Efficient double-sided liquid cooling plate
By setting heat dissipation fins on the cover plate of the liquid cooling plate and optimizing the flow channel structure, the problem of low heat transfer coefficient of the coolant is solved, achieving efficient heat dissipation and temperature control, and improving the stability and lifespan of the heat-generating element.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI HOTTOP ELECTRONIC TECH CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-04-17
AI Technical Summary
The heat transfer coefficient of the coolant in existing liquid cooling plates is relatively low, resulting in a decrease in heat dissipation performance.
Heat dissipation fins are installed on the cover plate of the liquid cooling plate. The heat dissipation fins extend into the cooling channel and come into contact with the coolant, increasing the heat exchange area. The flow of coolant is disturbed by the rhomboid prisms, and the channel structure is optimized to improve the heat exchange efficiency.
It improves the heat transfer coefficient and heat dissipation efficiency of the coolant, enabling it to remove more heat in the same amount of time, thereby improving the stability and reliability of the heating elements and extending their service life.
Smart Images
Figure CN224139334U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of liquid cooling plates, and in particular to a high-efficiency double-sided liquid cooling plate. Background Technology
[0002] Liquid cooling plates, as part of liquid cooling systems, are widely used in electronic devices, power batteries, and high-power devices. By creating internal cooling channels and utilizing the circulation of coolant within these channels, liquid cooling plates efficiently absorb and transfer the heat generated by heat-generating components to an external heat dissipation system, thus achieving temperature control of the heat-generating components.
[0003] However, in actual use, it was found that when the coolant flows in the cooling channel, the heat transfer coefficient of the coolant is low, which leads to a decrease in the overall heat dissipation performance of the liquid cooling plate. Utility Model Content
[0004] To improve the heat dissipation efficiency of liquid cooling plates, this application provides a high-efficiency double-sided liquid cooling plate.
[0005] This application provides a high-efficiency double-sided liquid-cooled plate, which adopts the following technical solution:
[0006] A high-efficiency double-sided liquid cooling plate includes a substrate and a cover plate. The substrate has cooling channels for coolant flow, and the cover plate covers the cooling channels and is sealed to the substrate. The end of the cover plate away from the substrate abuts against a heat-generating element. The substrate has an inlet and an outlet, through which coolant enters the cooling channels and flows out from the outlet. The end of the cover plate facing the substrate has protruding heat dissipation fins that extend into the cooling channels but do not contact the bottom of the cooling channels.
[0007] By adopting the above technical solution, a liquid cooling plate is installed at the heat-generating point of the heat-generating element, and the heat is transferred to the heat dissipation fins through the cover plate. The coolant flows into the cooling channel through the inlet and absorbs the heat conducted by the heat dissipation fins as it flows in the cooling channel. The heat dissipation fins can effectively contact the coolant, increasing the effective heat exchange area. At the same time, the heat dissipation fins extending into the cooling channel disturb the flow of the coolant, improving the heat transfer coefficient. The coolant that has absorbed heat flows out from the outlet to the external heat dissipation system, thereby achieving temperature control of the heat-generating element.
[0008] Optionally, the heat dissipation fins include a plurality of uniformly spaced rhomboid prisms.
[0009] By adopting the above technical solution, the coolant flows through the gap between adjacent rhomboid prisms, giving the coolant a larger contact area with the rhomboid prisms, and the rhomboid prisms disturb the flow of the coolant, thereby improving heat dissipation efficiency.
[0010] Optionally, the axis of the rhomboid prism is arranged along the direction of coolant flow.
[0011] By adopting the above technical solution, the coolant first contacts the corners of the rhomboid prism before flowing to both sides, making the contact path between the coolant and the surface of the rhomboid prism longer, the local heat transfer coefficient higher, and reducing flow dead angles, thus making the coolant distribution more uniform.
[0012] Optionally, the cover plate and the rhomboid prism are connected by vacuum brazing.
[0013] By adopting the above technical solution, the vacuum brazing connection method enables the connection between the cover plate and the rhomboid column to have high connection strength and reliability.
[0014] Optionally, the position and shape of the heat dissipation fins correspond one-to-one with the position and shape of the cooling channels.
[0015] By adopting the above technical solution, the contact area of the coolant is increased during the flow of the coolant in the cooling channel, thereby improving the heat dissipation efficiency of the liquid cooling plate.
[0016] Optionally, the cooling channel adopts a mosquito coil-shaped disc channel.
[0017] By adopting the above technical solution, the mosquito coil-shaped flow channel has a longer path, which allows the coolant to stay in the cooling flow channel for a longer time, effectively absorbing and carrying away heat, achieving more complete heat exchange, and improving heat dissipation efficiency.
[0018] Optionally, cooling channels are provided on both sides of the substrate, and the two cooling channels are arranged in parallel; two cover plates are provided, and the two cover plates are respectively sealed and connected to both sides of the substrate.
[0019] By adopting the above technical solution, the cooling channels arranged in parallel on both sides of the substrate enable the liquid cooling plate to dissipate heat from multiple heat-generating elements simultaneously, increasing the contact area between the coolant and the heat dissipation fins, thereby removing more heat in the same amount of time, effectively reducing the temperature of the heat-generating elements and surrounding components, and maintaining the stability and reliability of the heat-generating elements under high load operation.
[0020] Optionally, one end of the cooling channel is provided with a liquid inlet channel, which is connected to a liquid inlet, and the other end of the cooling channel is connected with a liquid outlet channel, which is connected to a liquid outlet.
[0021] By adopting the above technical solution, the coolant can be distributed more evenly to the cooling channels on both sides, ensuring that the coolant flow rate on both sides of the substrate is consistent and stable.
[0022] Optionally, the cover plate and the substrate are connected by vacuum brazing.
[0023] By adopting the above technical solution, the vacuum brazing connection method makes the connection between the cover plate and the substrate more solid, improves the stability and reliability of the liquid cooling plate, and has good sealing performance, avoiding problems such as reduced heat dissipation performance and equipment damage caused by coolant leakage.
[0024] Optionally, the liquid inlet and liquid outlet are both located on the same side of the substrate.
[0025] By adopting the above technical solution, the inlet and outlet are located on the same side of the substrate, making the connection of external pipes more convenient, reducing pipe crossings and complex layouts, and lowering the installation difficulty.
[0026] In summary, this application includes at least one of the following beneficial technical effects:
[0027] 1. By setting heat dissipation fins on the cover plate, and the heat dissipation fins extending into the cooling channel but not contacting the bottom of the cooling channel; the heat dissipation fins include several uniformly spaced rhomboid prism heat dissipation fins, and the coolant flows in the gap between adjacent rhomboid prisms, which can effectively extend the flow path of the coolant in the cooling channel, increase the effective heat exchange area, and improve the heat transfer coefficient.
[0028] 2. By arranging cooling channels in parallel on both sides of the substrate, the liquid cooling plate can dissipate heat from multiple heat-generating elements at the same time, thereby removing more heat in the same amount of time, effectively reducing the temperature of the heat-generating elements and surrounding components, and maintaining the stability and reliability of the heat-generating elements under high load operation.
[0029] 3. By setting up inlet and outlet channels, the coolant can be distributed more evenly to the cooling channels on both sides, ensuring that the coolant flow rate on both sides of the substrate is consistent and stable. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;
[0031] Figure 2 This is a schematic diagram of the substrate structure in this application;
[0032] Figure 3 This is a cross-sectional view of the substrate along the AA direction in this application;
[0033] Figure 4 This is a schematic diagram of the cover plate in this application;
[0034] Figure 5 yes Figure 4 Enlarged view of section A;
[0035] Figure 6 This is a partial cross-sectional view in this application that highlights the heat dissipation fins extending into the cooling channel;
[0036] Figure 7 This is a cross-sectional view of the overall structure of this application.
[0037] Reference numerals: 1. Substrate; 11. Cooling channel; 12. Liquid inlet; 13. Liquid inlet channel; 14. Liquid outlet; 15. Liquid outlet channel; 2. Cover plate; 21. Heat dissipation fins; 22. Rhomboid prism. Detailed Implementation
[0038] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.
[0039] In this embodiment, the heating element is illustrated using an IGBT chip as an example, but this does not limit the scope of this application.
[0040] This application discloses a high-efficiency double-sided liquid-cooled plate, referring to... Figure 1 and Figure 2 The device includes a substrate 1 and a cover plate 2. A cooling channel 11 is formed on the substrate 1. The cover plate 2 covers the cooling channel 11 and is sealed to the substrate 1. The end of the cover plate 2 away from the substrate 1 abuts against the IGBT chip. An inlet 12 and an outlet 14 are formed on the same side of the substrate 1. The inlet 12 and the outlet 14 are respectively connected to the inside of the cooling channel 11.
[0041] During operation, the liquid cooling plate is placed in close contact with the heat-generating part of the IGBT chip, and the heat is transferred to the cover plate 2. The coolant flows into the cooling channel 11 through the inlet 12. When flowing in the cooling channel 11, it absorbs the heat conducted by the cover plate 2 and then flows out from the outlet 14 to the external heat dissipation system, thereby achieving temperature control of the IGBT chip and helping to extend the service life of the IGBT chip and its corresponding hardware.
[0042] Reference Figure 2 and Figure 3 One end of the cooling channel 11 is connected to the liquid inlet channel 13, which is connected to the liquid inlet 12. The other end of the cooling channel 11 is connected to the liquid outlet channel 15, which is connected to the liquid outlet 14. In this embodiment, the cooling channel 11 is a mosquito coil-shaped channel; in other embodiments, the cooling channel 11 can be a serpentine channel, a wave channel, or other channel structures.
[0043] Reference Figure 4 and Figure 5 The cover plate 2 has a heat dissipation fin 21 protruding from one end facing the substrate 1. The heat dissipation fin 21 extends into the cooling channel 11, and the position and shape of the heat dissipation fin 21 correspond one-to-one with the position and shape of the cooling channel 11.
[0044] Reference Figure 5 and Figure 6The heat dissipation fins 21 include several rhomboid prisms 22, the tooth height of which is half the depth of the cooling channel 11. The longer axis of the rhomboid prisms 22 is arranged along the direction of coolant flow, so that the coolant first contacts the edges of the rhomboid prisms 22 before flowing to both sides, which makes the contact path between the coolant and the surface of the rhomboid prisms 22 longer and the local heat transfer coefficient higher. The rhomboid prisms 22 are evenly spaced along the direction perpendicular to the coolant flow to form multiple horizontal rows. The multiple horizontal rows are arranged sequentially along the direction of coolant flow, and the rhomboid prisms 22 in the later horizontal row are located between two adjacent rhomboid prisms 22 in the previous row. The coolant flows in the gap between two adjacent rhomboid prisms 22, which prolongs the flow path of the coolant, increases the effective heat transfer area, and improves the heat transfer coefficient. In this embodiment, the tooth height of the rhomboid prism 22 is 3mm, the tooth spacing between two adjacent rhomboid prisms 22 in each horizontal row is 0.4mm, and the rhomboid prism 22 is fixedly connected to the cover plate 2 by vacuum brazing.
[0045] By adjusting the width, tooth height, tooth spacing between adjacent rhomboid prisms 22, and the overall shape of the heat dissipation fins 21, the flow cross section of the coolant in the cooling channel 11 can be adjusted, the flow rate of the coolant can be controlled, and the flow resistance can be flexibly adjusted, thereby adjusting the heat dissipation effect of the liquid cooling plate, which can be adapted to heat-generating elements of different power.
[0046] Reference Figure 2 and Figure 7 Cooling channels 11 are respectively formed on both sides of the substrate 1, and the two ends of the two cooling channels 11 are connected to the liquid inlet channel 13 and the liquid outlet channel 15 respectively, so that the cooling channels 11 on both sides of the substrate 1 are arranged in parallel. In use, the two sides of the liquid cooling plate can simultaneously contact the heat-generating parts of different IGBT chips, thereby removing more heat in the same amount of time, effectively reducing the temperature of the IGBT chips, and improving the heat dissipation efficiency of the liquid cooling plate. In addition, there are two cover plates 2, which cover both sides of the substrate 1 respectively and are connected to the substrate 1 by vacuum brazing to ensure the connection strength and sealing effect between the cover plate 2 and the substrate 1.
[0047] The implementation principle of a high-efficiency double-sided liquid cooling plate disclosed in this application is as follows: coolant flows into the inlet channel 13 through the inlet 12, and then flows into the cooling channels 11 on both sides; heat is transferred to the rhomboid prism 22 through the cover plate 2. When the coolant flows in the gaps of the rhomboid prism 22, it absorbs the heat conducted by the rhomboid prism 22. At the same time, the rhomboid prism 22 disturbs the flow of coolant, thereby improving heat dissipation efficiency; the coolant that has absorbed heat on both sides flows into the outlet channel 15, and then flows out from the outlet 14 to the external heat dissipation system, thereby realizing temperature control of the IGBT chip. This not only improves the stability and durability of the IGBT chip, but also helps to extend the service life of the hardware.
[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A high-efficiency double-sided liquid cooling plate, characterized in that, The device includes a substrate (1) and a cover plate (2). The substrate (1) has a cooling channel (11) for coolant flow. The cover plate (2) covers the cooling channel (11) and is sealed to the substrate (1). The end of the cover plate (2) away from the substrate (1) is in contact with the heating element. The substrate (1) has an inlet (12) and an outlet (14) respectively. The coolant enters the cooling channel (11) through the inlet (12) and flows out from the outlet (14). The end of the cover plate (2) facing the substrate (1) has a heat dissipation fin (21) protruding out. The heat dissipation fin (21) extends into the cooling channel (11) but does not contact the bottom of the cooling channel (11).
2. The high-efficiency double-sided liquid-cooled plate according to claim 1, characterized in that, The heat dissipation fins (21) include a number of uniformly spaced rhomboid prisms (22).
3. The high-efficiency double-sided liquid-cooled plate according to claim 2, characterized in that, The axis of the rhomboid prism (22) is set along the direction of coolant flow.
4. The high-efficiency double-sided liquid-cooled plate according to claim 2, characterized in that, The cover plate (2) and the rhomboid column (22) are connected by vacuum brazing.
5. A high-efficiency double-sided liquid-cooled plate according to claim 1, characterized in that, The position and shape of the heat dissipation fins (21) correspond one-to-one with the position and shape of the cooling channels (11).
6. The high-efficiency double-sided liquid-cooled plate according to claim 5, characterized in that, The cooling channel (11) adopts a mosquito coil-shaped disc channel.
7. The high-efficiency double-sided liquid-cooled plate according to claim 1, characterized in that, Cooling channels (11) are provided on both sides of the substrate (1), and the two cooling channels (11) are arranged in parallel; there are two cover plates (2), and the two cover plates (2) are respectively sealed and connected to both sides of the substrate (1).
8. A high-efficiency double-sided liquid-cooled plate according to claim 7, characterized in that, One end of the cooling channel (11) is provided with a liquid inlet channel (13), which is connected to the liquid inlet (12). The other end of the cooling channel (11) is connected to a liquid outlet channel (15), which is connected to the liquid outlet (14).
9. A high-efficiency double-sided liquid-cooled plate according to claim 1, characterized in that, The cover plate (2) and the substrate (1) are connected by vacuum brazing.
10. A high-efficiency double-sided liquid-cooled plate according to claim 1, characterized in that, The liquid inlet (12) and liquid outlet (14) are both located on the same side of the substrate (1).