Variable-pitch chip testing device

Abstract

The utility model relates to the technical field of semiconductor chip testing, and particularly discloses a variable-pitch chip testing device which comprises a chip feeding mechanism, a transfer mechanism, a testing machine, a variable-pitch transfer mechanism, a carrier transfer mechanical arm and a good product discharging mechanism. The feeding mechanism sends out the storage carrier, the transfer mechanism conveys the testing carrier, and the testing machine carries out chip testing. And the variable-pitch transfer mechanism is used for adjusting the distance between the chips and matching the storage and test carriers. And the carrier transfer manipulator takes out the tested carriers, and the qualified product discharging mechanism stacks and stores qualified chips. According to the variable-pitch chip testing device provided by the utility model, the distance between the chips can be adjusted according to testing requirements in the testing process, so that the working space during chip testing is ensured, and the efficiency of the chips in the storage and transportation processes is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip testing technology, and in particular to a variable-gap chip testing device. Background Technology

[0002] Before a chip leaves the factory, it needs to be placed in a test carrier. Then, the test carrier containing multiple chips is sent to a chip tester, which performs unified functional tests on the multiple chips in the test carrier.

[0003] Generally, in order to ensure that each chip has sufficient testing space, the chip spacing between two adjacent chips in the test carrier is relatively large.

[0004] However, excessively large chip spacing leads to lower efficiency in chip storage and transportation. Conversely, using storage containers with smaller chip spacing to store and transport chips cannot meet the testing requirements of chip testing machines.

[0005] Therefore, this utility model is dedicated to developing a variable-pitch chip testing device that can adjust the chip spacing according to testing needs during the testing process, thereby ensuring the working space during chip testing and improving the efficiency of chip storage and transportation.

[0006] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0007] One objective of this invention is to provide a variable-pitch chip testing device that can adjust the chip spacing according to testing needs during the testing process, thereby ensuring both the working space during chip testing and improving the efficiency of chip storage and transportation.

[0008] To achieve the above objectives, this utility model provides a variable-gap chip testing device, comprising:

[0009] A chip feeding mechanism is used to feed out stacked storage carriers loaded with chips to be tested one by one.

[0010] The transit mechanism is used to transport test vehicles with chip spacing greater than that of the storage vehicle;

[0011] A chip testing machine is used to obtain a test carrier from the transfer mechanism and return the tested chip along with the test carrier to the transfer mechanism.

[0012] A variable-pitch transfer mechanism is used to remove chips from the storage carrier, adjust the chip spacing to match the test carrier, and then place each chip into the test carrier; and to remove chips from the test carrier, adjust the chip spacing to match the storage carrier, and then place each chip into the storage carrier.

[0013] A carrier transfer robot is used to remove the storage carrier containing the tested chips from the chip feeding mechanism.

[0014] A good product unloading mechanism is used to receive the storage carrier loaded with tested and qualified chips taken out by the carrier transfer robot, and to stack and store the storage carriers.

[0015] Optionally, the variable pitch transfer mechanism includes a variable pitch module for picking up each of the chips, and a suction head drive unit for driving the variable pitch module to move.

[0016] Optionally, the variable pitch module includes:

[0017] Several spaced-apart first chip picks;

[0018] A plurality of second chip picks, each second chip pick being located between two first chip picks;

[0019] The synchronous belt includes a first straight belt segment and a second straight belt segment with opposite directions of movement, wherein each of the first chip picks is fixed on the first straight belt segment and each of the second chip picks is fixed on the second straight belt segment;

[0020] A variable-pitch motor is connected to a synchronous belt drive to drive the synchronous belt to rotate, so that each of the first chip pick-up heads moves closer to or further away from each of the second chip pick-up heads.

[0021] Optionally, both the first chip suction head and the second chip suction head include a suction head body and a suction head Z-axis linear drive mechanism that drives the suction head body to move up and down.

[0022] Optionally, the suction head driving unit includes a suction head X-axis linear drive mechanism that drives the variable pitch module to move back and forth, and a suction head Y-axis linear drive mechanism that drives the suction head X-axis linear drive mechanism to move left and right.

[0023] Optional, also includes:

[0024] A defective unloading mechanism is used to stack and store storage carriers loaded with chips that have failed tests.

[0025] Optional, also includes:

[0026] An empty pallet feeding mechanism is used to feed out several stacked empty storage containers one by one.

[0027] The carrier transfer robot is also used to transfer the empty tray feeding mechanism to the defective unloading mechanism, so that the variable pitch transfer mechanism can put the unqualified chips into the empty storage carrier of the defective unloading mechanism.

[0028] Optionally, each of the feeding mechanisms and each of the unloading mechanisms includes:

[0029] The storage frame has a vehicle passageway in the middle for storage vehicles to pass through, and four limiting columns at the top of the storage frame to horizontally limit the storage vehicles.

[0030] A side-push cylinder is located on the storage frame and is used to laterally clamp the storage carrier at the second lowest position to prevent the storage carriers at the second lowest position and above from falling downward through the carrier passageway.

[0031] A lifting mechanism, located below the vehicle passageway, is used to support the first low-position storage vehicle;

[0032] A buffer rack, comprising two oppositely arranged feeding plates, with a gap between the two feeding plates for the lifting mechanism to pass through;

[0033] A linear drive mechanism for the carrier drives the lifting mechanism to reciprocate between the storage frame and the buffer rack.

[0034] Optionally, the transfer mechanism includes a first transfer platform, a second transfer platform, a transfer robot for transferring test vehicles between the first transfer platform and the second transfer platform, a first transfer linear drive mechanism for reciprocating the first transfer platform between the variable-pitch transfer mechanism and the second transfer platform, and a second transfer linear drive mechanism for reciprocating the second transfer platform between the first transfer platform and the chip tester.

[0035] Optionally, it also includes a cache platform and a cleaning air nozzle located on the side of the cache platform.

[0036] The beneficial effects of this utility model are as follows: It provides a variable-pitch chip testing device, which is equipped with a variable-pitch transfer mechanism that can adjust the chip pitch. During the testing stage, the variable-pitch transfer mechanism can adjust the chip pitch to a larger pitch that meets the requirements of the testing machine, ensuring that each chip has sufficient testing space. During the storage and transportation stage, the variable-pitch transfer mechanism can adjust the chip pitch to a smaller pitch, thereby improving the space utilization and transportation efficiency of the storage vehicle.

[0037] Therefore, the variable-pitch chip testing device provided by this utility model can adjust the chip spacing according to the testing needs during the testing process, thereby ensuring the working space during chip testing and improving the efficiency of chip storage and transportation. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A schematic diagram of the front view structure of the variable-pitch chip testing device provided in the embodiment;

[0040] Figure 2 A schematic diagram of the rear view structure of the variable-pitch chip testing device provided in the embodiment;

[0041] Figure 3 A schematic diagram of the variable pitch module provided in the embodiment;

[0042] Figure 4 This is a schematic diagram of the structure of each of the feeding and unloading mechanisms.

[0043] In the picture:

[0044] 1a. Chip feeding mechanism; 1b. Good product unloading mechanism; 1c. Defective product unloading mechanism; 1d. Empty tray feeding mechanism; 101. Storage frame; 1011. Carrier chute; 102. Side push cylinder; 103. Lifting mechanism; 104. Buffer rack; 105. Carrier linear drive mechanism; 106. Limiting column;

[0045] 2. Transfer mechanism; 201. First transfer platform; 202. Second transfer platform; 203. Transfer robot; 204. First transfer linear drive mechanism; 205. Second transfer linear drive mechanism;

[0046] 3. Chip testing machine;

[0047] 4. Variable pitch transfer mechanism; 401. Variable pitch module; 4011a. First chip suction head; 4011b. Second chip suction head; 4011a1. Suction head body; 4011a2. Suction head Z-axis linear drive mechanism; 4012. Variable pitch motor; 402. X-axis linear drive mechanism; 403. Y-axis linear drive mechanism;

[0048] 5. Vehicle transfer robot;

[0049] 6. Caching platform;

[0050] 7. Clean the air nozzle. Detailed Implementation

[0051] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0052] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0053] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0054] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0055] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0056] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0057] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0058] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0059] This invention provides a variable-pitch chip testing device suitable for chip testing applications. It can adjust the chip spacing according to testing needs during the testing process, thereby ensuring the working space during chip testing and improving the efficiency of chip storage and transportation.

[0060] See Figures 1-2 The variable-pitch chip testing device provided in this embodiment includes a chip feeding mechanism 1a, a transfer mechanism 2, a chip testing machine 3, a variable-pitch transfer mechanism 4, a carrier transfer robot 5, and a good product unloading mechanism 1b.

[0061] The chip feeding mechanism 1a is used to feed out stacked storage carriers containing chips to be tested one by one. The transfer mechanism 2 is used to transport test carriers with chip spacing greater than the storage carriers. The chip testing machine 3 is used to obtain test carriers from the transfer mechanism 2 and return the tested chips along with the test carriers to the transfer mechanism 2.

[0062] The variable pitch transfer mechanism 4 is used to remove the chips from the storage carrier and adjust the chip spacing to match the test carrier before placing each chip into the test carrier; and to remove the chips from the test carrier and adjust the chip spacing to match the storage carrier before placing each chip into the storage carrier.

[0063] The carrier transfer robot 5 is used to remove the storage carrier loaded with tested chips from the chip feeding mechanism 1a. The good product unloading mechanism 1b is used to receive the storage carrier loaded with tested and qualified chips removed by the carrier transfer robot 5, and to stack and store the storage carriers.

[0064] The variable-gap chip testing device provided in this embodiment operates as follows:

[0065] S10: Operation of chip feeding mechanism 1a:

[0066] The chip feeding mechanism 1a delivers stacked storage carriers one by one, providing storage carriers for the chip testing preparation process.

[0067] S20: Operation of variable pitch transfer mechanism 4:

[0068] The variable pitch transfer mechanism 4 takes out the chip from the storage carrier delivered by the chip feeding mechanism 1a.

[0069] The robotic arm adjusts the spacing between the chips according to the testing requirements to match the spacing of the testing carrier.

[0070] After adjusting the spacing, the robotic arm places the chip into the test carrier provided by the transfer mechanism 2.

[0071] S30: Operation of Transit Center 2:

[0072] Transfer station 2 is responsible for transporting test carriers with chip spacing greater than that of the storage carrier to chip testing machine 3.

[0073] S40: Chip Tester 3 Operation:

[0074] The chip tester 3 receives the test carrier from the transfer unit 2 and performs functional tests.

[0075] After the test is completed, the chip tester 3 sends the test carrier with the tested chip back to the transfer mechanism 2, and the transfer mechanism 2 then sends the test carrier back to the variable pitch manipulator.

[0076] S50: The variable pitch transfer mechanism 4 is operated again:

[0077] The variable pitch transfer mechanism 4 takes the tested chips delivered by the transfer mechanism 2 from the test carrier and adjusts the chip spacing to match the spacing of the storage carrier.

[0078] After the adjustment is completed, the robotic arm places the chip back into the storage carrier of the chip feeding mechanism 1a.

[0079] S60: Operation of Vehicle Transfer Robot 5:

[0080] The carrier transfer robot 5 removes the storage carrier loaded with the tested chips from the chip feeding mechanism 1a and places it into the good product unloading mechanism 1b;

[0081] S70: Operation of Good Product Feeding Mechanism 1b:

[0082] The good product unloading mechanism 1b receives the storage carriers taken out by the carrier transfer robot 5 and stacks the storage carriers for storage and transportation.

[0083] The variable-pitch chip testing device provided in this embodiment is equipped with a variable-pitch transfer mechanism 4 that can adjust the chip pitch. During the testing phase, the variable-pitch transfer mechanism 4 can adjust the chip pitch to a larger pitch that meets the requirements of the testing machine, ensuring that each chip has sufficient testing space. During the storage and transportation phase, the variable-pitch transfer mechanism 4 can adjust the chip pitch to a smaller pitch, thereby improving the space utilization and transportation efficiency of the storage vehicle.

[0084] Therefore, the variable-pitch chip testing device provided by this utility model can adjust the chip spacing according to the testing needs during the testing process, thereby ensuring the working space during chip testing and improving the efficiency of chip storage and transportation.

[0085] The variable pitch transfer mechanism 4 includes a variable pitch module 401 for picking up each of the chips, and a suction head drive unit for driving the variable pitch module 401 to move.

[0086] See Figure 3 The variable pitch module 401 includes several first chip pick-up heads 4011a, several second chip pick-up heads 4011b, a synchronous belt, and a variable pitch motor 4012, which are arranged at intervals.

[0087] Each second chip pick 4011b is located between two first chip picks 4011a. The timing belt includes a first straight belt segment and a second straight belt segment with opposite directions of movement, wherein each first chip pick 4011a is fixed to the first straight belt segment and each second chip pick 4011b is fixed to the second straight belt segment. The variable pitch motor 4012 is connected to the timing belt drive and drives the timing belt to rotate, so that each first chip pick 4011a moves closer to or further away from each second chip pick 4011b.

[0088] Both the first chip suction head 4011a and the second chip suction head 4011b include a suction head body 4011a1 and a suction head Z-axis linear drive mechanism 4011a2 that drives the suction head body 4011a1 to move up and down. The suction head drive unit includes a suction head X-axis linear drive mechanism 402 that drives the variable pitch module 401 to move back and forth, and a suction head Y-axis linear drive mechanism 403 that drives the suction head X-axis linear drive mechanism 402 to move left and right.

[0089] The X-axis linear drive mechanism 402, the Y-axis linear drive mechanism 403, and the Z-axis linear drive mechanism 4011a2 of the suction head cooperate with each other to drive the suction head body 4011a1 to move in the up, down, left, right, forward, and backward directions, thereby transferring the chip.

[0090] The variable-pitch chip testing device also includes a defective unloading mechanism 1c and an empty tray feeding mechanism 1d. The defective unloading mechanism 1c is used to stack and store storage carriers loaded with chips that have failed the test. The empty tray feeding mechanism 1d is used to deliver several stacked empty storage carriers one by one. The carrier transfer robot 5 is also used to transfer the empty tray feeding mechanism 1d to the defective unloading mechanism 1c, so that the variable-pitch transfer mechanism 4 can place the chips that have failed the test into the empty storage carriers of the defective unloading mechanism 1c.

[0091] The empty tray feeding mechanism 1d sends out an empty storage carrier, and then the carrier transfer robot 5 transfers the empty tray feeding mechanism 1d to the defective unloading mechanism 1c. The variable pitch transfer mechanism 4 can then put the unqualified chips into the empty storage carrier of the defective unloading mechanism 1c. After the storage carrier is full, the defective unloading mechanism 1c stacks and stores the storage carriers loaded with the unqualified chips.

[0092] See Figure 4 Each of the feeding mechanisms and the unloading mechanisms includes a storage frame 101, a side-push cylinder 102, a lifting mechanism 103, a buffer rack 104, and a carrier linear drive mechanism 105.

[0093] The storage frame 101 has a carrier passageway 1011 at its center for the passage of storage vehicles, and four limiting columns 106 at its top to horizontally limit the movement of the storage vehicles. A side-push cylinder 102 is located on the storage frame 101 and is used to laterally clamp the second lowest-positioned storage vehicle to prevent the second lowest-positioned and higher-positioned storage vehicles from falling downwards through the carrier passageway 1011. A lifting mechanism 103 is located below the carrier passageway 1011 and is used to receive the first lowest-positioned storage vehicle. The buffer rack 104 includes two oppositely arranged discharge plates, with a space between the two discharge plates for the lifting mechanism 103 to pass through. A carrier linear drive mechanism 105 drives the lifting mechanism 103 to reciprocate between the storage frame 101 and the buffer rack 104.

[0094] When it is necessary to transport the storage carrier from the storage box 101 to the buffer rack 104, the operation process is as follows:

[0095] ① The side-push cylinder 102 clamps the second lowest position storage vehicle to prevent the second lowest position and above storage vehicles from falling downwards;

[0096] ② The lifting mechanism 103 moves upward to receive the first low-position storage carrier, and then moves downward, so that the first low-position storage carrier moves through the carrier passage 1011 to a position lower than the storage frame 101.

[0097] ③ The linear drive mechanism 105 drives the lifting mechanism 103 to carry the storage vehicle to the buffer rack 104. The lifting mechanism 103 then lowers the storage vehicle and places it on the buffer rack 104.

[0098] The steps of transferring the storage vehicle from the buffer rack 104 to the storage box 101 are the reverse of the above process, and will not be described in detail in this embodiment.

[0099] The transfer mechanism 2 includes a first transfer platform 201, a second transfer platform 202, a transfer robot 203 for transferring test vehicles between the first transfer platform 201 and the second transfer platform 202, a first transfer linear drive mechanism 204 for reciprocating the first transfer platform 201 between the variable pitch transfer mechanism 4 and the second transfer platform 202, and a second transfer linear drive mechanism 205 for reciprocating the second transfer platform 202 between the first transfer platform 201 and the chip tester 3.

[0100] Initially, the test carrier is located in the first transfer platform 201. The variable-pitch transfer mechanism 4 removes the chip from the storage carrier, adjusts the spacing, and places it into the test carrier provided by the first transfer platform 201. Then, the first transfer linear drive mechanism 204 drives the first transfer platform 201 to a position close to the second transfer platform 202, and the transfer robot 203 transfers the test carrier to the second transfer platform 202. The second transfer linear drive mechanism 205 transfers the second transfer platform 202 to the chip tester 3, and the chip tester 3 removes the test carrier from the second transfer platform 202 and performs testing.

[0101] After the test is completed, the chip tester 3 sends the test carrier back to the second transfer platform 202. Then, the first transfer platform 201, the second transfer platform 202, the transfer robot 203, the first transfer linear drive mechanism 204, and the second transfer linear drive mechanism 205 cooperate to send the test carrier back to its initial position so that the variable pitch transfer mechanism 4 can take out the chip from the test carrier and put it back into the storage carrier.

[0102] The variable-pitch chip testing device also includes a buffer platform 6 and a cleaning nozzle 7 located on the side of the buffer platform 6. For chips that fail the test and need to be retested, the variable-pitch transfer mechanism 4 can first transfer them to the buffer platform 6 for buffering. Optionally, before placing them on the buffer platform 6, the chips can be transferred above the cleaning nozzle 7 to clean the bottom of the chips.

[0103] In summary, the variable-gap chip testing device provided in this embodiment has the following advantages:

[0104] ① High flexibility: The chip spacing can be adjusted according to test requirements through the variable pitch transfer mechanism 4, adapting to different test environments and requirements, and ensuring that each chip has sufficient test space.

[0105] ② Efficiency Improvement: In the warehousing and transportation stages, adjusting the chip spacing improves the space utilization and transportation efficiency of warehousing vehicles.

[0106] ③ High degree of automation: The entire testing process, including material feeding, testing, and unloading, is automated, reducing manual operation and lowering labor intensity and production costs.

[0107] ④ Clean and environmentally friendly: Equipped with a cleaning nozzle 7, it can clean chips that are abnormal during testing, ensuring the cleanliness of the chips and the accuracy of the test.

[0108] ⑤ Convenient retesting: For chips that need to be retested, they can be cached through the cache platform 6 for easy subsequent processing.

[0109] It should be noted that the linear drive mechanism mentioned in this utility model can be a cylinder, hydraulic cylinder, electric cylinder, or motor lead screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, brushless motor, or rotary cylinder, etc. This utility model does not limit the specific structural form of the linear drive mechanism and the rotary drive mechanism.

[0110] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A variable pitch chip testing device, characterized by, include: A chip feeding mechanism (1a) is used to feed out one by one a stack of storage carriers loaded with chips to be tested. Transfer mechanism (2), the transfer mechanism (2) is used to transport test vehicles with chip spacing greater than that of the storage vehicle; Chip tester (3), the chip tester (3) is used to obtain the test carrier from the transfer mechanism (2) and send the tested chip along with the test carrier back to the transfer mechanism (2). The variable pitch transfer mechanism (4) is used to take out the chips from the storage vehicle and adjust the chip spacing to match the test vehicle before putting each chip into the test vehicle. And for removing the chips from the test vehicle and adjusting the chip spacing to match the storage vehicle, and then placing each of the chips into the storage vehicle; Carrier transfer robot (5), the carrier transfer robot (5) is used to remove the storage carrier loaded with the tested chip from the chip feeding mechanism (1a); Good product unloading mechanism (1b) is used to receive the storage carrier loaded with the tested and qualified chips taken out by the carrier transfer robot (5) and stack the storage carriers.

2. The variable distance chip testing device of claim 1, wherein, The variable pitch transfer mechanism (4) includes a variable pitch module (401) for picking up each of the chips, and a suction head drive unit for driving the variable pitch module (401) to move.

3. The variable distance chip testing device of claim 2, wherein, The variable pitch module (401) includes: Several first chip picks (4011a) are arranged at intervals. A plurality of second chip picks (4011b), each second chip pick (4011b) being located between two first chip picks (4011a); The synchronous belt includes a first straight belt segment and a second straight belt segment with opposite directions of movement, wherein each of the first chip picks (4011a) is fixed on the first straight belt segment and each of the second chip picks (4011b) is fixed on the second straight belt segment; A variable pitch motor (4012) is connected to a synchronous belt drive to drive the synchronous belt to rotate, so that each of the first chip pick-up heads (4011a) moves closer to or further away from each of the second chip pick-up heads (4011b).

4. The variable distance chip testing device of claim 3, wherein, Both the first chip pick-up head (4011a) and the second chip pick-up head (4011b) include a pick-up head body (4011a1) and a pick-up head Z-axis linear drive mechanism (4011a2) that drives the pick-up head body (4011a1) to move up and down.

5. The variable distance chip testing device of claim 2, wherein The suction head drive unit includes a suction head X-axis linear drive mechanism (402) that drives the variable pitch module (401) to move back and forth, and a suction head Y-axis linear drive mechanism (403) that drives the suction head X-axis linear drive mechanism (402) to move left and right.

6. The variable distance chip testing device of claim 1, wherein, Also includes: A defective unloading mechanism (1c) is used to stack and store storage carriers loaded with chips that have failed the test.

7. The variable distance chip testing device of claim 6, wherein, Also includes: Empty pallet feeding mechanism (1d), which is used to feed out several stacked empty storage vehicles one by one; The carrier transfer robot (5) is also used to transfer the empty tray feeding mechanism (1d) to the defective unloading mechanism (1c) so that the variable pitch transfer mechanism (4) can put the unqualified chips into the empty storage carrier of the defective unloading mechanism (1c).

8. The variable distance chip testing device of claim 7, wherein, Each of the aforementioned feeding mechanisms and each of the aforementioned unloading mechanisms includes: The storage frame (101) has a vehicle passageway (1011) in the middle position for the storage vehicle to pass through, and the top of the storage frame (101) has four limiting columns (106) for horizontally limiting the storage vehicle. A side-push cylinder (102) is located on the storage frame (101) and is used to laterally clamp the second lowest position of the storage carrier to restrict the storage carriers at the second lowest position and above from falling down through the carrier passage (1011). A lifting mechanism (103) is located below the vehicle passageway (1011) and is used to support the first low-position storage vehicle. The buffer rack (104) includes two oppositely arranged feeding plates, and a gap space is provided between the two feeding plates for the lifting mechanism (103) to pass through; The vehicle linear drive mechanism (105) drives the lifting mechanism (103) to reciprocate between the storage box (101) and the buffer rack (104).

9. The variable distance chip testing device of claim 1, wherein, The transfer mechanism (2) includes a first transfer platform (201), a second transfer platform (202), a transfer manipulator (203) for transferring test vehicles between the first transfer platform (201) and the second transfer platform (202), a first transfer linear drive mechanism (204) for reciprocating the first transfer platform (201) between the variable pitch transfer mechanism (4) and the second transfer platform (202), and a second transfer linear drive mechanism (205) for reciprocating the second transfer platform (202) between the first transfer platform (201) and the chip tester (3).

10. The variable distance chip testing device of claim 1, wherein, It also includes a buffer platform (6) and a cleaning nozzle (7) located on the side of the buffer platform (6).

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