Computing node and computing device

Abstract

The embodiment of the utility model provides a computing node and computing equipment. The computing node comprises a mainboard and a liquid cooling heat dissipation device. The liquid cooling heat dissipation device comprises a first flow distributor, a plurality of liquid cooling branches and a plurality of cold plates. The first flow distributors are communicated with the multiple cold plates in a one-to-one correspondence mode through the multiple liquid cooling branches, each cold plate is arranged on the side, back to the mainboard, of the corresponding power consumption device and used for dissipating heat of the corresponding power consumption device, and the first flow distributors are used for controlling the flow of cooling liquid entering the multiple liquid cooling branches; and the flow of the cooling liquid of the liquid cooling branch is in direct proportion to the heating degree of the corresponding power consumption device. According to the computing node provided by the embodiment of the invention, the problem that the heat dissipation effect of the power consumption device is poor due to the fact that the heating degree of the power consumption device is not matched with the heat dissipation capability is solved.

Description

Technical Field

[0001] This application relates to the field of computing device technology, and more particularly to a computing node and a computing device. Background Technology

[0002] With the rapid development of internet technology and the booming development of cloud services and cloud computing, the computing power and storage density of servers have increased rapidly, leading to increased power consumption and heat generation of equipment components. Servers generate a significant amount of heat during operation, and excessive heat accumulation can negatively impact server performance. Therefore, liquid cooling is commonly used to dissipate heat from servers and prevent temperature-related performance effects.

[0003] Servers contain various devices with different power consumption levels. These devices generate varying amounts of heat. In related technologies, these devices are equipped with cold plates. The server contains liquid cooling pipes connected to multiple cold plates. These pipes supply coolant to the cold plates for liquid cooling of the devices. However, in these technologies, there is a tendency for devices with lower heat consumption to overheat, while devices with higher heat consumption experience poor heat dissipation. Utility Model Content

[0004] This application provides a computing node and computing device that can solve the problem of mismatch between the heat generation and heat dissipation capacity of power consumption devices, resulting in poor heat dissipation performance of power consumption devices.

[0005] In a first aspect, embodiments of this application provide a computing node, including a motherboard and a liquid cooling device. The liquid cooling device includes a first flow distributor, multiple liquid cooling branches, and multiple cold plates. The first flow distributor is connected to the multiple cold plates one-to-one through the multiple liquid cooling branches. Each cold plate is located on the side of its corresponding power consumption device facing away from the motherboard, providing heat dissipation for the corresponding power consumption device. The first flow distributor controls the flow rate of coolant into the multiple liquid cooling branches, and the flow rate of coolant in each liquid cooling branch is proportional to the heat generation of the corresponding power consumption device.

[0006] The computing node provided in this application embodiment has a first flow distributor that is connected to the cold plates corresponding to multiple power consumption devices through multiple liquid cooling branches to provide coolant to the multiple cold plates. The flow of coolant removes the heat transferred from the power consumption devices to the cold plates, thereby achieving heat dissipation of the power consumption devices. This allows the multiple power consumption devices to operate within the optimal temperature range, ensuring the operational reliability of the computing node and computing equipment.

[0007] Different power-consuming devices on the motherboard generate varying degrees of heat during operation due to their different power consumption. Therefore, in this embodiment, a first flow distributor can provide different flow rates of coolant to the cold plates corresponding to power-consuming devices with different heat generation levels, thereby meeting the heat dissipation needs of these devices and facilitating precise heat dissipation for multiple power-consuming devices.

[0008] Specifically, for power-consuming devices with high heat generation, the first flow distributor can allocate more coolant flow to the liquid cooling branch connected to the cold plate corresponding to the power-consuming device with high heat generation, so that more coolant can flow to the cold plate corresponding to the power-consuming device with high heat generation, thereby improving the heat dissipation efficiency of the power-consuming device with high heat generation, thus meeting the heat dissipation requirements of the power-consuming device with high heat generation, reducing the possibility that the coolant is evenly distributed from each liquid cooling branch to each power-consuming device, which may lead to difficulty in meeting the heat dissipation requirements of the power-consuming device with high heat generation.

[0009] For low-heat-generating power devices, the first flow distributor can allocate a smaller amount of coolant flow to the liquid cooling branch connected to the cold plate corresponding to the low-heat-generating power device. This results in less coolant flowing to the cold plate corresponding to the low-heat-generating power device, thus meeting the heat dissipation requirements of the high-heat-generating power device. However, this reduces the uniform distribution of coolant from each liquid cooling branch to each power device, potentially leading to overcooling of the low-heat-generating power device. This could cause the operating temperature of the power device to drop below its optimal temperature, affecting its lifespan and even the normal operation of the computing node. Furthermore, it's easy to understand that overcooling of low-heat-generating power devices can also lead to coolant waste and increased liquid cooling costs.

[0010] In this embodiment, the flow rate of coolant in multiple liquid-cooled branches can be controlled by a first flow distributor. Compared to some related technologies that set different resistance blocks in each pipe leading to the cold plate, this simplifies the structure of the liquid-cooled branches and reduces the possibility of increased structural complexity and assembly steps due to multiple different resistance blocks.

[0011] Furthermore, by controlling the flow rate of coolant in multiple liquid-cooled branches through a first flow distributor, these branches can have identical structures. Multiple liquid-cooled branches can use pipes of the same specifications, reducing the variety of materials and improving assembly efficiency. It also helps reduce the possibility of incorrect assembly due to differences in liquid-cooled branch specifications, which would otherwise necessitate complex error-proofing mechanisms.

[0012] In one possible implementation, the first flow distributor includes a liquid inlet tank with multiple liquid inlets, and multiple liquid cooling branches correspond one-to-one with the multiple liquid inlets to communicate with the liquid inlet tank.

[0013] In this embodiment, the coolant in the main inlet pipe can first enter the inlet tank, and then enter multiple cold plates through multiple inlets on the inlet tank. The inlet tank can distribute the flow rate of coolant entering the multiple inlet branches through the inlets, thereby dissipating the amount of coolant entering the cold plates to provide targeted heat dissipation for different power consumption devices.

[0014] In one possible implementation, the multiple liquid inlets have different sizes, and the size of the liquid inlet is proportional to the heat generation of the corresponding power consumption device.

[0015] In this embodiment, the power consumption device corresponding to the liquid inlet is a power consumption device for cooling the cold plate connected to the liquid inlet. By setting multiple liquid inlets with different sizes, the flow rate of coolant entering multiple liquid cooling branches can be controlled by the size of the liquid inlet, thereby controlling the flow rate of coolant entering the cold plate by the flow rate of coolant in the liquid cooling branches.

[0016] When the liquid inlet is large, the flow rate into the liquid cooling branch connected to it is also large, resulting in a larger liquid intake for the cold plate connected to that branch. A larger liquid inlet provides better heat dissipation, allowing the cold plate to be placed in close contact with high-power devices that generate significant heat.

[0017] In one possible implementation, the first flow distributor further includes multiple liquid inlet distribution boxes, which are connected to a liquid inlet tank and multiple liquid cooling branches. The multiple liquid inlet distribution boxes are used to provide coolant of different flow rates to multiple cold plates. One end of the multiple liquid inlet distribution boxes is connected to multiple liquid inlets in a one-to-one correspondence, and the other end of the multiple liquid inlet distribution boxes is connected to multiple liquid cooling branches in a one-to-one correspondence.

[0018] In this embodiment, by setting different sizes for the liquid inlets and allowing multiple liquid inlet distribution boxes to correspond to different inlets, the flow rates of coolant in the multiple liquid inlet distribution boxes can be made different. Since the multiple liquid inlet distribution boxes are connected to multiple liquid cooling branches respectively, the flow rates of coolant flowing from the multiple liquid cooling branches to the cold plates can also be different. Thus, different cold plates can have different heat dissipation capabilities to dissipate heat from power consumption devices with different heat levels.

[0019] In one possible implementation, the multiple liquid dispensing tanks have different capacities, and the capacity of the liquid dispensing tank is proportional to the heat generation of the corresponding power consumption device.

[0020] In this embodiment, the power consumption device corresponding to the liquid inlet distribution box is a power consumption device that uses a cold plate for heat dissipation connected to the liquid inlet distribution box. When the liquid inlet distribution box can store a large capacity of coolant, it can provide a larger flow rate to the liquid cooling branch, thereby improving the heat dissipation efficiency of the power consumption device. Furthermore, when the internal space of the liquid inlet distribution box is large, the flow resistance of the coolant within the liquid inlet distribution box is relatively small, which is beneficial to increasing the flow rate of the coolant and improving the heat dissipation efficiency of the power consumption device.

[0021] Specifically, the liquid inlet distribution box with a larger internal space is connected to the cold plate corresponding to the high-heat-generating power consumption device via a liquid cooling branch, so as to provide a larger flow of coolant to the cold plate corresponding to the high-heat-generating power consumption device to meet the heat dissipation requirements of the high-heat-generating power consumption device. Conversely, the liquid inlet distribution box with a smaller internal space is connected to the cold plate corresponding to the low-heat-generating power consumption device via a liquid cooling branch, so as to meet the heat dissipation requirements of the low-heat-generating power consumption device.

[0022] In one possible implementation, the inlets are all the same size, but the cross-sectional areas of the multiple liquid inlet distribution boxes are different. The cross-sectional area is perpendicular to the flow direction of the coolant, and the size of the cross-sectional area is proportional to the heat generation of the power-consuming device corresponding to the liquid inlet distribution box. Alternatively, the inlets are all the same size, but the extension lengths of the multiple liquid inlet distribution boxes are different, and the extension length of the liquid inlet distribution box is proportional to the heat generation of the power-consuming device.

[0023] In this embodiment, the cross-sectional area of ​​multiple liquid inlet distribution boxes can be set to be different, or the extension length of multiple liquid inlet distribution boxes can be set to be different, so that the flow rate of coolant in multiple liquid inlet distribution boxes is different. Thus, coolant with different inlet amounts can be provided to multiple liquid cooling branches through multiple liquid inlet distribution boxes, thereby enabling precise heat dissipation for power consumption devices with different heat levels.

[0024] In one possible implementation, each liquid inlet distribution box provides coolant to at least one cold plate. The power-consuming devices corresponding to multiple cold plates connected to the same liquid inlet distribution box have the same degree of heat generation.

[0025] In this embodiment, a liquid inlet distribution box can supply coolant to multiple cold plates through multiple liquid cooling branches. Since the amount of coolant supplied from the same liquid inlet distribution box to the connected liquid cooling branches is equal, the flow rate of coolant delivered to the multiple cold plates by the multiple liquid cooling branches is also equal, resulting in the same heat dissipation capacity for the multiple cold plates connected to the same liquid inlet distribution box. Therefore, the heat generation levels of the power consumption devices corresponding to the multiple cold plates can be the same or similar, ensuring effective heat dissipation for each power consumption device and avoiding the possibility of poor heat dissipation for some power consumption devices or excessive heat dissipation for others.

[0026] In one possible implementation, the liquid cooling heat dissipation device further includes a second flow distributor, which is connected to multiple cold plates. The second flow distributor is used to control the flow rate of the coolant flowing out of the cold plates, and the flow rate of the coolant flowing out of the cold plates is proportional to the heat generation of the corresponding power consumption device.

[0027] In this embodiment, coolant flows through multiple cold plates to form a high-temperature coolant. The high-temperature coolant can then flow out through a second flow distributor to remove heat from the cold plates to the outside of the liquid cooling heat dissipation device. The flow rate of coolant flowing out of the cold plates affects the heat dissipation capacity of the cold plates. A larger outflow rate allows the first flow distributor to replenish the cold plates with a corresponding flow rate of coolant, thus improving the heat dissipation capacity of the cold plates.

[0028] In one possible implementation, the liquid cooling branch includes an inlet branch and an outlet branch. One end of the inlet branch is connected to a first flow distributor, and the other end is connected to a cold plate; one end of the outlet branch is connected to a second flow distributor, and the other end is connected to a cold plate.

[0029] In this embodiment, the coolant distribution box can be connected to the cold plate via a coolant inlet branch. By distributing different amounts of coolant to multiple coolant inlet branches through multiple coolant distribution boxes, the flow rate of coolant flowing to multiple cold plates can be different, thereby achieving precise heat dissipation for power consumption devices with different heat levels.

[0030] The end of the liquid inlet branch connected to the liquid inlet distribution box can be the liquid inlet end of the liquid cooling branch. By controlling the liquid inlet flow of the liquid cooling branch at its inlet end, multiple liquid inlet branches can be made to have the same size and specifications, thus avoiding incorrect assembly. Furthermore, since there are a large number of liquid inlet branches, using liquid inlet branches of the same size and specifications can reduce material costs and improve assembly efficiency.

[0031] Secondly, embodiments of this application also provide a computing device, including a housing and computing nodes as described in any of the above embodiments. The housing has an accommodating space. There are multiple computing nodes, linearly distributed within the accommodating space. Attached Figure Description

[0032] Figure 1 This is a partial three-dimensional structural diagram of a computing node provided in an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the partial decomposition structure of the computing node provided in the embodiments of this application;

[0034] Figure 3 This is a partial three-dimensional structural diagram of another computing node provided in an embodiment of this application;

[0035] Figure 4 This is a partial three-dimensional structural diagram of another computing node provided in an embodiment of this application;

[0036] Figure 5 This is a partial three-dimensional structural diagram of another computing node provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100. Compute nodes;

[0039] 110. Motherboard;

[0040] 121. Liquid cooling branch; 1211. Liquid inlet branch; 1212. Liquid outlet branch;

[0041] 130. First flow distributor;

[0042] 131. Liquid inlet distribution box; 133. Liquid inlet tank; 133a. Liquid inlet port; 122. Main liquid inlet pipeline;

[0043] 140. Second flow distributor;

[0044] 134. Dispensing tank; 132. Dispensing distribution tank; 123. Main dispensing pipeline;

[0045] 150. Cold-rolled steel plate;

[0046] 101. First liquid inlet distribution box; 101a. First liquid inlet; 102. Second liquid inlet distribution box; 102a. Second liquid inlet; 103. Third liquid inlet distribution box; 103a. Third liquid inlet; 104. First liquid cooling branch; 105. Second liquid cooling branch; 106. Third liquid cooling branch; 107. First cold plate; 108. Second cold plate; 109. Third cold plate. Detailed Implementation

[0047] The computing nodes provided in this application can be applied to data centers. Internet service providers, enterprise platforms, research institutions, and other entities all require significant computing power, and the operating platform that supports storage, computing, and networking needs is called a data center. At least one computing device is located within the server room of a data center. This computing device can be used to provide services; it can be a super terminal capable of establishing communication connections with other devices and providing computing and / or storage functions to those devices. For example, the computing device can be a rack-mounted computing device (such as a rack-mounted server) or a tank-type computing device. This application does not impose any limitations on its implementation.

[0048] The computing device may include computing nodes. The number of computing nodes can be one or more. For example, a computing device may include 10-50 computing nodes. Computing nodes may be, but are not limited to, rack servers, blade servers, tower servers, etc.

[0049] In addition, a cooling system is installed in the computer room. This cooling system dissipates heat from the internal environment of the computer room to ensure the normal operation of the computing equipment. The specific structure and working principle of the cooling system in this embodiment are not described in detail.

[0050] As computing devices become increasingly integrated, the power consumption of core components within computing nodes is rising, generating more and more heat during operation. Examples of high-power components include the central processing unit (CPU), graphics processing unit (GPU), and switch. If excessive heat is generated by these components within a computing node and cannot be dissipated in time, the operation of the computing device will be affected. Therefore, heat dissipation of high-power components within computing nodes is particularly important during the design process.

[0051] In this embodiment, the computing node includes a liquid cooling device. The liquid cooling device includes a first flow distributor. The first flow distributor can supply coolant to multiple cold plates corresponding to multiple power consumption devices with different heat generation levels. The first flow distributor can distribute the flow rate of coolant entering the multiple cold plates, allocating more coolant to the cold plates corresponding to power consumption devices with higher heat generation levels and less coolant to the cold plates corresponding to power consumption devices with lower heat generation levels, thereby achieving targeted and precise heat dissipation for the power consumption devices. This can meet the heat dissipation needs of both low-heat and high-heat power consumption devices, achieving different heat dissipation requirements for power consumption devices with different heat generation levels and avoiding energy waste.

[0052] In this application, the first flow distributor can also be called a liquid-cooled combiner, which can achieve efficient and precise heat dissipation for power consumption devices, so that each power consumption device can be kept at the optimal operating temperature, which is conducive to improving the service life of power consumption devices and ensuring the normal operation of computing equipment.

[0053] The computing node 100 and computing device provided in this application embodiment will be described in detail below through specific implementation methods.

[0054] See Figure 1 and Figure 2As shown in the figure, this application embodiment provides a computing node 100, which may include a motherboard 110 and a liquid cooling heat dissipation device. The motherboard 110 is provided with multiple power consumption devices.

[0055] The liquid cooling heat dissipation device includes a first flow distributor 130, multiple liquid cooling branches 121, and multiple cold plates 150.

[0056] The cold plate 150 may have an internal space for containing coolant. The cold plate 150 can be in contact with the power-consuming device, and the heat generated by the power-consuming device during operation can be transferred to the cold plate 150. A liquid cooling branch 121 may be connected to the cold plate 150. The liquid cooling branch 121 can deliver coolant into the cold plate 150. The coolant flows within the cold plate 150 to remove the heat transferred from the power-consuming device to the cold plate 150, thereby achieving heat dissipation for the power-consuming device.

[0057] The first flow distributor 130 is connected to each liquid cooling branch 121. The first flow distributor 130 is connected to multiple cold plates 150 in a one-to-one correspondence through the multiple liquid cooling branches 121. Each cold plate 150 is located on the side of its corresponding power consumption device facing away from the main board 110, for heat dissipation of the corresponding power consumption device. The first flow distributor 130 is used to control the flow rate of coolant into the multiple liquid cooling branches 121. The flow rate of coolant in the liquid cooling branch 121 is proportional to the heat generation of the corresponding power consumption device.

[0058] In this embodiment, the first flow distributor 130 is connected to the cold plates 150 corresponding to the multiple power consumption devices through multiple liquid cooling branches 121, so as to provide coolant to the multiple cold plates 150. In this way, the heat transferred from the power consumption devices to the cold plates 150 is removed by the flow of coolant, thereby achieving heat dissipation of the power consumption devices. This allows the multiple power consumption devices to operate within the optimal temperature range, so as to ensure the operational reliability of the computing node 100 and the computing device.

[0059] Different power-consuming devices on the motherboard 110 generate varying degrees of heat during operation due to their different power consumption. Therefore, in this embodiment, the first flow distributor 130 can provide different flow rates of coolant to the cold plate 150 corresponding to power-consuming devices with different heat generation levels, thereby meeting the heat dissipation needs of power-consuming devices with different heat generation levels and facilitating precise heat dissipation for multiple power-consuming devices.

[0060] Specifically, for power consumption devices with high heat generation, the first flow distributor 130 can allocate a larger amount of coolant flow to the liquid cooling branch 121 connected to the cold plate 150 corresponding to the power consumption device with high heat generation, so that more coolant can flow to the cold plate 150 corresponding to the power consumption device with high heat generation, thereby improving the heat dissipation efficiency of the power consumption device with high heat generation, thus meeting the heat dissipation requirements of the power consumption device with high heat generation, reducing the possibility that the coolant is evenly distributed from each liquid cooling branch 121 to each power consumption device, which may lead to difficulty in meeting the heat dissipation requirements of the power consumption device with high heat generation.

[0061] For power devices with low heat generation, the first flow distributor 130 can allocate a smaller amount of coolant flow to the liquid cooling branch 121 connected to the cold plate 150 corresponding to the power device with low heat generation. This results in less coolant flowing to the cold plate 150 corresponding to the power device with low heat generation, thus meeting the heat dissipation requirements of the power device with high heat generation. However, this reduces the uniform distribution of coolant from each liquid cooling branch 121 to each power device, potentially leading to overcooling of the power device with low heat generation. This could cause the operating temperature of the power device to drop below its optimal temperature, affecting its lifespan and even the normal operation of the computing node 100. Furthermore, it is easy to understand that overcooling of the power device with low heat generation can also lead to coolant waste and increased liquid cooling costs.

[0062] In this embodiment, the flow rate of coolant in multiple liquid cooling branches 121 can be controlled by the first flow distributor 130. Compared with some related technologies, which set different resistance blocks in each pipe leading to the cold plate 150, the structure of the liquid cooling branch 121 can be simplified, and the possibility of increased structural complexity and assembly steps caused by multiple different resistance blocks can be reduced.

[0063] Furthermore, by controlling the flow rate of coolant in multiple liquid-cooled branches 121 through the first flow distributor 130, the multiple liquid-cooled branches 121 can have the same structure. Multiple liquid-cooled branches 121 can use pipes of the same specifications, reducing the types of materials and improving assembly efficiency. It also helps reduce the possibility of incorrect assembly due to differences in the specifications of the liquid-cooled branches 121, which would otherwise necessitate complex error-proofing structures.

[0064] In some examples, the computing device may have an external liquid cooling tank for storing coolant. The liquid cooling piping 120 may also include a main inlet pipe 122. One end of the main inlet pipe 122 may be connected to the liquid cooling tank, and the other end may be connected to a first flow distributor 130. Coolant in the liquid cooling tank can enter the first flow distributor 130 through the main inlet pipe 122, and then be distributed by the first flow distributor 130 to multiple liquid cooling branches 121 to deliver coolant to multiple cold plates 150.

[0065] In some related technologies, multiple pipes of different sizes are directly led out from the liquid cooling box to connect to multiple power consumption devices. The cold plate 150 on the power consumption device with a higher heat generation corresponds to a thicker pipe, so that more coolant is supplied to the higher-heat-generating power consumption device through the thicker pipe. Similarly, the cold plate 150 on the power consumption device with a lower heat generation corresponds to a thinner pipe, so that less coolant is supplied to the lower-heat-generating power consumption device through the thinner pipe.

[0066] It is easy to understand that various pipe specifications correspond to interfaces of different sizes. Since the dimensions of the pipes and interfaces are one-to-one, it is difficult to achieve rapid pipe installation. In this embodiment, the first flow distributor 130 is used to distribute different flow rates of coolant to the cold plates 150 corresponding to different power consumption devices. Therefore, the specifications of the main inlet pipe 122 can remain constant, which is beneficial for the rapid installation and removal of the main inlet pipe 122.

[0067] In some examples, the compute node 100 may also include a housing. A motherboard 110 and at least a portion of the liquid cooling system may be located within the housing. The housing protects the internal motherboard 110. The motherboard 110 and / or at least a portion of the liquid cooling system may be fixed to the side wall of the housing.

[0068] It should be noted that the embodiments of this application do not limit the types or specifications of power consumption devices.

[0069] In some examples, multiple power-consuming devices can refer to different types of power-consuming devices. For example, a CPU and a GPU. The CPU and GPU have different power consumptions and generate different amounts of heat during operation. The CPU and GPU are each equipped with a cold plate 150. Therefore, the first flow distributor 130 can control the flow rate of the coolant in the liquid cooling branch 121 connected to the cold plate 150 of the CPU and the cold plate 150 of the GPU to meet the heat dissipation requirements of the CPU and GPU respectively by using different coolant flow rates.

[0070] In other examples, multiple power-consuming devices may refer to power-consuming devices of the same type but different specifications. For example, different models of CPUs. The power consumption of a high-performance CPU is higher than that of a low-performance CPU. Therefore, the first flow distributor 130 can control the flow rate of coolant in the liquid cooling branch 121 connected to the cold plate 150 of the high-performance CPU to be greater than the flow rate of coolant in the liquid cooling branch 121 connected to the cold plate 150 of the low-performance CPU.

[0071] It should be noted that the embodiments of this application do not limit the location of multiple power consumption devices distributed on the motherboard 110.

[0072] See also some of the possible implementation methods. Figure 2 As shown, the first flow distributor 130 in this embodiment may include a liquid inlet tank 133. The liquid inlet tank 133 may have multiple liquid inlets 133a. Multiple liquid cooling branches 121 correspond one-to-one with the multiple liquid inlets 133a to communicate with the liquid inlet tank 133.

[0073] In this embodiment, the coolant in the main inlet pipe 122 can first enter the inlet tank 133, and then enter the multiple cold plates 150 through the multiple inlet ports 133a on the inlet tank 133. The inlet tank 133 can distribute the flow rate of coolant entering the multiple inlet branches 1211 through the inlet ports 133a, thereby dissipating the amount of coolant entering the cold plates 150 to provide directional heat dissipation for different power consumption devices.

[0074] See also some of the possible implementation methods. Figure 2 As shown, the sizes of the multiple liquid inlets 133a in this embodiment are different, and the size of the liquid inlet 133a is proportional to the heat generation of the corresponding power consumption device.

[0075] In this embodiment, by setting multiple liquid inlets 133a with different sizes, the flow rate of coolant entering multiple liquid cooling branches 121 can be controlled by the size of the liquid inlets 133a, thereby controlling the flow rate of coolant entering the cold plate 150 by the flow rate of coolant in the liquid cooling branches 121.

[0076] When the liquid inlet 133a is larger, the flow rate into the liquid cooling branch 121 connected to it is also larger, and the liquid inlet volume of the cold plate 150 connected to the liquid cooling branch 121 is also larger. When the liquid inlet 133a is larger, it can have a better heat dissipation effect, so the cold plate 150 can be placed in close contact with power consumption devices with high heat generation.

[0077] See also some of the possible implementation methods. Figure 1 and Figure 2As shown, the first flow distributor 130 in this embodiment may include a plurality of liquid inlet distribution tanks 131. The plurality of liquid inlet distribution tanks 131 are connected to a liquid inlet tank 133 and a plurality of liquid cooling branches 121. The plurality of liquid inlet distribution tanks 131 are used to provide coolant of different flow rates to a plurality of cold plates 150.

[0078] One end of each of the multiple liquid inlet distribution boxes 131 can be connected to one of the multiple liquid inlets 133a. The other end of each of the multiple liquid inlet distribution boxes 131 can be connected to one of the multiple liquid cooling branches 121.

[0079] In this embodiment, by setting different sizes for the liquid inlets 133a and allowing multiple liquid distribution boxes 131 to correspond to different liquid inlets 133a, the flow rates of coolant in the multiple liquid distribution boxes 131 can be different. Since the multiple liquid distribution boxes 131 are respectively connected to multiple liquid cooling branches 121, the flow rates of coolant flowing from the multiple liquid cooling branches 121 to the cold plate 150 can also be different. Therefore, different cold plates 150 can have different heat dissipation capabilities to dissipate heat from power consumption devices with different heat levels.

[0080] See in some examples Figure 2 and Figure 3 As shown, the first flow distributor 130 includes three liquid inlet distribution boxes 131 as an example. The three liquid inlet distribution boxes 131 are a first liquid inlet distribution box 101, a second liquid inlet distribution box 102, and a third liquid inlet distribution box 103. The liquid inlet box 133 is provided with a first liquid inlet 101a, a second liquid inlet 102a, and a third liquid inlet 103a, respectively corresponding to the first liquid inlet distribution box 101, the second liquid inlet distribution box 102, and the third liquid inlet distribution box 103. The number of power consumption devices can be three, and the three power consumption devices can correspond to the first cold plate 107, the second cold plate 108, and the third cold plate 109, respectively. Among them, the first liquid inlet distribution box 101 corresponds to the first liquid cooling branch 104. The second liquid inlet distribution box 102 corresponds to the second liquid cooling branch 105. The third liquid inlet distribution box 103 corresponds to the third liquid cooling branch 106. The number of first liquid cooling branches 104 can be at least one, corresponding to at least one first cold plate 107. The number of second liquid cooling branches 105 can be at least one, each corresponding to at least one second cold plate 108. The number of third liquid cooling branches 106 can be at least one, each corresponding to at least one third cold plate 109.

[0081] The first liquid inlet 101a is larger than the second liquid inlet 102a, and the second liquid inlet 102a is larger than the third liquid inlet 103a. Therefore, the flow rate of coolant in the first liquid inlet distribution tank 101 is greater than that in the second liquid inlet distribution tank 102. The flow rate of coolant in the second liquid inlet distribution tank 102 is greater than that in the third liquid inlet distribution tank 103. Compared to the second liquid inlet distribution tank 102 and the third liquid inlet distribution tank 103, the first liquid inlet distribution tank 101 allows the first cold plate 107 to have better heat dissipation. Therefore, the first liquid inlet distribution tank 101 can be used for power-consuming devices with high heat generation, so as to dissipate heat from these devices through the first cold plate 1071 with better heat dissipation capabilities. Correspondingly, the second liquid inlet distribution tank 102 allows the second cold plate 108 to have moderate heat dissipation capabilities, so as to dissipate heat from power-consuming devices with moderate heat generation. The third liquid inlet distribution box 103 can enable the third cold plate 109 to have a lower heat dissipation capacity, so as to dissipate heat for power consumption devices with low heat generation.

[0082] In some feasible implementations, the capacities of the multiple liquid dispensing tanks 131 in this application embodiment may be different. The capacity of the liquid dispensing tank 131 is proportional to the heat generation of the corresponding power consumption device.

[0083] In this embodiment, when the liquid inlet distribution box 131 can store a large capacity of coolant, it can provide a larger flow rate to the liquid cooling branch 121, thereby improving the heat dissipation efficiency for power consumption devices. Furthermore, when the internal space of the liquid inlet distribution box 131 is large, the flow resistance of the coolant within the liquid inlet distribution box 131 is relatively small, which is beneficial for increasing the flow rate of the coolant and improving the heat dissipation efficiency for power consumption devices.

[0084] Specifically, the liquid inlet distribution box 131, with a larger internal space, is connected to the cold plate 150 corresponding to the high-heat-generating power consumption device via the liquid cooling branch 121. This allows for a larger flow rate of coolant to the cold plate 150, thus meeting the heat dissipation requirements of the high-heat-generating power consumption device. Conversely, the liquid inlet distribution box 131, with a smaller internal space, is connected to the cold plate 150 corresponding to the low-heat-generating power consumption device via the liquid cooling branch 121, thus meeting the heat dissipation requirements of the low-heat-generating power consumption device.

[0085] See also some of the possible implementation methods. Figure 4 and Figure 5As shown, the liquid inlets 133a in this embodiment have the same size. The cross-sectional areas of the multiple liquid distribution boxes 131 can be different. The cross-sectional area is perpendicular to the flow direction of the coolant, and the size of the cross-sectional area is proportional to the heat generation of the corresponding power-consuming device. Alternatively, the liquid inlets 133a can have the same size, but the extension lengths of the multiple liquid distribution boxes 131 can be different. The extension length of the liquid distribution box 131 is proportional to the heat generation of the power-consuming device.

[0086] In this embodiment, the cross-sectional areas of the multiple liquid inlet distribution boxes 131 are different, or the extension lengths of the multiple liquid inlet distribution boxes 131 are different, so that the flow rates of the coolant in the multiple liquid inlet distribution boxes 131 are different. Thus, the multiple liquid inlet distribution boxes 131 can provide different amounts of coolant to the multiple liquid cooling branches 121, thereby enabling precise heat dissipation for power consumption devices with different heat levels.

[0087] Specifically, see Figure 4 As shown, the first liquid inlet distribution box 101, the second liquid inlet distribution box 102, and the third liquid inlet distribution box 103 are used to supply coolant to the first cold plate 107, the second cold plate 108, and the third cold plate 109, respectively. The cross-sectional area of ​​the first liquid inlet distribution box 101 is larger than that of the second liquid inlet distribution box 102, and the cross-sectional area of ​​the second liquid inlet distribution box 102 is larger than that of the third liquid inlet distribution box 103. The heat dissipation capacity of the first cold plate 107 is higher than that of the second cold plate 108, and the heat dissipation capacity of the second cold plate 108 is higher than that of the third cold plate 109.

[0088] See Figure 5 As shown, the first liquid inlet distribution box 101, the second liquid inlet distribution box 102, and the third liquid inlet distribution box 103 are used to supply coolant to the first cold plate 107, the second cold plate 108, and the third cold plate 109, respectively. The extension length of the first liquid inlet distribution box 101 is greater than that of the second liquid inlet distribution box 102, and the extension length of the second liquid inlet distribution box 102 is greater than that of the third liquid inlet distribution box 103. The heat dissipation capacity of the first cold plate 107 is higher than that of the second cold plate 108, and the heat dissipation capacity of the second cold plate 108 is higher than that of the third cold plate 109.

[0089] See also some of the possible implementation methods. Figure 3 As shown, each liquid inlet distribution box 131 in this embodiment can be used to provide coolant to at least one cold plate 150. The power consumption devices corresponding to the multiple cold plates 150 connected to the same liquid inlet distribution box 131 have the same degree of heat generation.

[0090] In this embodiment, a liquid inlet distribution box 131 can supply coolant to multiple cold plates 150 through multiple liquid cooling branches 121. Since the amount of coolant supplied from the same liquid inlet distribution box 131 to the connected liquid cooling branches 121 is equal, the flow rate of coolant delivered from the multiple liquid cooling branches 121 to the multiple cold plates 150 is also equal, resulting in the same heat dissipation capacity for the multiple cold plates 150 connected to the same liquid inlet distribution box 131. Therefore, the heat generation levels of the power consumption devices corresponding to the multiple cold plates 150 can be the same or similar, ensuring effective heat dissipation for each power consumption device and avoiding the possibility of poor heat dissipation for some power consumption devices or excessive heat dissipation for others.

[0091] See also some of the possible implementation methods. Figure 1 As shown, the liquid cooling device may further include a second flow distributor 140. The second flow distributor 140 is connected to multiple cold plates 150. The second flow distributor 140 is used to control the flow rate of the coolant flowing out of the cold plates 150. The flow rate of the coolant flowing out of the cold plates 150 is proportional to the heat generation of the corresponding power consumption device.

[0092] In this embodiment, coolant flows through multiple cold plates 150 to form a high-temperature coolant. The high-temperature coolant can flow out through the second flow distributor 140 to remove heat from the cold plates 150 to the outside of the liquid cooling heat dissipation device. The flow rate of coolant flowing out of the cold plates 150 affects the heat dissipation capacity of the cold plates 150. The greater the outflow of coolant, the more coolant the first flow distributor 130 can replenish the cold plates 150 with a corresponding flow rate, thus enabling the cold plates 150 to have better heat dissipation capacity.

[0093] In some examples, the second flow distributor 140 may include a liquid outlet tank 134. The liquid outlet tank 134 may have multiple liquid outlets. Multiple liquid cooling branches 121 correspond one-to-one with multiple liquid outlets so that the cold plate 150 is connected to the liquid outlet tank 134.

[0094] It is easy to understand that the size of the outlet can affect the flow rate of coolant out of the cold plate 150. The larger the outlet size, the greater the flow rate of coolant out of the cold plate 150, so that the cold plate 150 can have better heat dissipation capacity.

[0095] The size of the outlet can correspond to the size of the inlet 133a to maintain the flow rate of coolant within the cold plate 150. In other words, the flow rate of coolant entering the cold plate 150 can be matched with the flow rate of coolant exiting the cold plate 150.

[0096] In some examples, the second flow distributor 140 may further include multiple outlet distribution boxes 132. The outlet distribution boxes 132 may connect to the outlet tank 134 and multiple liquid cooling branches 121. The multiple outlet distribution boxes 132 are used to contain the coolant flowing out of the cold plate 150. One end of each of the multiple outlet distribution boxes 132 is connected to a corresponding outlet, and the other end of each of the multiple outlet distribution boxes 132 is connected to a corresponding liquid cooling branch 121.

[0097] The output amount of coolant delivered from multiple liquid cooling branches 121 to the liquid outlet tank 134 can be different by adjusting the size of the liquid outlet, or the output amount of coolant delivered from multiple liquid cooling branches 121 to the liquid outlet tank 134 can be different by adjusting the capacity of multiple liquid outlet distribution tanks 132. This is not limited in the embodiments of this application.

[0098] In some examples, the liquid cooling line 120 may also include a main outlet line 123. The main outlet line 123 is connected to the outlet tank 134. The main outlet line 123 is used to remove the high-temperature coolant to the outside of the computing node 100.

[0099] In some examples, the capacities of the multiple liquid dispensing tanks 132 may be different. The capacities of the multiple liquid dispensing tanks 132 are proportional to the heat generation of the corresponding power-consuming devices. The capacities of the multiple liquid dispensing tanks 132 may be matched with the capacities of the corresponding multiple liquid inlet tanks 131.

[0100] In some examples, the cross-sectional areas of the multiple coolant distribution boxes 132 may be different. The cross-sectional area is perpendicular to the flow direction of the coolant. The cross-sectional area of ​​the coolant distribution box 132 may be proportional to the heat generated by the power-consuming device. Alternatively, when the outlet sizes are equal, the extension lengths of the multiple coolant distribution boxes 132 may be different. The extension length of the coolant distribution box 132 is proportional to the heat generated by the power-consuming device.

[0101] See also some of the possible implementation methods. Figure 1 As shown, the liquid cooling branch 121 may include an inlet branch 1211 and an outlet branch 1212. One end of the inlet branch 1211 is connected to the first flow distributor 130. The other end of the inlet branch 1211 is connected to the cold plate 150. One end of the outlet branch 1212 is connected to the second flow distributor 140. The other end of the outlet branch 1212 is connected to the cold plate 150.

[0102] In this embodiment, the liquid inlet distribution box 131 can be connected to the cold plate 150 via the liquid inlet branch 1211. By distributing different amounts of coolant to multiple liquid inlet branches 1211 through multiple liquid inlet distribution boxes 131, the flow rate of coolant flowing to multiple cold plates 150 can be different, thereby achieving precise heat dissipation for power consumption devices with different heat levels.

[0103] One end of the liquid inlet branch 1211 connected to the liquid inlet distribution box 131 can be the liquid inlet end of the liquid cooling branch 121. By controlling the liquid inlet flow of the liquid cooling branch 121 at its inlet end, multiple liquid inlet branches 1211 can be made to have the same size and specifications, thus avoiding misassembly. Furthermore, since there are a large number of liquid inlet branches 1211, using liquid inlet branches 1211 of the same size and specifications can reduce material costs and improve assembly efficiency.

[0104] It should be noted that this embodiment does not limit the way the inlet distribution box 131 distributes the coolant into the multiple inlet branches 1211. For example, the coolant capacity in the multiple inlet distribution boxes 131 can be unequal. Alternatively, the inlet distribution box 131 can be provided with mounting ports of different sizes.

[0105] For example, the liquid inlet distribution box 131 may be provided with an installation port. The liquid inlet end of the liquid cooling branch 121 can be sealed to the liquid inlet distribution box 131 through the installation port. When the coolant capacity in multiple liquid inlet distribution boxes 131 is equal, multiple liquid inlet distribution boxes 131 can be provided with installation ports of different sizes to release coolant of different flow rates through the installation ports of different sizes, so that the amount of coolant entering the multiple liquid cooling branches 121 is different.

[0106] It is easy to understand that the larger the size of the mounting port, the larger the amount of coolant entering the connected liquid inlet branch 1211, the larger the flow rate of coolant in the liquid cooling branch 121, the higher the liquid cooling cycle efficiency of the power consumption device, and the better the heat dissipation effect of the power consumption device.

[0107] In this embodiment, the inlet distribution box 131 can supply low-temperature coolant to the cold plate 150 through the inlet branch 1211. The low-temperature coolant can absorb the heat from the power consumption devices, thereby reducing the temperature of the power consumption devices and achieving liquid cooling. At this time, the temperature of the low-temperature coolant rises. The high-temperature coolant can enter the outlet distribution box 132 through the outlet branch 1212 and flow out to the outside of the computing node 100.

[0108] Since the amount of coolant supplied to the multiple inlet distribution boxes 131 and the multiple inlet branches 1211 is different, correspondingly, the amount of coolant supplied to the outlet distribution box 132 by the multiple outlet branches 1212 is also different. Specifically, for the same power consumption device, the amount of coolant supplied to the inlet branches 1211 by the inlet distribution box 131 is equal to the amount of coolant supplied to the outlet distribution box 132 by the outlet branches 1212.

[0109] Specifically, taking a power-consuming device with a high heat generation as an example, if the inflow and outflow of coolant on the corresponding cold plate 150 are not equal, the coolant circulation may be impaired, thus affecting the heat dissipation effect of the power-consuming device. The flow rate of coolant to the cold plate 150 corresponding to the power-consuming device should be consistent with the flow rate of coolant out of the cold plate 150.

[0110] In some examples, the end of the liquid outlet branch 1212 connected to the liquid outlet distribution box 132 can be the liquid outlet end of the liquid cooling branch 121. By controlling the liquid outlet volume of the liquid cooling branch 121 at its outlet end, multiple liquid outlet branches 1212 can have the same size specifications, thus avoiding misassembly. Furthermore, since there are a large number of liquid outlet branches 1212, using liquid outlet branches 1212 of the same size specifications can reduce material costs and improve assembly efficiency.

[0111] In some feasible implementations, the cold plate 150 on the power consumption device in this embodiment of the application may correspond to at least one liquid inlet branch 1211. The number of liquid inlet branches 1211 is proportional to the power consumption of the power consumption device.

[0112] In this embodiment, multiple liquid inlet branches 1211 can be used for power consumption devices with high heat generation. In other words, multiple liquid inlet branches 1211 can all be used to provide coolant to the cold plate 150 on the same power consumption device. Therefore, by using multiple liquid inlet branches 1211, the flow rate of coolant can be increased, thereby improving the heat dissipation efficiency of power consumption devices with high heat generation.

[0113] This application also provides a computing device. The computing device may include a housing and the computing node 100 in any of the above embodiments.

[0114] The outer casing may have accommodating space. The number of computing nodes 100 may be multiple. Multiple computing nodes 100 may be linearly distributed within the accommodating space.

[0115] In some examples, the liquid cooling box can supply a coolant at a lower temperature to multiple computing nodes 100 located within the housing. After absorbing heat generated by the power-consuming devices within the multiple computing nodes 100, the coolant itself heats up. At this point, the hot coolant can be discharged to the outside of the housing to achieve heat dissipation for the multiple computing nodes 100.

[0116] The high-temperature coolant discharged to the outside of the casing can be cooled and dissipated externally. For example, a coolant distribution unit (CDU) can be provided on the outside of the casing. The CDU can cool the high-temperature coolant to form a lower-temperature coolant, which is then returned to the liquid cooling tank. This allows the liquid cooling tank to continuously provide lower-temperature coolant to the multiple computing nodes 100 within the computing device, achieving continuous heat dissipation and ensuring stable operation of the computing device.

[0117] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A computing node (100), characterized in that, include: A motherboard (110) is provided with multiple power consumption devices; The liquid cooling heat dissipation device includes a first flow distributor (130), multiple liquid cooling branches (121), and multiple cold plates (150). The first flow distributor (130) is connected to each of the liquid cooling branches (121). The first flow distributor (130) is connected to each of the multiple liquid cooling branches (121) and the multiple cold plates (150) in a one-to-one correspondence. Each cold plate (150) is located on the side of the corresponding power consumption device facing away from the main board (110) to dissipate heat for the corresponding power consumption device. The first flow distributor (130) is used to control the flow rate of coolant into the multiple liquid cooling branches (121). The flow rate of coolant in the liquid cooling branches (121) is proportional to the heat generation degree of the corresponding power consumption device.

2. The computing node (100) according to claim 1, characterized in that, The first flow distributor (130) includes a liquid inlet tank (133), which has multiple liquid inlets (133a). Multiple liquid cooling branches (121) correspond one-to-one with the multiple liquid inlets (133a) to communicate with the liquid inlet tank (133).

3. The computing node (100) according to claim 2, characterized in that, The multiple liquid inlets (133a) have different sizes, and the size of the liquid inlet (133a) is proportional to the heat generation of the corresponding power consumption device.

4. The computing node (100) according to claim 2, characterized in that, The first flow distributor (130) further includes a plurality of liquid inlet distribution boxes (131), which are connected to the liquid inlet box (133) and the plurality of liquid cooling branches (121). The plurality of liquid inlet distribution boxes (131) are used to provide coolant of different flow rates to the plurality of cold plates (150). One end of each of the multiple liquid inlet distribution boxes (131) is connected to one of the multiple liquid inlets (133a), and the other end of each of the multiple liquid inlet distribution boxes (131) is connected to one of the multiple liquid cooling branches (121).

5. The computing node (100) according to claim 4, characterized in that, The liquid inlet distribution boxes (131) have different capacities, and the capacity of the liquid inlet distribution box (131) is proportional to the heat generation of the corresponding power consumption device.

6. The computing node (100) according to claim 4, characterized in that, The liquid inlets (133a) are all the same size, and the cross-sectional areas of the multiple liquid distribution boxes (131) are different. The cross-sectional area is perpendicular to the flow direction of the coolant, and the size of the cross-sectional area is proportional to the heat generation of the power consumption device corresponding to the liquid distribution box. Alternatively, the liquid inlets (133a) are of equal size, and the extension lengths of the multiple liquid distribution boxes (131) are different, with the extension length of the liquid distribution box (131) being proportional to the degree of heat generation of the power consumption device.

7. The computing node (100) according to claim 4, characterized in that, Each of the liquid inlet distribution boxes (131) provides coolant to at least one of the cold plates (150); Among them, the heat generation degree of the power consumption devices corresponding to the multiple cold plates (150) connected to the same liquid inlet distribution box (131) is the same.

8. The computing node (100) according to claim 2, characterized in that, The liquid cooling heat dissipation device further includes a second flow distributor (140), which is connected to a plurality of cold plates (150). The second flow distributor (140) is used to control the flow rate of the coolant flowing out of the cold plate (150). The flow rate of the coolant flowing out of the cold plate (150) is proportional to the heat generation of the corresponding power consumption device.

9. The computing node (100) according to claim 8, characterized in that, The liquid cooling branch (121) includes a liquid inlet branch (1211) and a liquid outlet branch (1212). One end of the liquid inlet branch (1211) is connected to the first flow distributor (130), and the other end of the liquid inlet branch (1211) is connected to the cold plate (150); one end of the liquid outlet branch (1212) is connected to the second flow distributor (140), and the other end of the liquid outlet branch (1212) is connected to the cold plate (150).

10. A computing device, characterized in that, include: The outer casing has a storage space; The computing node (100) as described in any one of claims 1 to 9 is a plurality of computing nodes (100), and the plurality of computing nodes (100) are linearly distributed in the accommodating space.

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