Electric connector and electronic equipment

Abstract

The utility model provides an electric connector and electronic equipment, and relates to the technical field of terminal equipment. The method is used for solving the problems that a metal structural part in an existing electronic device is not beneficial to thinning of the electronic device, and the light and thin development trend of the electronic device is affected. The electronic equipment comprises a middle frame, a circuit board and an electric connecting piece. The middle frame comprises a middle plate and a frame. The circuit board is arranged on the middle plate. The electric connecting piece comprises a base body part and a plurality of protruding parts, the protruding parts are arranged on the surface, facing the middle plate or the circuit board, of the base body part, the size of the protruding parts is smaller than 40 micrometers, and the electric connecting piece is connected between the middle plate and the circuit board in an abutting mode.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and more particularly to an electrical connector and an electronic device. Background Technology

[0002] Currently, mobile phones, smartwatches, tablets, and other electronic devices have become commonplace in daily life. These devices typically use circuit boards to enable communication between different electronic components, and these circuit boards are generally fixed to the device's frame with screws.

[0003] To improve the reliability and stability of the connection between the circuit board and the mid-frame, a metal structural component with a raised bulge can be installed between them. This component abuts against the circuit board and the mid-frame, reducing the likelihood of electrical instability caused by gaps between them. However, existing metal structural components hinder the thinning of electronic devices, thus impacting the trend towards lighter and thinner electronic devices. Utility Model Content

[0004] This application provides an electrical connector and an electronic device to solve the problem that metal structural components in existing electronic devices are not conducive to the thinning of electronic devices and affect the development trend of thinner and lighter electronic devices.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, an electronic device is provided, comprising a mid-frame, a circuit board, and an electrical connector. The mid-frame includes a middle plate and a frame. The circuit board is disposed on the middle plate. The electrical connector includes a base portion and a plurality of protrusions disposed on the surface of the base portion facing the middle plate or the circuit board, the protrusions having a size of less than 40 μm, and the electrical connector abutting between the middle plate and the circuit board.

[0007] The electronic device provided in the first aspect of this application reduces the size and weight of the protrusions, thereby contributing to the thinner and lighter design of the electronic device. Furthermore, more protrusions can be provided on the surface of the substrate, allowing for more current flow paths between the circuit board and the intermediate board, thus reducing the risk of RSE exceeding limits due to contact issues between individual protrusions and the intermediate board or circuit board.

[0008] Furthermore, due to the skin effect of conductors, the current flowing through a conductor tends to concentrate in the surface area. Therefore, the smaller the size of the protrusion, the smaller the contact area formed when the protrusion abuts against the circuit board or middle plate. This allows current to flow through most or even all of the contact area, which helps to ensure the stability of current flow.

[0009] In one possible implementation of the first aspect of this application, the size of the protrusion is greater than or equal to 10 μm and less than 40 μm.

[0010] In one possible implementation of the first aspect of this application, the size of the protrusion is equal to 10 μm.

[0011] In one possible implementation of the first aspect of this application, the height of the protrusion is less than 40 μm along the stacking direction of the middle plate and the circuit board.

[0012] In one possible implementation of the first aspect of this application, the density of the protrusions on the surface of the base portion is greater than or equal to 1*102 7 pcs / m 2 .

[0013] In one possible implementation of the first aspect of this application, the protrusion includes conductive particles, a portion of which is embedded within the substrate. This allows for the use of different materials to form the conductive particles based on actual needs; for example, a lower-cost conductive material can be selected, thereby reducing production costs.

[0014] In one possible implementation of the first aspect of this application, the conductive particles include a metal layer and non-metallic particles, with the metal layer encapsulating the non-metallic particles. For example, the non-metallic particles can be glass microspheres, diamond particles, etc., and the metal layer can include metallic materials such as nickel and silver.

[0015] In one possible implementation of the first aspect of this application, the conductive particles include metal particles. For example, the metal particles may include nickel particles, stainless steel particles, etc.

[0016] In one possible implementation of the first aspect of this application, the base portion and the protrusion are integrally formed. For example, the protrusion is formed on the surface of the base portion by a stamping process.

[0017] In one possible implementation of the first aspect of this application, multiple protrusions are provided on both surfaces of the substrate facing the middle plate and the circuit board. This allows the protrusions on both sides of the substrate to abut against the middle plate and the circuit board respectively, thereby forming multiple current flow channels between the substrate and the middle plate, and between the substrate and the circuit board, which helps to further reduce the risk of exceeding the RSE limit.

[0018] In one possible implementation of the first aspect of this application, the base portion has a ring-shaped structure.

[0019] In one possible implementation of the first aspect of this application, the base portion includes an abutting portion and an elastic portion. One end of the elastic portion is connected to the abutting portion and extends along the distribution direction of the middle plate and the circuit board, while the other end of the elastic portion extends towards the side closer to the middle plate or the circuit board. In this structure, when the base portion abuts between the middle plate and the circuit board, the elastic portion is compressed and undergoes elastic deformation, generating an elastic force. This elastic force enables the base portion to stably abut against the circuit board and the middle plate, thereby improving the reliability of the overall structure.

[0020] In a second aspect, an electrical connector is provided, which includes a base portion and a plurality of protrusions, the protrusions being disposed on one side surface of the base portion, and the size of the protrusions being less than 40 μm.

[0021] The electrical connector provided in the second aspect of this application, when abutting between the middle plate and the circuit board of an electronic device, has a smaller protrusion size, i.e., lighter weight, which is beneficial for the thinner and lighter design of the electronic device. Furthermore, more protrusions can be provided on the surface of the base portion, allowing for more current flow paths between the circuit board and the middle plate, thereby reducing the risk of RSE exceeding limits due to contact issues between individual protrusions and the middle plate or circuit board.

[0022] Furthermore, due to the skin effect of conductors, the current flowing through a conductor tends to concentrate in the surface area. Therefore, the smaller the size of the protrusion, the smaller the contact area formed when the protrusion abuts against the circuit board or middle plate. This allows current to flow through most or even all of the contact area, which helps to ensure the stability of current flow.

[0023] In one possible implementation of the second aspect of this application, the height dimension of the protrusion is less than 40 μm along the direction perpendicular to the surface of the base portion.

[0024] In one possible implementation of the second aspect of this application, the height of the protrusion is greater than or equal to 10 μm and less than 40 μm along the direction perpendicular to the surface of the base portion.

[0025] In one possible implementation of the second aspect of this application, the height of the protrusion is equal to 10 μm along the direction perpendicular to the surface of the base portion.

[0026] In one possible implementation of the second aspect of this application, the density of the protrusions on the surface of the base portion is greater than or equal to 1*102 7 pcs / m 2 .

[0027] In one possible implementation of the second aspect of this application, the protrusion includes conductive particles, a portion of which is embedded within the substrate. This allows for the use of different materials to form the conductive particles based on actual needs; for example, a lower-cost conductive material can be selected, thereby reducing production costs.

[0028] In one possible implementation of the second aspect of this application, the conductive particles include a metal layer and non-metallic particles, with the metal layer encapsulating the non-metallic particles. For example, the non-metallic particles can be glass microspheres, diamond particles, etc., and the metal layer can include metallic materials such as nickel and silver.

[0029] In one possible implementation of the second aspect of this application, the conductive particles include metal particles. For example, the metal particles may include nickel particles, stainless steel particles, etc.

[0030] In one possible implementation of the second aspect of this application, the base portion and the protrusion are integrally formed. For example, the protrusion is formed on the surface of the base portion by a stamping process.

[0031] In one possible implementation of the second aspect of this application, multiple protrusions are provided on both sides of the substrate. This allows the protrusions on both sides of the substrate to abut against the middle plate and circuit board of the electronic device, respectively, thereby forming multiple current flow channels between the substrate and the middle plate, and between the substrate and the circuit board, which helps to further reduce the risk of exceeding RSE limits.

[0032] In one possible implementation of the second aspect of this application, the base portion has a ring-shaped structure.

[0033] In one possible implementation of the second aspect of this application, the base portion includes an abutting portion and an elastic portion. One end of the elastic portion is connected to the abutting portion, and the other end of the elastic portion extends away from the base portion in the thickness direction of the base portion. In this structure, when the base portion abuts between the middle plate and the circuit board, the elastic portion is compressed and undergoes elastic deformation, generating an elastic force. This elastic force enables the base portion to stably abut against the circuit board and the middle plate, thereby improving the reliability of the overall structure. Attached Figure Description

[0034] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0035] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0036] Figure 3 A structural diagram of a gasket provided in an embodiment of this application;

[0037] Figure 4This is a connection structure diagram of the gasket, middle plate, and circuit board provided in the embodiments of this application;

[0038] Figure 5 A structural diagram of an electrical connector provided in an embodiment of this application;

[0039] Figure 6 A connection structure diagram of the electrical connectors, middle plate, and circuit board provided in the embodiments of this application;

[0040] Figure 7 This is a schematic diagram of the current distribution flowing through the convex hull provided in an embodiment of this application;

[0041] Figure 8 A schematic diagram showing the distribution of current flowing through a protrusion provided in an embodiment of this application;

[0042] Figure 9 Another schematic diagram showing the current distribution flowing through the protrusion provided in an embodiment of this application;

[0043] Figure 10 A front view of an electrical connector provided in an embodiment of this application;

[0044] Figure 11 A front view of another electrical connector provided in an embodiment of this application;

[0045] Figure 12 A structural diagram of another electrical connector provided in an embodiment of this application;

[0046] Figure 13 A cross-sectional view of a conductive particle provided in an embodiment of this application;

[0047] Figure 14 A cross-sectional view of another conductive particle provided in an embodiment of this application;

[0048] Figure 15 A cross-sectional view of another type of conductive particle provided in an embodiment of this application;

[0049] Figure 16 This is a structural diagram of a metal gasket provided in an embodiment of this application;

[0050] Figure 17 This is a structural diagram of another metal gasket provided in an embodiment of this application;

[0051] Figure 18 A structural diagram of another type of metal gasket provided in the embodiments of this application;

[0052] Figure 19 A structural diagram of another electrical connector provided in the embodiments of this application;

[0053] Figure 20A structural diagram of another base portion of the electrical connector provided in an embodiment of this application;

[0054] Figure 21 for Figure 20 Front view of the provided electrical connector;

[0055] Figure 22 A partial structural diagram of an electrical connector disposed on a circuit board according to an embodiment of this application;

[0056] Figure 23 A structural diagram of another base portion provided in an embodiment of this application;

[0057] Figure 24 This is a structural diagram of another base portion provided in an embodiment of this application.

[0058] Reference numerals: 10-Electronic device; 100-Display module; 110-Light-transmitting cover; 120-Display screen; 200-Housing shell; 210-Back cover; 220-Middle frame; 221-Border; 222-Middle plate; 300-Circuit board; 400-Electronic component; 500-Gasket; 510-Protrusion; 600-Electrical connector; 610-Base part; 610a-Abutting part; 610b-Elastic part; 611-Metal gasket; 612-Reinforcing steel sheet; 613-Shielding cover; 620-Protrusion; 621-Conductive particle; 621a-Metal particle; 621b-Metal layer; 621c-Non-metal particle. Detailed Implementation

[0059] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0060] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0061] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0062] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0063] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc. For ease of explanation, the following description uses a mobile phone as an example.

[0064] Please see Figure 1 and Figure 2 , Figure 1 This is a structural diagram of the electronic device 10 provided in the embodiments of this application. Figure 2 This is an exploded view of the electronic device 10 provided in an embodiment of this application. As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can have an approximately rectangular plate-like structure. The electronic device 10 may include a display module 100, a housing 200, a circuit board 300, and electronic components 400.

[0065] For ease of description below, an XYZ coordinate system is established, defining the width direction of electronic device 10 as the X-axis, the length direction of electronic device 10 as the Y-axis, and the thickness direction of electronic device 10 as the Z-axis. It is understood that the coordinate system of electronic device 10 can be flexibly set according to actual needs; this application only provides an example and should not be considered a specific limitation thereof. Figure 1 and Figure 2 The electronic device 10 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0066] The aforementioned display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover 110 and a display screen 120 (also known as a display panel), with the light-transmitting cover 110 and the display screen 120 stacked together. The material of the light-transmitting cover 110 includes, but is not limited to, glass. For example, the light-transmitting cover 110 can be a common light-transmitting cover 110, used to protect the display screen 120 from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 110 can also be a touch-enabled light-transmitting cover 110, enabling the electronic device 10 to have touch functionality, thus making it more convenient for users. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover 110.

[0067] Furthermore, the aforementioned display screen 120 can be a flexible display screen 120 or a rigid display screen 120. For example, the display screen 120 can be an organic light-emitting diode (OLED) display screen 120, an active-matrix organic light-emitting diode (AMOLED) display screen 120, a mini light-emitting diode display screen 120, a micro light-emitting diode display screen 120, a micro organic light-emitting diode display screen 120, a quantum dot light-emitting diode (QLED) display screen 120, or a liquid crystal display (LCD) display screen 120.

[0068] The aforementioned housing 200 is used to protect the electronic components 400 inside the electronic device 10. The housing 200 may include a rear cover 210 and a middle frame 220. The rear cover 210 is located on the side of the display screen 120 away from the light-transmitting cover plate 110 and is stacked with the light-transmitting cover plate 110 and the display screen 120. The middle frame 220 is located between the light-transmitting cover plate 110 and the rear cover 210. The middle frame 220 is fixedly connected to the rear cover 210. For example, the middle frame 220 and the rear cover 210 can be fixedly connected by means of adhesive, threaded connection, welding, snap-fit, etc.; or, the middle frame 220 can also be integrally formed with the rear cover 210, that is, the middle frame 220 and the rear cover 210 form a single structural component. The light-transmitting cover 110 can be glued to the middle frame 220 so that the light-transmitting cover 110, the rear cover 210 and the frame 221 form a receiving cavity inside the electronic device 10, and the circuit board 300 and electronic device 400 are all disposed in the receiving cavity.

[0069] In some embodiments, the aforementioned middle frame 220 may include a frame 221 and a middle plate 222. The frame 221, the light-transmitting cover 110, and the rear cover 210 form the aforementioned receiving cavity. The middle plate 222 is disposed within the receiving cavity and is located on the side of the display screen 120 away from the light-transmitting cover 110. The middle plate 222 is fixedly connected to the frame 221. Exemplarily, the middle plate 222 and the frame 221 can be fixedly connected by adhesive, threaded connection, welding, snap-fit, or other methods; alternatively, the middle plate 222 and the frame 221 can be an integrally formed structure, i.e., the middle plate 222 and the frame 221 form a single structural component. The middle plate 222 divides the aforementioned receiving cavity into two independent spaces. One space is located between the light-transmitting cover 110 and the middle plate 222, and the display screen 120 is located within this space. The other space is located between the middle plate 222 and the rear cover 210, and the aforementioned circuit board 300 is located within this space.

[0070] The aforementioned electronic device 400 is used to implement various functions of the electronic device 10. The electronic device 400 can be soldered onto the circuit board 300, or the electronic device can also be electrically connected to the circuit board 300 through a flexible connector, for example, the flexible connector can be an FPC board (Flexible Printed Circuit, flexible circuit board 300).

[0071] For example, the electronic device 400 can be a control chip (e.g., a system-on-chip, SOC), a graphics processing unit (GPU), universal flash storage (UFS), a camera module, a flash module, and capacitors, resistors, inductors, etc.

[0072] The aforementioned circuit board 300 is used to house the electronic components 400 inside the electronic device 10 and to achieve electrical connections between the electronic components 400. The circuit board 300 can be fixed to the middle plate 222 by means of adhesive bonding, threaded connection, soldering, snap-fit, etc. Therefore, this application does not impose any special limitations on the fixing method of the circuit board 300.

[0073] In some examples, circuit board 300 can be threadedly connected to intermediate plate 222 using screws, i.e., the circuit board 300 is fixed to intermediate plate 222 by screws. In electronic device 10, intermediate plate 222 can form the reference ground of electronic device 10, and circuit board 300 needs to be electrically connected to intermediate plate 222 (i.e., the two are in contact) to achieve grounding. Since there may be a certain gap between circuit board 300 and intermediate plate 222 when they are locked together by screws, the contact between them may be unstable, which may lead to the risk of exceeding the RSE (Radiated Spurious Emission) limit.

[0074] It is understood that the middle plate 222 can be made of metal, or it can be made of both metal and plastic. In this case, the part of the middle frame 220 made of metal forms a reference ground, i.e., the metal area of ​​the circuit board 300 contacts the metal area of ​​the middle plate 222 to achieve electrical connection between the two.

[0075] Based on this, please refer to Figure 3 and Figure 4 , Figure 3 This is a structural diagram of a gasket 500 provided in an embodiment of this application. Figure 4 This diagram illustrates the connection structure of the gasket 500, the middle plate 222, and the circuit board 300 provided in this embodiment. The aforementioned electronic device 10 may further include a gasket 500 with a protrusion 510 on its surface, and the aforementioned screws (such as…) Figure 4 (As shown by the dashed line) Passes through the circuit board 300, the gasket 500 and the middle plate 222 in sequence, and locks the circuit board 300, the gasket 500 and the middle plate 222 so that the gasket 500 abuts between the circuit board 300 and the middle plate 222. The protrusion 510 on the gasket 500 can abut with the circuit board 300 or the middle plate 222, thereby making the circuit board 300 and the middle plate 222 stably electrically connected through the protrusion 510.

[0076] However, the thickness of the spacer 500 with the protrusion 510 is generally large. For example, along the stacking direction of the middle plate 222 and the circuit board 300, i.e., the Z-axis direction, the overall thickness D of the spacer 500 and the protrusion 510 is greater than 0.2 mm, and the height of the protrusion 510 on the spacer 500 is generally 50 μm. Therefore, the large size along the Z-axis direction affects the overall thinning of the electronic device 10. Furthermore, if the protrusion 510 is removed, resulting in surface-to-surface contact between the spacer 500 and the middle plate 222, the risk of exceeding the RSE limit will also be higher.

[0077] To resolve the above issues, please refer to [link / reference]. Figure 5 and Figure 6 , Figure 5This is a structural diagram of an electrical connector 600 provided in an embodiment of this application. Figure 6 This is a connection structure diagram of the electrical connector 600, the middle plate 222 and the circuit board 300 provided in the embodiments of this application. The electrical connector 600 is applied in the above-mentioned electronic device 10, that is, the electrical connector 600 abuts between the middle plate 222 and the circuit board 300.

[0078] Specifically, the electrical connector 600 may include a base portion 610 and a plurality of protrusions 620. The protrusions 620 are disposed on the surface of the base portion 610, that is, a plurality of protrusions 620 are disposed on the surface of the base portion 610 facing the middle plate 222 or facing the circuit board 300, and the size of the protrusions 620 is less than 40 μm.

[0079] It is understandable that the size of the protrusion 620 being less than 40μm means that the maximum size of the protrusion 620 does not exceed 40μm, that is, the size of the protrusion 620 along different directions is less than 40μm. For example, along the Z-axis direction, the height L of the protrusion 620 is less than 40μm. Along the direction parallel to... Figure 1 and Figure 2 The dimensions in any direction within the XY plane shown are all less than 40 μm. Figure 5 The viewing angle of the electrical connector 600 shown is parallel to the XY plane. Furthermore, the dimensions of the protrusion 620 are also less than 40 μm in other directions within space.

[0080] Furthermore, the shape of the protrusion 620 can be hemispherical, a spherical structure formed by multiple multifaceted surfaces, or other irregular structures, etc. Therefore, this application does not impose any special limitations on it.

[0081] In some embodiments, the size of the protrusion 620 may be greater than or equal to 10 μm and less than 40 μm. For example, the height of the protrusion 620 along the Z-axis may be 10 μm. In the embodiments described below, the protrusion 620 is a hemispherical structure with a radius of 10 μm, that is, the height of the protrusion 620 along the Z-axis is 10 μm.

[0082] In this way, by reducing the size of the protrusion 620, for example, reducing the size of the protrusion 620 along the Z-axis, it is beneficial to reduce the thickness of the electronic device 10. Reducing the size of the protrusion 620 parallel to the XY plane can reduce the volume of the protrusion 620 and the size of the base portion 610, which is beneficial to reducing the mass of the electrical connector 600, thereby contributing to the thinning and lightening of the electronic device 10.

[0083] Furthermore, please continue reading Figure 5 and Figure 6By providing more protrusions 620 on the surface of the base portion 610, the number of protrusions 620 can be increased, and all protrusions 620 abut against the circuit board 300 or the middle plate 222, compared to Figure 4 The pad 500 with protrusion 510 shown, and the electrical connector 600, can create more current flow paths between the circuit board 300 and the middle plate 222, such as... Figure 4 and Figure 6 As indicated by the middle arrow, this reduces the risk of RSE exceeding the limit due to unstable contact between individual protrusions 620 and the middle plate 222 or circuit board 300.

[0084] It should be noted that when there is alternating current or an alternating electromagnetic field in a conductor, the current distribution inside the conductor is not uniform, and the current tends to concentrate on the outer surface of the conductor. This phenomenon is called the skin effect, and it is particularly noticeable in high-frequency signals. When the current density at a certain location inside the conductor decreases to 1 / e of the current density at the conductor surface, the distance from that location to the conductor surface is called the skin depth, which is denoted by the letter δ.

[0085] Since the communication frequency of electronic device 10 is a high-frequency AC signal, the communication signal of electronic device 10 will exhibit a skin effect when passing through the aforementioned electrical connector 600. It has been verified that most of the AC signal inside the conductor is distributed within a region of less than twice the skin depth of the conductor.

[0086] For example, with Figure 3 and Figure 4 The convex hull 510 shown is a hemispherical structure. Please refer to the following for further information. Figure 7 , Figure 7 This is a schematic diagram of the current distribution flowing through the convex hull 510 provided in an embodiment of this application. Figure 7 The shaded area represents the region where current flows.

[0087] The contact surface formed after the convex bulge 510 abuts against the surface of the circuit board 300 or the middle plate 222 is a circular structure, and the radius 'a' of this circle is within 10. -4 The skin depth of common metallic conductors at high frequencies is twice that of 2δ at 10 μm, which is on the order of m. -6 At the m level, it is evident that a is much greater than 2δ. This means that in most areas of the contact surface after the convex hull 510 abuts against the circuit board 300 or the middle plate 222, no current flows. This is because the skin effect causes a large portion of the contact surface to be wasted, affecting the stability of current flow.

[0088] And for Figure 5 and Figure 6 Please refer to the electrical connector 600 shown. Figure 8 and Figure 9 , Figure 8This is a schematic diagram showing the current distribution flowing through the protrusion 620 provided in an embodiment of this application. Figure 9 This is a schematic diagram showing another distribution of current flowing through the protrusion 620 provided in an embodiment of this application.

[0089] Since the radius of the hemispherical structure formed by the protrusion 620 is less than 40 μm, for example, the radius of the protrusion 620 can be 10 μm, that is, the radius of the protrusion 620 can be 10 μm. -5 m level, even at 10 -6 The area of ​​the contact surface formed after the protrusion 620 abuts against the circuit board 300 or the middle plate 222 will be smaller than the radius of the protrusion 620. Therefore, the radius of the contact surface formed after the protrusion 620 abuts against the circuit board 300 or the middle plate 222 is in the range of m. -6 At the m level, that is, the radius 'a' of the contact surface formed by the protrusion 620 provided in this application after it abuts against the circuit board 300 or the middle plate 222 is approximately twice the skin depth 2δ (e.g., ...). Figure 8 As shown), even less than twice the skin depth 2δ, meaning that current flows through both contact surfaces (as shown). Figure 9 As shown), this arrangement ensures that most of the contact surface formed after the protrusion 620 abuts against the circuit board 300 or the middle plate 222 can carry current, thus guaranteeing the stability of current flow.

[0090] Based on this, the density of the protrusions 620 provided on the surface of the base portion 610 in the aforementioned electrical connector 600 can be greater than or equal to 1*10. 7 pcs / m 2 Specifically, the actual flow area of ​​the gasket 500 provided by the related technology can be calculated first; then the actual flow area of ​​a single protrusion 620 in the electrical connector 600 provided in this application can be calculated; finally, the density of the protrusion 620 of the electrical connector 600 provided in this application can be calculated based on the actual flow area of ​​the gasket 500 provided by the related technology.

[0091] In this way, the current-carrying effect of the electrical connector 600 provided in this application is similar to or the same as that of the gasket 500 provided in related technologies, while the size of the electrical connector 600 provided in this application embodiment is smaller, which is more conducive to the thinning and lightening of the electronic device 10. Moreover, the greater the density of the protrusions 620, the more current flow paths can be formed, resulting in better conductivity of the electrical connector 600 and a lower risk of exceeding the RSE limit.

[0092] In addition, please see Figure 10 , Figure 10 A front view of an electrical connector 600 provided in an embodiment of this application. The base portion 610 of the electrical connector 600 faces... Figure 6At least one of the two surfaces of the circuit board 300 or the intermediate plate 222 is provided with a protrusion 620. For example, the protrusion 620 is provided on the surface of the base portion 610 facing the circuit board 300. When the electrical connector 600 abuts between the circuit board 300 and the intermediate plate 222, the base portion 610 contacts the intermediate plate 222, and the protrusion 620 abuts against the circuit board 300. Conversely, the base portion 610 contacts the circuit board 300, and the protrusion 620 abuts against the intermediate plate 222.

[0093] Alternatively, please see Figure 11 , Figure 11 This is a front view of another electrical connector 600 provided in an embodiment of this application, wherein the base portion 610 of the electrical connector 600 faces... Figure 6 Both the surface of the circuit board 300 and the surface facing the middle plate 222 can be provided with protrusions 620. When the electrical connector 600 is disposed between the middle plate 222 and the circuit board 300, the protrusions 620 on both sides of the base portion 610 abut against the middle plate 222 and the circuit board 300 respectively, thereby helping to further reduce the risk of RSE exceeding the standard.

[0094] In some embodiments, please refer to Figure 12 , Figure 12 This is a structural diagram of another electrical connector 600 provided in an embodiment of this application. The protrusion 620 may include conductive particles 621, and the base portion 610 may include a metal gasket 611. A portion of the conductive particles 621 is embedded in the metal gasket 611, so that the portion of the conductive particles 621 exposed on the surface of the metal gasket 611 is used for contact with... Figure 3 The circuit board 300 or the middle board 222 shown is abutted.

[0095] For example, please refer to Figure 13 , Figure 13 This is a cross-sectional view of a conductive particle 621 provided in an embodiment of this application. The conductive particle 621 is a metal particle 621a, which may include, for example, nickel particles, stainless steel particles, etc. In some examples, please refer to... Figure 14 , Figure 14 This is a cross-sectional view of another conductive particle 621 provided in an embodiment of this application. The conductive particle 621 may further include a metal layer 621b, which encapsulates the metal particle 621a to form the conductive particle 621. Alternatively, please refer to... Figure 15 , Figure 15 This is a cross-sectional view of another conductive particle 621 provided in the embodiments of this application. The conductive particle 621 may also include non-metallic particles 621c and a metal layer 621b. For example, non-metallic particles 621c may include non-metallic materials such as glass microspheres and diamond particles, and metal layer 621b may include metallic materials such as nickel and silver.

[0096] Alternatively, the aforementioned protrusion 620 can also be formed on one side surface of the metal gasket 611 by stamping or other processes, that is, the protrusion 620 and the base portion 610 form an integral structure, which is beneficial to improving the overall strength of the electrical connector 600. Therefore, this application does not impose any special limitations on this.

[0097] Furthermore, the aforementioned metal gasket 611 and Figure 3 The circuit board 300 or the middle plate 222 is in contact, that is, the electrical connector 600 abuts between the circuit board 300 and the middle plate 222, thereby enabling an electrical connection between the circuit board 300 and the middle plate 222. For example, the material of the metal gasket 611 can be 301 stainless steel, brass, or other metal materials.

[0098] In some examples, please refer to Figure 16 and Figure 17 , Figure 16 This is a structural diagram of a metal gasket 611 provided in an embodiment of this application. Figure 17 This is a structural diagram of another metal gasket 611 provided in an embodiment of this application. The shape of the metal gasket 611 can be a closed annular structure, for example, the metal gasket 611 can be a circular ring or a square ring, etc. Figure 4 When the middle plate 222 and the circuit board 300 are connected by screws, the metal washer 611 can be fitted onto the screw so that the metal washer 611 can better absorb the floating height generated by the screw, thereby reducing the risk of unstable electrical connection between the circuit board 300 and the middle plate 222 due to the gap.

[0099] For example, please refer back to the reference. Figure 12 , Figure 12 The metal pad 611 shown is a circular ring structure. Conductive particles 621 are disposed on the metal pad 611, with the outer portion of the conductive particles 621 being hemispherical. The radius of each conductive particle 621 can be 10 μm, and the density of the conductive particles 621 on the surface of the metal pad 611 can be 1.5 * 10^6 μm. 8 pcs / m 2 .

[0100] Alternatively, please see Figure 18 , Figure 18 This is a structural diagram of another metal gasket 611 provided in an embodiment of this application. The metal gasket 611 can also be a non-closed annular structure; for example, the metal gasket 611 can be a three-quarters annular structure. Figure 4 When the middle plate 222 and the circuit board 300 are connected by screws, the metal washer 611 can be fitted onto the screw to absorb the buoyancy caused by the screw and ensure a stable electrical connection between the circuit board 300 and the middle plate 222.

[0101] For example, please refer to Figure 19 , Figure 19 This is a structural diagram of another electrical connector 600 provided in an embodiment of this application. Figure 19 The metal pad 611 shown is a three-quarters circular ring structure. Conductive particles 621 are disposed on the metal pad 611, with the outer portion of the conductive particles 621 being hemispherical. The radius of each conductive particle 621 can be 10 μm, and the density of the conductive particles 621 on the surface of the metal pad 611 can be 2*10^6. 8 pcs / m 2 .

[0102] In other examples, please refer to Figure 20 and Figure 21 , Figure 20 This is a structural diagram of another base portion 610 of the electrical connector 600 provided in an embodiment of this application. Figure 21 for Figure 20 The front view of the provided electrical connector 600 shows that the base portion 610 may include an abutment portion 610a and an elastic portion 610b. One end of the elastic portion 610b is connected to the abutment portion 610a. Along the thickness direction of the base portion 610, i.e., the Z-axis direction, the other end of the elastic portion 610b extends away from the base portion 610, i.e., the other end of the elastic portion 610b extends towards the side closer to the middle plate 222 or closer to the circuit board 300. For example, the base portion 610 is... Figure 18 and Figure 19 In the case of the metal gasket 611 with a three-quarter ring structure shown, one end of the metal gasket 611 is raised along the Z-axis direction to form an elastic part 610b.

[0103] In this structure, when the electrical connector 600 abuts between the middle plate 222 and the circuit board 300, the elastic part 610b is compressed and undergoes elastic deformation. Under the action of the elastic force generated by the elastic part 610b, the electrical connector 600 can abut more stably between the middle plate 222 and the circuit board 300, thereby further absorbing the floating height when the screw is tightened and reducing the risk of unstable electrical connection caused by the gap between the middle plate 222 and the circuit board 300.

[0104] Based on the above embodiments, please refer to Figure 22 , Figure 22This is a partial structural diagram of the electrical connector 600 provided in this application embodiment, disposed on the circuit board 300. Multiple electrical connectors 600 can be disposed between the circuit board 300 and the intermediate plate 222. The base portion 610 of the multiple electrical connectors 600, i.e., the metal pad 611, can have the same or different shapes. For example, one metal pad 611 can form a ring structure, and another metal pad 611 can form an irregular shape, so that the metal pad 611 does not affect the layout of other components on the circuit board 300.

[0105] In some other possible embodiments, please refer to Figure 23 , Figure 23 This is a structural diagram of another base portion 610 provided in an embodiment of this application. The base portion 610 can also be a reinforcing steel sheet 612. The reinforcing steel sheet 612 can be disposed on the circuit board 300. The reinforcing steel sheet 612 can be formed by embedding conductive particles 621 or by forming protrusions through a stamping process, so that the reinforcing steel sheet 612 can serve as an electrical connector 600 and abut against the circuit board 300 and the middle plate 222.

[0106] Alternatively, please see Figure 24 , Figure 24 This is a structural diagram of another base portion 610 provided in an embodiment of this application. The base portion 610 can also be a shield 613. The shield 613 is disposed on the circuit board 300. A protrusion 620 is formed on a portion of the shield 613 by embedding conductive particles 621 or by forming a protrusion using a stamping process. The protrusion 620 on the shield 613 abuts against the middle plate 222, thereby making the shield 613 serve as an electrical connector 600 between the circuit board 300 and the middle plate 222 to achieve a stable electrical connection between the circuit board 300 and the middle plate 222.

[0107] It is understood that the base portion 610 of the electrical connector 600 provided in this application embodiment can also be formed by other metal components inside the electronic device 10. That is, the protrusion 620 is formed on the metal component by embedding conductive particles 621 or by forming protrusions using a stamping process, so that the metal component can serve as the electrical connector 600 between the middle plate 222 and the circuit board 300. Therefore, this application does not impose any special limitations on the specific structural form of the base portion 610.

[0108] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0109] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: Mid-frame, including the middle plate and the edge; A circuit board is mounted on the middle plate; An electrical connector includes a base portion and a plurality of protrusions, the protrusions being disposed on the surface of the base portion facing the middle plate or the circuit board, the size of the protrusions being less than 40 μm, and the electrical connector abutting between the middle plate and the circuit board.

2. The electronic device according to claim 1, characterized in that, The size of the protrusion is greater than or equal to 10 μm and less than 40 μm.

3. The electronic device according to claim 2, characterized in that, The protrusion has a size of 10 μm.

4. The electronic device according to any one of claims 1-3, characterized in that, Along the stacking direction of the middle plate and the circuit board, the height of the protrusion is less than 40 μm.

5. The electronic device according to any one of claims 1-4, characterized in that, The density of the protrusions on the surface of the base portion is greater than or equal to 1*10. 7 pcs / m 2 .

6. The electronic device according to any one of claims 1-5, characterized in that, The protrusion includes conductive particles, and a portion of the conductive particles is embedded within the substrate.

7. The electronic device according to claim 6, characterized in that, The conductive particles include a metal layer and non-metallic particles, with the metal layer encapsulating the non-metallic particles.

8. The electronic device according to claim 6, characterized in that, The conductive particles include metal particles.

9. The electronic device according to any one of claims 1-5, characterized in that, The base portion and the protrusion portion are integrally formed.

10. The electronic device according to any one of claims 1-9, characterized in that, The base portion has multiple protrusions on both surfaces facing the middle plate and the circuit board.

11. The electronic device according to any one of claims 1-10, characterized in that, The base portion has a ring-shaped structure.

12. The electronic device according to any one of claims 1-10, characterized in that, The base portion includes an abutting portion and an elastic portion. One end of the elastic portion is connected to the abutting portion and extends along the distribution direction of the middle plate and the circuit board. The other end of the elastic portion extends toward the side closer to the middle plate or the circuit board.

13. An electrical connector, characterized in that, It includes a base portion and a plurality of protrusions, the protrusions being disposed on one side surface of the base portion, the size of the protrusions being less than 40 μm; the protrusions include conductive particles, a portion of which are embedded within the base portion.

14. The electrical connector according to claim 13, characterized in that, The height of the protrusion is less than 40 μm in a direction perpendicular to the surface of the base portion.

15. The electrical connector according to claim 14, characterized in that, Along a direction perpendicular to the surface of the base portion, the height of the protrusion is greater than or equal to 10 μm and less than 40 μm.

16. The electrical connector according to claim 15, characterized in that, Along a direction perpendicular to the surface of the base portion, the height of the protrusion is equal to 10 μm.

17. The electrical connector according to any one of claims 13-16, characterized in that, The density of the protrusions on the surface of the base portion is greater than or equal to 1*10. 7 pcs / m 2 .

18. The electrical connector according to any one of claims 13-17, characterized in that, The conductive particles include a metal layer and non-metallic particles, with the metal layer encapsulating the non-metallic particles.

19. The electrical connector according to any one of claims 13-17, characterized in that, The conductive particles include metal particles.

20. The electrical connector according to any one of claims 13-19, characterized in that, Multiple protrusions are provided on both sides of the base portion.

21. The electrical connector according to any one of claims 13-20, characterized in that, The base portion has a ring-shaped structure.

22. The electrical connector according to any one of claims 13-20, characterized in that, The base portion includes an abutting portion and an elastic portion. One end of the elastic portion is connected to the abutting portion. The other end of the elastic portion extends away from the base portion in the thickness direction.

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