QSFP +40GPSM4 optical transceiver module meeting industrial grade temperature

Abstract

The utility model discloses a QSFP + 40GPSM4 optical transceiver module meeting industrial grade temperature, which comprises a base, a circuit board, a coupling receiving amplifier and an upper cover, the top of the circuit board comprises a fixed seat, an FPC (Flexible Printed Circuit), an optical fiber connector, an interface, a laser transmitter, a receiving amplifier and a photoelectric detector, and the interface is arranged at the middle position of the circuit board; according to the utility model, after optical signals needing to be received pass through the optical fiber connector, light is received by the photoelectric detector and converted into electric signals, and then the signals are amplified by the amplifier, so that the problems of high-speed signal stability of the module and errors of received signals after the signals are converted into the optical signals in an outdoor severe high and low temperature environment are solved; practical functions of the industrial-grade temperature GPSM optical transceiver module are realized, power consumption is reduced, performance and stability are enhanced, a QSFP + module supporting high-speed industrial-grade temperature is realized, KM long-distance transmission is supported, power consumption is low, stability is high, and reliability is high.

Description

Technical Field

[0001] This utility model relates to the field of data center communication network technology, specifically a QSFP+40GPSM4 optical transceiver module that meets industrial-grade temperature requirements. Background Technology

[0002] Data centers are the lifeline that keeps our digital and efficient world running. The goal of optical transceiver modules is to make this lifeline sustainable in optical communication, focusing on low power consumption and high performance solutions. Adhering to this common goal of green development, environmental protection requirements require low carbon, carbon neutrality and carbon peaking. Under normal circumstances, optical modules are mainly deployed in small homes and offices, as well as large data centers. However, in some sparsely populated areas, such as deserts, valleys, oceans and mountains, optical modules are sometimes also needed.

[0003] Industrial-grade optical modules have advantages such as high reliability and strong performance. They are suitable for outdoor working environments with varying temperatures and relatively harsh conditions. Furthermore, the optical transceiver module of this invention can achieve power consumption that is almost the same as that of ordinary high-temperature modules while meeting industrial-grade temperature requirements, which greatly reduces heat dissipation costs. Currently, the industrial-grade 40GPSM4 optical transceiver module has entered the mass verification stage. With the balance between bandwidth growth and energy consumption costs in data centers, the 40GPSM4 optical transceiver module will soon be able to enter the mass deployment trend. Utility Model Content

[0004] The purpose of this invention is to overcome the stability problem of high-speed signals of the module in harsh outdoor high and low temperature environments, and the error problem of received signals after conversion into optical signals, so as to realize the practical function of industrial-grade temperature GPSM optical transceiver module, reduce power consumption, and enhance performance and stability.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a QSFP+40GPSM4 optical transceiver module that meets industrial-grade temperature requirements, comprising a base, a circuit board, a coupling receiving amplifier, and a top cover. The top of the circuit board includes a mounting base, an FPC flexible board, an optical fiber connector, an interface, a laser transmitter, a receiving amplifier, and a photodetector.

[0006] The interface is located in the middle of the circuit board. The circuit board is equipped with a protective plate covering the outside of the interface. One end of the circuit board is equipped with four sets of FPC flexible boards. A laser emitter is connected to one side of the FPC flexible board, and an optical fiber line that is connected to an optical fiber connector is provided on one side of the laser emitter.

[0007] Preferably, the circuit board is disposed on the inner side of the base, and the base and the top cover are spliced ​​together to facilitate the protection of the circuit board.

[0008] Preferably, one end of the inner side of the base is provided with an opening, and a pull ring is inserted through the opening. The pull ring extends through the opening into the interior of the base and is slidably connected thereto. The opening allows the pull ring to extend and retract within the base.

[0009] Preferably, there are four sets of laser emitters, which are connected to and driven by two sets of driving circuits. The four sets of laser emitters are connected to fiber optic connectors via fiber optic cables, which facilitates the use of two driving chips to control the four laser emitters as the emitting part to output and transmit optical signals.

[0010] Preferably, the four sets of FPC flexible boards are welded to the plate surface of the base, and the four sets of FPC flexible boards are interconnected with the laser emitter. Compared with the smaller mini laser emitter, this saves costs, has a compact layout, and makes fuller use of the internal space of the structural components.

[0011] Preferably, a protective cover is attached to the outside of the fiber optic connector and fixed with UV adhesive. This not only protects the gold wires but also prevents dust from contaminating the receiving amplifier during assembly, thereby improving the reliability of the module.

[0012] Preferably, the coupled receiving amplifier is coupled through a photodetector and an optical fiber connector to form a receiving section, which facilitates the amplification and transmission of optical signals.

[0013] The QSFP+40GPSM4 optical transceiver module proposed in this utility model meets industrial-grade temperature requirements and has at least the following beneficial effects:

[0014] By converting the optical signal to be received into an electrical signal using a photodetector after passing through an optical fiber connector, and then amplifying the signal using an amplifier, the stability problem of high-speed signals in harsh outdoor high and low temperature environments is overcome, as well as the error problem of received signals after conversion into optical signals. This enables the practical function of an industrial-grade temperature-controlled GPSM optical transceiver module, reduces power consumption, enhances performance and stability, and realizes a QSFP+ module that supports high-speed industrial-grade temperature control. It also supports long-distance transmission over kilometers (KM), with low power consumption, strong stability, and high reliability, simplifying the deployment, maintenance, and repair costs of the equipment. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall design structure of the optical transceiver module of this utility model;

[0016] Figure 2 This is a schematic diagram of the internal layout and optical path routing of the optical transceiver module of this utility model.

[0017] In the diagram: 1. Base; 2. Mounting bracket; 3. Circuit board; 4. Protective plate; 5. Top cover; 6. FPC flexible board; 7. Fiber optic connector; 8. Pull ring; 9. Interface; 10. Laser emitter. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-2 The present invention provides an embodiment of a QSFP+40GPSM4 optical transceiver module that meets industrial-grade temperature requirements, comprising a base 1, a circuit board 3, a coupled receiving amplifier and a top cover 5. The top of the circuit board 3 includes a fixing seat 2, an FPC flexible board 6, an optical fiber connector 7, an interface 9, a laser transmitter 10, a receiving amplifier and a photodetector.

[0020] Interface 9 is located in the middle of circuit board 3. Circuit board 3 is provided with a protective plate 4 covering the outside of interface 9. One end of circuit board 3 is provided with four sets of FPC flexible boards 6. One side of FPC flexible boards 6 is connected to a laser transmitter 10. One side of the laser transmitter 10 is provided with an optical fiber line that is connected to the optical fiber connector 7. Circuit board 3 is located inside the base 1. The base 1 and the top cover 5 are spliced ​​together to facilitate the protection of circuit board 3. The coupling receiving amplifier is coupled through a photodetector and optical fiber connector 7 to form a receiving part, which facilitates the amplification and transmission of optical signals.

[0021] An opening is provided at one end of the inner side of the base 1, and a pull ring 8 is inserted through the opening. The pull ring 8 extends through the opening into the interior of the base 1 and is slidably connected thereto. The opening allows the pull ring 8 to extend and retract within the base 1.

[0022] There are four sets of laser emitters 10, which are connected to and driven by two sets of driving circuits. The four sets of laser emitters 10 are connected to the fiber optic connector 7 through fiber optic cables, so that the four laser emitters 10 can be controlled by two driving chips to transmit optical signals.

[0023] Example 1, such as Figure 1-2 As shown, by selecting all raw materials that can meet industrial-grade temperature requirements and choosing anti-sulfurization components, the stability is further enhanced. After coupling, the receiving amplifier is covered with a protective cover and then encapsulated with UV glue, closely attached to the PCB body, further enhancing the stability and reliability of the module.

[0024] Example 2, as Figure 1-2 As shown, by providing a high and low temperature testing environment, a high and low temperature aging test chamber is used. The test fixtures, 40GPSM4 optical transceiver module, and USB data communication cable are all placed in the aging test chamber to simulate harsh external environment testing. When the module reaches a high temperature of 85℃ and a low temperature of -40℃, the power-on test is started. The standard test requirements are to test I2C communication, digital reporting and monitoring, photoelectric performance parameters, etc., according to standard protocols such as optical module protocols SFF-8472, SFF-8436, and IEEE802.3ba.

[0025] By utilizing the high and low temperature testing environment, the high-frequency performance, gold finger connection reliability, optical device reliability, and overall heat dissipation of the product can be fully tested. The testing is standardized, defective manufacturing processes are eliminated, and the standard modular design greatly improves the module yield and first-pass yield.

[0026] Working principle: This is a QSFP+40GPSM4 optical transceiver module that meets industrial-grade temperature requirements;

[0027] The signal received by the QSFP+ gold finger is transmitted to the laser transmitter 10, and the electrical signal is driven by two sets of driving circuits. Then, the laser transmitter 10 is driven to convert the electrical signal into an optical signal for output, thereby realizing the optical transceiver module's function of emitting a light signal. The optical signal to be received is received by a photodetector and converted into an electrical signal. The signal is then amplified by a receiving amplifier and finally sent to the QSFP+ gold finger, thereby realizing the optical transceiver module's function of receiving a light signal.

[0028] The transmitting section uses two driver chips to control four laser transmitters 10, and then uses a kit to fix the laser transmitters 10 inside the structural component; the receiving section uses a coupled receiving TIA / LA amplifier, photodetector and fiber optic connector 7, and then covers all the chips in the receiving section with a protective cover and connects the fiber optic cable with fiber optic connector 7. All raw materials are selected to meet industrial-grade temperature requirements, which improves the stability and reliability of the module. Compared with the traditional QSFP+40GPSM4 optical transceiver module, the operating temperature can reach -40~85℃, and it has the advantages of low cost, low power consumption, good heat dissipation and high stability.

[0029] In summary, this transceiver module achieves high-speed, industrial-grade temperature control with QSFP+ technology. It continues to operate normally under radiated interference environments (RE30M-1GFCC, 30M-1GEN, 1-18GFCC, 1-6GEN, 18-40GFCC) and RS80M-1G, 1G-4G, 4G-6G interference environments. Furthermore, it supports long-distance transmission up to 10km, exhibits low power consumption, high stability, and high reliability, simplifying equipment deployment, maintenance, and repair costs.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0031] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly, for example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

Claims

1. A QSFP+40GPSM4 optical transceiver module that meets industrial-grade temperature requirements, comprising a base (1), a circuit board (3), a coupling receiver amplifier, and a top cover (5), characterized in that: The top of the circuit board (3) includes a mounting base (2), an FPC flexible board (6), an optical fiber connector (7), an interface (9), a laser transmitter (10), a receiving amplifier, and a photodetector. The interface (9) is located in the middle of the circuit board (3). The circuit board (3) is provided with a protective plate (4) covering the outside of the interface (9). One end of the circuit board (3) is provided with four sets of FPC flexible boards (6), and one side of the FPC flexible board (6) is connected to a laser emitter (10). One side of the laser emitter (10) is provided with an optical fiber line that is connected to the optical fiber connector (7).

2. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The circuit board (3) is located inside the base (1), and the base (1) and the top cover (5) are spliced ​​together.

3. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The base (1) has an opening at one end of its inner side, and a pull ring (8) is inserted through the opening. The pull ring (8) extends through the opening into the interior of the base (1) and is slidably connected thereto.

4. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The laser emitter (10) consists of four groups, which are connected to and driven by two groups of driving circuits. The four groups of laser emitters (10) are connected to the fiber optic connector (7) via fiber optic cables.

5. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The four sets of FPC flexible boards (6) are welded to the plate surface of the base (1), and the four sets of FPC flexible boards (6) are interconnected with the laser emitter (10).

6. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The outer side of the fiber optic connector (7) is covered with a protective cover, which is fixed with UV glue.

7. The QSFP+40G SM4 optical transceiver module satisfying industrial level temperature according to claim 1, characterized in that: The coupled receiving amplifier is coupled through a photodetector and an optical fiber connector (7) to form the receiving section.

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