Ultra-large type upper and lower plate processing device for reaction cavity of generic semiconductor film deposition equipment

Abstract

The utility model discloses a processing device for ultra-large upper and lower plates of a reaction cavity of generic semiconductor film deposition equipment, which comprises a bottom plate and a positioning rotary support, and a central positioning hole is arranged in the middle of the bottom plate; the positioning rotating support comprises an upper frame, a lower frame and a supporting column, the upper frame is a square frame with an upper cross-shaped reinforcing beam arranged in the middle, the lower frame is a square frame with a lower cross-shaped reinforcing beam arranged in the middle, the upper frame and the lower frame are connected through the supporting column, a positioning rotating bearing is installed below the center of the lower cross-shaped reinforcing beam, and the positioning rotating bearing is connected with the supporting column. An inner supporting leg is arranged below the middle of each frame edge of the lower frame, outer supporting legs are arranged below four top corners of the lower frame, rollers are arranged on each inner supporting leg and each outer supporting leg, a plurality of workpiece supporting plates are arranged on the upper surface of the upper frame, and a flexible base plate is arranged on each workpiece supporting plate. By means of the mode, labor hours can be reduced, machining efficiency is improved, and stability of final machining precision is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and in particular to a processing device for an ultra-large upper and lower plate of a reaction chamber in a general semiconductor thin film deposition equipment. Background Technology

[0002] In semiconductor thin film deposition equipment, the upper and lower plates of the reaction chamber are ultra-large plate-like parts, and both are critical components with high requirements for machining accuracy, resulting in high overall material and manufacturing costs. Traditional machining methods involve fixing the workpiece on the worktable of a large gantry milling machine and machining the side features using a side milling head. This method only allows machining of the structures on both sides of the X-axis at a time, not simultaneously machining the structural features on both sides of the Y-axis. Therefore, rotation is required after machining. However, due to the large size of the workpiece, rotation requires multiple people working together and re-leveling, which severely impacts machining efficiency and accuracy. Furthermore, the introduction of numerous external influencing factors significantly increases the risk of non-conformities, increasing risk management costs and creating safety hazards. Utility Model Content

[0003] The main technical problem solved by this utility model is to provide a processing device for an ultra-large upper and lower plate of the reaction chamber in a semiconductor thin film deposition equipment, which can reduce manual labor and improve processing efficiency and accuracy.

[0004] To solve the above-mentioned technical problems, the present invention provides a technical solution as follows: A large-scale upper and lower plate processing device for the reaction chamber of a semiconductor thin film deposition equipment is provided, comprising: a base plate and a positioning and rotating bracket. The base plate has a central positioning hole in the middle, and the positioning and rotating bracket is mounted on the base plate. The positioning and rotating bracket is a frame structure welded from square steel tubes, including an upper frame, a lower frame, and support columns. The upper and lower frames are square frames of the same size. An upper cross reinforcing beam is provided in the middle of the upper frame, and a lower cross reinforcing beam is provided in the middle of the lower frame. The upper and lower frames are connected by the support columns, which consist of nine columns in total, four of which are arranged at opposite corners between the upper and lower frames. The upper frame has four support feet positioned between the midpoint of each side of the upper frame and the midpoint of the corresponding side of the lower frame. A third support foot is positioned between the intersection of the upper and lower cross-shaped reinforcing beams. A bearing seat is installed below the center intersection of the lower cross-shaped reinforcing beams. A positioning rotary bearing matching the size of the center positioning hole of the base plate is installed on the bearing seat. An inner support foot is installed below the center of each side of the lower frame. Outer support feet are installed below the four corners of the lower frame. Rollers are installed at the bottom of each inner and outer support foot. A workpiece support plate is positioned directly above the top of each support column on the upper surface of the upper frame. A flexible pad is placed on each workpiece support plate.

[0005] In a preferred embodiment of this invention, the base plate is provided with a rotating track, the center of which is the central positioning hole. The diameter of the rotating track is the same as the side length of the lower frame, so that each inner support foot can be installed on the rotating track. The base plate is also square, and auxiliary tracks corresponding to the positions of the four outer support feet are installed at the four apex corners of the square.

[0006] In a preferred embodiment of this utility model, the positioning hole is a tapered truncated hole, and the positioning rotary bearing is a tapered positioning roller bearing that matches the taper of the positioning hole.

[0007] In a preferred embodiment of this utility model, each outer support foot is provided with an insertion hole, and the base plate is provided with a positioning pin hole that matches the insertion hole. The insertion hole on any outer support foot can be connected to the positioning pin hole by a pin, thereby fixing the base plate and the positioning rotating bracket together.

[0008] In a preferred embodiment of this utility model, a transition guard plate is further provided between the flexible pad and the corresponding workpiece support plate, and the size of the transition guard plate is larger than the size of the flexible pad.

[0009] The beneficial effects of this utility model are as follows: This utility model is a special processing device for the ultra-large upper and lower plates of the reaction chamber of a semiconductor thin film deposition equipment. By using this device, the original multi-person operation can be completed by one person. This not only reduces labor time and improves processing efficiency, but also significantly reduces the external factors affecting the processing process and improves the stability of the entire processing environment, thereby significantly reducing the impact of the overall rotation on the workpiece processing accuracy. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of a preferred embodiment of the present invention;

[0011] Figure 2 This is a schematic diagram of the three-dimensional structure after the workpiece is removed in the illustrated embodiment;

[0012] Figure 3 This is a schematic diagram of the bottom view structure of the embodiment shown;

[0013] Figure 4 This is a schematic diagram of the bottom structure after removing the base plate in the illustrated embodiment;

[0014] The components in the attached diagram are labeled as follows:

[0015] 1. Workpiece; 2. Base plate; 3. Positioning and rotating bracket; 4. Pin;

[0016] 201. Rotary track; 202. Auxiliary track; 203. Center positioning hole; 204. Positioning pin hole;

[0017] 301. Positioning rotary bearing; 302. Flexible pad; 303. Adapter guard plate; 304. Upper frame; 305. Lower frame; 306.

[0018] 307. Upper cross reinforcing beam, 308. Lower cross reinforcing beam, 309. Support column, 3000. Outer support foot, 3010. Inner support foot, 3011. Bearing seat, 3012. Workpiece support plate. Detailed Implementation

[0019] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0020] Please see Figure 1 and Figure 2 The embodiments of this utility model include:

[0021] A large-scale upper and lower plate processing device for the reaction chamber of a semiconductor thin film deposition equipment is characterized by comprising: a base plate 2 and a positioning and rotating bracket 3. The base plate 2 has a central positioning hole 203 in the middle, and the positioning and rotating bracket 3 is mounted on the base plate 2. The positioning and rotating bracket 3 is a frame structure welded from square steel tubes, including an upper frame 304, a lower frame 305, and support columns 308. The upper frame 304 and the lower frame 305 are square frames of the same size. An upper cross reinforcing beam 306 is provided in the middle of the upper frame 304, and a lower cross reinforcing beam 307 is provided in the middle of the lower frame 305. The upper frame 304 and the lower frame 305 are connected by the support columns 308. There are a total of 9 support columns 308: 4 are arranged between the opposite apex corners of the upper frame 304 and the lower frame 305; 4 are arranged between the midpoint of each frame side of the upper frame 304 and the midpoint of the corresponding frame side of the lower frame 305; and 1 is arranged between the upper cross reinforcing beam 306 and the lower frame 305. Between the intersections of the cross reinforcing beams 307, a bearing seat 3011 is installed below the center intersection of the lower cross reinforcing beams 306. A positioning rotary bearing 301 that matches the size of the center positioning hole 203 on the base plate 2 is installed on the bearing seat 3011. An inner support foot 3010 is installed below the middle of each frame edge of the lower frame 305. An outer support foot 309 is installed below the four top corners of the lower frame 305. Rollers are installed at the bottom of the inner support foot 3010 and the outer support foot 309. A workpiece support plate 3012 is provided on the upper surface of the upper frame 304 corresponding to the position directly above the top of each support column 308. A flexible pad 302 made of PVC material is placed on each workpiece support plate 3012. A transition guard plate 303 is also provided between the flexible pad 302 and the corresponding workpiece support plate 3012. The size of the transition guard plate 303 is larger than the size of the flexible pad 302 to prevent the flexible pad 302 from falling off.

[0022] The base plate 2 is provided with a rotating track 201, the center of which is the center positioning hole 203. The diameter of the rotating track 201 is the same as the side length of the lower frame 305, so that each inner support foot 3010 can be installed on the rotating track 201. The base plate 2 is also square, and auxiliary tracks 202 corresponding to the positions of the four outer support feet 309 are installed at the four apex corners of the square. By setting the rotating track 201, the inner support feet 3010 are constrained when the rotating positioning bracket 3 rotates as a whole, so that the inner support feet 3010 always move along the rotating track 201, thereby ensuring that the lateral force on the positioning rotating bearing 301 is balanced during the rotation, and improving the service life of the positioning rotating bearing 301. The auxiliary tracks 202 can constrain the four outer support feet 309 within the track, which facilitates overall alignment after rotation and provides fulcrums at the four corners of the positioning rotating bracket 3, keeping the top of the positioning rotating bracket 3 horizontal and meeting the requirements of processing accuracy.

[0023] The central positioning hole 203 is a tapered platform hole, and the positioning rotary bearing 301 is a tapered positioning roller bearing whose taper matches that of the central positioning hole 203. This combination ensures that the positioning rotary bearing 301 automatically aligns and tightens when installed in the central positioning hole 203, guaranteeing the overall rotational stability.

[0024] Each outer support leg 309 has a socket, and the base plate 2 has a positioning pin hole 204 that matches the socket. The socket on any outer support leg 309 can be connected to the positioning pin hole 204 by a pin, thus fixing the base plate 2 and the positioning rotation bracket 2 together. In this way, whenever the processing angle needs to be changed, it is only necessary to rotate the whole thing and realign it.

[0025] In this invention, the base plate 2 is first positioned on the gantry worktable using a pressure plate, the X / Y axes are aligned and leveled to ensure the overall flatness requirements of the workpiece 1 during processing. Then, a flexible PVC pad 302 is placed on the positioning rotating bracket 3 to prevent surface damage to the workpiece 1 during processing. The workpiece 1 is then fixed to the positioning rotating bracket 3. During processing, the workpiece 1 can be rotated on the CNC gantry milling machine as needed, allowing the side milling head to directly process the characteristic shapes of the four sides of the workpiece 1. The entire process requires no secondary leveling and can be completed by a single worker, effectively reducing the processing difficulty of such large workpieces 1 while ensuring processing accuracy and improving efficiency.

[0026] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A processing device for an ultra-large upper and lower plate of a reaction chamber in a semiconductor thin film deposition equipment, characterized in that, include: A base plate and a positioning and rotating bracket, wherein the base plate has a central positioning hole in the middle, and the positioning and rotating bracket is mounted on the base plate; The positioning and rotating bracket is a frame structure welded from square steel tubes, including an upper frame, a lower frame, and support columns. The upper and lower frames are square frames of the same size. An upper cross reinforcing beam is set in the middle of the upper frame, and a lower cross reinforcing beam is set in the middle of the lower frame. The upper and lower frames are connected by the support columns. There are a total of 9 support columns: 4 are arranged between the opposite corners of the upper and lower frames, 4 are arranged between the midpoint of each side of the upper frame and the midpoint of the corresponding side of the lower frame, and 1 is arranged between the upper cross reinforcing beam and the lower frame. Between the intersections of the lower cross reinforcing beams, a bearing seat is installed below the center intersection of the lower cross reinforcing beams. A positioning rotary bearing that matches the size of the center positioning hole of the base plate is installed on the bearing seat. An inner support foot is installed below the middle of each frame edge of the lower frame. An outer support foot is installed below the four top corners of the lower frame. A roller is installed at the bottom of each inner support foot and outer support foot. A workpiece support plate is provided on the upper surface of the upper frame corresponding to the position directly above the top of each support column. A flexible pad is placed on each workpiece support plate.

2. The processing device for processing the super-large upper and lower plates of the reaction cavity of the universal semiconductor thin film deposition equipment according to claim 1, wherein The base plate is provided with a rotating track, the center of which is the center positioning hole. The diameter of the rotating track is the same as the side length of the lower frame, so that each inner support foot can be installed on the rotating track.

3. The processing device for processing the ultra-large upper and lower plates of the reaction cavity of the universal semiconductor thin film deposition equipment according to claim 2, wherein, The base plate is also square, and auxiliary tracks corresponding to the four external support feet are installed at the four apex corners of the square.

4. The ultra-large upper and lower plate processing device for the reaction chamber of the semiconductor thin film deposition equipment according to claim 1, characterized in that, The positioning hole is a tapered platform hole, and the positioning rotary bearing is a tapered positioning roller bearing that matches the taper of the positioning hole.

5. The universal semiconductor thin film deposition apparatus reaction cavity super-large upper and lower plate processing device according to claim 1, characterized in that, Each outer support foot has a socket, and the base plate has a positioning pin hole that matches the socket. The socket on any outer support foot can be connected to the positioning pin hole by a pin, thereby fixing the base plate and the positioning rotating bracket together.

6. The universal semiconductor thin film deposition apparatus reaction cavity super-large upper and lower plate processing device according to claim 1, characterized in that, A transition guard plate is also provided between the flexible pad and the corresponding workpiece support plate, and the size of the transition guard plate is larger than the size of the flexible pad.

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