Leftover material receiving mechanism

Abstract

The utility model provides a rim charge receiving mechanism which is arranged below a turnover mechanism of an ultrasonic stripping machine and comprises a light source assembly and a material receiving assembly which are arranged on a machine frame. The light source assembly can move up and down so as to adjust the distance between the light source assembly and the turnover mechanism. The material receiving assembly comprises a translation assembly arranged on the rack and a material receiving frame arranged on the translation assembly; the translation assembly can drive the material receiving frame to move horizontally, so that the material receiving frame can move to the position above the light source assembly after the light source assembly descends, and the material receiving frame can avoid the light source assembly when the light source assembly ascends. According to the embodiment, frame disintegrating slag falling during overturning of a chip product can be received, and the situation that the cleaning and maintenance difficulty is increased due to the fact that the frame disintegrating slag is scattered on equipment is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing equipment technology, specifically to an edge material receiving mechanism. Background Technology

[0002] In semiconductor chip manufacturing, before chip dicing, the wafer is adhered to a metal ring fixture using UV adhesive to facilitate subsequent edge trimming and stripping processes. The applicant, in utility model patent application number CN202322365754.4, proposed an integrated ultrasonic stripping machine. During the edge trimming process, the metal ring fixture with the adhered chip is fixed to the flipping module of the ultrasonic stripping machine. The edge trimming unit cuts off the edge of the chip. Simultaneously, a suction mechanism consisting of an air extraction pipe and a concentrator on the edge trimming unit sucks away the cut edge waste. After the edge is cut, the flipping module flips the metal ring fixture to facilitate subsequent stripping from the back of the fixture. However, the applicant discovered that during the edge trimming process, some of the cut edge waste is bounced off, preventing the suction mechanism from completely sucking it away. This results in uncollected waste fragments scattering into the equipment when the flipping module flips the chip, making cleaning difficult and posing significant challenges to equipment cleaning and maintenance. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model designs an edge material receiving mechanism, which can catch the falling edge debris when the flipping mechanism flips the chip, without affecting the supplementary lighting of the chip product.

[0004] This utility model is achieved through the following technical solution: an edge material receiving mechanism is set below the flipping mechanism of an ultrasonic dematerializer, including a light source assembly and a receiving assembly set on the frame; the light source assembly can move up and down to adjust the distance between it and the flipping mechanism;

[0005] The receiving assembly includes a translation component mounted on the frame and a receiving frame mounted on the translation component; the translation component can drive the receiving frame to move horizontally so that the receiving frame can move above the light source component after the light source component descends, and the receiving frame can avoid the light source component when the light source component rises.

[0006] The translation component includes two linear guide rails arranged parallel to each other on the frame, a guide rail plate connecting the two linear guide rails, a translation guide column arranged on the frame, a connecting plate arranged on the translation guide column and fixedly connected to the guide rail plate, and a translation cylinder installed on the frame for pushing the connecting plate to move along the guide column; the receiving frame is arranged on the guide rail plate.

[0007] The upper surface of the guide rail plate is provided with a placement cavity, and the receiving frame is placed in the placement cavity.

[0008] The bottom of the recessed cavity has several hollowed-out sections.

[0009] The light source assembly includes a lifting cylinder mounted on a frame, a light source mounting plate mounted on the telescopic end of the lifting cylinder, and a light source mounted on the light source mounting plate; the lifting cylinder can drive the light source mounting plate to move up and down.

[0010] A vertical guide post is vertically arranged on the lower surface of the light source mounting plate, and a linear bearing is arranged on the mounting plate of the frame, with the vertical guide post passing through the linear bearing.

[0011] Compared with the prior art, the embodiments of this application have the following beneficial effects: By setting a receiving component below the flipping mechanism of the ultrasonic dematerializer, the receiving component can move horizontally. When the flipping mechanism drives the chip product to flip, the receiving component moves to the bottom of the chip product to catch the falling frame debris and prevent the frame debris from scattering onto the equipment. During the edge cutting process, the receiving component resets, allowing the light source component to rise and approach the chip product to provide supplementary lighting for the chip product, making the equipment more accurate in positioning the product frame. Attached Figure Description

[0012] The accompanying drawings, which are provided to further illustrate this application and constitute a part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute a limitation thereof. In the drawings, the same reference numerals denote the same components.

[0013] Figure 1 This is a schematic diagram showing the edge material receiving mechanism of this utility model installed below the flipping mechanism of the ultrasonic descrambling machine.

[0014] Figure 2 This is a structural diagram of the edge material receiving mechanism of this utility model from one perspective.

[0015] Figure 3 This is a structural diagram of the edge material receiving mechanism of this utility model from another perspective.

[0016] Figure 4 This is a structural diagram of the guide rail plate and receiving frame of this utility model.

[0017] The reference numerals in the above figures are as follows: 100-flipping mechanism, 200-edge material receiving mechanism, 201-frame, 202-lifting cylinder, 203-vertical guide column, 204-linear bearing, 205-light source mounting plate, 206-light source, 207-linear guide rail, 208-guide rail plate, 209-material receiving frame, 210-translation guide column, 211-connecting plate, 212-translation cylinder, 213-placement cavity, 214-cutout, 215-mounting plate. Detailed Implementation

[0018] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0019] It should be noted that if the terms "first," "second," etc., are used in the specification, claims, and accompanying drawings of this application, they are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0020] In this application, when terms such as "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" are used, they indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0021] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0022] Furthermore, in this application, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] Example

[0025] This embodiment discloses an edge material receiving mechanism, such as... Figure 1 As shown, the edge material receiving mechanism 200 is located below the flipping mechanism 100 of the ultrasonic dematerializer. It is used to receive the edge fragments that fall from the chip product when the flipping mechanism 100 flips, and also to provide supplementary lighting to the chip product from below, so that the detection mechanism of the ultrasonic dematerializer can obtain a clearer image of the chip product, enabling the detection mechanism to more accurately locate the edge of the chip product and improve the edge removal quality.

[0026] Specifically, such as Figure 2 , 3 As shown, the edge material receiving mechanism 200 includes a light source assembly and a receiving assembly mounted on the frame 201 of the ultrasonic stripper. The light source assembly is movable vertically to adjust its distance from the flipping mechanism 100. The receiving assembly includes a translation component mounted on the frame 201 and a receiving frame 209 mounted on the translation component; the translation component can drive the receiving frame 209 to move horizontally, so that the receiving frame 209 can move above the light source assembly after the light source assembly descends, and can avoid the light source assembly when the light source assembly rises.

[0027] Specifically, the light source assembly is located directly below the carrier platform of the flipping mechanism 100. When the chip product is clamped on the carrier platform, the light source assembly can provide supplemental lighting to the chip product from below. By setting the light source assembly to be movable up and down, it allows the light source to rise and get closer to the chip product, ensuring the clarity of the image of the chip product acquired by the detection component of the ultrasonic dematerializer. When the light source descends, it provides enough space for the receiving frame 209 to move directly below the chip product.

[0028] The translation assembly includes two linear guide rails 207 parallel to each other on the frame 201, a guide rail plate 208 connecting the two linear guide rails 207, a translation guide post 201 mounted on the frame 201, a connecting plate 211 mounted on the translation guide post 201 and fixedly connected to the guide rail plate 208, and a translation cylinder 212 mounted on the frame 201 for pushing the connecting plate 211 to move along the guide post 201; the receiving frame 209 is mounted on the guide rail plate 208. When the translation cylinder 212 extends or retracts, it can drive the connecting plate 211 to move along the guide post 201, thereby causing the guide rail plate 208 to move along the two linear guide rails 207.

[0029] like Figure 4 As shown, the upper surface of the guide rail plate 208 is provided with a placement cavity 213, and the receiving frame 209 can be placed in the placement cavity 213. When it is necessary to clean the frame debris inside the receiving frame 209, the receiving frame 209 can be removed.

[0030] In addition, the bottom of the placement cavity 213 is provided with several hollows 214 to reduce the weight of the entire mechanism.

[0031] like Figure 2 As shown, the light source assembly includes a lifting cylinder 202 mounted on a frame 201, a light source mounting plate 205 mounted on the telescopic end of the lifting cylinder 202, and a light source 206 mounted on the light source mounting plate 205. Specifically, the telescopic end of the lifting cylinder 202 passes upward through the mounting plate 215 of the frame 201 and is fixed to the light source mounting plate 205. The light source 206 is mounted on the upper surface of the light source mounting plate 205 with screws. When the lifting cylinder 202 extends, it pushes the light source mounting plate 205 upward, bringing the light source 206 closer to the chip product. When the lifting cylinder 202 retracts, it lowers the light source mounting plate 205.

[0032] In addition, a vertical guide post 203 is vertically arranged on the lower surface of the light source mounting plate 205, and a linear bearing 204 is arranged on the mounting plate 215 of the frame 201, through which the vertical guide post 203 passes. When the lifting cylinder 202 drives the light source mounting plate 205 to rise or fall, the vertical guide post 203 also rises or falls accordingly, and the arrangement of the vertical guide post 203 can make the rise and fall of the light source mounting plate 205 more stable.

[0033] During the edge trimming process, the lifting cylinder 202 pushes the light source 206 upward, bringing it closer to the chip product to provide supplemental lighting. At this time, the receiving frame 209 is moved to the side away from the chip product. When the flipping mechanism 100 wants to flip the chip product, the lifting cylinder 202 first lowers the light source 206, then the translation component moves the receiving frame 209 between the chip product and the light source 206. Finally, the flipping mechanism 100 flips the chip product, and the edge debris on the chip product falls into the receiving frame 209.

[0034] This embodiment can catch the frame fragments that fall when the chip product is flipped, preventing the frame fragments from scattering onto the device and increasing the difficulty of cleaning and maintenance.

[0035] It should be noted that all features disclosed in this specification, or all steps in all methods or processes disclosed, may be combined in any way, except for mutually exclusive features and / or steps.

[0036] Furthermore, the specific embodiments described above are exemplary. Those skilled in the art can devise various solutions inspired by the disclosure of this utility model, and these solutions all fall within the scope of this utility model and its protection. Those skilled in the art should understand that this utility model specification and its drawings are illustrative and not intended to limit the scope of the claims. The scope of protection of this utility model is defined by the claims and their equivalents.

Claims

1. A material receiving mechanism, disposed below the flipping mechanism (100) of an ultrasonic dewatering machine, characterized in that, It includes a light source assembly and a receiving assembly mounted on a frame (201); the light source assembly is capable of moving up and down to adjust the distance between it and the flipping mechanism (100); The receiving assembly includes a translation component mounted on the frame (201) and a receiving frame (209) mounted on the translation component; the translation component can drive the receiving frame (209) to move horizontally so that the receiving frame (209) can move above the light source component after the light source component descends, and the receiving frame (209) can avoid the light source component when the light source component rises.

2. The edge material receiving mechanism according to claim 1, characterized in that, The translation component includes two linear guide rails (207) arranged parallel to each other on the frame (201), a guide rail plate (208) connecting the two linear guide rails (207), a translation guide column (210) arranged on the frame (201), a connecting plate (211) arranged on the translation guide column (210) and fixedly connected to the guide rail plate (208), and a translation cylinder (212) installed on the frame (201) for pushing the connecting plate (211) to move along the translation guide column (210); the receiving frame (209) is arranged on the guide rail plate (208).

3. The edge material receiving mechanism according to claim 2, characterized in that, The upper surface of the guide rail plate (208) is provided with a placement cavity (213), and the receiving frame (209) is placed in the placement cavity (213).

4. The edge material receiving mechanism according to claim 3, characterized in that, The bottom of the placement cavity (213) is provided with several hollowed-out holes (214).

5. The edge material receiving mechanism according to claim 1, characterized in that, The light source assembly includes a lifting cylinder (202) mounted on a frame (201), a light source mounting plate (205) mounted on the telescopic end of the lifting cylinder (202), and a light source (206) mounted on the light source mounting plate (205); the lifting cylinder (202) can drive the light source mounting plate (205) to rise and fall.

6. The edge material receiving mechanism according to claim 5, characterized in that, A vertical guide post (203) is vertically arranged on the lower surface of the light source mounting plate (205), and a linear bearing (204) is arranged on the mounting plate (215) of the frame (201), and the vertical guide post (203) passes through the linear bearing (204).

Images