Silica gel pad pasting device and battery production equipment

Abstract

The utility model discloses a silica gel pad pasting device and battery production equipment, and relates to the technical field of battery production, the silica gel pad pasting device comprises a gel feeding mechanism, a gel stripping auxiliary mechanism and a transfer mechanism, the gel feeding mechanism comprises a gel feeding platform and a gel feeding piece connected with the gel feeding platform, the glue feeding piece is used for enabling a paper tape to move on the glue feeding platform in the first direction and enabling a silica gel pad on the paper tape to extend in the second direction; the glue stripping auxiliary mechanism comprises a glue stripping auxiliary part, the glue stripping auxiliary part and the glue feeding platform are arranged in a spaced mode in the third direction, and the glue stripping auxiliary part extends in the second direction and moves in the first direction and the third direction relative to the glue feeding platform; the transfer mechanism comprises a transfer platform, the transfer platform is arranged on one side of the glue feeding platform in the first direction and used for being arranged in front of the moving direction of the paper tape, and the transfer platform extends in the second direction. According to the silica gel pad pasting device, stripping of the silica gel pad can be optimized.

Description

Technical Field

[0001] This application relates to the field of battery manufacturing technology, and more specifically, to a silicone pad bonding device and battery manufacturing equipment. Background Technology

[0002] During battery assembly, a buffer silicone pad needs to be attached to the top seal pit of the battery using a silicone pad attaching device. This buffer silicone pad isolates the battery cell from the PCM. Because the buffer silicone pad is very small and its production size varies, when peeling the buffer silicone pad from the release paper, slender silicone pads are prone to falling off due to their small bonding area and low basis weight, while silicone pads with high basis weight are difficult to peel off. Thus, traditional silicone pad attaching devices are prone to poor peeling of the buffer silicone pad. Utility Model Content

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a silicone pad bonding device that can optimize the peeling of silicone pads.

[0004] This application also provides a battery manufacturing apparatus.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, this application provides a silicone pad adhesive device having a first direction, a second direction, and a third direction, wherein the first direction, the second direction, and the third direction intersect each other, and the silicone pad adhesive device includes:

[0007] The glue feeding mechanism includes a glue feeding platform and a glue feeding component connected to the glue feeding platform. The glue feeding component is used to move the paper tape on the glue feeding platform along the first direction and to extend the silicone pad on the paper tape along the second direction.

[0008] A peeling auxiliary mechanism includes a peeling auxiliary component, which is spaced apart from the glue feeding platform along a third direction. The peeling auxiliary component extends along a second direction and moves relative to the glue feeding platform along the first direction and the third direction.

[0009] The transfer mechanism includes a transfer platform, which is disposed on one side of the glue feeding platform along the first direction and is used to be disposed in front of the paper tape in the direction of movement, and the transfer platform extends along the second direction.

[0010] In an optional embodiment, the silicone pad bonding device further includes a sensing mechanism, which includes a position sensor and a controller. The adhesive peeling auxiliary component and the position sensor are both electrically connected to the controller. The adhesive feeding platform is provided with a sensing area, which is located on the movement path of the silicone pad along the first direction. The position sensor is disposed within the sensing area.

[0011] In an optional embodiment, the adhesive peeling auxiliary mechanism further includes a first driving member, a second driving member, and a connecting member. The adhesive peeling auxiliary member is connected to the second driving member, and the second driving member is used to drive the adhesive peeling auxiliary member to move along the third direction. The second driving member is connected to the connecting member, and the connecting member is connected to the first driving member. The first driving member is used to drive the connecting member to move along the first direction.

[0012] In an optional embodiment, the transfer mechanism further includes a third drive unit connected to the transfer platform and used to drive the transfer platform to move along the third direction.

[0013] In an optional embodiment, the silicone pad bonding device further includes a bonding mechanism for adsorbing the silicone pad on the transfer platform and bonding the silicone pad to the battery cell.

[0014] In an optional embodiment, the adhesive mechanism includes an adsorption adhesive member, which is spaced apart from the transfer platform along the third direction. The adsorption adhesive member has an adsorption portion, which is disposed close to the transfer platform, and the cross-sectional area of ​​the adsorption portion gradually increases in the direction away from the transfer platform.

[0015] In an optional embodiment, the adsorption part is provided with a plurality of adsorption holes, the plurality of adsorption holes are arranged at intervals along the second direction, the adsorption part has an adsorption surface extending along the second direction, the adsorption surface is used to adhere to the silicone pad, and each adsorption hole penetrates the adsorption surface.

[0016] In an optional embodiment, the adsorption adhesive is provided with a connection hole and an air extraction hole, each of the adsorption holes is connected to one end of the connection hole, and the end of the connection hole away from the adsorption hole is connected to the air extraction hole.

[0017] In an optional embodiment, the adhesive mechanism further includes a fourth driving member connected to the adsorbent adhesive member and used to drive the adsorbent adhesive member to rotate about the second direction.

[0018] Secondly, this application provides a battery manufacturing apparatus, comprising:

[0019] The silicone pad bonding device as described in any of the foregoing embodiments.

[0020] The silicone pad bonding device of this application has the following advantages:

[0021] In the silicone pad pasting device of this application, the paper tape can be moved along the first direction by the glue feeding component, and the peeling auxiliary component can be pressed onto the silicone pad by moving along the first direction and the third direction. The silicone pad on the paper tape is pushed along the first direction by the movement of the peeling auxiliary component along the first direction, so as to push the silicone pad onto the transfer platform. The silicone pad is then peeled off from the paper tape by the peeling auxiliary component, thereby reducing the difficulty of peeling the silicone pad. Furthermore, since the peeling auxiliary component, the silicone pad and the transfer platform are all arranged to extend along the second direction, when the peeling auxiliary component pushes the silicone pad to move along the first direction, the silicone pad can be completely pressed under the peeling auxiliary component, so as to avoid the silicone pad lifting or deformation during the peeling process. At the same time, the silicone pad is completely supported on the transfer platform, thereby improving the peeling effect of the silicone pad. Thus, the silicone pad pasting device of this application can optimize the peeling of silicone pads. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the silicone pad adhesive device in this application is shown;

[0024] Figure 2 A schematic diagram of the adhesive peeling auxiliary mechanism in this application is shown;

[0025] Figure 3 It shows Figure 2 Enlarged structural diagram at point A;

[0026] Figure 4 A schematic diagram of the transfer mechanism in this application is shown;

[0027] Figure 5 It shows Figure 4 Enlarged structural diagram at point B;

[0028] Figure 6 A schematic diagram of the adhesive peeling auxiliary components, transfer platform, and adsorption / adhesive components during adhesive peeling is shown.

[0029] Figure 7A schematic diagram of the adhesive mechanism in this application is shown;

[0030] Figure 8 A schematic diagram of the structure of the adhesive attachment in this application is shown.

[0031] Explanation of key component symbols:

[0032] 10-Silicone pad adhesive device;

[0033] 100 - Glue feeding mechanism; 110 - Glue feeding platform; 120 - Glue feeding component;

[0034] 200 - Glue peeling auxiliary mechanism; 210 - Glue peeling auxiliary component; 211 - Glue peeling surface; 220 - First driving component; 230 - Second driving component; 240 - Connecting component;

[0035] 300 - Transfer mechanism; 310 - Transfer platform; 311 - Transfer surface; 320 - Third drive component;

[0036] 400 - Sensing mechanism; 410 - Position sensing element;

[0037] 500 - Adhesive mechanism; 510 - Adsorption adhesive component; 511 - Adsorption part; 5111 - Adsorption hole; 5112 - Adsorption surface; 512 - Connection hole; 513 - Vacuum hole; 514 - Connection part; 520 - Fourth driving component; 530 - Fifth driving component; 540 - Vacuuming component;

[0038] 20-Silicone pad;

[0039] x - First direction; y - Second direction; z - Third direction. Detailed Implementation

[0040] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0041] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] Reference Figure 1 , Figure 2 as well as Figure 4 As shown, the silicone pad pasting device 10 involved in the embodiments of this application has a first direction x, a second direction y and a third direction z, the first direction x, the second direction y and the third direction z intersect each other, and the silicone pad pasting device 10 includes: a glue feeding mechanism 100, a glue peeling auxiliary mechanism 200 and a transfer mechanism 300.

[0046] Specifically, the glue feeding mechanism 100 includes a glue feeding platform 110 and a glue feeding component 120 connected to the glue feeding platform 110. The glue feeding component 120 is used to move the paper tape on the glue feeding platform 110 along a first direction x and to extend the silicone pad 20 on the paper tape along a second direction y. The glue peeling auxiliary mechanism 200 includes a glue peeling auxiliary component 210, which is spaced apart from the glue feeding platform 110 along a third direction z. The glue peeling auxiliary component 210 extends along the second direction y and moves relative to the glue feeding platform 110 along both the first direction x and the third direction z. The transfer mechanism 300 includes a transfer platform 310, which is located on one side of the glue feeding platform 110 along the first direction x and is positioned in front of the paper tape in the direction of movement. The transfer platform 310 extends along the second direction y.

[0047] It should be noted that the first direction x is Figure 1 The direction indicated by x in the middle, and the second direction y is... Figure 1 The direction indicated by y in the middle, and the direction of the third direction z are... Figure 1 The direction indicated by z in the middle.

[0048] In the silicone pad pasting device 10 of this application, the paper tape can be moved along the first direction x on the glue feeding platform 110 by the glue feeding member 120. At the same time, the peeling auxiliary member 210 can be pressed onto the silicone pad 20 by moving along the first direction x and the third direction z. The movement of the peeling auxiliary member 210 along the first direction x pushes the silicone pad 20 on the paper tape along the first direction x, so as to push the silicone pad 20 onto the transfer platform 310. Thus, the silicone pad 20 is peeled off from the paper tape by the peeling auxiliary member 210, thereby reducing the weight of the silicone pad 20. Furthermore, since the peeling aid 210, the silicone pad 20, and the transfer platform 310 all extend along the second direction y, when the peeling aid 210 pushes the silicone pad 20 to move along the first direction x, the silicone pad 20 can be completely pressed under the peeling aid 210, so as to avoid the silicone pad 20 from lifting or deforming during the peeling process. At the same time, the silicone pad 20 is completely supported on the transfer platform 310, thereby improving the peeling effect of the silicone pad 20. Thus, the silicone pad pasting device 10 of this application can optimize the peeling of the silicone pad 20.

[0049] Specifically, refer to Figure 3As shown, in this embodiment, the adhesive peeling aid 210 has an adhesive peeling surface 211. The adhesive peeling surface 211 is disposed on the side of the adhesive peeling aid 210 close to the adhesive feeding platform 110 along the third direction z. The adhesive peeling surface 211 extends along the second direction y and is disposed parallel to the adhesive feeding platform 110, so that the silicone pad 20 is completely pressed under the adhesive peeling surface 211, avoiding the silicone pad 20 from lifting or deforming during the adhesive peeling process, thereby improving the adhesive peeling effect and efficiency of the silicone pad 20.

[0050] Reference Figure 1 As shown, the silicone pad pasting device 10 also includes a sensing mechanism 400, which includes a position sensor 410 and a controller. The adhesive peeling auxiliary component 210 and the position sensor 410 are both electrically connected to the controller. The adhesive feeding platform 110 is provided with a sensing area, which is located on the moving path of the silicone pad 20 along the first direction x. The position sensor 410 is set in the sensing area.

[0051] In this embodiment, when the silicone pad 20 moves along the first direction x into the sensing area, the position sensor 410 senses the position signal of the silicone pad 20 and sends the sensed position signal of the silicone pad 20 to the controller, so that the controller controls the peeling auxiliary component 210 to move along the first direction x and the third direction z to the position of the silicone pad 20, so that the peeling auxiliary component 210 can press on the silicone pad 20 to facilitate the subsequent peeling of the silicone pad 20.

[0052] Reference Figure 2 As shown, the adhesive peeling auxiliary mechanism 200 also includes a first driving member 220, a second driving member 230, and a connecting member 240. The adhesive peeling auxiliary member 210 is connected to the second driving member 230. The second driving member 230 is used to drive the adhesive peeling auxiliary member 210 to move along a third direction z. The second driving member 230 is connected to the connecting member 240. The connecting member 240 is connected to the first driving member 220. The first driving member 220 is used to drive the connecting member 240 to move along a first direction x.

[0053] In this embodiment, the first driving member 220 can drive the connector 240 to move along the first direction x, so that the connector 240 drives the peeling auxiliary member 210 to move along the first direction x. At the same time, the second driving member 230 can drive the peeling auxiliary member 210 to move relative to the connector 240 along the third direction z, thereby realizing the movement of the peeling auxiliary member 210 along the first direction x and along the third direction z, so that the peeling auxiliary member 210 moves to the position of the silicone pad 20 and presses it on the silicone pad 20, thereby realizing the peeling of the silicone pad 20.

[0054] Reference Figure 4 as well as Figure 6As shown, the transfer mechanism 300 also includes a third drive unit 320, which is connected to the transfer platform 310 and is used to drive the transfer platform 310 to move along a third direction z.

[0055] In this embodiment, before peeling off the silicone pad 20, the transfer platform 310 can be driven to move along the third direction z by the third driving member 320, so that the transfer platform 310 and the glue feeding platform 110 are on the same plane in the third direction z, thereby facilitating the glue peeling auxiliary member 210 to push the silicone pad 20 onto the transfer platform 310 along the first direction x. After the silicone pad 20 is transferred onto the transfer platform 310, the transfer platform 310 can be driven to move along the third direction z by the third driving member 320, so that the transfer platform 310 and the glue peeling auxiliary member 210 are separated, so that the silicone pad 20 can be attached to the battery cell in the future.

[0056] Reference Figure 1 As shown, the silicone pad pasting device 10 also includes a pasting mechanism 500, which is used to adsorb the silicone pad 20 on the transfer platform 310 and to paste the silicone pad 20 onto the battery cell.

[0057] In this embodiment, after the silicone pad 20 is transferred to the transfer platform 310, the transfer platform 310 can be driven to move along the third direction z by the third driving member 320 so that the transfer platform 310 is separated from the peeling auxiliary member 210. At this time, the silicone pad 20 on the transfer platform 310 can be adsorbed by the pasting mechanism 500 so that the pasting mechanism 500 can paste the silicone pad 20 onto the battery cell.

[0058] Specifically, refer to Figure 5 As shown, in this embodiment, the transfer platform 310 has a transfer surface 311, which is disposed on the side of the transfer platform 310 close to the glue feeding platform 110 along the third direction z. The transfer surface 311 extends along the second direction y and is arranged parallel to the glue feeding platform 110. In this way, when the glue peeling auxiliary component 210 pushes the silicone pad 20 onto the transfer platform 310 along the first direction x, it can improve the smoothness of the movement of the silicone pad 20 along the first direction x, thereby reducing the probability of the silicone pad 20 wrinkling during the movement along the first direction x. At the same time, it ensures that the silicone pad 20 continues to extend along the second direction y after being pushed onto the transfer platform 310, so that the adhesive mechanism 500 can adsorb the silicone pad 20, which is convenient for subsequent adhesive bonding of the silicone pad 20 to the battery cell.

[0059] Specifically, refer to Figure 5 As shown, in this embodiment, the transfer surface 311 is a toothed surface or a wavy surface, that is, the transfer surface 311 is a high-friction surface. In this way, the silicone pad 20 can be prevented from adhering to the transfer surface 311, so as to facilitate the subsequent transfer of the silicone pad 20.

[0060] Reference Figure 6 as well as Figure 7 As shown, the adhesive mechanism 500 includes an adsorption adhesive member 510, which is spaced apart from the transfer platform 310 along the third direction z. The adsorption adhesive member 510 has an adsorption part 511, which is disposed close to the transfer platform 310. The cross-sectional area of ​​the adsorption part 511 gradually increases in the direction away from the transfer platform 310.

[0061] Specifically, refer to Figure 7 As shown, in this embodiment, the adhesive mechanism 500 further includes a fifth driving member 530, which is connected to the adsorption adhesive member 510 and is used to drive the adsorption adhesive member 510 to rotate around a third direction z, so that the adsorption adhesive member 510 and the transfer platform 310 are located on the same plane in the third direction z, so that the adsorption adhesive member 510 can adsorb the silicone pad 20 on the transfer platform 310.

[0062] In this embodiment, after the silicone pad 20 is transferred to the transfer platform 310, the silicone pad 20 can be adsorbed by the adsorption part 511 of the adsorption adhesive 510 to transfer the silicone pad 20 from the transfer platform 310, which facilitates the subsequent adhesion of the silicone pad 20 to the battery cell. Since the cross-sectional area of ​​the adsorption part 511 gradually increases in the direction away from the transfer platform 310, the structural strength of the adsorption part 511 can be improved, thereby improving the adsorption capacity of the adsorption part 511 for the silicone pad 20.

[0063] Reference Figure 8 As shown, the adsorption part 511 is provided with a plurality of adsorption holes 5111, which are arranged at intervals along the second direction y. The adsorption part 511 has an adsorption surface 5112 extending along the second direction y. The adsorption surface 5112 is used to adhere to the silicone pad 20. Each adsorption hole 5111 penetrates the adsorption surface 5112.

[0064] In this embodiment, since multiple adsorption holes 5111 are arranged at intervals along the second direction y, and each adsorption hole 5111 penetrates the adsorption surface 5112, when the adsorption part 511 adsorbs the silicone pad 20, the adsorption holes 5111 are evacuated to make the silicone pad 20 adhere tightly to the adsorption surface 5112, thereby achieving the adsorption of the silicone pad 20 by the adsorption part 511, so as to transfer the silicone pad 20 from the transfer platform 310, which facilitates the subsequent pasting of the silicone pad 20 onto the battery cell.

[0065] Specifically, in this embodiment, since the cross-sectional area of ​​the adsorption part 511 gradually increases in the direction away from the transfer platform 310, when adsorption holes 5111 are drilled on the adsorption part 511, the possibility of the adsorption part 511 being broken can be reduced, thereby improving the structural strength of the adsorption part 511.

[0066] Continue to refer to Figure 8 As shown, the adsorption adhesive 510 is provided with a connection hole 512 and an air extraction hole 513. Each adsorption hole 5111 is connected to one end of the connection hole 512, and the end of the connection hole 512 away from the adsorption hole 5111 is connected to the air extraction hole 513.

[0067] Specifically, continue to refer to Figure 8 As shown, in this embodiment, the cross-sectional area of ​​the adsorption part 511 gradually increases along the direction away from the transfer platform 310 to form a trapezoidal structure. The adsorption adhesive 510 also has a connecting part 514, which is connected to the end of the adsorption part 511 away from the transfer platform 310. That is, the connecting part 514 is connected to the large end of the trapezoidal structure. The connecting hole 512 extends to both the connecting part 514 and the adsorption part 511 to connect the air extraction hole 513 and the adsorption hole 5111. At the same time, the connecting hole 512 is adapted to be inclined in the adsorption adhesive 510 so that the connecting hole 512 can be located in the middle of the adsorption adhesive 510, rather than at the edge of the adsorption adhesive 510. In this way, when drilling the connecting hole 512, the possibility of the adsorption adhesive 510 being broken can be reduced, thereby improving the structural strength of the adsorption adhesive 510.

[0068] Specifically, refer to Figure 7 As shown, in this embodiment, the adhesive mechanism 500 further includes a vacuuming component 540, and the air extraction hole 513 is connected to the vacuuming component 540 to achieve vacuuming of the adsorption hole 5111.

[0069] In this embodiment, the evacuation port 513 is used to evacuate the adsorption port 5111 by drawing a vacuum through the evacuation port 513. Since each adsorption port 5111 is connected to one end of the connection port 512, and the end of the connection port 512 away from the adsorption port 5111 is connected to the evacuation port 513, the adsorption port 5111 can be evacuated by drawing a vacuum through the evacuation port 513, so that the silicone pad 20 is adsorbed onto the adsorption surface 5112, thereby transferring the silicone pad 20 from the transfer platform 310, which is convenient for the subsequent attachment of the silicone pad 20 to the battery cell.

[0070] Continue to refer to Figure 7 As shown, the adhesive mechanism 500 also includes a fourth driving member 520, which is connected to the adsorption adhesive member 510 and is used to drive the adsorption adhesive member 510 to rotate around the second direction y.

[0071] In this embodiment, after the silicone pad 20 is adsorbed onto the adsorption and adhesive component 510, the fourth driving component 520 drives the adsorption and adhesive component 510 to rotate around the second direction y, so that the silicone pad 20 rotates around the second direction y to a position parallel to the adhesive surface of the battery cell. Then, the fifth driving component 530 drives the adsorption and adhesive component 510 to rotate around the third direction z, so that the silicone pad 20 can move towards the adhesive surface of the battery cell, so that the silicone pad 20 is adhered to the adhesive surface of the battery cell, thereby realizing the automatic adhesion of the silicone pad 20.

[0072] The battery production equipment involved in this application embodiment includes: the silicone pad pasting device 10 described above.

[0073] In this embodiment, since the silicone pad bonding device 10 of this application can optimize the peeling of the silicone pad 20, the silicone pad bonding device 10 of this application can have a high silicone pad 20 bonding effect. Thus, the battery production equipment of this application can have a high production yield.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0075] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A silicone pad attaching device characterized by comprising: The silicone pad adhesive device (10) has a first direction (x), a second direction (y), and a third direction (z), wherein the first direction (x), the second direction (y), and the third direction (z) intersect each other. The glue feeding mechanism (100) includes a glue feeding platform (110) and a glue feeding component (120) connected to the glue feeding platform (110). The glue feeding component (120) is used to move the paper tape on the glue feeding platform (110) along the first direction (x) and to extend the silicone pad (20) on the paper tape along the second direction (y). A peeling auxiliary mechanism (200) includes a peeling auxiliary component (210), which is spaced apart from the glue feeding platform (110) along the third direction (z). The peeling auxiliary component (210) extends along the second direction (y) and moves relative to the glue feeding platform (110) along the first direction (x) and the third direction (z). The transfer mechanism (300) includes a transfer platform (310), which is disposed on one side of the glue feeding platform (110) along the first direction (x) and is used to be disposed in front of the moving direction of the paper tape, and the transfer platform (310) extends along the second direction (y).

2. The device according to claim 1, wherein The silicone pad pasting device (10) further includes a sensing mechanism (400), which includes a position sensor (410) and a controller. The adhesive peeling auxiliary component (210) and the position sensor (410) are both electrically connected to the controller. The adhesive feeding platform (110) is provided with a sensing area, which is located on the moving path of the silicone pad (20) along the first direction (x). The position sensor (410) is disposed in the sensing area.

3. The device according to claim 1, wherein The adhesive peeling auxiliary mechanism (200) further includes a first driving member (220), a second driving member (230), and a connecting member (240). The adhesive peeling auxiliary member (210) is connected to the second driving member (230), and the second driving member (230) is used to drive the adhesive peeling auxiliary member (210) to move along the third direction (z). The second driving member (230) is connected to the connecting member (240), and the connecting member (240) is connected to the first driving member (220). The first driving member (220) is used to drive the connecting member (240) to move along the first direction (x).

4. The device according to claim 1, wherein The transfer mechanism (300) further includes a third drive unit (320), which is connected to the transfer platform (310) and is used to drive the transfer platform (310) to move along the third direction (z).

5. The device of claim 1, wherein the adhesive is a silicone adhesive. The silicone pad pasting device (10) further includes a pasting mechanism (500), which is used to adsorb the silicone pad (20) on the transfer platform (310) and to paste the silicone pad (20) onto the battery cell.

6. The silicone pad bonding device according to claim 5, characterized in that, The adhesive mechanism (500) includes an adsorption adhesive member (510), which is spaced apart from the transfer platform (310) along the third direction (z). The adsorption adhesive member (510) has an adsorption part (511), which is located close to the transfer platform (310). The cross-sectional area of ​​the adsorption part (511) gradually increases in the direction away from the transfer platform (310).

7. The device according to claim 6, wherein The adsorption part (511) is provided with a plurality of adsorption holes (5111), which are arranged at intervals along the second direction (y). The adsorption part (511) has an adsorption surface (5112) extending along the second direction (y). The adsorption surface (5112) is used to adhere to the silicone pad (20). Each adsorption hole (5111) penetrates the adsorption surface (5112).

8. The device according to claim 7, wherein The adsorption adhesive (510) is provided with a connection hole (512) and an air extraction hole (513). Each adsorption hole (5111) is connected to one end of the connection hole (512), and the end of the connection hole (512) away from the adsorption hole (5111) is connected to the air extraction hole (513).

9. The device of claim 6, wherein the adhesive is a silicone adhesive. The adhesive mechanism (500) further includes a fourth driving member (520), which is connected to the adsorption adhesive member (510) and is used to drive the adsorption adhesive member (510) to rotate around the second direction (y).

10. A battery production apparatus characterized by comprising: include: The silicone pad adhesive device (10) as described in any one of claims 1-9.

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