Semiconductor test fixture convenient to install

Abstract

The utility model relates to the technical field of semiconductor test fixtures, and particularly discloses a semiconductor test fixture convenient to install, which comprises a test board, uniformly distributed frame bodies are fixedly installed on the test board, movable frames are arranged on the frame bodies in a sliding manner, and electric push rods are fixedly installed at the tops of the frame bodies. The end of an output shaft of the electric push rod is fixedly installed on the top of the movable frame, a movable plate is slidably arranged on the movable frame, a motor is fixedly installed at the end of the movable frame, a lead screw is fixedly installed at the end of an output shaft of the motor, a connecting block is fixedly installed at the end of the movable plate, and the connecting block is in threaded connection with the lead screw. A pressing plate is arranged at the end of the movable plate, and a first rubber plate and a second rubber plate are laid on the bottom edge and the side edge of the pressing plate correspondingly. The semiconductor testing clamp convenient to install can press or clamp the edge of a semiconductor, the pressing or clamping mode can be accurately selected according to the specific requirements of a semiconductor device, and the clamping efficiency is improved. And the applicability of the test scene is expanded.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor test fixture technology, and in particular relates to a semiconductor test fixture that is easy to install. Background Technology

[0002] Semiconductor testing requires the use of fixtures to accurately fix and connect semiconductor devices, ensuring reliable contact between test probes and device pins or specific test points, providing a stable electrical connection for the testing equipment, thereby helping testers accurately evaluate device performance and reliability, improving testing efficiency and reducing operational difficulty.

[0003] Existing semiconductor test fixtures have a single clamping method, and most of them can only use a fixed clamping mode. They cannot flexibly switch between pressing and clamping modes according to the diverse specific needs of semiconductor devices. This means that for different types of semiconductor devices, such as thin and light semiconductor chips, their fragile edges may be more suitable for gentle pressing to avoid damage. Therefore, this needs to be improved. To this end, a semiconductor test fixture that is easy to install is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor test fixture that is easy to install, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor test fixture that is easy to install, comprising a test platform, on which uniformly distributed frames are fixedly installed, a movable frame is slidably disposed on the frames, an electric push rod is fixedly installed on the top of the frames, the output shaft end of the electric push rod is fixedly installed to the top of the movable frame, a movable plate is slidably disposed on the movable frame, a motor is fixedly installed at the end of the movable frame, a lead screw is fixedly installed at the end of the motor output shaft, a connecting block is fixedly installed at the end of the movable plate, the connecting block is threadedly connected to the lead screw, a pressure plate is disposed at the end of the movable plate, and rubber plate one and rubber plate two are respectively laid on the bottom edge and side edge of the pressure plate.

[0006] As a further description of the above solution: by setting up a test platform, frame, movable frame, electric push rod, movable plate, motor, lead screw, connecting block, pressure plate, rubber plate one, and rubber plate two working together, the semiconductor edge can be pressed or clamped, which makes it easy to accurately select the pressing or clamping method according to the specific needs of the semiconductor device, thus expanding the applicability of the test scenario.

[0007] Preferably, both the first rubber plate and the second rubber plate are equipped with miniature pressure sensors.

[0008] As a further description of the above scheme: both rubber plate one and rubber plate two are equipped with miniature pressure sensors, which can adjust the holding force of the rubber plates and rubber plate two on the semiconductor devices.

[0009] Preferably, the pressure plate is snapped onto the end of the movable plate.

[0010] As a further description of the above solution: the pressure plate is snapped at the end of the movable plate, which facilitates easy replacement of pressure plates of different sizes.

[0011] Preferably, the test platform has evenly distributed positioning openings, and the bottom of the frame is fixedly installed with positioning blocks. The bottom size of the positioning blocks is adapted to the size of the positioning openings. The test platform has through openings at the positioning openings, and a connecting rod is slidably installed on the through opening. A handle is fixedly installed at the bottom end of the connecting rod, and the connecting rod and the positioning block are provided with fixing parts.

[0012] As a further description of the above solution: by setting up positioning ports, positioning blocks, through ports, connecting rods, handles, and cooperating with the fixing parts, the entire fixture can be easily installed and disassembled, making it easy to adjust the number of fixture sets and further improving the applicability of the device.

[0013] Preferably, the fastener includes an insertion port at the bottom of the positioning block, an installation port on the side of the positioning block located at the insertion port, a spring disposed in the installation port, a fixing block slidably disposed on the installation port, and a fixing port disposed on the side of the end of the connecting rod.

[0014] As a further description of the above scheme: the components within the fastener are described.

[0015] Preferably, the end size of the connecting rod is adapted to the size of the socket, the spring is pressed between the positioning block and the fixing block, and the fixing block and the fixing socket are set as compatible arc surfaces.

[0016] As a further description of the above scheme: the positional relationship and shape of the components within the fixture are described.

[0017] Preferably, both the opening and the connecting rod are square, and the size of the opening is adapted to the size of the connecting rod.

[0018] As a further description of the above solution: both the opening and the connecting rod are set to be square, and the size of the opening is adapted to the size of the connecting rod, which can improve the stability of the fixture after installation and fixation.

[0019] In summary, compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. In this utility model, by setting up a test platform, frame, movable frame, electric push rod, movable plate, motor, lead screw, connecting block, pressure plate, rubber plate one, and rubber plate two, the semiconductor edge can be pressed or clamped. This allows for precise selection of pressing or clamping methods according to the specific needs of the semiconductor device, thus expanding the applicability of the testing scenario.

[0021] 2. By setting up a positioning port, positioning block, through port, connecting rod, handle, and fixing parts, the fixture can be easily installed and disassembled, and the number of fixture sets can be adjusted, thus further improving the applicability of the device. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a structural diagram of the frame of this utility model;

[0024] Figure 3 This is a bottom view of the frame structure of this utility model;

[0025] Figure 4 This is a bottom view of the test stand structure of this utility model;

[0026] Figure 5 This is a structural diagram of the test stand and port of this utility model;

[0027] Figure 6 This is a structural diagram of the frame, positioning block, connecting rod, and handle of this utility model;

[0028] Figure 7 This is a front view cross-sectional structural diagram of the positioning block and connecting rod of this utility model.

[0029] Legend:

[0030] 1. Test stand; 2. Frame; 3. Movable frame; 4. Electric push rod; 5. Movable plate; 6. Motor; 7. Lead screw; 8. Connecting block; 9. Pressure plate; 10. Rubber plate one; 11. Rubber plate two; 12. Positioning port; 13. Positioning block; 14. Through port; 15. Connecting rod; 16. Handle; 17. Fixing component; 171. Insert; 172. Mounting port; 173. Spring; 174. Fixing block; 175. Fixing port. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figure 1-7 This utility model provides a technical solution:

[0033] A semiconductor test fixture that is easy to install includes a test platform 1, on which uniformly distributed frames 2 are fixedly installed. A movable frame 3 is slidably disposed on the frame 2. An electric push rod 4 is fixedly installed on the top of the frame 2. The output shaft end of the electric push rod 4 is fixedly installed to the top of the movable frame 3. A movable plate 5 is slidably disposed on the movable frame 3. A motor 6 is fixedly installed at the end of the movable frame 3. A lead screw 7 is fixedly installed at the end of the output shaft of the motor 6. A connecting block 8 is fixedly installed at the end of the movable plate 5. The connecting block 8 is threadedly connected to the lead screw 7. A pressure plate 9 is provided at the end of the movable plate 5. A rubber sheet 10 and a rubber sheet 2 11 are respectively laid on the bottom edge and side edge of the pressure plate 9.

[0034] When performing clamping tests on semiconductor devices, operators select the pressing or clamping method based on the characteristics of the semiconductor device or the testing requirements.

[0035] When the pressing method is selected, the semiconductor device is placed in the middle of the test stage 1. The motor 6 at the end of the movable frame 3 is started. Its output shaft rotates and drives the lead screw 7 to rotate. The connecting block 8 at the end of the movable plate 5 is threadedly connected to the lead screw 7. The rotation of the lead screw 7 drives the connecting block 8 and the movable plate 5 connected to it to move horizontally on the movable frame 3, so that the pressure plate 9 and the rubber plate 10 at the end of the movable plate 5 move towards the top edge of the semiconductor device. When multiple sets of rubber plates 10 are facing the top edge of the semiconductor device, the electric push rod 4 at the top of the frame 2 is started. The output shaft of the electric push rod 4 pushes the movable frame 3 to slide downward on the frame 2, thereby driving the pressure plate 9 and the rubber plate 10 at the bottom edge of the pressure plate 9 to gently press against the edge of the top surface of the semiconductor device, thus realizing the pressing operation.

[0036] If the clamping method is selected, the electric push rod 4 first drives the rubber plate 11 to face the side edge of the semiconductor device, and then the motor 6 is started to drive multiple sets of rubber plates 11 to gently press against the side edge of the semiconductor device to achieve the clamping operation.

[0037] After the semiconductor device is pressed or clamped, the semiconductor device is inspected.

[0038] This easy-to-install semiconductor test fixture can press or clamp the semiconductor edge, allowing for precise selection of the pressing or clamping method according to the specific needs of the semiconductor device, thus expanding the applicability of the testing scenarios.

[0039] Miniature pressure sensors are installed inside both rubber plate 10 and rubber plate 21.

[0040] Both rubber plate 10 and rubber plate 2 are equipped with miniature pressure sensors. When rubber plate 10 or rubber plate 2 11 contacts the semiconductor device and applies pressure, the miniature pressure sensors sense the pressure change and control the pressure data received by the system. This allows for a direct understanding of the holding force of the rubber plates and rubber plate 2 11 on the semiconductor device. If the holding force is too large or too small and does not meet the test requirements, the operator can adjust the pressure of rubber plate 10 and rubber plate 2 11 on the semiconductor device by adjusting the speed of motor 6 and the stroke of electric push rod 4, etc., to ensure that the holding force is always within a suitable range and to guarantee the accuracy and safety of the test.

[0041] The pressure plate 9 is snapped onto the end of the movable plate 5;

[0042] The pressure plate 9 is snapped onto the end of the movable plate 5. The operator only needs to manually apply a certain external force to overcome the friction at the snap-fit ​​point to remove the existing pressure plate 9 from the end of the movable plate 5. Then, the new pressure plate 9 is aligned with the snap-fit ​​position at the end of the movable plate 5 and gently pressed to snap the pressure plate 9 into the end of the movable plate 5, thus completing the easy replacement of the pressure plate 9. This facilitates the easy replacement of pressure plates 9 of different sizes, improving the efficiency and flexibility of the testing work.

[0043] The test bench 1 has evenly distributed positioning openings 12. Positioning blocks 13 are fixedly installed at the bottom of the frame 2. The bottom dimensions of the positioning blocks 13 are adapted to the dimensions of the positioning openings 12. Each of the positioning openings 12 on the test bench 1 has a through-hole 14. A connecting rod 15 is slidably mounted on the through-hole 14. A handle 16 is fixedly installed at the bottom end of the connecting rod 15. Fixing members 17 are provided on the connecting rod 15 and the positioning blocks 13. The fixing member 17 includes a [missing information - likely a component or element] located at the bottom of the positioning block 13. The connector 171, the mounting port 172 located on the side of the positioning block 13, the spring 173 disposed in the mounting port 172, the fixing block 174 slidably disposed on the mounting port 172, and the fixing port 175 disposed on the side of the end of the connecting rod 15, wherein the end size of the connecting rod 15 is adapted to the size of the connector 171, the spring 173 is pressed between the positioning block 13 and the fixing block 174, and the fixing block 174 and the fixing port 175 are configured as matching arc surfaces;

[0044] When installing the fixture, the operator first aligns the positioning block 13 at the bottom of the frame 2 with the positioning opening 12 on the test bench 1. The bottom size of the positioning block 13 matches the size of the positioning opening 12, allowing the positioning block 13 to be accurately inserted into the positioning opening 12. At this time, the insertion port 171 of the positioning block 13 is aligned with the through port 14 on the test bench 1. Then, the operator inserts the connecting rod 15 into the through port 14 using the handle 16. The end of the connecting rod 15 extends from the through port 14 and inserts into the insertion port 171 of the positioning block 13. During the insertion of the end of the connecting rod 15 into the insertion port 171, the fixing block 174 is subjected to compressive force. When the fixing block 174 is compressed by the squeezing force, the spring 173 is inserted into the mounting. When the end of the connecting rod 15 is fully inserted into the socket 171, the mounting port 172 is aligned with the fixing port 175. The restoring force of the spring 173 will lock the fixing block 174 into the fixing port 175. At this time, the handle 16 is pressed against the bottom surface of the test bench 1, and the installation of the fixture is completed. Conversely, simply pull the handle 16 to drive the connecting rod 15 out of the socket 171 of the positioning block 13, and the fixture can be disassembled. The fixture can be easily installed and disassembled, and the number of fixture sets can be adjusted, further improving the applicability of the device.

[0045] Both the through-hole 14 and the connecting rod 15 are square, and the size of the through-hole 14 is adapted to the size of the connecting rod 15;

[0046] Both the through-hole 14 and the connecting rod 15 are square, and the size of the through-hole 14 is adapted to the size of the connecting rod 15. This prevents the connecting rod 15 from rotating freely within the through-hole 14, allowing it to slide up and down along the square outline of the through-hole 14. During testing, even if the fixture is subjected to certain external forces, such as vibration or slight collisions, the tight square fit between the connecting rod 15 and the through-hole 14 can effectively prevent the fixture from shifting or shaking in the horizontal direction. This improves the stability of the fixture after installation and ensures that the fixture can always provide a stable and reliable support and clamping environment for the semiconductor device during testing, thus ensuring the accuracy of the test results.

[0047] Working principle:

[0048] When performing clamping tests on semiconductor devices, operators select the pressing or clamping method based on the characteristics of the semiconductor device or the testing requirements.

[0049] When the pressing method is selected, the semiconductor device is placed in the middle of the test stage 1. The motor 6 at the end of the movable frame 3 is started. Its output shaft rotates and drives the lead screw 7 to rotate. The connecting block 8 at the end of the movable plate 5 is threadedly connected to the lead screw 7. The rotation of the lead screw 7 drives the connecting block 8 and the movable plate 5 connected to it to move horizontally on the movable frame 3, so that the pressure plate 9 and the rubber plate 10 at the end of the movable plate 5 move towards the top edge of the semiconductor device. When multiple sets of rubber plates 10 are facing the top edge of the semiconductor device, the electric push rod 4 at the top of the frame 2 is started. The output shaft of the electric push rod 4 pushes the movable frame 3 to slide downward on the frame 2, thereby driving the pressure plate 9 and the rubber plate 10 at the bottom edge of the pressure plate 9 to gently press against the edge of the top surface of the semiconductor device, thus realizing the pressing operation.

[0050] If the clamping method is selected, the electric push rod 4 first drives the rubber plate 11 to face the side edge of the semiconductor device, and then the motor 6 is started to drive multiple sets of rubber plates 11 to gently press against the side edge of the semiconductor device to achieve the clamping operation.

[0051] After the semiconductor device is pressed or clamped, the semiconductor device is inspected.

[0052] This easy-to-install semiconductor test fixture can press or clamp the semiconductor edge, allowing for precise selection of the pressing or clamping method according to the specific needs of the semiconductor device, thus expanding the applicability of the test scenarios.

[0053] in,

[0054] Both rubber plate 10 and rubber plate 2 are equipped with miniature pressure sensors. When rubber plate 10 or rubber plate 2 11 comes into contact with the semiconductor device and applies pressure, the miniature pressure sensors sense the pressure change and control the pressure data received by the system. This allows for a direct understanding of the holding force of the rubber plate and rubber plate 2 11 on the semiconductor device. If the holding force is too large or too small and does not meet the test requirements, the operator can adjust the pressure of rubber plate 10 and rubber plate 2 11 on the semiconductor device by adjusting the speed of motor 6 and the stroke of electric push rod 4, etc., to ensure that the holding force is always within a suitable range and to ensure the accuracy and safety of the test.

[0055] The pressure plate 9 is snapped onto the end of the movable plate 5. The operator only needs to manually apply a certain external force to overcome the friction at the snap-fit ​​point to remove the existing pressure plate 9 from the end of the movable plate 5. Then, the new pressure plate 9 is aligned with the snap-fit ​​position at the end of the movable plate 5 and gently pressed to snap the pressure plate 9 into the end of the movable plate 5, thus completing the easy replacement of the pressure plate 9. This facilitates the easy replacement of pressure plates 9 of different sizes, improving the efficiency and flexibility of the testing work.

[0056] When installing the fixture, the operator first aligns the positioning block 13 at the bottom of the frame 2 with the positioning opening 12 on the test bench 1. The bottom size of the positioning block 13 matches the size of the positioning opening 12, allowing the positioning block 13 to be accurately inserted into the positioning opening 12. At this time, the insertion port 171 of the positioning block 13 is aligned with the through port 14 on the test bench 1. Then, the operator inserts the connecting rod 15 into the through port 14 using the handle 16. The end of the connecting rod 15 extends from the through port 14 and inserts into the insertion port 171 of the positioning block 13. During the insertion of the end of the connecting rod 15 into the insertion port 171, the fixing block 174 is subjected to compressive force. When the fixing block 174 is compressed by the squeezing force, the spring 173 is inserted into the mounting. When the end of the connecting rod 15 is fully inserted into the socket 171, the mounting port 172 is aligned with the fixing port 175. The restoring force of the spring 173 will lock the fixing block 174 into the fixing port 175. At this time, the handle 16 is pressed against the bottom surface of the test bench 1, and the installation of the fixture is completed. Conversely, simply pull the handle 16 to drive the connecting rod 15 out of the socket 171 of the positioning block 13, and the fixture can be disassembled. The fixture can be easily installed and disassembled, and the number of fixture sets can be adjusted, further improving the applicability of the device.

[0057] Both the through-hole 14 and the connecting rod 15 are square, and the size of the through-hole 14 is adapted to the size of the connecting rod 15. This prevents the connecting rod 15 from rotating freely within the through-hole 14, allowing it to slide up and down along the square outline of the through-hole 14. During testing, even if the fixture is subjected to certain external forces, such as vibration or slight collisions, the tight square fit between the connecting rod 15 and the through-hole 14 can effectively prevent the fixture from shifting or shaking in the horizontal direction. This improves the stability of the fixture after installation and ensures that the fixture can always provide a stable and reliable support and clamping environment for the semiconductor device during testing, thus ensuring the accuracy of the test results.

[0058] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor test fixture for easy installation comprising a test table (1), characterized in that, The test bench (1) is fixedly installed with uniformly distributed frames (2). A movable frame (3) is slidably arranged on the frame (2). An electric push rod (4) is fixedly installed on the top of the frame (2). The output shaft end of the electric push rod (4) is fixedly installed on the top of the movable frame (3). A movable plate (5) is slidably arranged on the movable frame (3). A motor (6) is fixedly installed at the end of the movable frame (3). A lead screw (7) is fixedly installed at the end of the output shaft of the motor (6). A connecting block (8) is fixedly installed at the end of the movable plate (5). The connecting block (8) is threadedly connected to the lead screw (7). A pressure plate (9) is provided at the end of the movable plate (5). Rubber plate one (10) and rubber plate two (11) are respectively laid on the bottom edge and side edge of the pressure plate (9).

2. A semiconductor test fixture for easy installation according to claim 1, wherein, Both the first rubber plate (10) and the second rubber plate (11) are equipped with miniature pressure sensors.

3. A semiconductor test fixture for easy installation according to claim 1, wherein The pressure plate (9) is snapped onto the end of the movable plate (5).

4. The easily installed semiconductor test fixture of claim 1, wherein, The test platform (1) has evenly distributed positioning openings (12). The bottom of the frame (2) is fixedly installed with positioning blocks (13). The bottom size of the positioning blocks (13) is adapted to the size of the positioning openings (12). The test platform (1) has through openings (14) at the positioning openings (12). A connecting rod (15) is slidably installed on the through opening (14). A handle (16) is fixedly installed at the bottom of the connecting rod (15). Fixing parts (17) are provided on the connecting rod (15) and the positioning blocks (13).

5. A semiconductor test fixture for easy installation according to claim 4, wherein, The fastener (17) includes an insertion port (171) at the bottom of the positioning block (13), an installation port (172) on the side of the positioning block (13) located at the insertion port (171), a spring (173) disposed in the installation port (172), a fixing block (174) slidably disposed on the installation port (172), and a fixing port (175) on the side of the end of the connecting rod (15).

6. A semiconductor test fixture for easy installation according to claim 5, characterized in that, The end size of the connecting rod (15) is adapted to the size of the socket (171), the spring (173) is pressed between the positioning block (13) and the fixing block (174), and the fixing block (174) and the fixing port (175) are set to be compatible arc surfaces.

7. A semiconductor test fixture for easy installation according to claim 4, wherein Both the opening (14) and the connecting rod (15) are square, and the size of the opening (14) is adapted to the size of the connecting rod (15).

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