor, bringing it closer to the mounting base until the DIP packaged chip under test is placed in the positioning slot, at which point the head of the spring contactor contacts the pins. When using this application to test DIP packaged chips, only the fixture needs to be installed on the testing machine body; when testing other chips, the fixture can be removed. Therefore, this application does not require modification of the original testing machine, is low-cost, and does not affect the testing of other chips. Attached Figure Description
[0022] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein:
[0023] Figure 1 This is a schematic diagram of the structure of a fixture and mating plate for testing the three-temperature performance of DIP packaged chips in a preferred embodiment of this utility model;
[0024] Figure 2 yes Figure 1 A diagram from another perspective;
[0025] Figure 3 yes Figure 1 Schematic diagram of the intermediate pressure head assembly;
[0026] Figure 4 yes Figure 3 A diagram from another perspective;
[0027] Figure 5 yes Figure 3 Top view;
[0028] Figure 6 yes Figure 5 AA section view;
[0029] Figure 7 yes Figure 1 A schematic diagram of the structure of the test socket, the DIP packaged chip under test, and the chip pickup component;
[0030] Figure 8 yes Figure 7 The main view;
[0031] Figure 9 yes Figure 7 Top view;
[0032] Figure 10 yes Figure 9 BB cross-sectional view;
[0033] Figure 11 yes Figure 9 CC section view;
[0034] Figure 12 yes Figure 1 Schematic diagram of the middle connecting plate;
[0035] Explanation of reference numerals in the accompanying drawings: 100, pressure head assembly; 110, pressure head body; 111, vent hole; 120, chip pickup component; 121, suction head; 122, gripper; 130, lower pressure column assembly; 131, lower pressure column; 140, pressure plate hole; 150, connecting hole; 151, first through hole; 152, second through hole; 160, pressure plate; 170, spring;
[0036] 200. Test socket; 210. Test socket body; 211. Mounting chamber; 212. First guide groove; 213. Second guide groove; 220. Mounting base; 221. Positioning groove; 230. Spring piece; 251. Protrusion; 240. First wedge block; 250. Second wedge block;
[0037] 300. Connecting plate; 310. Through hole;
[0038] 400, DIP packaged chip under test; 410, pin. Detailed Implementation
[0039] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.
[0040] Reference Figures 1-12 As shown, this embodiment of the present invention provides a testing machine, including a testing machine body, a fixture for three-temperature performance testing of DIP packaged chips, and a docking plate. The testing machine body includes a floating head (not shown in the figure) that can move up and down.
[0041] A fixture for three-temperature performance testing of DIP packaged chips includes a pressure head assembly 100 and a test socket 200. The pressure head assembly 100 moves vertically; the pressure head assembly 100 is connected to the bottom of a floating head, and includes a pressure head body 110, a chip pickup component 120, and two sets of downward pressure posts 130. The chip pickup component 120 is connected to the middle position of the pressure head body 110 and is used to pick up the DIP packaged chip 400 under test; the two sets of downward pressure posts 130 are located at the bottom of the pressure head body 110 and are symmetrically arranged on both sides of the chip pickup component 120. The test socket 200 is located below the pressure head assembly 100.
[0042] The test socket 200 includes a test socket body 210, a mounting base 220, and two contact components. The test socket body 210 has a mounting chamber 211 on its top. The mounting base 220 is located within the mounting chamber 211. The top of the mounting base 220 has a positioning groove 221 for placing the DIP packaged chip 400 under test, located directly below the chip pickup component 120. The two contact components are located in the mounting chamber 211 and symmetrically arranged on both sides of the mounting base 220. Each contact component includes an intermediate transmission component and a spring contact 230 located inside the intermediate transmission component. The intermediate transmission component is located below the pressure post assembly 130. The pins 410 of the DIP packaged chip 400 under test, placed in the positioning groove 221, are located inside the spring contact 230.
[0043] The mating plate 300 is connected to the test machine body and is located between the pressure head assembly 100 and the test socket 200. The mating plate 300 has a through hole 310; the chip pickup component 120 extends into the mounting chamber 211 through the through hole 310.
[0044] The pressure head assembly 100 moves up and down, and the chip pickup component 120 is configured to place the DIP packaged chip 400 under test into the positioning slot 221. At the same time, the pressure column assembly 130 moves downward, driving the intermediate transmission component to move toward the mounting base 220 in the mounting chamber 211 until the intermediate transmission component abuts against the spring 230 and contacts the pin 410.
[0045] Specifically, this embodiment provides a mounting base 220 for placing the DIP packaged chip 400 under test. The pressure head assembly 100 of this application moves with the floating head of the original testing machine to pick up the DIP packaged chip 400 under test, and then presses down with the floating head to place the DIP packaged chip 400 under test into the positioning slot 221. Simultaneously, during the pressing process, the pressing column assembly 130 drives the intermediate transmission component to move and abut against the outside of the spring piece 230, bringing it closer to the mounting base 220 until the DIP packaged chip 400 under test is placed in the positioning slot 221, at which point the head of the spring piece 230 contacts the pin 410. When using this application to test DIP packaged chips, only the fixture needs to be installed on the testing machine body; when testing other chips, the fixture can be removed. Therefore, this application does not require modification of the original testing machine, is low-cost, and does not affect the testing of other chips.
[0046] Further, the intermediate transmission component includes a first wedge block 240 and a second wedge block 250 that cooperates with the first wedge block 240. The first wedge block 240 moves up and down in the mounting chamber 211, and the pressing column assembly 130 is connected to the top of the first wedge block 240; the second wedge block 250 is located between the first wedge block 240 and the spring piece 230; the second wedge block 250 translates towards the mounting base 220 in the mounting chamber 211 to drive the spring piece 230 to deform so that the spring piece 230 contacts the pin 410. Specifically, in this embodiment, the pressing movement is converted into the movement of the second wedge block 250 through the cooperation of the first wedge block 240 and the second wedge block 250, thereby driving the spring piece 230 to deform and contact the pin 410.
[0047] Furthermore, the test socket body 210 is also provided with a first guide groove 212 and a second guide groove 213; the first wedge block 240 moves up and down in the first guide groove 212; and the second wedge block 250 moves horizontally in the second guide groove 213. Specifically, this embodiment provides a first guide groove 212 and a second guide groove 213, which can guide the movement of the first wedge block 240 and the second wedge block 250, making the operation more stable. The structure is simple and the operation is stable and reliable.
[0048] Furthermore, the chip pickup component 120 includes an adsorption head 121 and two claws 122. The two claws 122 are symmetrically arranged on both sides of the adsorption head 121; the claws 122 correspond to the side of the DIP packaged chip 400 under test that has pins 410. A vent hole 111 is provided in the middle of the pressure head body 110, and the vent hole 111 is connected to the adsorption head 121. Specifically, in this embodiment, the DIP packaged chip 400 under test is picked up by the adsorption head 121. After the DIP packaged chip 400 under test is placed in the positioning slot 221, in order to avoid the difference in the spacing between the pins 410 on both sides and the spring contact 230 being too large, causing one side of the pins 410 to quickly contact the spring contact 230 while the other side of the pins 410 does not contact the spring contact 230, resulting in test failure. Therefore, when the adsorption head 121 adsorbs the DIP packaged chip 400 to be tested, the gripper 122 limits the position of the DIP packaged chip 400 to be tested, thereby ensuring the consistency of the position of each DIP packaged chip 400 to be tested in the positioning groove 221, and further ensuring the smooth progress of the test.
[0049] Furthermore, the pressure column assembly 130 includes two spaced-apart pressure columns 131. The pressure head assembly 100 has interconnected pressure plate holes 140 and connecting holes 150 from top to bottom; a pressure plate 160 is installed in the pressure plate hole 140. The pressure columns 131 slide up and down in the connecting holes 150; a spring 170 is installed in the connecting holes 150, and the spring 170 connects the pressure plate 160 and the pressure columns 131. The pressure column 131 includes a head and a rod, the head being larger than the rod; the connecting holes 150 include a first through hole 151 and a second through hole 152 interconnected from top to bottom; the head is slidably connected in the first through hole 151, the top of the head has a groove, and the bottom of the spring 170 is located in the groove; the rod is slidably connected in the second through hole 152. Specifically, this embodiment has a simple structure, runs smoothly and reliably, and can ensure that the spring 230 contacts the pin 410 while the DIP packaged chip 400 under test is placed in the positioning slot 221.
[0050] Furthermore, the bottom end of the spring piece 230 is fixedly connected to the test socket body 210, and the top end is located in the mounting chamber 211; the intermediate transmission component drives the top end of the spring piece 230 to approach the pin 410 until the top end of the spring piece 230 contacts the pin 410. Specifically, in this embodiment, the top end of the spring piece 230 is deformed by the intermediate transmission component, thereby contacting the pin 410. The structural connection is stable and reliable, and the deformation of the spring piece 230 ensures that the spring piece 230 remains in contact with the pin 410 under the action of the intermediate transmission component during the test. After the test is completed, the intermediate transmission component moves away from the mounting base 220, and the spring piece 230 returns to its initial state under its own elastic deformation, thereby separating from the pin 410.
[0051] Furthermore, a protrusion 251 is provided on the side of the second wedge block 250 near the mounting base 220; the pressure head assembly 100 presses down so that the protrusion 251 abuts against the top of one side of the spring piece 230. Specifically, the protrusion 251 provided in this embodiment can quickly deform the head of the spring piece to contact the pin 410, and the structure is simple and reliable.
[0052] Furthermore, the spring contact 230 includes a spring contact body and multiple spring contact heads connected to one end of the spring contact body; one end of the spring contact body is fixedly connected to the test socket body 210, and the multiple spring contact heads are spaced apart and connected to the other end of the spring contact body, with each spring contact head corresponding to a pin 410. Specifically, because the DIP packaged chip 400 under test has pins 410 on both sides, and multiple pins 410 are spaced apart on each side of the DIP packaged chip 400 under test, this application provides multiple spring contact heads that correspond one-to-one with each pin 410, thereby ensuring that each pin 410 is in contact with the spring contact 230, ensuring the smooth progress of the test and the accuracy of the test results.
[0053] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A fixture for testing the three-temperature performance of DIP packaged chips, characterized in that: include: The pressure head assembly moves up and down; the pressure head assembly includes a pressure head body, a chip pickup component, and two sets of downward pressure posts; the chip pickup component is connected to the middle position of the pressure head body and is used to pick up the DIP packaged chip to be tested; the two sets of downward pressure posts are located at the bottom of the pressure head body and are symmetrically arranged on both sides of the chip pickup component; A test socket is located below the pressure head assembly. The test socket includes a test socket body, a mounting base, and two contact components. The top of the test socket body has a mounting chamber. The mounting base is located in the mounting chamber. The top of the mounting base has a positioning groove for placing the DIP packaged chip under test, and the positioning groove is located directly below the chip pickup component. The two contact components are located in the mounting chamber and symmetrically arranged on both sides of the mounting base. Each contact component includes an intermediate transmission component and a spring piece located inside the intermediate transmission component. The intermediate transmission component is located directly below the lower pressure post assembly. The pressure head assembly moves up and down, and the chip pickup component is configured to place the DIP packaged chip under test in the positioning slot; at the same time, the downward pressure column group moves downward to drive the intermediate transmission component to move toward the mounting base in the mounting chamber until the intermediate transmission component abuts against the spring and contacts the pin.
2. The fixture for three-temperature performance testing of DIP packaged chips according to claim 1, characterized in that: The intermediate transmission component includes a first wedge block and a second wedge block that cooperates with the first wedge block; the first wedge block moves up and down in the mounting chamber, and the pressure column assembly is connected to the top of the first wedge block; the second wedge block is located between the first wedge block and the spring sheet; the second wedge block translates towards the mounting base in the mounting chamber to drive the spring sheet to deform so that the spring sheet contacts the pin.
3. The fixture for three-temperature performance testing of DIP packaged chips according to claim 2, characterized in that: The test socket body is also provided with a first guide groove and a second guide groove; the first wedge block moves up and down in the first guide groove; the second wedge block moves horizontally in the second guide groove.
4. The fixture for three-temperature performance testing of DIP packaged chips according to claim 2, characterized in that: The second wedge block has a protrusion on the side near the mounting base; the pressure head assembly presses down so that the protrusion abuts against the top of the spring sheet.
5. The fixture for three-temperature performance testing of DIP packaged chips according to claim 1, characterized in that: The chip pickup component includes an adsorption head and two claws; the two claws are symmetrically arranged on both sides of the adsorption head; and the claws correspond to the side of the DIP packaged chip under test that has pins; the pressure head body has a vent hole in the middle, and the vent hole is connected to the adsorption head.
6. The fixture for three-temperature performance testing of DIP packaged chips according to claim 1, characterized in that: The pressure column assembly includes two pressure columns spaced apart.
7. The fixture for three-temperature performance testing of DIP packaged chips according to claim 6, characterized in that: The pressure head assembly has interconnected pressure plate holes and connecting holes from top to bottom; a pressure plate is installed in the pressure plate hole; the lower pressure column slides up and down in the connecting hole; a spring is installed in the connecting hole, and the spring is connected between the pressure plate and the lower pressure column.
8. The fixture for three-temperature performance testing of DIP packaged chips according to claim 1, characterized in that: The bottom end of the spring is fixedly connected to the test socket body, and the top end is located in the mounting chamber; the intermediate transmission component drives the top end of the spring to approach the pin until the top end of the spring contacts the pin.
9. The fixture for three-temperature performance testing of DIP packaged chips according to claim 1, characterized in that: The spring includes a spring body and a plurality of spring heads connected to one end of the spring body; one end of the spring body is fixedly connected to the test socket body, and the plurality of spring heads are spaced apart and connected to the other end of the spring body, with each spring head corresponding to a pin.
10. A testing machine, characterized in that: include: The testing machine body includes a floating head that can move up and down; The fixture for three-temperature performance testing of DIP packaged chips according to any one of claims 1 to 9, wherein the pressure head assembly is connected to the bottom of the floating head; a docking plate is connected to the test machine body and disposed between the pressure head assembly and the test socket; the docking plate is provided with a through hole; and the chip pickup component extends into the mounting chamber through the through hole.