Bending-resistant flexible circuit board

Abstract

The utility model relates to a bending-resistant flexible circuit board which comprises a substrate with a copper foil layer at the top end, flexible woven mesh layers are arranged at the bottom of the substrate and the top of the copper foil layer, a flexible plate is arranged at the bottom of the lower woven mesh layer, and elastic blocks for clamping the two ends of the substrate are arranged at the top of the flexible plate. Wherein a flexible strip bonded to the top of the upper woven mesh layer is arranged between the two sets of elastic blocks, a plurality of T-shaped plates located at the bottom of the lower woven mesh layer are further arranged on the top of the flexible plate side by side, and a bonding layer bonded to the lower woven mesh layer is arranged above the T-shaped plates. The bending resistance of the circuit board is improved, and the heat dissipation environment of the circuit board is also improved.

Description

Technical Field

[0001] This invention relates to the field of circuit boards, and in particular to a flexible circuit board that is resistant to bending. Background Technology

[0002] Flexible printed circuit boards (FPCBs), also known as flexible boards, are printed circuits made of flexible insulating substrates. Flexible circuits offer excellent electrical performance, meet the design needs of smaller and higher-density installations, and also help reduce assembly steps and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, and can withstand millions of dynamic bends without damaging the wires. They can be arranged arbitrarily according to spatial layout requirements and can move and stretch arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection. Flexible circuit boards can greatly reduce the size and weight of electronic products, and are suitable for the development of electronic products towards high density, miniaturization, and high reliability.

[0003] For example, a flexible circuit board for mobile phones with the patent number CN222235128U has the following defects when in use: while improving the bending resistance of the circuit board, it cannot effectively improve its heat dissipation environment. Summary of the Invention

[0004] The purpose of this invention is to provide a flexible circuit board that is resistant to bending.

[0005] The technical problem of this invention is mainly solved by the following technical solution:

[0006] A flexible circuit board with bend resistance includes a substrate with a copper foil layer at the top, and flexible braided mesh layers at the bottom of the substrate and the top of the copper foil layer. A flexible plate is provided at the bottom of the lower braided mesh layer, and elastic blocks for clamping both ends of the substrate are provided at the top of the flexible plate. A flexible strip is provided between two sets of elastic blocks and bonded to the top of the upper braided mesh layer. Several T-shaped plates located at the bottom of the lower braided mesh layer are also arranged side by side on the top of the flexible plate, and an adhesive layer bonded to the lower braided mesh layer is provided above the T-shaped plates.

[0007] Preferably, the bottom end of the upper woven mesh layer is bonded to the copper foil layer, and the top end of the lower woven mesh layer is bonded to the bottom of the substrate.

[0008] Preferably, the number of flexible strips is multiple sets, wherein the ends of multiple sets of flexible strips are connected to corresponding elastic blocks.

[0009] Preferably, the woven mesh layer covers the edge of the substrate.

[0010] Preferably, a strip block supporting the bottom end of the substrate is provided at the angle between the flexible plate and the elastic block.

[0011] Preferably, the vertical end of the T-shaped plate is provided with a receiving channel, the adhesive layer has a T-shaped structure, the adhesive layer is made of resin, the vertical end of the adhesive layer passes through the receiving channel, and the horizontal end of the adhesive layer is bonded and fixed to the lower woven mesh layer and the top of the T-shaped plate respectively.

[0012] The beneficial effects of this invention are as follows: When the substrate is bent, the flexible strip and flexible woven mesh layer can be stretched and the flexible plate can be bent. The flexible strip, flexible plate and woven mesh layer can enhance the overall strength and toughness of the substrate and improve its bending and tear resistance, thereby making the circuit board more resistant to pressure during bending. When the stretched flexible strip and the upper woven mesh layer retract and reset, the circuit board can gradually return to its original position after bending. At the same time, while improving the strength, pressure resistance and tear resistance of the circuit board, the woven mesh layer can also reduce its impact on the heat dissipation of the substrate, so that the heat dissipated by the circuit board can be quickly dissipated through the pores of the woven mesh layer without being obstructed. At the same time, when the substrate is bent, the adhesive layer and elastic block can be squeezed to deform, preventing the above components from affecting the bending of the substrate and causing severe friction and damage between them. The adhesive layer can also effectively improve the heat dissipation efficiency and effect of the substrate. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the present invention;

[0014] Figure 2 This is a top view of the present invention;

[0015] Figure 3 yes Figure 1 A magnified view of a specific part.

[0016] In the diagram: 1. Substrate, 2. Copper foil layer, 3. Woven mesh layer, 4. Flexible board, 5. Elastic block, 6. Flexible strip, 7. T-shaped plate, 8. Adhesive layer, 9. Strip block, 10. Accommodation channel. Detailed Implementation

[0017] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0018] A flexible circuit board with bend resistance includes a substrate 1 with a copper foil layer 2 at the top. Both the bottom of the substrate 1 and the top of the copper foil layer 2 are provided with flexible woven mesh layers 3, and the woven mesh layers 3 wrap around the edge of the substrate 1. A flexible plate 4 is provided at the bottom of the lower woven mesh layer 3, the bottom end of the upper woven mesh layer 3 is bonded to the copper foil layer 2, and the top end of the lower woven mesh layer 3 is bonded to the bottom of the substrate 1.

[0019] The top of the flexible plate 4 is provided with elastic blocks 5 that hold the two ends of the substrate 1, and a strip block 9 that supports the bottom of the end of the substrate 1 is provided at the angle between the flexible plate 4 and the elastic blocks 5. A flexible strip 6 is provided between the two sets of elastic blocks 5 and is bonded to the top of the upper woven mesh layer 3. There are multiple sets of flexible strips 6, and the ends of the multiple sets of flexible strips 6 are connected to the corresponding elastic blocks 5.

[0020] The top of the flexible board 4 is also provided with several T-shaped plates 7 arranged side by side at the bottom of the lower woven mesh layer 3, and an adhesive layer 8 is provided above the T-shaped plates 7 to be bonded to the lower woven mesh layer 3.

[0021] The vertical end of the T-shaped plate 7 is provided with a receiving channel 10. The adhesive layer 8 has a T-shaped structure and is made of epoxy resin. The vertical end of the adhesive layer 8 passes through the receiving channel 10, and the horizontal end of the adhesive layer 8 is bonded and fixed to the lower woven mesh layer 3 and the top of the T-shaped plate 7 respectively.

[0022] This invention places the substrate 1 between two sets of elastic blocks 5 and supports it with strip blocks 9, thereby limiting and supporting the substrate 1. At the same time, the adhesive layer 8 on the T-shaped plate 7 provides multi-point support for the bottom of the substrate 1, suspending it. When the substrate 1 is bent, the flexible strip 6 and the flexible woven mesh layer 3 can be stretched, and the flexible plate 4 can be bent. The flexible strip 6, the flexible plate 4, and the woven mesh layer 3 enhance the overall strength and toughness of the substrate 1, thereby improving its resistance to bending and tearing. This makes the circuit board more resistant to pressure during bending. The flexible strip 6 and the upper woven mesh layer 3 retract and return to their original position after being stretched. This allows the circuit board to gradually return to its original position after bending. At the same time, the braided mesh layer 3 not only improves the strength, compressive strength and tear resistance of the circuit board, but also reduces its impact on the heat dissipation of the substrate 1. This allows the heat dissipated by the circuit board to be quickly dissipated through the aperture of the braided mesh layer 3 without obstruction. When the substrate 1 is bent, it can squeeze the adhesive layer 8 and the elastic block 5 to deform it, preventing the above components from affecting the bending of the substrate 1 and causing severe friction and damage between them. Furthermore, due to the influence of the material of the adhesive layer 8 itself, it can also effectively improve the heat dissipation efficiency and effect of the substrate 1.

[0023] The present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A flexible circuit board resistant to bending, comprising a substrate with a copper foil layer disposed on its top surface, characterized in that: Both the bottom of the substrate and the top of the copper foil layer are provided with flexible woven mesh layers. A flexible plate is provided at the bottom of the lower woven mesh layer. Elastic blocks that clamp both ends of the substrate are provided at the top of the flexible plate. A flexible strip that is bonded to the top of the upper woven mesh layer is provided between two sets of elastic blocks. Several T-shaped plates located at the bottom of the lower woven mesh layer are also arranged side by side at the top of the flexible plate. An adhesive layer that is bonded to the lower woven mesh layer is provided above the T-shaped plates.

2. The flexible wiring board according to claim 1, wherein: The bottom of the upper woven mesh layer is bonded to the copper foil layer, and the top of the lower woven mesh layer is bonded to the bottom of the substrate.

3. The flexible wiring board according to claim 1, wherein: The number of flexible strips is multiple sets, and the ends of multiple sets of flexible strips are connected to corresponding elastic blocks.

4. The flexible wiring board according to claim 1, wherein: The woven mesh layer wraps around the edge of the substrate.

5. The flexible wiring board according to claim 1, wherein: A strip-shaped block supporting the bottom end of the substrate is provided at the angle between the flexible plate and the elastic block.

6. The flexible wiring board according to claim 1, wherein: The vertical end of the T-shaped plate is provided with a receiving channel. The adhesive layer has a T-shaped structure and is made of resin. The vertical end of the adhesive layer passes through the receiving channel, and the horizontal end of the adhesive layer is bonded and fixed to the woven mesh layer below and the top of the T-shaped plate respectively.

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