Heat dissipation structure of photovoltaic inverter

Abstract

The utility model relates to the technical field of inverter heat dissipation, and discloses a heat dissipation structure of a photovoltaic inverter, which comprises a case, a mounting assembly and a heat dissipation assembly, and is characterized in that the top of the case is provided with an air outlet, and the bottom of the case is provided with an air inlet; the mounting assembly is arranged in the case, and a heating power device is suitable for being arranged on the mounting assembly; the heat dissipation assembly comprises a cooling fin set, a heat conduction mechanism and an air blowing mechanism, one side of the heat conduction mechanism is connected with the installation assembly, the other side of the heat conduction mechanism is connected with the cooling fin set, and the air blowing mechanism is arranged at the bottom of the case, located below the cooling fin set and suitable for inducing air from the air inlet and blowing air to the air outlet; according to the utility model, the overall heat dissipation structure in the case is optimized, heat generated by the photovoltaic inverter during long-time working can be effectively reduced, the heat dissipation effect is excellent, and the heat dissipation function is comprehensive.

Description

Technical Field

[0001] This utility model relates to the field of inverter heat dissipation technology, specifically to a heat dissipation structure for a photovoltaic inverter. Background Technology

[0002] With the widespread application of photovoltaic (PV) power generation systems, string PV inverters are widely used due to their advantages such as high modularity, convenient maintenance, and high maximum power point tracking (MPPT) efficiency. As a key device connecting PV modules and the grid, the stability and safety of the inverter's operation directly affect the power generation efficiency and lifespan of the entire PV system. During actual operation, the power devices inside the inverter (such as IGBT modules, inductors, and capacitors) continuously generate a large amount of heat under prolonged high-load operation. If heat dissipation is not timely and effective, it will not only cause the device temperature to rise, reducing its efficiency, but may even lead to device damage due to excessive temperature, thus affecting the stable operation of the inverter and even the entire system.

[0003] An existing string inverter cooling structure includes a chassis, an air duct structure, and a fan assembly. The chassis has an air intake at the bottom and symmetrical exhaust vents on both sides of the top outer wall, forming a "T"-shaped air duct structure. The inverter components are installed inside the chassis, and the fan assembly is located inside the chassis near the air intake. The fan assembly draws in cool air through the air intake, flows along the air duct structure through the inverter components, and then exhausts it through the exhaust vents. However, this string inverter cooling structure relies on a single heat dissipation path, resulting in incomplete and uneven heat dissipation, and it cannot effectively cope with the enormous heat generated by the photovoltaic inverter during prolonged high-load operation. Utility Model Content

[0004] In view of this, the present invention provides a heat dissipation structure for a photovoltaic inverter to solve the problems of uneven heat dissipation and poor heat dissipation effect of existing string inverter heat dissipation structures.

[0005] In a first aspect, this utility model provides a heat dissipation structure for a photovoltaic inverter, comprising:

[0006] The chassis has an air outlet at the top and an air inlet at the bottom;

[0007] Mounting components are disposed within the chassis, and the mounting components are adapted to mount heat-generating power devices;

[0008] A heat dissipation assembly includes: a heat sink assembly, a heat conduction mechanism, and a blower mechanism. One side of the heat conduction mechanism is connected to the mounting assembly, and the other side is connected to the heat sink assembly. The blower mechanism is disposed at the bottom of the chassis and below the heat sink assembly. The blower mechanism is adapted to draw air from the air inlet and blow air to the air outlet.

[0009] Beneficial effects

[0010] The top and bottom of the chassis feature air inlets and outlets. Combined with the heatsink assembly and air blower mechanism, this enables efficient and uniform heat dissipation from power components, significantly improving heat dissipation efficiency. The heat conduction mechanism, integrated with the heatsink assembly, effectively conducts heat from the power components to the heatsink, and the air blower mechanism accelerates heat dissipation, optimizing the airflow path within the chassis and enhancing the overall heat dissipation performance.

[0011] In one alternative embodiment, the mounting assembly includes an upper mounting plate and a lower mounting plate, the upper mounting plate being located above the lower mounting plate and close to the door side of the chassis.

[0012] In one optional embodiment, the heat conduction mechanism includes an upper heat conduction component and a lower heat conduction component. One side of the upper heat conduction component is connected to the upper mounting plate, and the other side is connected to the heat sink assembly. One side of the lower heat conduction component is connected to the lower mounting plate, and the other side is connected to the heat sink assembly.

[0013] Beneficial effects

[0014] The upper and lower heat-conducting components can quickly and evenly transfer the heat from the power device to the heat sink assembly, resulting in high heat transfer efficiency.

[0015] In one optional embodiment, the upper heat-conducting component includes: a first heat-conducting plate, one side of which is connected to the side of the upper mounting plate away from the heat-generating power device, and the other side is connected to one side of the heat sink assembly.

[0016] In one optional embodiment, the lower heat-conducting component includes: a second heat-conducting plate, a third heat-conducting plate, and a plurality of heat dissipation pipes. The second heat-conducting plate is connected to the side of the lower mounting plate away from the heat-generating power device. The third heat-conducting plate is connected to the other side of the heat sink assembly. The plurality of heat dissipation pipes are spaced apart on the other side of the second heat-conducting plate, and the lower end of each heat dissipation pipe is connected to the second heat-conducting plate, and the upper end is connected to the third heat-conducting plate.

[0017] Beneficial effects

[0018] The second heat-conducting plate conducts heat from the lower mounting plate and heat pipes to the heat sink assembly, while the third heat-conducting plate further transfers the heat emitted by the heat pipes to the heat sink assembly. Through multi-layered and multi-channel heat conduction paths, heat dissipation efficiency is significantly improved. The use of multiple heat pipes ensures more even heat distribution during conduction, further enhancing the heat dissipation effect.

[0019] In one alternative embodiment, the heat sink assembly includes a plurality of adjacent T-shaped heat sinks.

[0020] In one optional embodiment, the blower mechanism includes: a mounting housing and a fan, the mounting housing being disposed at the bottom of the chassis, the mounting housing having a mounting hole, and the fan being disposed in the mounting hole.

[0021] Beneficial effects

[0022] The fan draws in cool air from the air inlet and blows it onto the heat sink assembly, carrying away heat from the surface of the heat-generating power components and promoting rapid heat dissipation.

[0023] In one optional embodiment, a drying component is further included, the drying component comprising: a holding plate disposed above the blower mechanism, the holding plate having a plurality of partition grooves spaced apart, the partition grooves containing dried powder.

[0024] Beneficial effects

[0025] The drying component effectively absorbs moisture inside the chassis, preventing moisture buildup on electronic components and circuit boards of heat-generating power devices, and reducing the risk of electrical short circuits, corrosion, or damage caused by a humid environment. The drying powder absorbs moisture from the airflow blown in by the blower, maintaining a dry environment inside the chassis.

[0026] In one alternative embodiment, the drying assembly further includes drying plates disposed on the inner walls of both sides of the chassis.

[0027] In one alternative embodiment, a dustproof net is also included, which is disposed at the air inlet and the air outlet.

[0028] Beneficial effects

[0029] Dust filters can prevent external dust and debris from entering the chassis through the air outlet and air inlet. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a general schematic diagram of the heat dissipation structure of a photovoltaic inverter according to an embodiment of the present invention;

[0032] Figure 2This is a schematic diagram of the box structure according to an embodiment of the present utility model;

[0033] Figure 3 This is a schematic diagram of the heat dissipation structure according to an embodiment of the present utility model;

[0034] Figure 4 for Figure 3 A magnified view of part A in the diagram;

[0035] Figure 5 for Figure 3 A magnified view of part B in the diagram;

[0036] Figure 6 This is a schematic diagram of the hair dryer mechanism according to an embodiment of the present utility model;

[0037] Figure 7 This is a schematic diagram of the holding plate structure according to an embodiment of the present utility model;

[0038] Figure 8 for Figure 7 A magnified view of part C in the diagram.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Chassis; 11. Door;

[0041] 2. Install the components: 21. Upper mounting plate; 22. Lower mounting plate;

[0042] 31. Heat sink assembly; 3211. First heat conduction plate; 3221. Second heat conduction plate; 3222. Third heat conduction plate; 3223. Heat pipe; 33. Air blower mechanism; 331. Mounting housing; 332. Fan.

[0043] 41. Container plate; 42. Divider trough; 43. Drying plate;

[0044] 5. Dustproof netting. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0046] The following is combined Figures 1 to 8 The following describes embodiments of the present invention.

[0047] According to an embodiment of the present invention, a heat dissipation structure for a photovoltaic inverter is provided, comprising: a chassis 1, a mounting component 2, and a heat dissipation component. The chassis 1 has an air outlet at the top and an air inlet at the bottom. The mounting component 2 is disposed inside the chassis 1 and is adapted to mount heat-generating power devices. The heat dissipation component includes: a heat sink assembly 31, a heat conduction mechanism, and a blower mechanism 33. One side of the heat conduction mechanism is connected to the mounting component 2, and the other side is connected to the heat sink assembly 31. The blower mechanism 33 is disposed at the bottom of the chassis 1 and below the heat sink assembly 31. The blower mechanism 33 is adapted to draw air from the air inlet and blow air to the air outlet.

[0048] The chassis 1 includes a door 11 and a cabinet, with the door 11 rotatably mounted on the cabinet. An air outlet is located at the top of the chassis 1, and an air inlet is located at the bottom, forming an effective airflow path. Mounting components 2 and heat dissipation components are both housed within the chassis 1. The mounting components 2 support the heat conduction mechanism and mount the heat-generating power devices. The heat conduction mechanism transfers the heat generated by the heat-generating power devices to the heat sink assembly 31. A blower mechanism 33 at the bottom of the chassis 1 draws external cool air into the chassis 1 through the air inlet, carrying away the heat from the heat sink assembly 31 and the heat-generating power devices, before expelling it through the air outlet.

[0049] An efficient airflow path is formed inside the chassis 1, allowing cool air to enter smoothly. The cool air enters through the air inlet, passes through the heat sink assembly 31, and is blown out through the air outlet, carrying away the heat generated by the power devices. Simultaneously, the heat conduction mechanism accelerates heat transfer from the power devices, significantly improving heat dissipation efficiency and ensuring stable operation of the power devices under high loads. The connection between the heat conduction mechanism and the mounting assembly 2 optimizes the overall heat dissipation structure inside the chassis 1, ensuring stable temperature of the power devices, reducing the impact of temperature fluctuations on their performance, and extending their service life.

[0050] In one embodiment, the mounting assembly 2 includes an upper mounting plate 21 and a lower mounting plate 22, wherein the upper mounting plate 21 is located above the lower mounting plate 22 and close to the door 11 of the chassis 1.

[0051] Specifically, mounting component 2 is located in the upper middle part of chassis 1 and is used to fix and support the heat-generating power devices of the inverter, such as IGBT modules, inductors, and capacitors. The upper mounting plate 21 and the lower mounting plate 22 are arranged in a stepped manner. The left and right sides of the upper mounting plate 21 and the lower mounting plate 22 are fastened to the inner wall of chassis 1 by bolts to ensure that the heat-generating power devices can be stably installed inside chassis 1. Among them, high-heat-generating electrical components such as IGBT modules are installed on the lower mounting plate 22, while some low-heat-generating components such as inductors and capacitors are installed on the upper mounting plate 21.

[0052] In one embodiment, the heat sink assembly 31 includes a plurality of adjacent T-shaped heat sinks.

[0053] Specifically, multiple T-shaped heat sinks are connected closely together to form a T-shaped heat sink group 31. The cross-section of the T-shaped heat sink has a T-shaped structure with a large side wing area, which can increase the contact area with the air and enhance the heat dissipation effect. The T-shaped heat sink can be made of a metal material with high thermal conductivity, such as aluminum or copper, which can increase the speed at which heat is transferred from the heat conduction mechanism to the surface of the heat sink, while ensuring that the heat sink body has sufficient strength and rigidity.

[0054] In one embodiment, the heat conduction mechanism includes an upper heat conduction member and a lower heat conduction member. One side of the upper heat conduction member is connected to the upper mounting plate 21, and the other side is connected to the heat sink assembly 31. One side of the lower heat conduction member is connected to the lower mounting plate 22, and the other side is connected to the heat sink assembly 31.

[0055] Specifically, the heat-conducting plate can be made of high-purity aluminum plate or aluminum-copper composite plate, which has excellent thermal conductivity. One side of the upper and lower heat-conducting components is bonded to the mounting plate. When the power device is working, it will generate heat. The upper heat-conducting component conducts the heat from the upper mounting plate 21 to the heat sink assembly 31, and the lower heat-conducting component conducts the heat from the lower mounting plate 22 to the heat sink assembly 31, thereby achieving centralized heat dissipation from multiple heat sources.

[0056] In one embodiment, the upper heat-conducting component includes: a first heat-conducting plate, one side of which is connected to the side of the upper mounting plate 21 away from the heat-generating power device, and the other side of which is connected to one side of the heat sink assembly 31.

[0057] Specifically, the shape of the first heat-conducting plate is similar to that of the upper mounting plate 21, but its size is slightly smaller than that of the mounting plate. One side of the first heat-conducting plate is bonded to the back of the heating surface of the upper mounting plate 21, without directly contacting the heating power device. At the same time, the other side of the first heat-conducting plate is bonded to one side of the lower end of the heat sink assembly 31. Through the upper heat-conducting structure, the heat emitted by the heating power device can be transferred to the heat sink assembly 31, realizing the effective transfer and release of heat.

[0058] In one embodiment, the lower heat-conducting component includes: a second heat-conducting plate 3221, a third heat-conducting plate 3222, and a plurality of heat dissipation pipes 3223. The second heat-conducting plate 3221 is connected to the side of the lower mounting plate 22 away from the heat-generating power device, the third heat-conducting plate 3222 is connected to the other side of the heat sink assembly 31, and the plurality of heat dissipation pipes 3223 are spaced apart on the other side of the second heat-conducting plate 3221, with the lower end of the heat dissipation pipe 3223 connected to the second heat-conducting plate 3221 and the upper end connected to the third heat-conducting plate 3222.

[0059] Since the top surface of the lower mounting plate 22 is connected to the bottom surface of the heat sink assembly 31, the contact area between the lower mounting plate 22 and the heat sink assembly 31 is relatively small. Therefore, a lower heat-conducting component is required to achieve heat transfer. Specifically, one side of the second heat-conducting plate 3221 is attached and bonded to the back heating surface of the lower mounting plate 22 to collect the heat transferred from the heat-generating power device. Multiple heat dissipation pipes 3223 are spaced apart along the length of the second heat-conducting plate 3221, and the lower end of each heat dissipation pipe 3223 is tightly connected to the upper end of the second heat-conducting plate 3221 to ensure that heat can be quickly transferred into the heat dissipation pipe 3223. The third heat-conducting plate 3222 uses an L-shaped heat-conducting plate structure, which is simultaneously attached to the bottom and side surfaces of the other side of the T-shaped heat sink assembly 31. The L-shaped heat-conducting plate structure can be integrally formed or it can be formed by vertically splicing two "I"-shaped heat sinks. In this embodiment, the third heat-conducting plate 3222 is formed by vertically splicing two "I"-shaped heat-conducting plates. The upper end of each heat pipe 3223 is connected to the lower end of the third heat-conducting plate 3222. The heat pipe 3223 can have a hollow structure and be filled with a cooling medium, such as a coolant or other liquid that can dissipate heat quickly. The heat on the second heat-conducting plate 3221 can be conducted from bottom to top along the heat pipe 3223 to the third heat-conducting plate 3222, and finally diffused to the heat sink assembly 31, achieving layered distribution and uniform release of heat. The heat generated by the power device causes the coolant inside the heat pipe 3223 to evaporate. Subsequently, the coolant liquefies and releases heat at the upper part of the heat pipe 3223, transferring the heat from the power device to the heat sink assembly 31 through the second heat-conducting plate 3221, the third heat-conducting plate 3222, and the heat pipe 3223. A continuous heat conduction path is formed between the second heat-conducting plate 3221, the heat pipe 3223, and the third heat-conducting plate 3222, enhancing the conduction efficiency.

[0060] In one embodiment, the blower mechanism 33 includes: a mounting housing 331 and a fan 332. The mounting housing 331 is disposed at the bottom of the chassis 1, and a mounting hole is provided on the mounting housing 331. The fan 332 is disposed in the mounting hole.

[0061] Specifically, the mounting housing 331 is a rectangular shell, fixed to the bottom of the chassis 1, located above the air inlet and corresponding to it. Two mounting holes matching the size of the fans 332 are provided on the mounting housing 331. The two fans 332 are embedded and fixed in the mounting holes to prevent vibration and displacement during operation. The mounting housing 331 is made of engineering plastic or metal with good mechanical strength and corrosion resistance.

[0062] When fan 332 is working, it draws in outside air through the air inlet and directs the cool air toward the top of the chassis into the heat sink assembly 31 area. As the cool air flows over the surface of the heat sink, it carries away heat and is eventually exhausted from the air outlet at the top of the chassis 1, forming a stable airflow path.

[0063] In one embodiment, the heat dissipation structure of the photovoltaic inverter further includes a drying component, which includes a holding plate 41 disposed above the blower mechanism 33. The holding plate 41 is provided with a plurality of partition grooves 42 at intervals, and the partition grooves 42 contain drying powder.

[0064] Specifically, the mounting housing 331 has a mounting groove on its upper part, and the holding plate 41 is fixed in the mounting groove of the mounting housing 331. The holding plate 41 is made of heat-resistant and moisture-resistant plastic or metal. Multiple evenly distributed rectangular partition grooves 42 are opened on the holding plate 41 at intervals. Each partition groove 42 holds a certain amount of dry powder, such as silica gel, calcium chloride powder, molecular sieve, etc. In this embodiment, calcium chloride powder is used, which has excellent moisture absorption properties and can continuously absorb moisture from the cold air to keep the inside of the casing 1 dry. The holding plate 41 is located in the airflow path of the blower mechanism 33. The cold air entering the casing 1 will first come into contact with the holding plate 41. The cold air and the dry powder will come into full contact and be blown out with the cold air, which can dehumidify the cold air.

[0065] In one embodiment, the drying assembly further includes drying plates 43 disposed on the inner walls of both sides of the housing 1.

[0066] Specifically, two drying plates 43 are fixedly installed on the inner walls of both sides of the casing 1 using clips, screws, or sliding grooves, located near the cold air flow path. The cold air comes into contact with the drying plates 43 during its flow, further improving the overall dehumidification efficiency. The drying plates 43 can be made of materials with excellent moisture absorption properties, such as composite moisture-absorbing plates containing silica gel particles, activated alumina, or molecular sieves, possessing good moisture absorption capacity and service life. Alternatively, a box-type structure with replaceable drying media can be used for easy maintenance and replacement.

[0067] In one embodiment, a dustproof net 5 is also included, which is disposed at the air inlet and the air outlet.

[0068] Specifically, the dust filter 5 is installed at the bottom air inlet and top air outlet of the chassis 1, and is fixed by slots, screws, or magnetic structures. The dust filter 5 is made of finely woven stainless steel wire mesh, nylon mesh, or other synthetic materials with good corrosion resistance and tear resistance. The mesh size of the dust filter 5 is between 0.3mm and 1mm, which can effectively block dust particles without significantly hindering the flow of cold air.

[0069] Working Principle: High-heat-generating electrical components such as IGBT modules are mounted on the lower mounting plate 22, while low-heat-generating components such as inductors and capacitors are mounted on the upper mounting plate 21. The IGBT modules generate heat, which is transferred through the lower mounting plate 22 to the second heat-conducting plate 3221. The second heat-conducting plate 3221 then transfers the heat to the lower end of the heat sink 3223. The coolant in the heat sink 3223 evaporates upon heating, liquefies on the heat sink, and releases heat. Since the upper end of the heat sink 3223 is in contact with the third heat-conducting plate, the evaporated coolant liquefies again. Heat is then transferred from the heat sink to the third heat-conducting plate, and then to the heat sink assembly 31 for dissipation. Low-heat-generating components such as inductors and capacitors transfer heat through the upper mounting plate 21 to the first heat-conducting plate. The first heat-conducting plate transfers the heat to the heat sink assembly 31. Two sets of fans 332 deliver cool air into the chassis 1 through the air inlets and dissipate the heat from the heat sink assembly 31 to the outside of the chassis 1 through the air outlets.

[0070] The mounting plate 41 inside the housing 331 is filled with calcium chloride powder. The fan 332 draws cold air into the mounting plate 331. The cold air enters the multiple partition grooves 42 on the mounting plate 41. When passing through the partition grooves 42, the calcium chloride powder dries the cold air. At the same time, the two drying plates 43 on both sides of the chassis 1 further dry the air inside the chassis 1.

[0071] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A heat dissipation structure for a photovoltaic inverter, characterized in that, include: The chassis (1) has an air outlet at the top and an air inlet at the bottom; Mounting component (2), which is disposed inside the chassis (1), and the mounting component (2) is adapted to mount a heating power device; The heat dissipation assembly includes: a heat sink assembly (31), a heat conduction mechanism, and a blower mechanism (33). One side of the heat conduction mechanism is connected to the mounting assembly (2), and the other side is connected to the heat sink assembly (31). The blower mechanism (33) is located at the bottom of the chassis (1) and below the heat sink assembly (31). The blower mechanism (33) is adapted to draw air from the air inlet and blow air to the air outlet.

2. The heat dissipation structure of the photovoltaic inverter according to claim 1, characterized in that, The mounting assembly (2) includes an upper mounting plate (21) and a lower mounting plate (22), wherein the upper mounting plate (21) is located above the lower mounting plate (22) and close to the door (11) of the chassis (1).

3. The heat dissipation structure of the photovoltaic inverter according to claim 2, characterized in that, The heat conduction mechanism includes an upper heat conduction component and a lower heat conduction component. One side of the upper heat conduction component is connected to the upper mounting plate (21), and the other side is connected to the heat sink assembly (31). One side of the lower heat conduction component is connected to the lower mounting plate (22), and the other side is connected to the heat sink assembly (31).

4. The heat dissipation structure of the photovoltaic inverter according to claim 3, characterized in that, The upper heat-conducting component includes: a first heat-conducting plate, one side of which is connected to the side of the upper mounting plate (21) away from the heat-generating power device, and the other side is connected to one side of the heat sink assembly (31).

5. The heat dissipation structure of the photovoltaic inverter according to claim 3, characterized in that, The lower heat-conducting component includes: a second heat-conducting plate (3221), a third heat-conducting plate (3222), and a plurality of heat dissipation pipes (3223). The second heat-conducting plate (3221) is connected to the side of the lower mounting plate (22) away from the heat-generating power device. The third heat-conducting plate (3222) is connected to the other side of the heat sink assembly (31). The plurality of heat dissipation pipes (3223) are spaced apart on the other side of the second heat-conducting plate (3221), and the lower end of the heat dissipation pipe (3223) is connected to the second heat-conducting plate (3221), and the upper end is connected to the third heat-conducting plate (3222).

6. The heat dissipation structure of the photovoltaic inverter according to claim 1, characterized in that, The heat sink assembly (31) includes a plurality of adjacent T-shaped heat sinks.

7. The heat dissipation structure of the photovoltaic inverter according to claim 1, characterized in that, The blower mechanism (33) includes: a mounting housing (331) and a fan (332). The mounting housing (331) is located at the bottom of the chassis (1). The mounting housing (331) has a mounting hole, and the fan (332) is located in the mounting hole.

8. The heat dissipation structure of the photovoltaic inverter according to any one of claims 1-7, characterized in that, It also includes a drying component, which includes a holding plate (41) disposed above the blower mechanism (33), and a plurality of partition grooves (42) are provided on the holding plate (41) at intervals, wherein the partition grooves (42) contain drying powder.

9. The heat dissipation structure of the photovoltaic inverter according to claim 8, characterized in that, The drying assembly also includes drying plates (43) disposed on the inner walls of both sides of the housing (1).

10. The heat dissipation structure of the photovoltaic inverter according to claim 1, characterized in that, It also includes a dustproof net (5), which is disposed at the air inlet and the air outlet.

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