Heat dissipation assembly and terminal device

Abstract

A heat dissipation assembly comprises a bottom plate, a cover plate, a temperature sensor and a packaging layer. A groove and a through hole are formed in the bottom plate, and the through hole is communicated with the groove; the cover plate is located in the groove and the through hole, the cover plate and the bottom plate jointly define a containing groove, the containing groove comprises a first containing area and a second containing area which are communicated with each other, and the second containing area is communicated with the through hole; the temperature sensor comprises a main body part, a bending part and a probe, the bending part is connected with the main body part and the probe, the main body part is located in the first containing area, the bending part is located in the second containing area, and the probe is located in the through hole; and the packaging layer is filled in the accommodating groove and is used for fixing the temperature sensor. The temperature sensing accuracy of the heat dissipation assembly is high, the installation stability of the temperature sensor is improved, and the appearance performance can be improved. The utility model further provides a terminal device.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation component and a terminal device. Background Technology

[0002] The heat dissipation assembly includes a base plate and a temperature sensor. The temperature sensor is installed inside the base plate. There is a certain gap between the area sensed by the temperature sensor and the area that needs to be sensed, which leads to inaccurate temperature sensing. Utility Model Content

[0003] Therefore, it is necessary to provide a heat dissipation component with accurate temperature sensing.

[0004] A heat dissipation assembly includes a base plate, a cover plate, a temperature sensor, and an encapsulation layer. The base plate has a groove and a through hole, the through hole and the groove communicating with each other. The cover plate is located in the groove and the through hole, and the cover plate and the base plate together form a receiving groove. The receiving groove includes a first receiving area and a second receiving area that communicate with each other, the second receiving area communicating with the through hole. The temperature sensor includes a main body, a bent portion, and a probe. The bent portion connects the main body and the probe. The main body is located in the first receiving area, the bent portion is located in the second receiving area, and the probe is located in the through hole. The encapsulation layer fills the receiving groove to fix the temperature sensor.

[0005] In one possible implementation, the base plate includes a first surface, a second surface, and a side surface, the first surface and the second surface being disposed back to back, the side surface being connected to the first surface and the second surface; the groove is formed on the first surface and the side surface, the through hole penetrates the second surface, and the probe is exposed on the second surface.

[0006] In one possible implementation, the heat dissipation assembly further includes a heat sink located on the first surface.

[0007] In one possible implementation, the radiator includes heat dissipation fins and a heat pipe assembly, with a mounting groove provided on the first surface, a portion of the heat pipe located in the mounting groove, and another portion of the heat pipe located in the heat dissipation fins.

[0008] In one possible implementation, the cover plate includes a body and a protrusion extending from the body, the body being located in the first receiving area and the protrusion being located in the second receiving area.

[0009] In one possible implementation, the surface of the cover plate and the first surface are on the same plane.

[0010] In one possible implementation, the cross-section of the second containment area includes an arc shape.

[0011] In one possible implementation, the encapsulation layer is made of epoxy resin.

[0012] In one possible implementation, both the base plate and the cover plate are made of metal.

[0013] A terminal device, the terminal device including a heat dissipation component.

[0014] The heat dissipation assembly provided in this application has a temperature sensor located between a base plate and a cover plate. The connection between the base plate and the cover plate is highly reliable, which helps to reduce the risk of the temperature sensor falling off. The probe of the temperature sensor is exposed on the base plate, which helps to improve the accuracy of temperature sensing. In addition, the second surface of the base plate is the appearance surface of the heat dissipation assembly. When viewed from the side where the second surface is located, a small through hole is opened on the second surface, which helps to improve the aesthetics of the heat dissipation assembly, minimizes damage to the second surface, has little impact on the connection area between the second surface and the working element, and reduces the impact on the performance of the heat dissipation assembly. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a terminal device provided in some embodiments of this application.

[0016] Figure 2 A schematic diagram of the heat dissipation component provided for related technologies.

[0017] Figure 3 for Figure 1 The exploded view of the heat dissipation component is shown.

[0018] Figure 4 for Figure 1 The diagram shows the structure of some components of the heat dissipation assembly.

[0019] Figure 5 for Figure 4 The diagram shows a cross-sectional view of some components of the heat dissipation assembly along the AA direction.

[0020] Figure 6 This is a schematic diagram illustrating the assembly process of the heat dissipation component provided in an embodiment of this application.

[0021] Figure 7 for Figure 1 The diagram shows a partial structure of the heat dissipation assembly in another orientation. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0024] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0025] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a terminal device 200 provided in some embodiments of this application. The terminal device 200 includes a working element 210 and a heat dissipation assembly 100. The working element 210 generates heat during operation, and the heat dissipation assembly 100 is used to dissipate the heat so that the working element 210 operates at a suitable temperature. The terminal device 200 may be a server, desktop computer, laptop, etc.

[0026] Please see Figure 2 , Figure 2 A schematic diagram of the structure of a heat dissipation assembly 100' provided for related technologies. The heat dissipation assembly 100' includes a base plate 10', a temperature sensor 30', and an encapsulation layer 40'. A groove 14' is formed on the base plate 10', the temperature sensor 30' is placed in the groove 14', and the encapsulation layer 40' is located in the groove 14' and fixes the temperature sensor 30'. The temperature sensor 30', whose probe is used to sense temperature, is embedded in the encapsulation layer 40', which is not conducive to the accuracy of temperature sensing; using the encapsulation layer 40' to fix the temperature sensor 30' poses a high risk of the temperature sensor 30' falling out of the groove 14'; when viewed from the side of the base plate 10' where the groove 14' is formed, there is a color difference between the base plate 10' and the encapsulation layer 40', resulting in low aesthetic performance of the heat dissipation assembly 100'.

[0027] Please see Figure 3 , Figure 3 for Figure 1 The diagram shows an exploded view of the heat dissipation assembly 100. The heat dissipation assembly 100 may include a base plate 10, a cover plate 20, a temperature sensor 30, an encapsulation layer 40, and a heat sink 50. The temperature sensor 30 and the encapsulation layer 40 are both located between the base plate 10 and the cover plate 20. The encapsulation layer 40 is used to fix the temperature sensor 30, and the heat dissipation assembly 100 is fixed to the base plate 10. The heat dissipation assembly 100 has high temperature sensing accuracy, improves the installation stability of the temperature sensor 30, and enhances the appearance.

[0028] Please refer to the following: Figures 4 to 7 The base plate 10 is generally plate-shaped. The base plate 10 may include a first surface 11, a second surface 12, and a side surface 13. The first surface 11 and the second surface 12 are arranged back to back, and the side surface 13 is connected to the first surface 11 and the second surface 12.

[0029] The base plate 10 has a groove 14 and a through hole 15, which communicate with each other. The groove 14 is formed on the first surface 11 and the side surface 13, and the through hole 15 penetrates the second surface 12. Specifically, the groove 14 is generally arranged along a first direction L1, and the through hole 15 penetrates the first surface 11 and the second surface 12 along a second direction L2, where the first direction L1 and the second direction L2 intersect. In this embodiment, the first direction L1 and the second direction L2 are perpendicular.

[0030] The cover plate 20 may include a body 21 and a protrusion 22. The body 21 is generally elongated, and the protrusion 22 is located on the surface of the body 21. The body 21 and the protrusion 22 are an integral structure. The cover plate 20 is located in the groove 14.

[0031] The cover plate 20 and the base plate 10 together form a receiving groove 16, which is used to receive the temperature sensor 30 and the encapsulation layer 40. The receiving groove 16 may include a first receiving area 161 and a second receiving area 162 that are interconnected. The second receiving area 162 connects the first receiving area 161 and the through hole 15. Both the first receiving area 161 and the second receiving area 162 are part of the groove 14.

[0032] The temperature sensor 30 may include a main body 31, a bent portion 32, and a probe 33. The bent portion 32 connects the main body 31 and the probe 33. The main body 31 is located in the first receiving area 161, the bent portion 32 is located in the second receiving area 162, and the probe 33 is located in the through hole 15. The heat sink 50 is located on the first surface 11, and the probe 33 is exposed on the second surface 12. The probe 33 is used to sense the temperature of the heat dissipation assembly 100 on the side closest to the second surface 12.

[0033] The heat sink 50 may include heat dissipation fins 51 and heat pipe assembly 52, the heat pipe assembly 52 including multiple heat pipes 521. The heat dissipation fins 51 are mounted on the first surface 11, one end of each heat pipe 521 is connected to the base plate 10, and the other end of each heat pipe 521 is connected to the heat dissipation fins 51. Specifically, each heat pipe 521 is bent. The first surface 11 is provided with a mounting groove 17, and a portion of the heat pipe 521 is located in the mounting groove 17, which can increase the connection area between the heat pipe 521 and the base plate 10, which is beneficial to heat transfer; the heat pipe 521 is housed in the mounting groove 17, which can also reduce the thickness of the heat dissipation assembly 100 along the second direction L2; the other portion of the heat pipe 521 is located in the heat dissipation fins 51, which is beneficial to the rapid dissipation of heat through the heat dissipation fins 51.

[0034] The encapsulation layer 40 can be made of an insulating material, such as epoxy resin, and the encapsulation layer 40 is filled in the receiving groove 16.

[0035] Please see Figure 6 During the assembly of the heat dissipation assembly 100, the cover plate 20 can be placed in the base plate 10 first, and the cover plate 20 and the base plate 10 can be fixed together to form the receiving groove 16. The cover plate 20 and the base plate 10 can be fixed by welding. The probe 33 of the temperature sensor 30 is inserted into the receiving groove 16 from the first receiving area 161. During the insertion of the temperature sensor 30, the bent portion 32 of the temperature sensor 30 bends in the second receiving area 162, and the probe 33 is finally located in the through hole 15 and exposed in the base plate 10. After the encapsulation layer 40 is injected into the receiving groove 16 and cured, the encapsulation layer 40 fills the first receiving area 161 and the second receiving area 162. The encapsulation layer 40 is used to fix the temperature sensor 30 to the cover plate 20 and the base plate 10. The heat sink 50 is fixed to the base plate 10. The heat sink 50 can be detachably fixed by using a nut.

[0036] In this embodiment, the step of fixing the temperature sensor 30 in the base plate 10 and the cover plate 20 is before the step of welding the base plate 10 and the cover plate 20. This is equivalent to fixing the temperature sensor 30 after the welding step, which can prevent the temperature sensor 30 from being damaged at high temperatures due to high-temperature welding. The temperature sensor 30 is located between the base plate 10 and the cover plate 20, and the connection between the base plate 10 and the cover plate 20 has high reliability, which helps to reduce the risk of the temperature sensor 30 falling off. The probe 33 of the temperature sensor 30 is exposed on the base plate 10, which helps to improve the accuracy of temperature sensing. In addition, the second surface 12 of the base plate 10 is the appearance surface of the heat dissipation assembly 100. When viewed from the side where the second surface 12 is located, a small through hole 15 is opened on the second surface 12, which is beneficial to the aesthetics of the heat dissipation assembly 100, minimizes damage to the second surface 12, has little impact on the connection area between the second surface 12 and the working element 210, and reduces the impact on the performance of the heat dissipation assembly 100.

[0037] In some embodiments, the surface of the cover plate 20 facing away from the base plate 10 and the first surface 11 are on the same plane, which facilitates the assembly of the heat sink 50.

[0038] In some embodiments, the cross-section of the second receiving area 162 is arc-shaped along a direction perpendicular to the first direction L1 and the second direction L2. This facilitates bending of the temperature sensor 30 in the second receiving area 162 during the step of inserting the temperature sensor 30 into the receiving slot 16, which is beneficial for the assembly of the temperature sensor 30.

[0039] Both the base plate 10 and the cover plate 20 are made of metal. Metal is beneficial for rapid heat conduction and also helps to improve the strength of the heat dissipation component 100.

[0040] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the scope of the technical solutions of this application.

Claims

1. A heat dissipation component, characterized in that, include: The base plate has a groove and a through hole, and the through hole and the groove are connected. A cover plate is located in the groove and the through hole. The cover plate and the bottom plate together form a receiving groove. The receiving groove includes a first receiving area and a second receiving area that are interconnected. The second receiving area is connected to the through hole. A temperature sensor includes a main body, a bent portion, and a probe. The bent portion connects the main body and the probe. The main body is located in a first receiving area, the bent portion is located in a second receiving area, and the probe is located in a through-hole. An encapsulation layer is filled in the receiving groove to fix the temperature sensor.

2. The heat dissipation assembly of claim 1, wherein, The base plate includes a first surface, a second surface, and a side surface. The first surface and the second surface are arranged back to back, and the side surface is connected to the first surface and the second surface. The groove is formed on the first surface and the side surface, the through hole penetrates the second surface, and the probe is exposed on the second surface.

3. The heat dissipation assembly of claim 2, wherein, The heat dissipation assembly further includes a heat sink located on the first surface.

4. The heat dissipation assembly of claim 3, wherein, The radiator includes heat dissipation fins and a heat pipe assembly. A mounting groove is provided on the first surface, with a portion of the heat pipe located in the mounting groove and another portion of the heat pipe located in the heat dissipation fins.

5. The heat dissipation assembly of claim 2, wherein, The cover plate includes a body and a protrusion, the protrusion protruding from the body, the body being located in the first receiving area, and the protrusion being located in the second receiving area.

6. The heat dissipation assembly according to claim 2, characterized in that, The surface of the cover plate and the first surface are on the same plane.

7. The heat dissipating assembly of claim 1, wherein, The cross-section of the second containment area includes an arc shape.

8. The heat dissipating assembly of claim 1, wherein, The encapsulation layer is made of epoxy resin.

9. The heat dissipating assembly of claim 1, wherein, Both the base plate and the cover plate are made of metal.

10. A terminal device, characterized by comprising: The terminal device includes the heat dissipation component as described in any one of claims 1-9.

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