Insulation cabin

Abstract

An insulating compartment includes a plurality of insulating panels. The insulating plates are detachably connected with each other to form an accommodating space therein, and the accommodating space is suitable for at least partially accommodating the electronic device. At least one of the insulating plates includes two conductive layers, an insulating layer, and an insulating sealant. The insulating layer is sandwiched between the conductive layers so as to form a stacked structure together with the conductive layers. The stacked structure is at least partially embedded in the insulating sealant.

Description

Technical Field

[0001] This utility model relates to an insulating chamber, and more particularly to an open insulating chamber, wherein the insulating plate is detachable to accommodate electronic devices therein, thereby protecting the electronic devices from the influence of external electric fields. Background Technology

[0002] An insulating chamber is a device used to isolate the influence of external electric fields. It is suitable for housing precision electronic instruments to prevent them from being affected by external electromagnetic interference and thus ensuring their normal operation. In fact, insulating chambers are widely used in fields such as electronics, physics, and chemistry.

[0003] However, with the increasing power requirements of electronic instruments and the trend towards miniaturization to reduce their size, how to improve the shielding effect of the insulating chamber on electronic instruments, while simultaneously improving the assembly flexibility of the insulating chamber, is undoubtedly an important issue of great concern to the industry. Utility Model Content

[0004] One of the objectives of this invention is to provide an insulating chamber that can effectively reduce production costs and improve flexibility in use, while also effectively maintaining the function of blocking external electromagnetic fields and preventing corona discharge in the air.

[0005] According to one embodiment of the present invention, an insulating chamber comprises a plurality of insulating plates. The insulating plates are detachably connected to each other to form an accommodating space therein, the accommodating space being adapted to at least partially accommodate an electronic device. At least one of the insulating plates comprises two conductive layers, an insulating layer, and an insulating sealant. The insulating layer is sandwiched between the conductive layers to form a stacked structure together with the conductive layers. The stacked structure is at least partially embedded within the insulating sealant.

[0006] In one or more embodiments of this utility model, the conductive layer described above exposes the outer edge of the insulating layer.

[0007] In one or more embodiments of the present invention, the insulating layer has a first outer edge, and each of the conductive layers has a second outer edge, wherein the first outer edge is aligned with or protrudes from the second outer edge.

[0008] In one or more embodiments of this utility model, the insulating layer has a first area, and each of the conductive layers has a second area, wherein the first area is larger than the second area.

[0009] In one or more embodiments of this utility model, the above-mentioned insulating sealant completely covers the side surface of the stacked structure.

[0010] In one or more embodiments of this utility model, at least one of the conductive layers described above includes a plate portion and a first frame portion. The first frame portion is disposed on the outer edge of the plate portion and protrudes from the plate portion toward the side away from the insulating layer.

[0011] In one or more embodiments of this utility model, at least one of the conductive layers includes a plate portion and at least one locking portion. The locking portion is disposed on the side of the plate portion away from the insulating layer, and the locking portion is at least partially exposed to the insulating sealant.

[0012] In one or more embodiments of this invention, at least one of the conductive layers described above includes a plate portion and a second frame portion. The plate portion has an inner edge that defines an opening. The second frame portion is disposed on the inner edge and protrudes from the plate portion toward the side away from the insulating layer.

[0013] In one or more embodiments of this utility model, the above-mentioned insulating layer is bonded between the conductive layers.

[0014] In one or more embodiments of this utility model, at least one of the above-mentioned conductive layers is in the form of a mesh.

[0015] The above-described embodiments of this utility model have at least the following advantages:

[0016] (1) Since the two adjacent parts in the insulation board can be assembled using various detachable connection methods, the flexibility of the insulation chamber is improved.

[0017] (2) When potting technology is used, the shape design of the insulating board can be more flexible and will not be limited by the electric field distribution. The overall manufacturing yield is also improved, and the complexity of the manufacturing process can be greatly reduced, which can help reduce the production cost of the insulating chamber.

[0018] (3) Since the insulating sealant completely covers the side surface of the stacked structure, that is, the stacked structure is completely embedded in the insulating sealant, it can effectively prevent the second outer edge of the conductive layer from contacting the air, thereby maintaining the function of the insulating board in blocking external electromagnetic fields, and can prevent corona discharge in the air when there is high voltage on both sides. Attached Figure Description

[0019] Figure 1 A perspective view of an insulating chamber according to an embodiment of the present invention is provided.

[0020] Figure 2 For illustration Figure 1 A partial perspective view of the insulating board;

[0021] Figure 3 For illustration Figure 2 An exploded view of the stacked structure;

[0022] Figure 4 A partial perspective view of an insulating plate according to another embodiment of the present invention is shown.

[0023] Figure 5 To illustrate along Figure 4 A cross-sectional view of line segment AA;

[0024] Figure 6 A partial perspective view of an insulating plate according to another embodiment of the present invention is shown.

[0025] [Symbol Explanation]

[0026] 100: Insulation Chamber

[0027] 110: Insulation board

[0028] 111: Conductive layer

[0029] 1111: Board section

[0030] 1112: First frame

[0031] 1113: Locking part

[0032] 1114: Second frame

[0033] 112: Insulation layer

[0034] 113: Insulating sealant

[0035] AA: Line segment

[0036] AS: Storage Space

[0037] A1: First area

[0038] A2: Second area

[0039] EI: Inner Edge

[0040] EO1: First outer edge

[0041] EO2: Second outer edge

[0042] H: Perforation

[0043] OP: Open

[0044] S: Side surface

[0045] T: Stacked structure Detailed Implementation

[0046] The following describes several embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and elements will be shown in a simple schematic manner in the drawings, and in all drawings, the same reference numerals will be used to denote the same or similar elements. And, where feasible, features of different embodiments may be applied interchangeably.

[0047] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, which are understandable to those skilled in the art. Furthermore, the definitions of the foregoing terms in commonly used dictionaries should be interpreted in the context of this specification as having the meaning consistent with the relevant field of this invention. Unless specifically defined, these terms will not be construed as having idealized or overly formal meanings.

[0048] Please refer to Figure 1 . Figure 1 This is a perspective view of an insulating chamber 100 according to an embodiment of the present invention. In this embodiment, as... Figure 1 As shown, an insulating chamber 100 includes a plurality of insulating plates 110, which are detachably connected to each other to form an accommodating space AS therein. The accommodating space AS is adapted to at least partially accommodate electronic devices, so that the electronic devices are protected from external electromagnetic interference by the insulating plates 110. In practical applications, adjacent insulating plates 110 can be assembled using various detachable connection methods to improve the flexibility of use of the insulating chamber 100.

[0049] Please refer to Figures 2-3 . Figure 2 For illustration Figure 1 A partial perspective view of the insulating plate 110. Figure 3 For illustration Figure 2 An exploded view of the stacked structure T. In this embodiment, as... Figures 2-3 As shown, at least one of the insulating boards 110 includes two conductive layers 111, an insulating layer 112, and an insulating sealant 113 (the insulating sealant 113 is shown in dashed lines). The insulating layer 112 is sandwiched between the conductive layers 111 to form a stacked structure T together with the conductive layers 111. In fact, the insulating layer 112 is bonded between the conductive layers 111, and the stacked structure T is at least partially embedded in the insulating sealant 113.

[0050] During the manufacturing process of the insulating board 110, after the insulating layer 112 is bonded between the conductive layers 111 to form a stacked structure T together with the conductive layers 111, the stacked structure T can be potted so that the insulating sealant 113 covers the stacked structure T. With the use of potting technology, the shape design of the insulating board 110 can be more flexible and is not limited by the electric field distribution, while the overall manufacturing yield is improved, and the complexity of the manufacturing process can be greatly reduced, thus helping to reduce the production cost of the insulating chamber 100.

[0051] Specifically, the insulating layer 112 has a first outer edge EO1, while the conductive layer 111 has a second outer edge EO2. In this embodiment, the first outer edge EO1 of the insulating layer 112 is aligned with or protrudes from the second outer edge EO2 of the conductive layer 111. In other words, the conductive layer 111 exposes the first outer edge EO1 of the insulating layer 112. For example, as... Figure 2 As shown, the first outer edge EO1 of the insulating layer 112 protrudes beyond the second outer edge EO2 of the conductive layer 111. In other embodiments, depending on the actual situation, the first outer edge EO1 of the insulating layer 112 may be aligned with the second outer edge EO2 of the conductive layer 111.

[0052] Furthermore, such as Figure 2 As shown, the insulating sealant 113 completely covers the side surface S of the stacked structure T, that is, the stacked structure T is completely embedded in the insulating sealant 113. Therefore, it can effectively prevent the second outer edge EO2 of the conductive layer 111 from contacting the air, thereby maintaining the function of the insulating plate 110 in blocking external electromagnetic fields, and can prevent corona discharge in the air when there is high voltage across both sides.

[0053] Furthermore, such as Figure 3 As shown, in this embodiment, the insulating layer 112 has a first area A1, while the conductive layer 111 has a second area A2. In this embodiment, the first area A1 of the insulating layer 112 is larger than the second area A2 of the conductive layer 111. That is, the conductive layer 111 can be completely stacked on the insulating layer 112. Furthermore, depending on the actual situation, the size and shape of the conductive layer 111 can be different.

[0054] Please refer to Figure 4 . Figure 4 This is a partial perspective view illustrating an insulating plate 110 according to another embodiment of the present invention. In this embodiment, as... Figure 4 As shown, the conductive layer 111 includes a plate portion 1111 and a first frame portion 1112, wherein the first frame portion 1112 is disposed on the outer edge of the plate portion 1111 and protrudes from the plate portion 1111 towards the side away from the insulating layer 112. The first frame portion 1112 may be substantially a strip of metal, which can effectively reduce the electric field strength and improve the overall rigidity of the stacked structure T and thus the insulating plate 110.

[0055] On the other hand, depending on the actual situation, such as Figure 4 As shown, the plate portion 1111 has an inner edge EI, which defines an opening OP. Furthermore, the conductive layer 111 includes a second frame portion 1114, which is disposed on the inner edge EI and also protrudes from the plate portion 1111 towards the side away from the insulating layer 112. Similarly, the second frame portion 1114 can be substantially a strip of metal, which can effectively reduce the electric field strength and improve the overall rigidity of the stacked structure T and thus the insulating plate 110. For example, depending on the actual situation, the input and output terminals of the transformer (not shown) can be respectively disposed inside and outside the accommodating space AS, and the input and output terminals can be electrically coupled through the opening OP.

[0056] Please refer to Figure 5 . Figure 5 To illustrate along Figure 4 A cross-sectional view of line segment AA. In this embodiment, the conductive layer 111 includes a locking portion 1113, which is disposed on the side of the plate portion 1111 away from the insulating layer 112, and the insulating sealant 113 exposes at least a portion of the locking portion 1113, that is, the locking portion 1113 is at least partially exposed in the insulating sealant 113. In this way, the exposed locking portion 1113 can be directly connected to electronic devices located in the accommodating space AS, thereby improving the flexibility of use of the insulating compartment 100. For example, such as Figure 5 As shown, the locking part 1113 may be a columnar structure with internal threads, and at least partially protrudes from the insulating sealant 113, but the present invention is not limited to the number and placement of the locking part 1113.

[0057] Please refer to Figure 6 . Figure 6 This is a partial perspective view illustrating an insulating plate 110 according to another embodiment of the present invention. In this embodiment, as... Figure 6 As shown, the conductive layer 111 may be mesh-like depending on the implementation, that is, the conductive layer 111 has a plurality of through holes H, and the through holes H are distributed in the conductive layer 111 and at least partially expose the insulating layer 112.

[0058] In summary, the technical solution disclosed in the above embodiments of this utility model has at least the following advantages:

[0059] (1) Since the two adjacent parts in the insulation board can be assembled using various detachable connection methods, the flexibility of the insulation chamber is improved.

[0060] (2) When potting technology is used, the shape design of the insulating board can be more flexible and will not be limited by the electric field distribution. The overall manufacturing yield is also improved, and the complexity of the manufacturing process can be greatly reduced, which can help reduce the production cost of the insulating chamber.

[0061] (3) Since the insulating sealant completely covers the side surface of the stacked structure, that is, the stacked structure is completely embedded in the insulating sealant, it can effectively prevent the second outer edge of the conductive layer from contacting the air, thereby maintaining the function of the insulating board in blocking external electromagnetic fields, and can prevent corona discharge in the air when there is high voltage on both sides.

[0062] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. An insulated cabin, characterized in that, Include: A plurality of insulating plates, the plurality of insulating plates being detachably connected to form a receiving space therein, the receiving space being adapted to at least partially receive an electronic device, at least one of the plurality of insulating plates comprising: Two conductive layers; An insulating layer, sandwiched between the two conductive layers to form a stacked structure together with the two conductive layers; and An insulating sealant, wherein the stacked structure is at least partially embedded within the insulating sealant.

2. The insulated pod of claim 1, wherein, The two conductive layers expose one outer edge of the insulating layer.

3. The insulated pod of claim 1, wherein, The insulating layer has a first outer edge, and each of the two conductive layers has a second outer edge, the first outer edge being aligned with or protruding from the second outer edge.

4. The insulated pod of claim 1, wherein, The insulating layer has a first area, and each of the two conductive layers has a second area, the first area being larger than the second area.

5. The insulated pod of claim 1, wherein, The insulating sealant completely covers one side surface of the stacked structure.

6. The insulated pod of claim 1, wherein, At least one of the two conductive layers comprises: One board section; and A first frame portion is disposed on an outer edge of the plate portion and protrudes from the plate portion toward the side away from the insulating layer.

7. The insulated pod of claim 1, wherein, At least one of the two conductive layers comprises: One board section; and At least one locking part is disposed on the side of the plate away from the insulating layer, and the locking part is at least partially exposed in the insulating sealant.

8. The insulated pod of claim 1, wherein, At least one of the two conductive layers comprises: A plate portion having an inner edge defining an opening; and A second frame portion is disposed on the inner edge and protrudes from the plate portion toward the side away from the insulating layer.

9. The insulated pod of claim 1, wherein, The insulating layer is bonded between the two conductive layers.

10. The insulated pod of claim 1, wherein, At least one of the two conductive layers is mesh-like.

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