Wafer carrying device

Abstract

The utility model relates to the field of semiconductor manufacturing equipment, and discloses a wafer carrying device, which comprises a carrying assembly, the carrying assembly comprises a mounting seat, a rotating device, a telescopic device and an adsorption device are arranged in the mounting seat, the telescopic device is arranged at the output end of the rotating device, and the adsorption device is arranged at the output end of the telescopic device. The rotating device is used for adjusting the telescopic direction of the telescopic device; the telescopic device is used for driving and adjusting the position of the adsorption device; according to the utility model, the telescoping direction of the telescoping device can be adjusted through the rotating device, and the adsorption device can telescope towards multiple directions in cooperation with the telescoping device so as to carry different wafers, so that the wafers can be carried and transferred more conveniently and rapidly, and the wafer carrying efficiency is higher; and the telescopic moving direction of the adsorption device can be adjusted through rotation of the rotating device in a narrow space so as to adsorb and carry wafers in different directions, the whole carrying process is more flexible, and the wafer carrying device can adapt to more variable wafer carrying work in the narrow space.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment, and in particular to a wafer handling device. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafer handling and transfer is a crucial step that requires high accuracy and efficiency. Traditional robotic arms lack flexibility in confined spaces and cannot perform actions such as double-range extension and rotation. They are ill-suited for handling various types of wafers, have low wafer handling and transfer efficiency, and are more prone to damaging wafers during the handling process. This is especially true in limited spaces, where they are even less able to meet the growing demands of the industry. Utility Model Content

[0003] The technical problem this utility model aims to solve is: how to make wafer handling more flexible and efficient. To solve the above technical problem, this utility model provides a wafer handling device, including a handling assembly. The handling assembly includes a mounting base, and the mounting base is provided with a rotating device, a telescopic device, and an adsorption device. The telescopic device is located at the output end of the rotating device, and the adsorption device is located at the output end of the telescopic device. The rotating device is used to adjust the telescopic direction of the telescopic device, and the telescopic device is used to drive and adjust the position of the adsorption device.

[0004] Preferably, the rotating device includes a first geared motor, which is disposed on one side of the mounting base. The output end of the first geared motor passes through the bottom wall of the mounting base and is connected to a rotating platform. The top surface of the rotating platform is fixedly connected to the telescopic device.

[0005] Preferably, the telescopic device includes a first telescopic module and a second telescopic module arranged in parallel, the first telescopic module and the second telescopic module being slidably connected, and the adsorption device being slidably connected to the second telescopic module.

[0006] Preferably, the first telescopic module is driven to connect to a first slider, the second telescopic module is fixedly connected to a fixing block, and the first slider is fixedly connected to the fixing block; the second telescopic module is slidably connected to a second slider on the side away from the fixing block, and the second slider is fixedly connected to the adsorption device.

[0007] Preferably, the adsorption device includes a non-contact suction cup or a soft-contact suction cup.

[0008] Preferably, the system further includes an adjustment component, which includes a mounting plate. The mounting plate is equipped with a lifting module and a second reduction motor. The second reduction motor is connected to the lifting module in a transmission manner. The lifting module is driven by a mounting bracket. The mounting bracket is fixedly connected to the mounting base and the first reduction motor.

[0009] Preferably, the mounting bracket includes a first plate and a second plate that are fixedly connected. The first plate is driven to the lifting module, and the second plate is fixedly connected to the mounting base and the first reduction motor. A support plate is provided between the first plate and the second plate.

[0010] Preferably, the mounting base is provided with a rotary cable chain, the mounting plate is provided with a lifting cable chain, and the rotating platform is provided with a telescopic cable chain.

[0011] Compared with the prior art, the wafer handling device provided in this embodiment of the present invention has the following advantages:

[0012] In this invention, the direction of extension and retraction of the telescopic device can be adjusted by the rotating device. In conjunction with the telescopic device, the position of the adsorption device at the end of the telescopic device can be adjusted more conveniently, so that the adsorption device can extend and retract in multiple directions to transport different wafers. This makes it easier and faster to transport and transfer wafers, resulting in higher wafer transport efficiency. Moreover, in a confined space, the direction of extension and retraction of the adsorption device can be adjusted by rotating the rotating device, thereby adsorbing and transporting wafers in different directions. The entire transport process is more flexible and can better adapt to the more varied wafer transport work in confined spaces. Attached Figure Description

[0013] Figure 1 This is a perspective view of the present invention;

[0014] Figure 2 This is a schematic diagram of the structure of this utility model in its retracted state;

[0015] Figure 3 This is a schematic diagram of the extended state of this utility model.

[0016] In the diagram: 1. Mounting base; 11. Rotary cable chain;

[0017] 2. Rotating device; 21. First geared motor; 22. Rotating platform;

[0018] 3. Telescopic device; 31. First telescopic module; 32. Second telescopic module; 33. First slider; 34. Fixing block; 35. Second slider; 36. Telescopic cable chain;

[0019] 4. Adsorption device;

[0020] 5. Mounting plate; 51. Lifting module; 52. Second geared motor; 53. Mounting bracket; 531. First plate; 532. Second plate; 533. Support plate; 54. Lifting cable chain. Detailed Implementation

[0021] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0022] like Figures 1 to 3 As shown, a preferred embodiment of the present invention provides a wafer handling device, which includes a handling component. The handling component includes a mounting base 1. The mounting base 1 is provided with a rotating device 2, a telescopic device 3, and an adsorption device 4. The telescopic device 3 is disposed at the output end of the rotating device 2, and the adsorption device 4 is disposed at the output end of the telescopic device 3. The rotating device 2 is used to adjust the telescopic direction of the telescopic device 3, and the telescopic device 3 is used to drive and adjust the position of the adsorption device 4.

[0023] Specifically, in conventional technical solutions, robotic arms used for wafer handling and transfer often have very complex structures and require a large amount of space. Due to their complex structure, wafer transfer efficiency is very low, and the transfer process can easily damage the wafer. In this embodiment, however, the rotating device 2 can adjust the extension and retraction direction of the telescopic device 3, allowing the telescopic device 3 to drive the adsorption device 4 at its end to extend and retract in different directions to handle wafers in different orientations. Once the adsorption device 4 has stably adsorbed the wafer, the telescopic device 3 can drive the adsorption device 4 and the wafer to retract to their original positions. Subsequently, the rotating device 2 drives the telescopic device 3, the adsorption device 4, and the wafer to rotate, thus realizing the wafer handling and transfer. The entire wafer handling and transfer process is smoother, more flexible, and more efficient. Furthermore, because the adsorption device 4 can move in any direction and adsorb the wafer, the handling device can meet different handling needs within a smaller space, enabling the handling and transfer of more and more different wafers more flexibly, and improving the space utilization and handling flexibility of the wafer handling device.

[0024] In some embodiments, the rotating device 2 includes a first geared motor 21, which is disposed on one side of the mounting base 1. The output end of the first geared motor 21 passes through the bottom wall of the mounting base 1 and is connected to a rotating platform 22. A telescopic device 3 is fixedly connected to the top surface of the rotating platform 22.

[0025] Specifically, the first geared motor 21, located on the outer side of the bottom wall of the mounting base 1, drives the rotating platform 22 located inside the mounting base 1 to rotate, thereby driving the telescopic device 3 and the adsorption device 4 on it to rotate. The first geared motor 21 is fixedly connected to the mounting base 1. The geared motor can reduce the rotation speed of the rotating platform 22 and precisely control the rotation angle of the rotating platform 22, so that the telescopic device 3 can accurately and stably face different directions. The telescopic device 3 can then more accurately drive the adsorption device 4 to move in different directions to adsorb the wafer. The accuracy of wafer adsorption and transportation is higher, and it is less likely to damage the wafer, reducing the risk of wafer transportation and transfer.

[0026] In some embodiments, the telescopic device 3 includes a first telescopic module 31 and a second telescopic module 32 arranged in parallel, the first telescopic module 31 and the second telescopic module 32 are slidably connected, and the adsorption device 4 is slidably connected to the second telescopic module 32.

[0027] Furthermore, the first telescopic module 31 is driven to be connected to the first slider 33, the second telescopic module 32 is fixedly connected to the fixing block 34, and the first slider 33 is fixedly connected to the fixing block 34; the second telescopic module 32 is slidably connected to the side away from the fixing block 34, and the second slider 35 is fixedly connected to the adsorption device 4.

[0028] Specifically, in this embodiment, the telescopic device 3 includes two telescopic modules, which can achieve double-range telescopic extension, increasing the range of movement of the adsorption device 4. The telescopic device 3 can drive the adsorption device 4 to move a longer distance, thereby adsorbing wafers at a greater distance. This allows the entire handling device to adjust the distance the adsorption device 4 moves according to the storage location of different wafers. As needed, the adsorption device 4 can adsorb and transport wafers over a larger range, thus meeting more diverse handling requirements.

[0029] In some embodiments, the adsorption device 4 includes a non-contact suction cup or a soft-contact suction cup. Specifically, the adsorption device 4 may employ a ceramic finger vacuum suction cup, thereby enabling more stable and reliable adsorption and transfer of the wafer.

[0030] In some embodiments, an adjustment component is also included. The adjustment component includes a mounting plate 5. The mounting plate 5 is provided with a lifting module 51 and a second reduction motor 52. The second reduction motor 52 is connected to the lifting module 51 in a transmission manner. The lifting module 51 is driven to be connected to a mounting bracket 53. The mounting bracket 53 is fixedly connected to a mounting base 1 and a first reduction motor 21.

[0031] Furthermore, the mounting bracket 53 includes a first plate 531 and a second plate 532 that are fixedly connected. The first plate 531 is driven to be connected to the lifting module 51, and the second plate 532 is fixedly connected to the mounting base 1 and the first reduction motor 21. A support plate 533 is provided between the first plate 531 and the second plate 532.

[0032] Specifically, in the actual wafer handling process, when the adsorption device 4 moves directly above the semi-circular wafer to be handled, it needs to be lowered to bring the repair device closer to the wafer for stable adsorption. Similarly, for wafers that need to be lowered, the adsorption device 4 needs to be lowered to a suitable height for safe placement, preventing the risk of wafer damage from falling. Therefore, it is necessary to set up an adjustment component to adjust the height of the mounting base 1 and the adsorption device 4 on it. The second reduction motor 52, in conjunction with the lifting module 51, can stably lower the height of the mounting base 1, reducing the adverse effects of vibration and ensuring stability, accuracy, and safety during wafer handling. Furthermore, the support plate 533 in the mounting bracket 53 further improves the structural stability and support strength, ensuring that the mounting base 1 does not vibrate or sway during lifting, further enhancing the stability of wafer handling.

[0033] In some embodiments, the mounting base 1 is equipped with a rotary cable chain 11, the mounting plate 5 is equipped with a lifting cable chain 54, and the rotating platform 22 is equipped with a telescopic cable chain 36. The cable chains enable the storage, traction, and protection of various pipes and lines. The rotary cable chain 11, in particular, is useful because the first reduction motor 21 drives the rotating platform 22 to rotate, facilitating the telescopic device 3 to drive the adsorption device 4 to extend and retract in different directions. The rotating platform 22 can rotate more than 360 degrees to adapt to a wider range of applications. Since the adsorption device 4 needs to be connected to a vacuum device via an air pipe, the air pipe and cable can easily become entangled during the rotation of the rotating platform 22, affecting the operation of the entire handling device. The rotary cable chain effectively stores and guides the air pipe and cable, ensuring the normal operation of the entire handling device.

[0034] In some embodiments, a plurality of wafer storage boxes are also included, which are arranged around the mounting base 1 and are used to store wafers. In one specific embodiment, the plurality of wafer storage boxes are evenly arranged along an arc, thereby facilitating the telescopic device 3 to drive the adsorption device 4 into different wafer storage boxes to transport and store wafers, resulting in higher wafer transport and transfer efficiency.

[0035] In summary, this utility model provides a wafer handling device that can adjust the orientation of the telescopic device 3 and the adsorption device 4 through the rotating device 2, thereby facilitating the telescopic device 3 to drive the adsorption device 4 to extend and retract in different directions, and thus adsorbing and storing wafers in different positions, greatly improving the wafer handling efficiency. At the same time, the entire handling device is more flexible and versatile, and can handle wafers located in different directions in a smaller space.

[0036] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of this utility model, and these improvements and substitutions should also be considered within the protection scope of this utility model.

Claims

1. A wafer handling device, characterized in that, The device includes a conveying assembly, which includes a mounting base. The mounting base is equipped with a rotating device, a telescopic device, and an adsorption device. The telescopic device is located at the output end of the rotating device, and the adsorption device is located at the output end of the telescopic device. The rotating device is used to adjust the telescopic direction of the telescopic device, and the telescopic device is used to drive and adjust the position of the adsorption device.

2. The wafer handling device according to claim 1, characterized in that, The rotating device includes a first geared motor, which is disposed on one side of the mounting base. The output end of the first geared motor passes through the bottom wall of the mounting base and is connected to a rotating platform. The top surface of the rotating platform is fixedly connected to the telescopic device.

3. The wafer handling device according to claim 1, characterized in that, The telescopic device includes a first telescopic module and a second telescopic module arranged in parallel, the first telescopic module and the second telescopic module being slidably connected, and the adsorption device being slidably connected to the second telescopic module.

4. The wafer handling device according to claim 3, characterized in that, The first telescopic module is driven and connected to a first slider, the second telescopic module is fixedly connected to a fixed block, and the first slider is fixedly connected to the fixed block; the second telescopic module is slidably connected to a second slider on the side away from the fixed block, and the second slider is fixedly connected to the adsorption device.

5. The wafer handling device according to claim 1, characterized in that, The adsorption device includes a non-contact suction cup or a soft-contact suction cup.

6. The wafer handling apparatus according to claim 2, characterized in that, It also includes an adjustment component, which includes a mounting plate. The mounting plate is equipped with a lifting module and a second reduction motor. The second reduction motor is connected to the lifting module in a transmission manner. The lifting module is driven to be connected to a mounting bracket. The mounting bracket is fixedly connected to the mounting base and the first reduction motor.

7. The wafer handling apparatus according to claim 6, characterized in that, The mounting bracket includes a first plate and a second plate that are fixedly connected. The first plate is driven to the lifting module, and the second plate is fixedly connected to the mounting base and the first reduction motor. A support plate is provided between the first plate and the second plate.

8. The wafer handling apparatus according to claim 7, characterized in that, The mounting base is equipped with a rotary cable chain, the mounting plate is equipped with a lifting cable chain, and the rotating platform is equipped with a telescopic cable chain.

Images