Thermostat of photoelectric pod gyroscope

Abstract

The utility model discloses a constant temperature device of a photoelectric pod gyroscope, and relates to the technical field of photoelectric pods of unmanned aerial vehicles. The constant temperature device comprises a gyroscope chip IMU and a constant temperature resistor, the gyroscope chip IMU and a peripheral circuit matched with the gyroscope chip IMU are arranged on the front face of the PCB, a plurality of heat conduction grooves arranged at intervals are formed in the periphery of the gyroscope chip IMU, and the heat conduction grooves avoid signal lines and power lines connected with the gyroscope chip. A heat conduction groove is formed in the PCB, the heat conduction groove penetrates through an insulating plate of the PCB, the constant-temperature resistor is attached to the portion, on the back face of the gyroscope chip, of the PCB, the gyroscope chip IMU senses environment temperature information and transmits the environment temperature information to the microprocessor MCU, and the microprocessor MCU controls the constant-temperature resistor to work according to the received environment temperature information.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic pod technology for unmanned aerial vehicles (UAVs), and in particular to a temperature control device for an optoelectronic pod gyroscope that is small in size and has more accurate error compensation. Background Technology

[0002] In modern aviation, airborne pods are increasingly widely used, and the inertial measurement unit (IMU), as a key component for acquiring motion information within the pod, directly affects the pod's stability and mission execution effectiveness. Because the gyroscopes inside the optoelectronic pod are precision components, the error compensation of the measured data varies under different operating temperatures. Therefore, a temperature control device is needed to stabilize the operating temperature of the gyroscopes inside the pod. However, traditional temperature control devices only consider heat dissipation and temperature detection. When the pod moves, the gyroscope temperature fluctuates rapidly, causing the error compensation of the gyroscope measurements to change quickly. This leads to inaccurate error compensation calculations, affecting the pod's imaging stability and target positioning accuracy. Utility Model Content

[0003] The technical problem to be solved by this utility model is how to provide a temperature control device for an optoelectronic pod gyroscope with a simple structure and more accurate temperature compensation.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a temperature control device for an optoelectronic pod gyroscope, the temperature control device including a gyroscope chip IMU and a temperature control resistor, the gyroscope chip IMU and its supporting peripheral circuits are arranged on the front side of a PCB board, a plurality of spaced heat-conducting grooves are formed on the outer periphery of the gyroscope chip IMU, the heat-conducting grooves avoid the signal lines and power lines connected to the gyroscope chip, and the heat-conducting grooves penetrate the insulating plate of the PCB board, the temperature control resistor is attached to the PCB board on the back side of the gyroscope chip, the gyroscope chip IMU senses the ambient temperature information and transmits the ambient temperature information to the microprocessor MCU, the microprocessor MCU controls the temperature control resistor to work according to the received ambient temperature information, so that the working temperature of the gyroscope chip IMU rises to the set temperature.

[0005] A further technical solution is as follows: the gyroscope chip IMU uses chip U1, pin 1 of U1 is grounded, pin 8 of U1 is divided into two paths, the first path is grounded through capacitor C2, and the second path is connected to power supply VCC; pin 9 of U1 is divided into four paths, the first path is connected to power supply VCC through resistor R2, the second path is grounded through light-emitting diode LED1, the third path is connected to power supply VCC through resistor R3, and the fourth path is grounded through resistor R5; pins 23 and 24 of U1 are connected to the SCL pin and SDA pin of the microprocessor MCU respectively through connector U2; the PB5 pin of the microprocessor MCU is connected to the base of transistor Q1, the emitter of transistor Q1 is grounded through resistor R6, and the collector of transistor Q1 is connected to power supply VCC.

[0006] The beneficial effects of adopting the above technical solution are as follows: This application improves performance in terms of temperature control accuracy, dynamic response, and error compensation stability by setting a semi-circular heat-conducting groove around the gyroscope chip IMU and setting a constant-temperature resistor on the back of the gyroscope chip IMU. The use of a PCB heat-conducting groove and a constant-temperature resistor on the back makes the overall weight of the pod lighter and the calculated error compensation more accurate. Attached Figure Description

[0007] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0008] Figure 1 This is a front view of the circuit board of the device described in this embodiment of the utility model;

[0009] Figure 2 This is a back view of the circuit board of the device described in this embodiment of the utility model;

[0010] Figure 3 This is a schematic block diagram of the device described in an embodiment of the present utility model;

[0011] Figure 4 This is a circuit diagram of the device described in an embodiment of the present invention;

[0012] The components include: 1. Gyroscope chip (IMU); 2. Thermostatic resistor; 3. PCB board; 4. Heat sink. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0015] like Figures 1-4 As shown in the figure, this utility model discloses a temperature control device for an optoelectronic pod gyroscope. The temperature control device includes a gyroscope chip IMU 1 and a temperature-controlled resistor 2. The gyroscope chip IMU 1 and its associated peripheral circuits are arranged on the front side of a PCB board 3. A plurality of spaced heat-conducting grooves 4 are formed on the outer periphery of the gyroscope chip IMU 1. Preferably, the heat-conducting grooves 4 include two semi-annular heat-conducting grooves arranged symmetrically on the left and right sides. The heat-conducting grooves 4 avoid the signal lines and power lines connected to the gyroscope chip IMU 1, and the heat-conducting grooves 4 penetrate the insulating plate of the PCB board 3. The temperature-controlled resistor 2 is attached to the PCB board 3 on the back side of the gyroscope chip. The gyroscope chip IMU 1 senses the ambient temperature information and transmits the ambient temperature information to the microprocessor MCU. The microprocessor MCU controls the temperature-controlled resistor 2 to work according to the received ambient temperature information, so that the operating temperature of the gyroscope chip IMU 1 rises to the set temperature.

[0016] Furthermore, such as Figure 3 As shown, in this application, the MCU exchanges data with the gyroscope module, the thermostat module, and the communication interface module via an internal bus. The gyroscope module directly transmits the measured acceleration, angular velocity, and temperature data to the MCU for processing. The MCU then controls the operating state of the thermostat to maintain a constant temperature based on the processed data. The MCU also exchanges data with external systems via serial port and Ethernet.

[0017] Furthermore, such as Figures 1-2 As shown, in this application, a semi-circular heat-conducting groove (0.6mm wide and 1.6mm deep) is made on the PCB board around the gyroscope. It is cut 2mm from the edge of the gyroscope chip and avoids all signal lines. The two sides of the PCB are connected through vias to form a three-dimensional heat-conducting network.

[0018] Furthermore, such as Figure 4As shown in this application, the gyroscope chip IMU1 uses chip U1. Pin 1 of U1 is grounded. Pin 8 of U1 is divided into two paths: the first path is grounded through capacitor C2, and the second path is connected to power supply VCC. Pin 9 of U1 is divided into four paths: the first path is connected to power supply VCC through resistor R2, the second path is grounded through light-emitting diode LED1, the third path is connected to power supply VCC through resistor R3, and the fourth path is grounded through resistor R5. Pins 23 and 24 of U1 are connected to the SCL pin and SDA pin of the microprocessor MCU, respectively, through connector U2. The PB5 pin of the microprocessor MCU is connected to the base of transistor Q1. The emitter of transistor Q1 is grounded through resistor R6, and the collector of transistor Q1 is connected to power supply VCC.

[0019] The thermostatic resistor 2 is a PTC resistor, specifically a 60℃ Curie temperature PTC, mounted on the back of the PCB (aligned with the center of the gyroscope chip), and its bottom is in direct contact with the pod's titanium alloy frame via a 0.2mm thick aluminum heat-conducting sheet (surface anodized).

[0020] After the device is powered on, the IMU's temperature gradually increases, and the IMU sends this temperature reading to other devices. These devices then use the temperature reading from the IMU to determine whether to allow the thermostatic resistor to heat up. When heating is required, the control device sends high or low level signals to control the SS8050 transistor Q1, causing the resistor R6 (thermostatic resistor) to heat up. The circuit in this application uses the IMU's built-in temperature sensor to detect the temperature and employs the thermostatic resistor for temperature control.

[0021] This application achieves a significant improvement in core performance aspects such as temperature control accuracy, dynamic response, and error compensation stability through a structural design that incorporates a semi-annular heat-conducting groove and a back-side thermostatic resistor. The use of PCB slotting and the addition of a back-side thermostatic resistor makes the pod lighter and the calculated error compensation more precise.

Claims

1. A temperature control device for an optoelectronic pod gyroscope, characterized in that: The constant temperature device includes a gyroscope chip IMU (1) and a constant temperature resistor (2). The gyroscope chip IMU (1) and its associated peripheral circuits are arranged on the front side of the PCB board (3). A number of spaced heat conduction grooves (4) are formed on the outer periphery of the gyroscope chip IMU (1). The heat conduction grooves (4) avoid the signal lines and power lines connected to the gyroscope chip IMU (1) and penetrate the insulating plate of the PCB board (3). The constant temperature resistor (2) is attached to the PCB board (3) on the back side of the gyroscope chip. The gyroscope chip IMU (1) senses the ambient temperature information and transmits the ambient temperature information to the microprocessor MCU. The microprocessor MCU controls the constant temperature resistor (2) to work according to the received ambient temperature information, so that the working temperature of the gyroscope chip IMU (1) rises to the set temperature.

2. The temperature control device for the photoelectric pod gyroscope as described in claim 1, characterized in that: The gyroscope chip IMU (1) uses chip U1. Pin 1 of U1 is grounded. Pin 8 of U1 is divided into two paths: the first path is grounded through capacitor C2, and the second path is connected to power supply VCC. Pin 9 of U1 is divided into four paths: the first path is connected to power supply VCC through resistor R2, the second path is grounded through light-emitting diode LED1, the third path is connected to power supply VCC through resistor R3, and the fourth path is grounded through resistor R5. Pins 23 and 24 of U1 are connected to the SCL pin and SDA pin of the microprocessor MCU through connector U2, respectively. The PB5 pin of the microprocessor MCU is connected to the base of transistor Q1. The emitter of transistor Q1 is grounded through resistor R6, and the collector of transistor Q1 is connected to power supply VCC.

3. The temperature control device for the photoelectric pod gyroscope as described in claim 1, characterized in that: The heat-conducting groove (4) includes two semi-annular heat-conducting grooves arranged symmetrically on the left and right.

4. The temperature control device for the photoelectric pod gyroscope as described in claim 3, characterized in that: The width of the heat-conducting groove (4) is 0.6 mm.

5. The temperature control device for the photoelectric pod gyroscope as described in claim 1, characterized in that: The thermostatic resistor (2) is a PTC resistor.

6. The temperature control device for the photoelectric pod gyroscope as described in claim 1, characterized in that: The bottom of the thermostatic resistor (2) is in direct contact with the titanium alloy frame of the pod through a 0.2mm thick aluminum heat-conducting sheet.

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