LED packaging device

Abstract

The utility model discloses an LED packaging device, and the device comprises a pedestal which is provided with a die bonding region; the light-emitting chip is fixedly arranged in the die bonding area; the reflecting layer is arranged on the base, and the height of the reflecting layer is smaller than that of the light-emitting chip; a preset gap is formed between the reflecting layer and the light-emitting chip, and the size of the preset gap is gradually increased in the direction away from the die bonding area; the light-transmitting layer surrounds the light-emitting chip and is arranged in the preset gap in a filling manner; and the packaging adhesive layer is arranged above the base and covers the light-emitting chip, the reflecting layer and the light-transmitting layer. The height of the reflecting layer is lower than that of the light-emitting chip, and a gap is formed between the reflecting layer and the side surface of the light-emitting chip, so that emergent light at the side part of the light-emitting chip can pass through the reflecting layer to be directly emitted and can also be projected to the reflecting layer to be reflected outwards through the reflecting layer, and the emergent light utilization rate of the light-emitting chip is greatly improved; therefore, the luminance of the LED packaging device is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diodes, and more specifically to an LED packaging device. Background Technology

[0002] With the development and maturation of LED technology, LED products are being used more and more widely in production and daily life, and people are increasingly pursuing high-brightness LEDs. Currently, the application of high-reflectivity white wall adhesive in LED products is relatively mature, and it significantly improves brightness. However, the current problem is that if the white wall adhesive is too thin, the reflective agent content will be insufficient, failing to achieve good reflection; if the white wall adhesive is too thick, the parts of the chip that are blocked from emitting light will not be able to emit light, resulting in lower actual brightness. Utility Model Content

[0003] The main technical problem this invention addresses is how to achieve high-brightness LED products.

[0004] To address the aforementioned technical problems, this application provides an LED packaging device, comprising:

[0005] The base has a bearing surface, on which a solidification region is formed;

[0006] A light-emitting chip is fixedly disposed in the die-bonding region;

[0007] A reflective layer surrounds the light-emitting chip and is fixedly disposed on the base. The height of the reflective layer relative to the supporting surface is less than the height of the light-emitting chip relative to the supporting surface. A preset gap exists between the reflective layer and the light-emitting chip, and the size of the preset gap gradually increases in the direction away from the die-bonding region.

[0008] A light-transmitting layer surrounds the light-emitting chip and fills the preset gap;

[0009] An encapsulating adhesive layer is disposed above the base, and covers the light-emitting chip, the reflective layer, and the light-transmitting layer therein.

[0010] In one embodiment, the height of the light-emitting chip above the height of the reflective layer is greater than or equal to 1 / 2 of the total height of the light-emitting chip.

[0011] In one embodiment, the height of the light-transmitting layer relative to the supporting surface is greater than or equal to the height of the light-emitting chip relative to the supporting surface.

[0012] In one embodiment, the light-transmitting layer covers the light-emitting chip along the side light-emitting surface and the top light-emitting surface of the light-emitting chip.

[0013] In one embodiment, the surface of the reflective layer opposite to the side-emitting surface of the light-emitting chip is an inclined surface or a curved surface.

[0014] In one embodiment, the reflective layer and the side of the base are aligned with the side of the LED package device.

[0015] In one embodiment, the LED packaging device further includes a support having a bottom wall and side walls surrounding the bottom wall, the bottom wall and the side walls forming an accommodating space; a base is formed on the bottom wall, and the light-emitting chip, the reflective layer, the light-transmitting layer and the encapsulating adhesive layer are all disposed within the accommodating space.

[0016] In one embodiment, all surfaces within the accommodating space, except for the die-bonding region, are covered by the reflective layer.

[0017] In one embodiment, a lens is further included, which covers the surface of the encapsulating adhesive layer away from the base and is fixed to the encapsulating adhesive layer.

[0018] In one embodiment, the surface of the lens is formed as a curved surface that convexes outward in a direction away from the light-emitting chip, or a plane parallel to the light-emitting surface of the light-emitting chip.

[0019] According to the LED packaging device of the above embodiment, since the height of the reflective layer is lower than that of the light-emitting chip, and there is a gap between the reflective layer and the side of the light-emitting chip, the light emitted from the side of the light-emitting chip can pass through the reflective layer and be emitted directly, or it can be projected onto the reflective layer and reflected outward by the reflective layer. Therefore, the light emission utilization rate of the light-emitting chip is greatly improved, thereby effectively increasing the luminous brightness of the LED packaging device. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the LED packaging device structure in the embodiments of this application.

[0021] Figure 2 This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0022] Figure 3 for Figure 2 Enlarged view of part A in the middle.

[0023] Figure 4 This is another schematic diagram of part A in an embodiment of this application.

[0024] Figure 5 This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0025] Figure 6This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0026] Figure 7 This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0027] Figure 8 This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0028] Figure 9 This is a schematic diagram of another embodiment of the LED packaging device in this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Base; 10-Bearing surface; 11-Die-bonding region;

[0031] 2-Light-emitting chip; 21-Top light-emitting surface; 22-Side light-emitting surface;

[0032] 3-Reflective layer;

[0033] 4-Transparent layer;

[0034] 5-Encapsulating adhesive layer;

[0035] 6-Bracket; 60-Accommodation space; 61-Bottom wall; 62-Side wall;

[0036] 7-Lens. Detailed Implementation

[0037] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0038] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0039] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0040] In related technologies, to improve the luminous effect of LED products, especially to enhance brightness, a white adhesive is typically incorporated into the LED packaging structure to improve reflectivity. However, if the white adhesive is too thin, the reflective agent content will be insufficient, resulting in inadequate reflection and a negligible effect on brightness enhancement. Conversely, if the white adhesive is too thick, it may obstruct the sides of the LED chip, preventing light emission from those sides and limiting overall light output, thus further restricting the overall brightness improvement.

[0041] To address the issue of poor brightness enhancement in LED products in related technologies, this application provides an LED packaging device. Please refer to... Figure 1 and Figure 2 The specific structure of the LED packaging device includes: a base 1 having a bearing surface 10, on which a die-bonding region 11 is formed; a light-emitting chip 2 fixedly disposed in the die-bonding region 11; a reflective layer 3 surrounding the light-emitting chip 2 and fixedly disposed in the base 1, wherein the height of the reflective layer 3 relative to the bearing surface 10 is less than the height of the light-emitting chip 2 relative to the bearing surface 10; a preset gap between the reflective layer 3 and the light-emitting chip 2, wherein the size of the preset gap gradually increases in the direction away from the die-bonding region 11; a light-transmitting layer 4 surrounding the light-emitting chip 2 and filling the preset gap; and an encapsulating adhesive layer 5 disposed above the base 1, covering the light-emitting chip 2, the reflective layer 3, and the light-transmitting layer 4 therein.

[0042] The LED packaging device in this application refers to a light-emitting device obtained by packaging an LED chip as a light source. The LED chip can be a standard LED chip or a flip-chip LED chip. Different types of LED chips can be selected according to the specific light emission color requirements, and multiple LED chips can be combined to form a complete light source. Accordingly, the light-emitting chip 2 in this application embodiment refers to at least one LED chip serving as the light source in the entire LED packaging device.

[0043] To support the various components, the LED packaging device in this embodiment includes a base 1, which has a support surface 10, typically considered as the front side of the base 1. Depending on specific design requirements, the base 1 is provided with a die-bonding region 11 corresponding to the fixing of the light-emitting chip 2, and an electrical connection portion disposed on the die-bonding region 11. This electrical connection portion can form an electrical connection with the light-emitting chip 2, thereby enabling the light-emitting chip 2 to be energized and emit light. Generally, the base 1 typically has one or two support surfaces 10. When there are two support surfaces 10, these two support surfaces 10 are located on two opposite surfaces of the base 1, forming a double-sided light-emitting LED packaging device.

[0044] The light-emitting chip 2 can be fixedly disposed on the die-bonding area 11 on the base 1 using a die-bonding material, wherein the light-emitting chip 2 is formed on the base 1 at a predetermined height; in order to improve the reflectivity and thus improve the luminous brightness of the LED package device, a reflective layer 3 is also disposed on the base 1. Based on the purpose of reflecting the light emitted by the light-emitting chip 2, the reflective layer 3 is disposed around the light-emitting chip 2, so the reflective layer 3 can reflect the light emitted by the light-emitting chip 2. In this embodiment, the reflective layer 3 can be a white adhesive layer. The reflective layer 3 can be disposed on the bearing surface 10 of the base 1, or on the side of the base 1, or even integrally formed with the base 1.

[0045] To avoid obstruction of the LED chip's side surface by the reflective layer 3, the height of the reflective layer 3 relative to the supporting surface 10 in this embodiment is less than the height of the light-emitting chip 2 relative to the supporting surface 10; in other words, the top of the light-emitting chip 2 is higher than the reflective layer 3. This arrangement ensures that, on the one hand, the top light-emitting surface 21 of the light-emitting chip 2 can emit light normally without any impact, and on the other hand, the top of the side light-emitting surface 22 of the light-emitting chip 2 can also emit light normally without being obstructed by the reflective layer 3, thereby improving the luminous brightness of the LED package device. Figure 3 As shown, Figure 3 The diagram shows a schematic of light emanating directly from the top of the side light-emitting surface 22 of the light-emitting chip.

[0046] Having solved the problem of unobstructed light emission from the top of the side-emitting surface 22 of the light-emitting chip 2, to ensure unobstructed light emission from the bottom of the side-emitting surface 22, the reflective layer 3 in this embodiment has a preset gap with the light-emitting chip 2. The size of this preset gap gradually increases along the direction away from the die-bonding region 11, that is, along the height direction of the light-emitting chip 2, the reflective layer 3 gradually moves away from the light-emitting chip 2. In this structure, on the one hand, the light emitted from the side-emitting surface 22 of the light-emitting chip 2 can be emitted outward through the gap between the light-emitting chip 2 and the reflective layer 3, avoiding obstruction of the side-emitting surface 22 by the reflective layer 3; on the other hand, the light emitted from the side-emitting surface 22, after being projected onto the reflective layer 3, is reflected towards the top-emitting surface 21 by the gradually increasing distance between the reflective layer 3 and the light-emitting chip 2 due to the increasing distance between them. This effectively increases the light emission of the light-emitting chip 2, thereby improving the overall brightness of the LED package. Figure 3 As shown, Figure 3 The diagram shows a schematic of light emitted from the bottom of the light-emitting surface 22 of the light-emitting chip being reflected outward by the reflective layer.

[0047] In order to fill the gap between the reflective layer 3 and the light-emitting chip 2, a light-transmitting layer 4 is also included. The light-transmitting layer 4 has high light transmittance, which allows the light emitted by the light-emitting surface 22 of the light-emitting chip 2 to be projected outward as much as possible.

[0048] In addition, to excite the light emitted by the light-emitting chip 2 to obtain the desired light color, and to mix the emitted light from the light-emitting chip 2 to make the light emission more uniform, the LED packaging device in this embodiment also has a packaging adhesive layer 5. The packaging adhesive layer 5 is disposed above the base 1, and the packaging adhesive layer 5 covers all components including the light-emitting chip 2, the reflective layer 3, and the light-transmitting layer 4. In this way, part of the light emitted by the light-emitting chip 2 is directly incident on the packaging adhesive layer 5, excited by the phosphor in the packaging adhesive layer 5 to produce light of the corresponding color and transmitted outward, and the other part is reflected by the reflective layer 3 and then projected onto the packaging adhesive layer 5, excited by the phosphor in the packaging adhesive layer 5 to produce light of the corresponding color and transmitted outward. Since the reflective layer 3 does not block the light emitted by the light-emitting chip 2, the amount of light emitted by the light-emitting chip 2 projected onto the packaging adhesive layer 5 is guaranteed, thereby increasing the light emission of the entire LED packaging device. The top surface of the reflective layer 3 can also reflect the light scattered in the encapsulating adhesive layer 5 outwards from the LED package device, thereby increasing the amount of light emitted from the LED package device and improving the brightness of the LED package device.

[0049] In some optional embodiments, to minimize the obstruction of light emission from the side-emitting surface 22 of the light-emitting chip 2 by the reflective layer 3, the height of the light-emitting chip 2 above the reflective layer 3 can be set to be greater than or equal to half the total height of the light-emitting chip 2. That is, at least half of the size of the light-emitting chip 2 is exposed outside the reflective layer 3, ensuring that at least half of the side-emitting surface 22 of the light-emitting chip 2 can emit light directly without being obstructed by the reflective layer 3. Simultaneously, thinning the reflective layer 3 reduces the amount of light emitted from the side-emitting surface 22 being reflected back to the light-emitting chip 2 by the reflective layer 3. Furthermore, to ensure sufficient reflectant content, the reflective layer 3 generally has a thickness of at least 1 / 4 of the light-emitting chip 2, thereby preventing poor display quality in the LED package due to insufficient reflectant content. Please refer to [reference needed]. Figure 4 , Figure 4 The diagram shows how light emitted from the side-emitting surface 22 is reflected back to the light-emitting chip 2 by the reflective layer 3.

[0050] In some alternative embodiments, please refer to Figure 5 To improve the uniformity of light emission, the height of the light-transmitting layer 4 relative to the supporting surface 10 is greater than or equal to the height of the light-emitting chip 2 relative to the supporting surface 10. The light-transmitting layer 4 is filled in a preset gap, that is, the light-transmitting layer 4 is disposed between the side light-emitting surface 22 of the light-emitting chip 2 and the reflective layer 3. Therefore, by setting the height of the light-transmitting layer 4 to be greater than or equal to the height of the light-emitting chip 2 relative to the supporting surface 10, the entire side light-emitting surface 22 of the light-emitting chip 2 can emit light through the light-transmitting layer 4, which improves the consistency of light emission from the side light-emitting surface 22 to a certain extent.

[0051] Additionally, in some alternative embodiments, please refer to Figure 6 To further improve the light emission consistency of the entire LED package, especially to unify the light emission effects of the top light-emitting surface 21 and the side light-emitting surface 22 of the light-emitting chip 2, the light-transmitting layer 4 can cover the light-emitting chip 2 along the side light-emitting surface 22 and the top light-emitting surface 21. In other words, the light-transmitting layer 4 is set to wrap around the light-emitting chip 2, so that the light emitted from either the top light-emitting surface 21 or the side light-emitting surface 22 must pass through the light-transmitting layer 4 before being emitted outwards before entering the encapsulating adhesive layer 5. Therefore, the light-transmitting layer 4 can, to a certain extent, ensure the consistency of the emitted light. Furthermore, due to the structural sequence, the light-transmitting layer 4 is set before the encapsulating adhesive layer 5. By setting the light-transmitting layer 4, the light-emitting chip 2 can be pre-cured, thereby preventing the light-emitting chip 2 from detaching from the base 1.

[0052] To enhance the reflective effect of the reflective layer 3 on the side-emitting surface 22 of the light-emitting chip 2, in some optional embodiments, the surface of the reflective layer 3 opposite to the side-emitting surface 22 of the light-emitting chip 2 is either inclined or curved. In other words, the surface of the reflective layer 3 opposite to the side-emitting surface 22 of the light-emitting chip 2 is a uniform surface, and can be switched between inclined and curved surfaces depending on the desired light emission effect. Please refer to... Figure 7 and Figure 8 Taking a curved surface as an example, in some optional embodiments, the surface of the reflective layer 3 opposite to the side light-emitting surface 22 of the light-emitting chip 2 is a concave curved surface that is concave inward along the direction away from the light-emitting chip 2, or a convex curved surface that is convex outward along the direction close to the light-emitting chip 2. The effect of the concave curved surface is that it can achieve light focusing to a certain extent. Therefore, by setting the concave curved surface, the light emitted by the LED package device can be more focused, its divergence angle is smaller, and the projection distance of the LED package device can be increased. On the other hand, if the surface is set as a convex curved surface, the divergence angle can be increased to a certain extent, thereby increasing the projection area of ​​the LED package device.

[0053] In some alternative embodiments, to further enhance the brightening effect of the reflective layer 3, please refer to... Figure 1 The reflective layer 3 extends along the bearing surface 10 of the base 1. The side of the reflective layer 3 and the side of the base 1 are aligned at the edge of the LED package device. That is, the side of the reflective layer 3, the side of the substrate 1 and the side of the LED package device are aligned and are on the same plane. The reflective layer 3 covers all surfaces of the bearing surface 10 except for the die bonding area 11, increasing the reflective surface area of ​​the reflective layer 3. The light emitted by the light-emitting chip 2 can be fully reflected by the reflective layer 3, improving the light efficiency.

[0054] In some alternative embodiments, please refer to Figure 2 To further enhance the luminous effect, the LED packaging device may also include a support 6. The support 6 has a bottom wall 61 and side walls 62 surrounding the bottom wall 61, which together form an accommodating space 60. A base 1 is formed on the bottom wall 61, and the light-emitting chip 2, reflective layer 3, light-transmitting layer 4, and encapsulating adhesive layer 5 are all disposed within the accommodating space 60. The base 1 can essentially be part of the support 6. The bottom wall 61 of the support 6 forms a bearing surface 10, and the light-emitting chip 2 is fixed within the bottom wall 61 of the support 6. The reflective layer 3 is also disposed on the bottom wall 61 of the support 6, surrounding the light-emitting chip 2. By providing the support 6, a certain range of the encapsulating adhesive layer 5 can be defined, reducing the divergence angle of the LED packaging device and increasing the projection distance. Furthermore, by providing the support 6, the components located within the accommodating space 60 can be protected, extending the lifespan of the LED packaging device.

[0055] In some optional embodiments, to further enhance the brightness of the reflective layer 3, all surfaces inside the accommodating space 60, except for the die-bonding area 11, are covered by the reflective layer 3. Specifically, all surfaces inside the accommodating space 60, including the bottom wall 61 and side walls 62 of the support 6 forming the accommodating space 60, enclose the inner surface of the accommodating space 60. Since the base 1 is formed on the bottom wall 61, the die-bonding area 11 on the bearing surface 10 of the base 1 is equivalent to the bottom wall 61 corresponding to the inner surface of the accommodating space 60. Without affecting the light emission of the light-emitting chip 2, the maximum coverage of the reflective layer 3 is to cover all areas except for the die-bonding area 11 of the light-emitting chip 2. Thus, without affecting the die bonding and light emission of the light-emitting chip 2, the light emitted by the light-emitting chip 2 can be fully reflected by the reflective layer 3, thereby further improving the brightness of the LED packaged device. In other words, in this embodiment of the application, the light output brightness of the LED package device is further improved by covering the bearing surface 10 of the bottom wall 61 of the bracket 6 with a reflective layer 3 except for the die bonding area 11, and by also covering the inner surface of the side wall 62 of the bracket 6 with a reflective layer 3.

[0056] In some alternative embodiments, to improve the light emission effect, the cross-sectional area of ​​the accommodating space 60 gradually increases in the direction away from the light-emitting chip 2. Specifically, the bracket 6 can be designed with a parabolic surface, which can track the refraction trajectory of light to achieve optimal light intensity distribution and reduce the possibility of scattering and glare; in addition, this design not only improves the utilization rate of light, but also ensures that the light is more uniform and soft, avoiding phenomena such as black holes or yellow circles.

[0057] In some alternative embodiments, please refer to Figure 9 To adjust the light emission effect, the LED packaging device in this embodiment may further include a lens 7, wherein the lens 7 is disposed on the surface of the encapsulating adhesive layer 5 away from the base 1 and fixed to the encapsulating adhesive layer 5. Depending on the specific light emission requirements, the lens 7 can be configured with a corresponding shape; wherein the surface of the lens 7 can be formed as a curved surface convex outward in a direction away from the light-emitting chip 2, or a plane parallel to the top light-emitting surface 21 of the light-emitting chip 2. Forming the surface of the lens 7 as a curved surface convex outward in a direction away from the light-emitting chip 2 can achieve better light focusing, making the light emission of the LED packaging device more concentrated.

[0058] According to the LED packaging device in the embodiments of this application, since the height of the reflective layer 3 is lower than that of the light-emitting chip 2, and there is a gap between the reflective layer 3 and the side of the light-emitting chip 2, the light emitted from the side of the light-emitting chip 2 can pass through the reflective layer 3 and be emitted directly, or it can be projected onto the reflective layer 3 and then reflected outward by the reflective layer 3. Therefore, the light emission utilization rate of the light-emitting chip 2 is greatly improved, thereby effectively increasing the luminous brightness of the LED packaging device.

[0059] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. An LED packaging device, characterized in that, include: The base has a bearing surface, on which a solidification region is formed; The light-emitting chip is fixedly disposed in the die-bonding region; A reflective layer surrounds the light-emitting chip and is fixedly disposed on the base. The height of the reflective layer relative to the supporting surface is less than the height of the light-emitting chip relative to the supporting surface. A preset gap exists between the reflective layer and the light-emitting chip, and the size of the preset gap gradually increases in the direction away from the die-bonding region. A light-transmitting layer surrounds the light-emitting chip and fills the preset gap; An encapsulating adhesive layer is disposed above the base, and covers the light-emitting chip, the reflective layer, and the light-transmitting layer therein.

2. The LED packaging device as described in claim 1, characterized in that, The height of the light-emitting chip is greater than or equal to 1 / 2 of the total height of the light-emitting chip, which is above the height of the reflective layer.

3. The LED packaging device as described in claim 1, characterized in that, The height of the light-transmitting layer relative to the supporting surface is greater than or equal to the height of the light-emitting chip relative to the supporting surface.

4. The LED packaging device as described in claim 3, characterized in that, The light-transmitting layer covers the light-emitting chip along the side light-emitting surface and the top light-emitting surface of the light-emitting chip.

5. The LED packaging device as described in claim 1, characterized in that, The surface of the reflective layer opposite to the side light-emitting surface of the light-emitting chip is an inclined surface or a curved surface.

6. The LED packaging device as described in claim 1, characterized in that, The reflective layer and the side of the base are aligned with the side of the LED package device.

7. The LED packaging device according to any one of claims 1-5, characterized in that, The LED packaging device further includes a support, the support having a bottom wall and side walls surrounding the bottom wall, the bottom wall and the side walls forming an accommodating space; The base is formed on the bottom wall, and the light-emitting chip, the reflective layer, the light-transmitting layer, and the encapsulating adhesive layer are all disposed within the accommodating space.

8. The LED packaging device as described in claim 7, characterized in that, All surfaces within the accommodating space, except for the die-bonding region, are covered by the reflective layer.

9. The LED packaging device as described in any one of claims 1-6, characterized in that, It also includes a lens that covers the surface of the encapsulating adhesive layer away from the base and is fixed to the encapsulating adhesive layer.

10. The LED packaging device as described in claim 9, characterized in that, The surface of the lens is formed as a curved surface that bulges outward in a direction away from the light-emitting chip, or a plane that is parallel to the light-emitting surface of the light-emitting chip.

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