Annular cleaning device and semiconductor equipment
By designing a ring-shaped cleaning device, the device expands and is fixed to the inner wall of the chamber, and then blows and cleans through multiple nozzles. This solves the problem of cleaning liquid residue and confined spaces in semiconductor equipment, achieving efficient and stable cleaning results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MICROPOLARIS EQUIPMENT TECHNOLOGY CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-04-17
AI Technical Summary
Existing semiconductor equipment cleaning methods pose risks such as liquid residue interfering with reprocessing procedures and corroding equipment. Furthermore, manual wiping and nitrogen gun purging are difficult to effectively clean confined spaces, resulting in unstable particle distribution and affecting wafer yield.
Design an annular cleaning device, including an annular flexible body, an air inlet and multiple nozzles. Air is introduced through the air inlet to expand the flexible body and fix it to the inner side wall of the chamber. The nozzles perform multi-point blowing and cleaning of the inner side wall of the chamber. Combined with a lifting mechanism and an air supply unit, it achieves all-round cleaning.
It improves the cleanliness and efficiency of the inner wall of the chamber, overcomes the cleaning challenges of confined spaces, ensures the stability and coverage of cleaning, and reduces safety risks.
Smart Images

Figure CN224128158U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment, and more particularly to a ring cleaning device and semiconductor equipment. Background Technology
[0002] As precision manufacturing equipment, the cleanliness of semiconductor equipment directly impacts wafer processing quality. With increasingly stringent requirements for nanometer processes, controlling the number and size of particles within the equipment becomes increasingly crucial. To ensure processing quality, the equipment needs regular cleaning to meet users' stringent requirements for particle number and size.
[0003] Currently, the industry commonly uses a cleaning method that involves wiping various parts inside the process chamber with a special liquid (IPA or alcohol) and then using a nitrogen gun to blow away any remaining liquid. This method has two main drawbacks: first, residual special liquid can interfere with the reprocessing procedure; second, contact between some process gases and residual liquid and moisture may cause equipment corrosion at room temperature, and may even lead to explosions under high temperature and pressure, seriously threatening the lives and property of operators.
[0004] Due to the complex structure of semiconductor equipment, many small areas are difficult to clean effectively by hand. Existing manual wiping methods often backfire, leading to more unstable particle distribution and increasing the risk of low wafer yield. Although using a nitrogen gun to purge small spaces with a high flow rate of gas is a relatively safe and common practice, the cleaning effect is difficult to guarantee and cannot achieve the expected cleaning results due to the operator's operating habits and the randomness of holding the air gun. Utility Model Content
[0005] The present invention addresses the problem of providing a ring-shaped cleaning device and a semiconductor device for improving the cleaning effect of the inner sidewall of a cavity.
[0006] To address the aforementioned problems, this utility model provides an annular cleaning device, disposed on the inner sidewall of a cavity, for cleaning the inner sidewall of the cavity. The annular cleaning device includes: an annular flexible body having an annular cavity inside; an air inlet disposed on the annular flexible body and communicating with the annular cavity; and multiple nozzles disposed on the inner peripheral sidewall of the annular flexible body and communicating with the annular cavity.
[0007] Optionally, the annular cleaning device further includes: an angle adjustment structure for adjusting the angle of the nozzle, the angle adjustment structure including: a fixed seat disposed on the annular flexible body; a rotating element rotatably disposed on the fixed seat; a connecting pipe passing through the rotating element and the fixed seat, and one end of the connecting pipe communicating with the annular cavity; the nozzle is disposed at the end of the rotating element away from the fixed seat and communicating with the other end of the connecting pipe.
[0008] Optionally, the fixed base includes a concave spherical surface; the rotating element includes a convex spherical surface, the convex spherical surface and the concave spherical surface forming a spherical pair, so that the rotating element can rotate relative to the fixed base.
[0009] Optionally, the annular cleaning device further includes: an air intake assembly disposed on the annular flexible body, the air intake assembly including: a support structure including an arc-shaped through hole, the annular flexible body passing through the arc-shaped through hole, and the air inlet exposed on the support structure; and an air intake structure disposed on the support structure, the air intake structure including an air intake channel communicating with the air inlet.
[0010] Optionally, the air intake structure has an extending direction, which is perpendicular to the plane of the annular flexible body.
[0011] Optionally, the nozzle is provided on the side wall of the support structure facing the central region of the annular flexible body.
[0012] Optionally, the annular flexible body is made of an elastic material to increase in volume during airflow through the air inlet.
[0013] Optionally, the elastic material includes silicone rubber, fluororubber, or nitrile rubber.
[0014] Optionally, a plurality of the nozzles are arranged at equal angles along the circumference on the inner peripheral sidewall of the annular flexible body.
[0015] This utility model provides a semiconductor device, including: a cavity, including a chamber; a base, disposed inside the cavity; an annular cleaning device, disposed on the inner side wall of the cavity; a lifting mechanism, disposed at the bottom of the cavity, the output end of the lifting mechanism being connected to the base for driving the base to rise or fall to pass through the central region of the annular flexible body; and an air supply unit, connected to the air inlet of the annular cleaning device.
[0016] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:
[0017] The annular cleaning device provided in this embodiment is disposed on the inner sidewall of a cavity and is used to clean the inner sidewall of the cavity. The annular device includes an annular flexible body with an annular cavity inside. An air inlet is disposed on the annular flexible body and communicates with the annular cavity. Multiple nozzles are disposed on the inner peripheral sidewall of the annular flexible body and communicate with the annular cavity. When the annular cleaning device is working, air is introduced into the annular cavity through the air inlet. The annular flexible body expands due to the increased internal air pressure, increasing its volume. The annular flexible body can stably abut against and be fixed on the inner sidewall of the cavity. Gas is sprayed from the nozzles onto the inner sidewall of the cavity, achieving simultaneous multi-point blowing and cleaning of the inner sidewall of the cavity, improving the cleanliness of the inner sidewall of the cavity. In addition, through its specific structural design, this annular cleaning device can effectively address the technical challenge of cleaning in confined spaces in semiconductor equipment, thereby improving the efficiency and quality of equipment cleaning.
[0018] The semiconductor device provided in this embodiment includes: a cavity, including a chamber; a base, disposed inside the cavity; an annular cleaning device, disposed on the inner side wall of the cavity; a lifting mechanism, disposed at the bottom of the cavity, the output end of the lifting mechanism being connected to the base for driving the base to rise or fall, so that the side wall of the base passes through the central region of the annular flexible body; and an air supply unit, communicating with the air inlet of the annular cleaning device. When the semiconductor device is operating, the air supply unit is connected to the air inlet of the annular cleaning device, continuously supplying air to the annular cleaning device. This, combined with the annular flexible body and its internal annular cavity, and multiple nozzles located on the inner peripheral sidewall of the annular flexible body and communicating with the annular cavity, enables cleaning of the inner sidewall of the chamber. Furthermore, by driving the base upwards or downwards through a lifting mechanism, the sidewall of the base moves and passes through the central area of the annular flexible body, exposing the sidewall of the base to the spray range of the multiple nozzles of the annular cleaning device, achieving the effect of cleaning the sidewall of the base. This overcomes the technical shortcomings of existing handheld air guns, which are characterized by high randomness and difficulty in covering all areas. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the annular cleaning device according to an embodiment of the present invention;
[0020] Figure 2 yes Figure 1 Cross-sectional view at point AA;
[0021] Figure 3 yes Figure 1 Cross-sectional view at point BB;
[0022] Figure 4 This is a schematic diagram of a semiconductor device that uses a ring-shaped cleaning apparatus. Detailed Implementation
[0023] As can be seen from the background technology, existing annular cleaning devices have the following problems during operation. First, the operating space required for positioning or releasing the cover is relatively large. Second, excessive rotation of the cover can easily cause injury to personnel or equipment. These problems not only affect the efficiency of the equipment but may also threaten the safety of operators. Therefore, there is an urgent need for an improved annular cleaning device to solve these problems.
[0024] To address the aforementioned technical problems, this utility model provides an annular cleaning device mounted on the inner wall of a cavity for cleaning the inner wall. The annular device includes an annular flexible body with an annular cavity inside. An air inlet is located on the annular flexible body and communicates with the annular cavity. Multiple nozzles are located on the inner circumferential sidewall of the annular flexible body and communicate with the annular cavity. When the annular cleaning device is in operation, air is introduced into the annular cavity through the air inlet. The annular flexible body expands due to the increased internal air pressure, increasing its volume and allowing it to stably abut and fix against the inner wall of the cavity. Gas is sprayed from the nozzles onto the inner wall of the cavity, achieving simultaneous multi-point cleaning of the inner wall and improving its cleanliness. Furthermore, this annular cleaning device, through its specific structural design, effectively addresses the technical challenge of cleaning in confined spaces within semiconductor equipment, thereby improving the efficiency and quality of equipment cleaning.
[0025] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0026] refer to Figures 1 to 3 This utility model provides an annular cleaning device, which is disposed on the inner sidewall of a cavity and is used to clean the inner sidewall of the cavity. The annular cleaning device includes: an annular flexible body 100, including an annular cavity 101 inside it; an air inlet 102 disposed on the annular flexible body 100 and communicating with the annular cavity 101; and a plurality of nozzles 103 disposed on the inner peripheral sidewall of the annular flexible body 100 and communicating with the annular cavity 101.
[0027] The annular cleaning device provided in this embodiment is disposed on the inner sidewall of a cavity and is used to clean the inner sidewall of the cavity. The annular device includes an annular cavity 101 located inside it, an air inlet 102 disposed on the annular flexible body 100 and communicating with the annular cavity 101, and multiple nozzles 103 disposed on the inner peripheral sidewall of the annular flexible body 100 and communicating with the annular cavity 101. When the annular cleaning device is working, air is introduced into the annular cavity 101 through the air inlet 102, thereby causing the annular flexible body 100 to expand in volume due to air pressure. The annular flexible body 100 can stably abut against and be fixed on the inner sidewall of the cavity. Gas is sprayed from the nozzles 103 onto the inner sidewall of the cavity, realizing multi-point simultaneous blowing and cleaning of the inner sidewall of the cavity, improving the cleanliness of the inner sidewall of the cavity. In addition, through its specific structural design, this annular cleaning device can also effectively solve the technical problem of difficult cleaning in confined spaces in semiconductor equipment, thereby improving the efficiency and quality of equipment cleaning.
[0028] In this embodiment, the annular flexible body 100 includes an annular cavity 101 inside it.
[0029] The annular flexible body 100 is used for cleaning in semiconductor equipment. When gas is introduced into the annular cavity 101, the annular flexible body 100 is inflated, causing its volume to increase under air pressure. This results in a stable fit with the inner wall of the cavity, providing reliable positioning and a foundation for subsequent cleaning operations. Therefore, this device overcomes the technical shortcomings of handheld air gun cleaning, which involves high randomness, making the entire cleaning process more stable and controllable, thus improving the cleaning efficiency and quality of semiconductor equipment.
[0030] In this embodiment, the cross-section of the annular cavity 101 can be rectangular, square, circular, or elliptical.
[0031] In this embodiment, the material of the annular flexible body 100 includes an elastic material, and the annular flexible body 100 is adapted to increase in volume during the process of air passing through the air inlet 102.
[0032] The annular flexible body 100 is made of an elastic material, which gives it elasticity. When air is introduced through the air inlet 102, the annular flexible body 100 has the characteristic of increasing in volume when inflated. This allows the annular flexible body 100 to expand and stably abut against and fix itself to the inner side wall of the cavity, providing stable support for cleaning operations.
[0033] In this embodiment, the elastic material may include, but is not limited to, materials that are chemically resistant and have good elasticity, such as silicone rubber, fluororubber, or nitrile rubber.
[0034] In this embodiment, the air inlet 102 is disposed on the annular flexible body 100 and communicates with the annular cavity 101.
[0035] The air inlet 102 is located on the annular flexible body 100 of the annular cleaning device. Through communication with the annular cavity 101, gas is input. As gas is continuously introduced, the volume of the annular flexible body 100 increases, thereby forming a stable fit with the cavity wall. Therefore, it not only ensures the stability of the annular cleaning device, but also provides a gas source guarantee for subsequent multi-point simultaneous blowing and cleaning.
[0036] In this embodiment, a plurality of nozzles 103 are disposed on the inner peripheral sidewall of the annular flexible body 100 and communicate with the annular cavity 101.
[0037] Multiple nozzles 103 serve as the spraying elements of the annular cleaning device. By being set on the inner circumferential sidewall of the annular flexible body 100 and connected to the annular cavity 101, gas can be sprayed simultaneously from multiple points. This allows for comprehensive cleaning of the inner wall of the cavity during use, effectively solving the technical problems of high randomness and inability to maintain a fixed and continuous blowing when using traditional handheld air guns. This significantly improves the cleaning efficiency and quality of semiconductor equipment.
[0038] In this embodiment, a plurality of nozzles 103 are arranged at equal angles along the circumference on the inner peripheral sidewall of the annular flexible body 100.
[0039] Nozzles 103 are arranged at equal angles along the circumference on the inner circumferential sidewall of the annular flexible body 100, achieving uniform and comprehensive airflow distribution. During operation of the annular cleaning device, air is introduced into the annular cavity 101 through the air inlet 102. Gas is then sprayed from multiple nozzles 103 onto the inner sidewall of the cavity, achieving simultaneous multi-point cleaning of the inner sidewall. This improves the cleaning coverage and overcomes the problem of incomplete cleaning caused by the randomness and inability to maintain a fixed, continuous blowing pattern when using a handheld air gun. Consequently, the cleaning efficiency and quality of semiconductor equipment are significantly improved, which helps ensure the cleanliness of semiconductor equipment.
[0040] In this embodiment, the number of nozzles 103 is six, eight, ten, or twelve, but is not limited thereto.
[0041] In other embodiments, the annular cleaning device further includes: an angle adjustment structure for adjusting the angle of the nozzle, the angle adjustment structure including: a fixed seat disposed on the annular flexible body; a rotating element rotatably disposed on the fixed seat; a connecting pipe passing through the rotating element and the fixed seat, and one end of the connecting pipe communicating with the annular cavity; the nozzle is disposed at the end of the rotating element away from the fixed seat and communicating with the other end of the connecting pipe.
[0042] The angle adjustment structure achieves precise and controllable adjustment of the nozzle angle through the spherical pair of the fixed seat and the rotating element. As a result, the annular cleaning device can continuously blow the inner wall of the chamber from multiple angles and in a directional manner, thereby improving cleaning efficiency and quality. It overcomes the technical problems of high randomness and incomplete cleaning when cleaning with traditional handheld air guns, and effectively solves the technical problem of cleaning the narrow space in semiconductor equipment.
[0043] In other embodiments, a fixing seat is disposed on the annular flexible body. The fixing seat, through its fixed connection with the annular flexible body, provides a stable mounting base for the angle adjustment structure, thereby ensuring reliable rotation of the rotating element and stable passage of the connecting pipe, thus achieving precise adjustment of the nozzle angle.
[0044] In other embodiments, a rotating element is rotatably mounted on the fixed base. Simultaneously, because the nozzle is mounted on the rotating element, the nozzle can rotate relative to the fixed base.
[0045] In other embodiments, the connecting pipe passes through the rotating element and the fixed base, and one end of the connecting pipe communicates with the annular cavity. The connecting pipe, serving as a gas delivery channel, passes through the rotating element and the fixed base, allowing the rotating element to rotate while ensuring continuous gas delivery to the nozzle.
[0046] As an example, the connecting pipe is a flexible hose, meaning it can be bent.
[0047] In this embodiment, the nozzle is disposed on the rotating element and communicates with the connecting pipe.
[0048] By setting the nozzle on the rotating element and connecting it to the connecting pipe, the nozzle can rotate flexibly with the rotating element, thereby achieving continuous multi-angle blowing and cleaning of the inner wall of the cavity, thus improving cleaning efficiency and quality, and solving the technical problem of cleaning the narrow space in semiconductor equipment.
[0049] Specifically, the fixed base includes a concave spherical surface; the rotating element includes a convex spherical surface, the convex spherical surface and the concave spherical surface forming a spherical pair, so that the rotating element can rotate relative to the fixed member.
[0050] By using the spherical pair of the concave spherical surface of the fixed base and the convex spherical surface of the rotating element, the nozzle angle can be flexibly rotated, enabling the annular cleaning device to perform multi-angle, precise, and continuous blowing on the inner wall of the cavity, thereby improving the cleaning efficiency and quality of the inner sidewall of the cavity in semiconductor equipment.
[0051] In this embodiment, the annular cleaning device further includes: an air intake assembly 104 disposed on the annular flexible body 100. The air intake assembly 104 includes: a support structure 1041, the support structure 1041 including an arc-shaped through hole (not shown in the figure), the annular flexible body 100 passing through the arc-shaped through hole, and the air inlet 102 exposed on the support structure 1041; and an air intake structure 1042 disposed on the support structure 1041, the air intake structure 1042 including an air intake channel 1042a, the air intake channel 1042a communicating with the air inlet 102.
[0052] An air intake assembly 104 is mounted on the annular flexible body 100 and connected to it via an arc-shaped through hole. The air intake port 102 is exposed above the support structure 1041. A connection is established between the air intake structure 1042 and the air intake port 102 via the air intake channel 1042a, enabling gas delivery into the annular cavity 101. This ensures a stable and reliable air supply to the nozzles 103 in the entire annular cleaning device. When the annular cleaning device is operating, the air intake channel 1042a supplies gas to the air intake port 102. The gas enters the annular cavity 101 through the air intake port 102, increasing the volume of the annular flexible body 100 and stably fixing it to the inner wall of the cavity. The nozzles 103 then simultaneously clean the inner wall of the cavity from multiple points.
[0053] The support structure 1041 has an arc-shaped through hole, which matches the curvature of the annular flexible body 100 to form a stable connection base in physical space, thereby providing reliable structural support for the entire air intake assembly 104. This helps to improve the positional accuracy and connection strength between the annular flexible body 100 and the support structure 1041, so that the entire annular cleaning device can maintain structural stability during operation.
[0054] The air intake channel 1042a inside the air intake structure 1042 establishes a stable and reliable air path connection between the external air source and the air intake port 102, thereby ensuring that the gas can be continuously and stably delivered to the annular cavity 101, so that the annular flexible body 100 can expand and abut against the inner side wall of the cavity, and work with the nozzle 103 to achieve multi-point simultaneous blowing and cleaning of the inner side wall of the cavity, maintaining normal working condition. Therefore, it provides the necessary air source guarantee for the cleaning function of the entire annular cleaning device.
[0055] In this embodiment, the air intake structure 1042 has an extending direction, and the extending direction of the air intake structure 1042 is perpendicular to the plane where the annular flexible body is located.
[0056] By extending the intake structure 1042 perpendicular to the plane of the annular flexible body, it is possible to facilitate the connection of external air sources and form a shorter gas delivery path in the intake channel 1042a, thereby improving gas delivery efficiency.
[0057] In this embodiment, at least one nozzle 103 is also provided on the support structure 1041. The nozzle 103 is provided on the side wall of the support structure 1041 facing the central region of the annular flexible body, thereby expanding the cleaning coverage of the annular cleaning device. Furthermore, by working in synergy with the nozzle 103 on the annular flexible body 100, a more comprehensive cleaning effect is achieved.
[0058] In this embodiment, during the actual use of the annular cleaning device, nozzle 103 ejects gas. In other embodiments, the nozzle is a water-air universal nozzle, which can also eject a mixture of cleaning liquid (such as alcohol, isopropanol) and gas. Under high pressure, water-air mixed spraying is achieved, which can enhance the cleaning ability of the inner sidewall of the chamber. Therefore, it has a better cleaning effect than simple gas purging, making the equipment cleaning more efficient and thorough, and improving the overall cleaning quality.
[0059] This utility model also provides a semiconductor device. For example... Figure 4 As shown, the semiconductor device includes: a cavity, the cavity including a chamber 10; a base 20 disposed inside the chamber 10; the annular cleaning device disposed on the side wall of the chamber 10; a lifting mechanism 30 disposed at the bottom of the chamber 10, the output end of the lifting mechanism 30 being connected to the base 20 for driving the base 20 to rise or fall to pass through the central region of the annular flexible body 100; and an air supply unit 40 communicating with the air inlet 102 of the annular cleaning device.
[0060] The semiconductor device provided in this embodiment of the present invention includes: a cavity, including a chamber 10; a base 20 disposed inside the chamber 10; an annular cleaning device disposed on the inner side wall of the chamber 10; a lifting mechanism 30 disposed at the bottom of the chamber 10, the output end of the lifting mechanism 30 being connected to the base 20 for driving the base 20 to rise or fall, so that the side wall of the base 20 passes through the central region of the annular flexible body 100; and an air supply unit 40 communicating with the air inlet 102 of the annular cleaning device. When the semiconductor device is working, the air supply unit 40 is connected to the air inlet 102 of the annular cleaning device, continuously supplying air to the annular cleaning device. In conjunction with the annular flexible body 100 of the annular cleaning device and its internal annular cavity 101, as well as the multiple nozzles 103 disposed on the inner peripheral sidewall of the annular flexible body 100 and connected to the annular cavity 101, the inner sidewall of the chamber 10 can be cleaned. In addition, the lifting mechanism 30 drives the base 20 to rise or fall, thereby moving the sidewall of the base 20 and passing through the central area of the annular flexible body 100, so that the sidewall of the base 20 is exposed within the spray range of the multiple nozzles 103 of the annular cleaning device, achieving the effect of cleaning the sidewall of the base 20. This overcomes the technical defects of the prior art, such as the large randomness of handheld air guns and the difficulty in covering all areas.
[0061] In this embodiment, the cavity includes chamber 10. Chamber 10 provides a sealed space for the process.
[0062] In this embodiment, the base 20 is disposed inside the chamber 10. The base 20 is disposed inside the chamber 10 to provide support for the wafer.
[0063] In this embodiment, the lifting mechanism 30 is disposed at the bottom of the chamber 10. The output end of the lifting mechanism 30 is connected to the base 20 and is used to drive the base 20 to rise or fall, so that the side wall of the base 20 passes through the central region of the annular flexible body 100.
[0064] The lifting mechanism 30 drives the base 20 to move up and down, allowing the base 20 to pass through the central area of the annular flexible body 100. This exposes the sidewalls of the base 20 to the spray range of the multiple nozzles 103 of the annular cleaning device, achieving comprehensive cleaning of the sidewalls of the base 20. This overcomes the technical limitations of traditional handheld air guns, which struggle to reach all areas, making the cleaning process more efficient and thorough. The output end of the lifting mechanism 30 is connected to the base 20. By controlling the upward or downward movement of the base 20, it works in conjunction with the annular cleaning device to achieve precise cleaning of the sidewalls of the base 20.
[0065] In this embodiment, the gas supply unit 40 is connected to the air inlet 102 of the annular cleaning device. The gas supply unit 40 is used to supply gases such as compressed air or nitrogen. By connecting to the air inlet 102 of the annular cleaning device, the gas supply unit 40 continuously delivers gas into the annular cavity 101, thereby increasing the volume of the annular flexible body 100 and allowing it to stably abut against the inner wall of the cavity 10 through expansion. This drives multiple nozzles 103 to simultaneously perform stable multi-point blowing and cleaning of the inner wall of the cavity 10 and the side wall of the moving base 20. Therefore, it overcomes the technical problem of high randomness when cleaning with a handheld air gun, making the cleaning effect more reliable and efficient, and is conducive to improving the cleaning quality of semiconductor equipment.
[0066] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. An annular cleaning device, characterized in that The annular cleaning device, disposed on the inner sidewall of the cavity, is used for cleaning the inner sidewall of the cavity and includes: A ring-shaped flexible body, wherein the ring-shaped flexible body has an annular cavity inside; An air inlet is provided on the annular flexible body and communicates with the annular cavity; Multiple nozzles are disposed on the inner peripheral sidewall of the annular flexible body and communicate with the annular cavity.
2. The ring cleaning device of claim 1, wherein The annular cleaning device further includes: an angle adjustment structure for adjusting the angle of the nozzle, the angle adjustment structure comprising: A fixing seat is provided on the annular flexible body; A rotating element is rotatably mounted on the fixed base; A connecting tube passes through the rotating element and the fixed base, and one end of the connecting tube communicates with the annular cavity; The nozzle is located at the end of the rotating element away from the fixed base and is connected to the other end of the connecting pipe.
3. The ring cleaning apparatus of claim 2, wherein The fixing base includes: a concave spherical surface; The rotating element includes an outwardly convex spherical surface, which, together with the inwardly concave spherical surface, forms a spherical pair, enabling the rotating element to rotate relative to the fixed base.
4. The ring cleaning apparatus of claim 1, wherein The annular cleaning device further includes: an air intake assembly disposed on the annular flexible body, the air intake assembly comprising: The support structure includes an arc-shaped through hole, the annular flexible body passes through the arc-shaped through hole, and the air inlet is exposed in the support structure; An air intake structure is disposed on the support structure, the air intake structure includes an air intake channel, and the air intake channel is connected to the air intake port.
5. The ring cleaning apparatus of claim 4, wherein The air intake structure has an extending direction, which is perpendicular to the plane of the annular flexible body.
6. The ring cleaning apparatus of claim 4, wherein The nozzle is provided on the side wall of the support structure facing the central region of the annular flexible body.
7. The ring cleaning apparatus of claim 1, wherein The annular flexible body is made of an elastic material and is designed to increase in volume during the process of airflow through the air inlet.
8. The ring cleaning device of claim 7, wherein The elastic material includes: silicone rubber, fluororubber, or nitrile rubber.
9. The ring cleaning apparatus of claim 1, wherein Multiple nozzles are arranged at equal angles along the circumference on the inner peripheral sidewall of the annular flexible body.
10. A semiconductor device, characterized by comprising: include: Cavities, including chambers; A base is disposed inside the cavity; The annular cleaning device as described in any one of claims 1 to 9 is disposed on the inner sidewall of the chamber; a lifting mechanism is disposed at the bottom of the chamber, the output end of the lifting mechanism being connected to the base for driving the base to rise or fall to pass through the central region of the annular flexible body; The air supply unit is connected to the air inlet of the annular cleaning device.