Solder ball sucking mechanism

Abstract

The utility model discloses a solder ball sucking mechanism which is used for solving the technical problem that an existing solder ball sucking mechanism is prone to colliding with a chip substrate when sucking solder balls. The device comprises a lifting module, a solder ball suction module and an anti-collision module, the lifting module is connected with a mounting frame, the lifting module is used for driving the mounting frame to move in the vertical direction, and the solder ball suction module is connected to the mounting frame in a sliding mode and can be driven to move on the mounting frame in the vertical direction; the anti-collision module comprises a fixed contact and a movable contact, the movable contact and the fixed contact are both electrically connected with the lifting module, the movable contact is located above the fixed contact, and the movable contact and the fixed contact are arranged in an attached mode to form an access. The movable contact is connected to the solder ball suction module and elastically connected with the mounting rack, and the fixed contact is connected to the mounting rack.

Description

Technical Field

[0001] This utility model relates to the field of automated equipment design technology, and in particular to a solder ball suction mechanism. Background Technology

[0002] Currently, in the semiconductor manufacturing industry, after automatic ball placement on chip substrates, occasional instances of solder ball misalignment or excessive solder ball placement may occur. The traditional approach is to manually adjust the balls under a microscope with a needle to return them to the correct position or to remove the excess balls. However, as the semiconductor industry becomes more advanced, the diameter and spacing of solder balls are getting smaller, making it increasingly difficult to perform these operations manually.

[0003] To overcome the above problems, existing products on the market use vacuum nozzles to adsorb excess solder balls. Although this mechanism can effectively adsorb solder balls, in actual applications, it often collides with the chip substrate, causing damage to the chip substrate.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0005] This utility model discloses a solder ball suction mechanism to solve the technical problem that existing solder ball suction mechanisms are prone to collision with the chip substrate when suctioning solder balls.

[0006] The present invention provides a solder ball suction mechanism, including a lifting module, a solder ball suction module, and an anti-collision module;

[0007] The lifting module is connected to a mounting frame, and the lifting module is used to drive the mounting frame to move in the vertical direction. The solder ball picking module is slidably connected to the mounting frame and can be driven to move in the vertical direction on the mounting frame.

[0008] The anti-collision module includes a fixed contact and a movable contact. Both the movable contact and the fixed contact are electrically connected to the lifting module. The movable contact is located above the fixed contact and the two are fitted together to form a passage. The movable contact is connected to the solder ball picking module and elastically connected to the mounting bracket. The fixed contact is connected to the mounting bracket.

[0009] Optionally, the solder ball suction module includes a suction nozzle body and a negative pressure generating chamber;

[0010] The negative pressure generating chamber is slidably connected to the mounting bracket and connected to the movable contact;

[0011] The suction nozzle body is connected to the negative pressure generating chamber.

[0012] Optionally, the anti-collision module further includes a flow detector electrically connected to the lifting module;

[0013] The flow detector is connected to the negative pressure generating chamber to detect the air flow of the solder ball suction module.

[0014] Optionally, the mounting frame is provided with a lifting rail, and the negative pressure generating chamber is connected to a slider;

[0015] The slider is slidably connected to the lifting track.

[0016] Optionally, the mounting bracket is also equipped with a pressure detector;

[0017] The pressure detector is connected to the solder ball suction module to detect the suction pressure of the solder ball suction module.

[0018] Optionally, the lifting module is an electric cylinder or a pneumatic cylinder.

[0019] Optionally, the movable contact is connected to a spring, and the end of the spring away from the movable contact is connected to the mounting bracket.

[0020] Optionally, it also includes a first insulating block and a second insulating block;

[0021] The fixed contact is connected to the mounting bracket via the first insulating block;

[0022] The active contact is connected to the negative pressure generating chamber via the second insulating block.

[0023] Optionally, both the first insulating block and the second insulating block are insulating rubber, insulating silicone, or insulating plastic.

[0024] Optionally, it also includes a horizontal movement module connected to the lifting module to drive the lifting module to move in the horizontal direction.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] In this embodiment of the solder ball suction mechanism, the lifting module can drive the solder ball suction module to descend in order to pick up excess solder balls on the chip substrate. Under normal circumstances, the fixed contact and the movable contact in the anti-collision module are in contact with each other to form a passage, thereby enabling the lifting module to perform normal lifting function. When the solder ball suction module descends too far and comes into contact with the chip substrate, the solder ball suction module will rise a certain distance along the mounting bracket due to the reaction force of the chip substrate. At the same time, the movable contact will move with the solder ball suction module and separate from the fixed contact. At this time, since the fixed contact and the movable contact are disconnected, the lifting module will immediately stop working, thereby effectively avoiding collision damage to the chip substrate caused by the solder ball suction module, achieving the technical effect of effectively protecting the chip substrate while picking up solder balls. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a solder ball suction mechanism provided by this utility model;

[0029] Figure 2 A partial enlarged view of a solder ball suction mechanism provided by this utility model;

[0030] Illustration: Mounting bracket 1; Nozzle body 2; Negative pressure generating chamber 3; Flow detector 4; Lifting rail 5; Pressure detector 6; Fixed contact 7; Movable contact 8; First insulating block 9; Second insulating block 10; Spring 11. Detailed Implementation

[0031] This utility model discloses a solder ball suction mechanism to solve the technical problem that existing solder ball suction mechanisms are prone to collision with the chip substrate when suctioning solder balls.

[0032] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please see Figure 1 and Figure 2The present invention provides a solder ball suction mechanism, which includes a lifting module, a solder ball suction module and an anti-collision module.

[0034] The lifting module is connected to the mounting frame 1, and the lifting module is used to drive the mounting frame 1 to move in the vertical direction. The solder ball picking module is slidably connected to the mounting frame 1 and can be driven to move in the vertical direction on the mounting frame 1.

[0035] The anti-collision module includes a fixed contact 7 and a movable contact 8. Both the movable contact 8 and the fixed contact 7 are electrically connected to the lifting module. The movable contact 8 is located above the fixed contact 7 and the two are fitted together to form a passage. The movable contact 8 is connected to the solder ball picking module and is elastically connected to the mounting bracket 1. The fixed contact 7 is connected to the mounting bracket 1.

[0036] It should be noted that when the movable contact 8 and the fixed contact 7 are in contact, a circuit path is formed to enable the lifting module to work. Simply put, when the movable contact 8 and the fixed contact 7 are disconnected, the circuit is broken and the lifting module stops working.

[0037] In this embodiment of the solder ball suction mechanism, the lifting module can drive the solder ball suction module to descend in order to pick up excess solder balls on the chip substrate. Under normal circumstances, the fixed contact 7 and the movable contact 8 in the anti-collision module are in contact with each other to form a passage, thereby enabling the lifting module to perform normal lifting function. When the solder ball suction module descends too far and comes into contact with the chip substrate, the solder ball suction module will rise a certain distance along the mounting bracket 1 due to the reaction force of the chip substrate. At the same time, the movable contact 8 will move with the solder ball suction module and separate from the fixed contact 7. At this time, since the fixed contact 7 and the movable contact 8 are disconnected, the lifting module will immediately stop working, thereby effectively avoiding collision damage to the chip substrate caused by the solder ball suction module, achieving the technical effect of effectively protecting the chip substrate while picking up solder balls.

[0038] Furthermore, the solder ball suction module in this embodiment includes a suction nozzle body 2 and a negative pressure generating chamber 3;

[0039] The negative pressure generating chamber 3 is slidably connected to the mounting bracket 1 and connected to the movable contact 8;

[0040] The suction nozzle body 2 is connected to the negative pressure generating chamber 3.

[0041] It should be noted that, through the above design, the negative pressure generating chamber 3 mainly generates negative pressure so that the nozzle body 2 can pick up the solder ball.

[0042] Furthermore, the anti-collision module in this embodiment also includes a flow detector 4 electrically connected to the lifting module;

[0043] The flow detector 4 is connected to the negative pressure generating chamber 3 to detect the air flow of the solder ball suction module, specifically the air flow drawn in by the suction nozzle body 2.

[0044] It should be noted that, through the above design, when the nozzle body 2 picks up the solder ball, the solder ball will block the suction end of the nozzle body 2. The flow detector 4 will detect that the negative pressure air flow rate in the nozzle body 2 is 0. At this time, the flow detector 4 can send a signal to the lifting module through the relevant control system to stop the lifting module from working, so as to avoid the solder ball suction nozzle module from causing collision damage to the chip substrate, thereby effectively achieving the technical effect of picking up the solder ball while effectively protecting the chip substrate.

[0045] Furthermore, in this embodiment, the mounting frame 1 is provided with a lifting track 5, and the negative pressure generating chamber 3 is connected to a slider;

[0046] The slider is slidably connected to the lifting track 5.

[0047] It should be noted that the above design allows the solder ball pick-up module to move more smoothly and steadily along the mounting bracket 1.

[0048] Furthermore, the mounting bracket 1 in this embodiment is also equipped with a pressure detector 6;

[0049] The pressure detector 6 is connected to the solder ball suction module to detect the suction pressure of the solder ball suction module.

[0050] It should be noted that the above design allows operators to monitor the suction pressure of the solder ball suction module in real time.

[0051] Furthermore, the lifting module in this embodiment is existing technology, and it can specifically adopt an electric cylinder or a pneumatic cylinder. Designers can choose according to the actual situation, and this embodiment does not limit it.

[0052] Furthermore, in this embodiment, the movable contact 8 is connected to a spring 11, and the end of the spring 11 away from the movable contact 8 is connected to the mounting bracket 1.

[0053] It should be noted that, through the above design, when the solder ball picking module does not make any contact with the chip substrate, the elastic force of the spring 11 drives the movable contact 8 to remain in contact with the fixed contact 7. When the solder ball picking module makes contact with the chip substrate and is driven to move upward a certain distance, the movable contact 8 compresses the spring 11 and the movable contact 8 separates from the fixed contact 7.

[0054] Furthermore, the solder ball suction mechanism in this embodiment also includes a first insulating block 9 and a second insulating block 10;

[0055] The fixed contact 7 is connected to the mounting bracket 1 via the first insulating block 9;

[0056] The active contact 8 is connected to the negative pressure generating chamber 3 via the second insulating block 10.

[0057] It should be noted that, since the fixed contact 7 and the movable contact 8 are essentially circuit connection points, to avoid short circuits, it is preferable to use a first insulating block 9 and a second insulating block 10 to connect to the fixed contact 7 and the movable contact 8 respectively. Additionally, in another specific embodiment, the mounting bracket 1 can be made of insulating material.

[0058] Specifically, in this embodiment, both the first insulating block 9 and the second insulating block 10 are insulating rubber, insulating silicone, or insulating plastic.

[0059] Furthermore, the solder ball suction mechanism in this embodiment also includes a horizontal moving module, which is connected to the lifting module to drive the lifting module to move in the horizontal direction.

[0060] It should be noted that the above design allows the solder ball pick-up module to move horizontally.

[0061] In addition, the aforementioned horizontal movement module can be made of electric cylinder or pneumatic cylinder, and designers can choose according to the actual situation. This embodiment does not impose any restrictions on this.

[0062] Furthermore, it can be simply understood that in this embodiment, the flow detector 4, pressure detector 6, and anti-collision module are all connected to the control system, and are connected to the lifting module through the control system. The above connection method is common knowledge in the prior art of automated design, and will not be described in detail here.

[0063] The above provides a detailed description of the solder ball absorbing mechanism provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A suction ball mechanism, characterized by, This includes a lifting module, a solder ball picking module, and an anti-collision module; The lifting module is connected to the mounting frame (1), and the lifting module is used to drive the mounting frame (1) to move in the vertical direction. The solder ball picking module is slidably connected to the mounting frame (1) and can be driven to move in the vertical direction on the mounting frame (1). The anti-collision module includes a fixed contact (7) and a movable contact (8). Both the movable contact (8) and the fixed contact (7) are electrically connected to the lifting module. The movable contact (8) is located above the fixed contact (7) and the two are fitted together to form a passage. The movable contact (8) is connected to the solder ball picking module and is elastically connected to the mounting bracket (1). The fixed contact (7) is connected to the mounting bracket (1).

2. The suction ball mechanism according to claim 1, wherein The solder ball suction module includes a suction nozzle body (2) and a negative pressure generating chamber (3). The negative pressure generating chamber (3) is slidably connected to the mounting bracket (1) and connected to the movable contact (8); The suction nozzle body (2) is connected to the negative pressure generating chamber (3).

3. The suction ball mechanism according to claim 2, wherein The anti-collision module also includes a flow detector (4) electrically connected to the lifting module. The flow detector (4) is connected to the negative pressure generating chamber (3) to detect the air flow of the solder ball suction module.

4. The suction ball mechanism according to claim 2, wherein The mounting frame (1) is provided with a lifting rail (5), and the negative pressure generating chamber (3) is connected to a slider; The slider is slidably connected to the lifting track (5).

5. The suction ball mechanism according to claim 1, wherein The mounting bracket (1) is also equipped with a pressure detector (6); The pressure detector (6) is connected to the solder ball suction module to detect the suction pressure of the solder ball suction module.

6. The suction ball mechanism according to claim 1, wherein The lifting module is an electric cylinder or a pneumatic cylinder.

7. The suction ball mechanism according to claim 1, wherein The movable contact (8) is connected to a spring (11), and the end of the spring (11) away from the movable contact (8) is connected to the mounting bracket (1).

8. The suction ball mechanism according to claim 2, wherein It also includes a first insulating block (9) and a second insulating block (10); The fixed contact (7) is connected to the mounting bracket (1) via the first insulating block (9); The active contact (8) is connected to the negative pressure generating chamber (3) through the second insulating block (10).

9. The suction ball mechanism according to claim 8, wherein Both the first insulating block (9) and the second insulating block (10) are insulating rubber, insulating silicone or insulating plastic.

10. The suction ball mechanism according to claim 1, wherein It also includes a horizontal movement module, which is connected to the lifting module to drive the lifting module to move in the horizontal direction.

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