Etching device for chip production

Abstract

The utility model discloses an etching device for chip production, which comprises an etching box, the outer wall of the etching box is fixedly connected with a protective frame, the inner part of the protective frame is fixedly connected with a peristaltic pump and a partition plate, the top of the partition plate is fixedly connected with an air pump, the outer wall of the etching box is fixedly connected with a vertical frame, and the vertical frame is fixedly connected with the outer wall of the etching box. A first electric push rod is fixedly connected into the vertical frame, a connecting piece of a hollow structure is fixedly connected to the top of the output end of the first electric push rod, a lifting plate is fixedly connected to one end of the connecting piece, and two reinforcing rods are fixedly connected to the bottom of the lifting plate. According to the utility model, the etching solution (HF) is driven by the peristaltic pump to continuously flow in the circulating pipe, and the vertical reciprocating motion of the wafer is combined, so that the local concentration gradient is avoided, the reaction uniformity is ensured, the air pump injects air to form a high-pressure environment, the bubble breakage and escape are accelerated, and the etching defect caused by the adhesion of bubbles on the surface of the wafer is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip processing equipment technology, and in particular to an etching device for chip production. Background Technology

[0002] Etching is an indispensable part of semiconductor manufacturing, primarily aimed at removing specific materials from the wafer surface or thin film through chemical reactions to form the desired circuit patterns or structures. Wet etching is a common form of etching, where the wafer is immersed in a solution containing specific chemicals, using a chemical reaction to dissolve the materials not protected by photoresist. For example, wet etching often uses hydrofluoric acid (HF) solution to etch silicon material, thereby achieving pattern transfer.

[0003] In existing technologies, air bubbles in the solution are difficult to eliminate effectively. Air bubbles adhering to the wafer surface can lead to inconsistent etching rates and defects. Although some devices use static immersion, the solution has poor fluidity and uneven concentration distribution in the reaction area, further affecting the uniformity of the etching effect. Therefore, we propose an etching device for chip manufacturing to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an etching device for chip manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An etching apparatus for chip manufacturing includes an etching chamber. A protective frame is fixedly connected to the outer wall of the etching chamber. A peristaltic pump and a partition are fixedly connected inside the protective frame. An air pump is fixedly connected to the top of the partition. A vertical frame is fixedly connected to the outer wall of the etching chamber. A first electric push rod is fixedly connected inside the vertical frame. A hollow connector is fixedly connected to the top of the output end of the first electric push rod. A lifting plate is fixedly connected to one end of the connector. Two reinforcing rods are fixedly connected to the bottom of the lifting plate. The bottom of the two reinforcing rods is fixedly connected to the same sealing cover. A second electric push rod is fixedly connected to the bottom of the lifting plate. A docking plate is fixedly connected to the bottom of the output end of the second electric push rod. A placement assembly is provided on the outer wall of the docking plate.

[0007] Preferably, the placement assembly includes four corrugated rods, two positioning rods are fixedly connected to the top of the docking plate, and two sinking plates are fixedly connected to the bottom of the docking plate. Both ends of the four corrugated rods are fixedly connected to the outer walls of the two sinking plates. Multiple wafers are placed separately by setting the placement assembly.

[0008] Preferably, the outer wall of the etching tank is fixedly connected to a liquid filling pipe, and an existing pump body is installed at one end of the liquid filling pipe to transport the etching solution.

[0009] Preferably, the outer wall of the etching chamber is fixedly connected to three circulation pipes, the input end of the peristaltic pump is fixedly connected to the outer wall of the etching chamber, the output end of the air pump is fixedly connected to the outer wall of the etching chamber, and one end of the three circulation pipes is fixedly connected to a flexible pump pipe. The peristaltic pump circulates and delivers the etching solution by squeezing the flexible pump pipe.

[0010] Preferably, the outer wall of the vertical frame is provided with a vertical groove, the inner wall of the vertical groove is slidably connected to the outer wall of the connector, and the vertical groove assists the connector in moving up and down.

[0011] Preferably, the outer wall of the lifting plate has two sliding holes, and the inner walls of the two sliding holes are slidably connected to the outer walls of the two positioning rods respectively.

[0012] Preferably, the outer wall of the sealing cover has two strip-shaped holes, the inner walls of the two strip-shaped holes are slidably connected to the outer walls of the two recessed plates respectively, and the contact surfaces between the strip-shaped holes and the recessed plates are sealed.

[0013] Compared with the prior art, the advantages of this utility model are:

[0014] This solution uses a peristaltic pump to drive the etching solution (HF) to flow continuously in the circulation tube. Combined with the up-and-down reciprocating motion of the wafer, it avoids local concentration gradients and ensures reaction uniformity. An air pump injects air to create a high-pressure environment, which accelerates the bursting and escape of bubbles and reduces etching defects caused by bubble adhesion on the wafer surface.

[0015] The electrically driven sealing cover tightly presses against the top of the etching chamber, significantly reducing the risk of HF volatilization and improving operational safety; the corrugated rod design achieves wafer separation and fixation while allowing sufficient solution contact, balancing positioning accuracy and reaction efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of an etching apparatus for chip manufacturing proposed in this utility model.

[0018] Figure 2 This is a cross-sectional structural diagram of an etching apparatus for chip manufacturing proposed in this utility model;

[0019] Figure 3 This utility model proposes an etching apparatus for chip manufacturing. Figure 2 A magnified structural diagram of part A in the diagram;

[0020] Figure 4 This is a partial three-dimensional structural diagram of an etching device for chip manufacturing proposed in this utility model.

[0021] In the diagram: 1. Etching tank; 2. Protective frame; 3. Peristaltic pump; 4. Baffle plate; 5. Air pump; 6. Liquid filling pipe; 7. Circulation pipe; 8. Vertical frame; 9. First electric push rod; 10. Connector; 11. Lifting plate; 12. Reinforcing rod; 13. Sealing cover plate; 14. Second electric push rod; 15. Connecting plate; 16. Positioning rod; 17. Sinking plate; 18. Corrugated rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] Depend on Figures 1-4 As shown, an etching apparatus for chip manufacturing is disclosed, comprising an etching chamber 1, a protective frame 2 fixedly connected to the outer wall of the etching chamber 1, a peristaltic pump 3 and a partition 4 fixedly connected inside the protective frame 2, an air pump 5 fixedly connected to the top of the partition 4, the protective frame 2 protecting the peristaltic pump 3 and the air pump 5, a liquid filling pipe 6 fixedly connected to the outer wall of the etching chamber 1, and three circulation pipes 7 fixedly connected to the outer wall of the etching chamber 1, the input end of the peristaltic pump 3 fixedly connected to the outer wall of the etching chamber 1, and the output end of the air pump 5 fixedly connected to the outer wall of the etching chamber 1, the peristaltic pump 3 circulates the etching solution (HF) in the etching chamber 1, causing the etching solution (HF) in the etching chamber 1 to flow.

[0024] A vertical frame 8 is fixedly connected to the outer wall of the etching chamber 1. A first electric push rod 9 is fixedly connected inside the vertical frame 8. A hollow connector 10 is fixedly connected to the top of the output end of the first electric push rod 9. The connector 10 is a rectangular structure. A vertical groove is opened on the outer wall of the vertical frame 8. The inner wall of the vertical groove is slidably connected to the outer wall of the connector 10.

[0025] One end of the connector 10 is fixedly connected to a lifting plate 11. As the first electric push rod 9 rotates, it drives the connector 10 and the lifting plate 11 to move downward. Two reinforcing rods 12 are fixedly connected to the bottom of the lifting plate 11. The bottom of the two reinforcing rods 12 is fixedly connected to the same sealing cover plate 13. A U-shaped sealing gasket is fixedly embedded in the bottom of the sealing cover plate 13. The bottom of the lifting plate 11 is fixedly connected to a second electric push rod 14. The bottom of the output end of the second electric push rod 14 is fixedly connected to a docking plate 15. The rotation of the second electric push rod 14 drives the docking plate 15 to move up and down.

[0026] The outer wall of the docking plate 15 is provided with a placement assembly, which includes four corrugated rods 18. Two positioning rods 16 are fixedly connected to the top of the docking plate 15. Two sliding holes are opened on the outer wall of the lifting plate 11. The inner walls of the two sliding holes are slidably connected to the outer walls of the two positioning rods 16 respectively. The lifting plate 11 moves up and down with the assistance of the two positioning rods 16.

[0027] The bottom of the docking plate 15 is fixedly connected to two recessed plates 17. The two ends of the four corrugated rods 18 are fixedly connected to the outer walls of the two recessed plates 17. The four corrugated rods 18 are arranged in pairs, one above the other. The outer wall of the sealing cover plate 13 has two strip holes. The inner walls of the two strip holes are slidably connected to the outer walls of the two recessed plates 17 respectively. The whole is made of corrosion-resistant material.

[0028] Working principle: In use, multiple wafers are placed between four corrugated rods 18. The two lower corrugated rods 18 serve as bottom supports, while the two upper corrugated rods 18 act as side limiters. The corrugated structure of the rods 18 allows for the separation of multiple wafers. As the first electric push rod 9 rotates, it moves the connector 10 and the lifting plate 11 downwards. The lifting plate 11 then moves the sealing cover 13 and the second electric push rod 14 downwards. The bottom of the sealing cover 13 presses against the top of the etching chamber 1, sealing its top and reducing the evaporation of the etching solution (HF), thus lowering the risk. As the multiple wafers are immersed in the etching solution (HF)... In the process, the air pump 5 operates to draw outside air into the etching chamber 1, creating a high-pressure environment inside the etching chamber 1 to quickly eliminate air bubbles in the etching solution (HF) and prevent the etching solution (HF) from carrying a large number of air bubbles. Meanwhile, the peristaltic pump 3 operates to continuously deliver the etching solution (HF) to the three circulation pipes 7 for discharge and re-enter the etching chamber 1. The second electric push rod 14 operates to drive the docking plate 15 to move up and down. The up and down movement of the docking plate 15 drives the two sinking plates 17 to move up and down, and multiple wafers move up and down with it. In conjunction with the discharge through the three circulation pipes 7, the etching solution (HF) can be made to flow, avoiding excessive concentration changes during the reaction.

[0029] It should be noted that, in actual use, an existing PLC controller can be added. The PLC controller is electrically connected to the first electric push rod 9, the second electric push rod 14, the peristaltic pump 3, and the air pump 5, which facilitates the control of the overall operation.

[0030] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. Furthermore, the structure and principle of the components known to those skilled in the art can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0031] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An etching apparatus for chip manufacturing, comprising an etching chamber (1), characterized in that, The outer wall of the etching tank (1) is fixedly connected to a protective frame (2). The inside of the protective frame (2) is fixedly connected to a peristaltic pump (3) and a partition (4). The top of the partition (4) is fixedly connected to an air pump (5). The outer wall of the etching tank (1) is fixedly connected to a vertical frame (8). The inside of the vertical frame (8) is fixedly connected to a first electric push rod (9). The top of the output end of the first electric push rod (9) is fixedly connected to a hollow connector (10). One end of the connector (10) is fixedly connected to a lifting plate (11). The bottom of the lifting plate (11) is fixedly connected to two reinforcing rods (12). The bottom of the two reinforcing rods (12) is fixedly connected to the same sealing cover plate (13). The bottom of the lifting plate (11) is fixedly connected to a second electric push rod (14). The bottom of the output end of the second electric push rod (14) is fixedly connected to a docking plate (15). The outer wall of the docking plate (15) is provided with a placement component.

2. The etching apparatus for chip manufacturing according to claim 1, characterized in that, The placement assembly includes four corrugated rods (18), two positioning rods (16) are fixedly connected to the top of the docking plate (15), and two sinking plates (17) are fixedly connected to the bottom of the docking plate (15). Both ends of the four corrugated rods (18) are fixedly connected to the outer walls of the two sinking plates (17).

3. The etching apparatus for chip manufacturing according to claim 1, characterized in that, The outer wall of the etching tank (1) is fixedly connected to a liquid supply pipe (6).

4. The etching apparatus for chip manufacturing according to claim 1, characterized in that, The outer wall of the etching tank (1) is fixedly connected to three circulation pipes (7), the input end of the peristaltic pump (3) is fixedly connected to the outer wall of the etching tank (1), and the output end of the air pump (5) is fixedly connected to the outer wall of the etching tank (1).

5. The etching apparatus for chip manufacturing according to claim 1, characterized in that, The outer wall of the vertical frame (8) is provided with a vertical groove, and the inner wall of the vertical groove is slidably connected to the outer wall of the connector (10).

6. The etching apparatus for chip manufacturing according to claim 2, characterized in that, The outer wall of the lifting plate (11) has two sliding holes, and the inner walls of the two sliding holes are slidably connected to the outer walls of the two positioning rods (16).

7. The etching apparatus for chip manufacturing according to claim 2, characterized in that, The outer wall of the sealing cover (13) has two strip holes, and the inner walls of the two strip holes are slidably connected to the outer walls of the two sinking plates (17).

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