Water cooling plate for land wind power system

Abstract

The utility model discloses a water cooling plate for an onshore wind power system, which relates to the technical field of water cooling, and comprises a central plate, an upper plate and a lower plate are respectively and fixedly arranged at the top and the bottom of the central plate, the water cooling plate further comprises a secondary cooling component, and two cooling passages are arranged at the top of the central plate. One ends of the two cooling passages are fixedly connected with an input pipe and an output pipe respectively, the other ends of the two cooling passages are both fixedly provided with connecting pipes, and one ends of the two connecting pipes are both communicated with the secondary cooling assembly; the secondary cooling assembly is located on one side of the center plate and comprises a heat preservation box, first heat dissipation fins are fixedly installed on the top of the heat preservation box, and fins of the first heat dissipation fins extend into the heat preservation box. According to the secondary cooling assembly, secondary cooling can be conducted on cooling liquid flowing through the water cooling plate, the temperature of the cooling liquid in an outlet area can be obviously reduced, and the heat exchange efficiency is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of water cooling technology, and in particular to a water-cooled plate for onshore wind power systems. Background Technology

[0002] As onshore wind power systems develop towards higher power and higher density, the heat generated by their key components (such as generators and converters) during operation increases significantly. Traditional heat dissipation methods (such as natural air cooling and forced air cooling) are no longer sufficient to meet the demands for efficient heat dissipation, while liquid cooling systems are gradually becoming the mainstream solution due to their high heat capacity. However, existing liquid cooling technologies still have the following shortcomings:

[0003] 1. Limited heat dissipation efficiency: In conventional single-cycle liquid cooling systems, the temperature of the coolant gradually increases after flowing through the heat-generating components. Especially in high-temperature environments or under high-load conditions, the temperature at the end of the coolant approaches the critical value, resulting in a decrease in overall heat dissipation capacity.

[0004] 2. Uneven thermal management: When the coolant flows in a single flow channel, the coolant temperature near the outlet area is higher, which can easily cause uneven heat dissipation and affect the stability of the equipment.

[0005] Therefore, in order to solve the aforementioned problems, we propose a water-cooled plate for onshore wind power systems. Utility Model Content

[0006] The purpose of this invention is to address the deficiencies in the existing technology by proposing a water-cooled plate for onshore wind power systems.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A water-cooled plate for an onshore wind power system includes a center plate, an upper plate and a lower plate fixedly installed on the top and bottom of the center plate, respectively, and a secondary cooling assembly. The top of the center plate has two cooling passages, one end of each cooling passage is fixedly connected to an input pipe and an output pipe, and the other end of each cooling passage is fixedly installed with a connecting pipe. One end of each connecting pipe is connected to the secondary cooling assembly.

[0009] The secondary cooling assembly is located on one side of the central plate. The secondary cooling assembly includes an insulation box, a heat dissipation fin is fixedly installed on the top of the insulation box, the fins of the heat dissipation fin extend into the interior of the insulation box, a semiconductor refrigeration matrix is ​​fixedly installed on the top of the heat dissipation fin, and a heat dissipation component is fixedly installed on the top of the semiconductor refrigeration matrix.

[0010] Furthermore, the semiconductor cooling matrix is ​​composed of multiple semiconductor cooling chips, and the cold end of the semiconductor cooling matrix is ​​attached to the top of the heat dissipation fin.

[0011] Furthermore, the heat dissipation assembly includes a second heat dissipation fin and a plurality of heat dissipation fans. The second heat dissipation fin is fixedly installed on the hot end of the semiconductor cooling matrix, and the plurality of heat dissipation fans are fixedly installed on the top of the second heat dissipation fin.

[0012] Furthermore, the cooling path is a zigzag shape.

[0013] Furthermore, the outer surface of the insulated box is provided with an insulation layer, which is made of foam plastic, and one end of each of the two connecting pipes extends into one side of the interior of the insulated box.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention, by setting up two zigzag cooling channels and a secondary cooling component, allows the coolant to exchange heat twice with the upper and lower plates when flowing through the central plate. At the same time, the secondary cooling component can actively cool the returning coolant, significantly reducing the temperature of the coolant in the outlet area and effectively improving the heat exchange efficiency.

[0016] The cold end of the semiconductor cooling matrix of this invention is directly coupled to the first heat dissipation fin, which can quickly absorb the heat of the coolant and transfer it to the hot end. Combined with the second heat dissipation fin and the cooling fan for forced heat dissipation, it can achieve precise control of the coolant temperature and ensure that stable heat dissipation performance can be maintained even in high-temperature environments. Attached Figure Description

[0017] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a structural schematic diagram of the present invention without the upper plate.

[0020] Figure 3 This is a cross-sectional view of the secondary cooling component of this utility model.

[0021] In the diagram: 1. Upper plate; 2. Center plate; 3. Lower plate; 4. Secondary cooling assembly; 5. Connecting pipe; 6. Cooling passage; 7. Insulation box; 8. Heat dissipation fin one; 9. Semiconductor cooling matrix; 10. Heat dissipation fin two; 11. Cooling fan. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model;

[0023] Reference Figure 1-3 A water-cooled plate for an onshore wind power system includes a central plate 2, an upper plate 1 and a lower plate 3 fixedly installed on the top and bottom of the central plate 2 respectively, and a secondary cooling assembly 4. The top of the central plate 2 has two cooling passages 6, one end of the two cooling passages 6 is fixedly connected to an input pipe and an output pipe respectively, and the other end of the two cooling passages 6 is fixedly installed with a connecting pipe 5. One end of the two connecting pipes 5 is connected to the secondary cooling assembly 4.

[0024] The water-cooled plate can be installed in the wind power system. The low-temperature coolant is pumped into the corresponding cooling passage 6 through the input pipe by the liquid pump, so that the coolant exchanges heat with the upper plate 1 and the lower plate 3. Then, it flows into the secondary cooling component 4 through the corresponding connecting pipe 5. The secondary cooling component 4 can cool the coolant. The cooled coolant will flow into the cooling passage 6 connected to the output pipe through another connecting pipe 5. The coolant will exchange heat with the upper plate 1 and the lower plate 3 again. The cooled coolant will be discharged from the output pipe and enter the external cooling unit for recirculation.

[0025] The secondary cooling assembly 4 is located on one side of the central plate 2. The secondary cooling assembly 4 includes an insulation box 7. One end of each of the two connecting pipes 5 extends into one side of the insulation box 7. A heat dissipation fin 8 is fixedly installed on the top of the insulation box 7, with the fins of the heat dissipation fin 8 extending into the interior of the insulation box 7. A semiconductor cooling matrix 9 is fixedly installed on the top of the heat dissipation fin 8, and a heat dissipation component is fixedly installed on the top of the semiconductor cooling matrix 9. The semiconductor cooling matrix 9 is composed of multiple semiconductor cooling chips, and the cold end of the semiconductor cooling matrix 9 is in contact with the top of the heat dissipation fin 8.

[0026] The cold end of the semiconductor cooling matrix 9 can transfer low temperature to the interior of the insulation box 7 through the heat dissipation fins 8. After entering the interior of the insulation box 7, the coolant will exchange heat with the heat dissipation fins 8 to cool down, and then be discharged through the corresponding connecting pipes 5. By using the secondary cooling component 4 to cool the coolant again, the temperature of the coolant on the side of the central plate 2 near the output pipe can be effectively reduced, thus significantly enhancing the overall cooling effect of the water-cooled plate.

[0027] The heat dissipation assembly includes a second heat dissipation fin 10 and multiple cooling fans 11. The second heat dissipation fin 10 is fixedly installed at the hot end of the semiconductor cooling matrix 9, and the multiple cooling fans 11 are fixedly installed on top of the second heat dissipation fin 10. The second heat dissipation fin 10 can absorb the heat emitted from the hot end of the semiconductor cooling matrix 9 and accelerate the heat dissipation rate. After the cooling fans 11 are started, they can further improve the heat dissipation effect of the second heat dissipation fin 10 on the semiconductor cooling matrix 9.

[0028] The cooling passage 6 is zigzag-shaped. The zigzag-shaped cooling passage 6 can extend the flow time of the coolant and improve the heat exchange effect between the coolant and the upper plate 1 and the lower plate 3. The outer surface of the insulation box 7 is provided with an insulation layer, which is made of foam plastic. The insulation layer can effectively improve the capacity of the insulation box 7 and significantly reduce the impact of external heat on the interior of the insulation box 7.

Claims

1. A water-cooled plate for an onshore wind power system, comprising a center plate (2), wherein an upper plate (1) and a lower plate (3) are fixedly mounted on the top and bottom of the center plate (2), respectively, characterized in that, It also includes a secondary cooling assembly (4), and the top of the center plate (2) is provided with two cooling passages (6). One end of each of the two cooling passages (6) is fixedly connected to an input pipe and an output pipe, respectively. The other end of each of the two cooling passages (6) is fixedly installed with a connecting pipe (5), and one end of each of the two connecting pipes (5) is connected to the secondary cooling assembly (4). The secondary cooling component (4) is located on one side of the central plate (2). The secondary cooling component (4) includes a heat preservation box (7). A heat dissipation fin (8) is fixedly installed on the top of the heat preservation box (7). The fins of the heat dissipation fin (8) extend into the interior of the heat preservation box (7). A semiconductor cooling matrix (9) is fixedly installed on the top of the heat dissipation fin (8). A heat dissipation component is fixedly installed on the top of the semiconductor cooling matrix (9).

2. A water-cooled plate for a land-based wind power system according to claim 1, characterized in that, The semiconductor cooling matrix (9) is composed of multiple semiconductor cooling chips, and the cold end of the semiconductor cooling matrix (9) is attached to the top of the heat dissipation fin (8).

3. A water-cooled plate for a land-based wind power system according to claim 2, characterized in that, The heat dissipation assembly includes a second heat dissipation fin (10) and a plurality of heat dissipation fans (11). The second heat dissipation fin (10) is fixedly installed on the hot end of the semiconductor cooling matrix (9), and the plurality of heat dissipation fans (11) are fixedly installed on the top of the second heat dissipation fin (10).

4. A water-cooled plate for a land-based wind power system according to claim 1, characterized in that, The cooling passage (6) is a zigzag shape.

5. A water-cooled plate for a land-based wind power system according to claim 1, characterized in that, The outer surface of the insulated box (7) is provided with an insulation layer, which is made of foam plastic, and one end of each of the two connecting pipes (5) extends into one side of the interior of the insulated box (7).

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