Vertical developing equipment for circuit board production

By introducing a height-adjustable conveyor mechanism and a dust extraction device into the developing equipment, the problem of inconsistent coating effects on circuit boards of different thicknesses was solved, achieving uniform coating and resource conservation, and improving developing quality and processing efficiency.

CN224122888UActive Publication Date: 2026-04-14BOLUO COUNTY TENGJIN CIRCUIT BOARD FACTORY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-05-30
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

The coating mechanism of existing developing equipment is fixed and cannot adapt to circuit boards of different thicknesses, resulting in differences in coating effect and affecting the developing quality.

Method used

A height-adjustable conveying mechanism is adopted, and the height of the collection plate is adjusted by sliding on the guide column via a hydraulic rod to ensure that the circuit board is in contact with the coating mechanism. The surface of the circuit board is cleaned by a dust collection device and a capture mechanism, and the developing solution is collected by a V-shaped groove to achieve uniform coating and resource conservation.

Benefits of technology

It improves the quality of development, ensures consistent coating effects for circuit boards of different thicknesses, reduces resource waste and pollution, and improves processing efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224122888U_ABST
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Abstract

The utility model relates to vertical developing equipment for circuit board production, which comprises developing equipment, dust collection equipment is mounted in the developing equipment, the input end of the dust collection equipment is communicated with a capturing mechanism, and the outer side of the capturing mechanism is fixedly connected with the developing equipment; a plurality of groups of vertically arranged guide columns are mounted in the developing equipment, a sliding plate is slidably connected to the outer sides of the guide columns, a collecting plate is fixedly connected to one side of the sliding plate, baffles are fixedly connected to the two sides of the upper portion of the collecting plate, and a plurality of groups of guide rollers are rotatably connected to the opposite end faces of the baffles; compared with the prior art, the conveying mechanism has the advantages that the height of the conveying mechanism can be adjusted, a circuit board is placed above a guide roller, a second hydraulic rod is started to drive a collecting plate to move, and a sliding plate on the side face of the collecting plate stably and vertically adjusts the height under the action of a guide column; at the moment, the circuit board can be ensured to be in contact with a coating mechanism of developing equipment, the coating quality is ensured, and the developing quality is further ensured.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing, and in particular to a vertical developing device for circuit board manufacturing. Background Technology

[0002] Printed circuit boards (PCBs) typically refer to conductive patterns, including printed lines, printed components, or a combination of both, that are fabricated on insulating materials according to a predetermined design. The conductive patterns that provide electrical connections between components on the insulating substrate are called printed lines. PCB production requires developing equipment. A developing machine is a printing processing device that completes some or all of the developing, rinsing, coating, and drying processes in one go through a semi-automatic or fully automatic process on the exposed printing plate.

[0003] When processing circuit boards, developing equipment needs to evenly coat the surface of the circuit board with developing solution. This coating is usually done with a brush. However, in actual use, different circuit boards have different thicknesses. Multilayer circuit boards are much thicker than single-layer circuit boards. Since the coating mechanism of the developing equipment is usually fixed, the coating effect varies for circuit boards of different thicknesses, which may affect the developing quality. Therefore, a vertical developing equipment for circuit board production is proposed to address the above problems. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the main purpose of this utility model is to provide a vertical developing device for circuit board production. The second hydraulic rod is activated to drive the collecting plate to move. The sliding plate on the side of the collecting plate is stably adjusted up and down under the action of the guide column. At this time, it can ensure that the circuit board is in contact with the coating mechanism of the developing device, ensuring the coating quality, and thus ensuring the developing quality.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a vertical developing device for circuit board production, including a developing device.

[0006] The developing equipment is equipped with a dust collection device. The input end of the dust collection device is connected to a capture mechanism, and the outside of the capture mechanism is fixedly connected to the developing equipment.

[0007] The developing equipment has multiple sets of vertically arranged guide columns installed inside. A sliding plate is slidably connected to the outside of the guide columns. A collecting plate is fixedly connected to one side of the sliding plate. Baffles are fixedly connected to both sides above the collecting plate. Multiple sets of guide rollers are rotatably connected to the opposite end face of the baffles.

[0008] A vertically installed second hydraulic rod is fixedly connected to the bottom of the developing equipment, and the free end of the second hydraulic rod is fixedly connected to the collecting plate.

[0009] When processing circuit boards, developing equipment needs to evenly coat the surface of the circuit board with developing solution. This coating is typically done using a brush. However, in practice, different circuit boards have varying thicknesses; multi-layer circuit boards are significantly thicker than single-layer boards. Since the coating mechanism of the developing equipment is usually fixed, the coating effect varies depending on the thickness of the circuit board, potentially affecting the developing quality. By equipping the conveyor mechanism with an adjustable height, the circuit board is placed above the guide rollers. Activating the second hydraulic rod moves the collection plate, and the sliding plate on the side of the collection plate is stably adjusted up and down under the action of the guide column. This ensures that the circuit board contacts the coating mechanism of the developing equipment, guaranteeing coating quality and thus ensuring developing quality.

[0010] Furthermore, the surface of the collecting plate is provided with longitudinally arranged V-shaped grooves, and the transverse V-shaped grooves are arranged with one side being deeper and the other side being shallower.

[0011] Furthermore, a collection frame that is fixedly connected to the developing equipment is provided on one side below the collection plate.

[0012] The developer solution that drips from the coating can drip through the V-shaped groove on the surface of the collection plate into the collection frame below. The collection frame collects the developer solution in a centralized manner, avoiding waste and pollution.

[0013] Furthermore, the capture mechanism includes a fixed frame that is fixedly connected to the developing equipment, a first hydraulic rod that is rotatably connected inside the fixed frame, a movable plate that is rotatably connected to the other end of the first hydraulic rod, and multiple sets of suction pipes that are rotatably connected to the outside of the movable plate. One end of the suction pipe is connected to a connecting pipe, and the other end of the connecting pipe converges into a main pipe and is connected to the input end of the suction equipment.

[0014] Furthermore, a fixing plate is rotatably connected to the outside of the suction pipe via a pivot, and the outside of the fixing plate is fixedly connected to the fixing frame.

[0015] Before coating the circuit board, this device uses a dust extraction system and a capture mechanism to thoroughly treat the surface of the circuit board over a large area, cleaning away any residual impurities and ensuring a stable coating.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] By setting the conveying mechanism to be height adjustable, the circuit board is placed above the guide roller. The second hydraulic rod is activated to drive the collection plate to move. The sliding plate on the side of the collection plate is stably adjusted up and down under the action of the guide column. At this time, it can be ensured that the circuit board is in contact with the coating mechanism of the developing equipment, ensuring the coating quality and thus ensuring the developing quality.

[0018] Before coating the circuit board, this device uses a dust collection device and a capture mechanism to thoroughly treat the surface of the circuit board over a large area, cleaning away any residual impurities and ensuring a stable coating.

[0019] The developer solution that drips from the coating can drip through the V-shaped groove on the surface of the collection plate into the collection frame below. The collection frame collects the developer solution in a centralized manner, avoiding waste and pollution. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the capture mechanism structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the collecting plate structure of this utility model.

[0023] Legend: 1. Developing equipment; 2. Vacuuming equipment; 3. Capturing mechanism; 301. Fixed frame; 302. First hydraulic rod; 303. Moving plate; 304. Vacuuming pipe; 305. Fixed plate; 306. Connecting pipe; 4. Guide column; 5. Sliding plate; 6. Collection plate; 7. Second hydraulic rod; 8. Baffle; 9. Guide roller; 10. V-groove; 11. Collection frame. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Example

[0025] Vertical developing equipment used in circuit board production, such as Figure 1-3 As shown, it includes developing equipment 1.

[0026] The developing equipment 1 is equipped with a dust collection device 2. The input end of the dust collection device 2 is connected to a capture mechanism 3. The outer side of the capture mechanism 3 is fixedly connected to the developing equipment 1.

[0027] The developing equipment 1 has multiple sets of vertically arranged guide columns 4 installed inside. A sliding plate 5 is slidably connected to the outside of the guide column 4. A collecting plate 6 is fixedly connected to one side of the sliding plate 5. Baffles 8 are fixedly connected to the upper two sides of the collecting plate 6. Multiple sets of guide rollers 9 are rotatably connected to the opposite end face of the baffles 8.

[0028] The bottom of the developing equipment 1 is fixedly connected to a vertically arranged second hydraulic rod 7, and the free end of the second hydraulic rod 7 is fixedly connected to the collecting plate 6.

[0029] When processing circuit boards, the developing equipment needs to evenly coat the surface of the circuit board with developing solution. This coating is usually done with a brush. However, in actual use, different circuit boards have different thicknesses. Multilayer circuit boards are much thicker than single-layer circuit boards. The coating mechanism of the developing equipment is usually fixed. As a result, the coating effect varies for circuit boards of different thicknesses, which may affect the developing quality. By setting the conveying mechanism to be height adjustable, the circuit board is placed above the guide roller 9. The second hydraulic rod 7 is activated to move the collection plate 6. The sliding plate 5 on the side of the collection plate 6 is stably adjusted up and down under the action of the guide column 4. This ensures that the circuit board is in contact with the coating mechanism of the developing equipment 1, ensuring the coating quality and thus guaranteeing the developing quality.

[0030] The guide roller 9 is driven by a motor (not shown in the figure), and the rotation of the guide roller 9 is used for the conveying of the circuit board.

[0031] The surface of the collecting plate 6 is provided with a longitudinally arranged V-shaped groove 10, and the transverse V-shaped groove 10 is arranged with one side being deeper and the other side being shallower.

[0032] A collection frame 11, which is fixedly connected to the developing device 1, is provided on one side below the collection plate 6.

[0033] The developer solution that drips from the coating can drip through the V-shaped groove 10 on the surface of the collection plate 6 to the collection frame 11 below. The collection frame 11 can collect the developer solution in a concentrated manner, avoiding waste of resources and pollution.

[0034] Since the horizontal V-groove 10 is deeper on one side and shallower on the other, with the V-groove 10 closer to the front being the deeper side, it is convenient for the developing solution to collect inside the V-groove 10 and gradually drip into the collection frame 11 below.

[0035] The capture mechanism 3 includes a fixed frame 301 fixedly connected to the developing equipment 1, a first hydraulic rod 302 rotatably connected inside the fixed frame 301, a movable plate 303 rotatably connected to the other end of the first hydraulic rod 302, and multiple sets of suction pipes 304 rotatably connected to the outside of the movable plate 303. One end of the suction pipe 304 is connected to a connecting pipe 306, and the other end of the connecting pipe 306 converges into a main pipe and is connected to the input end of the suction equipment 2.

[0036] The outer side of the suction pipe 304 is also rotatably connected to a fixing plate 305 via a pivot, and the outer side of the fixing plate 305 is fixedly connected to the fixing frame 301.

[0037] Before coating the circuit board, this device uses a dust collection device 2 and a capture mechanism 3 to thoroughly treat the surface of the circuit board over a large area, cleaning any residual impurities on the surface of the circuit board and ensuring stable coating of the circuit board.

[0038] The airflow is driven by the vacuum cleaner 2. The air enters the connecting pipe 306 through the vacuum pipe 304 and then enters the vacuum cleaner 2. The first hydraulic rod 302 is activated to move the moving plate 303. The moving plate 303 drives the vacuum pipe 304 to rotate around the rotating part of the vacuum pipe 304 and the fixed plate 305. At this time, the vacuum pipe 304 rotates back and forth, which can expand the cleaning area of ​​the circuit board surface, realize large-area dust capture, and ensure the subsequent processing of the circuit board.

[0039] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A vertical developing apparatus for a production of a wiring board, characterized by: Including developing equipment (1). The developing equipment (1) is equipped with a dust collection device (2), and the input end of the dust collection device (2) is connected to a capture mechanism (3). The outer side of the capture mechanism (3) is fixedly connected to the developing equipment (1). The developing equipment (1) has multiple sets of vertically arranged guide columns (4) installed inside. A sliding plate (5) is slidably connected to the outside of the guide column (4). A collecting plate (6) is fixedly connected to one side of the sliding plate (5). Baffles (8) are fixedly connected to the upper two sides of the collecting plate (6). Multiple sets of guide rollers (9) are rotatably connected to the opposite end face of the baffle (8). The bottom of the developing equipment (1) is fixedly connected to a vertically arranged second hydraulic rod (7), and the free end of the second hydraulic rod (7) is fixedly connected to the collecting plate (6).

2. The vertical developing apparatus for a circuit board production according to claim 1, characterized by: The surface of the collecting plate (6) is provided with a V-shaped groove (10) arranged longitudinally, and the transverse V-shaped groove (10) is arranged with one side being deeper and the other side being shallower.

3. The vertical developing apparatus for a circuit board production according to Claim 1, characterized by: A collection frame (11) is fixedly connected to the developing equipment (1) on one side below the collection plate (6).

4. The vertical developing apparatus for a circuit board production according to Claim 1, characterized by: The capture mechanism (3) includes a fixed frame (301) fixedly connected to the developing equipment (1), a first hydraulic rod (302) rotatably connected inside the fixed frame (301), a movable plate (303) rotatably connected to the other end of the first hydraulic rod (302), and multiple sets of suction pipes (304) rotatably connected to the outside of the movable plate (303). One end of the suction pipe (304) is connected to a connecting pipe (306), and the other end of the connecting pipe (306) converges into a main pipe and is connected to the input end of the vacuuming equipment (2).

5. The vertical developing apparatus for a circuit board production according to claim 4, characterized by: The outside of the suction pipe (304) is also rotatably connected to a fixing plate (305) via a rotating shaft, and the outside of the fixing plate (305) is fixedly connected to the fixing frame (301).