Semiconductor processing clamping device convenient to adjust

By introducing adjustment and positioning mechanisms into the semiconductor processing clamping device, and utilizing servo motors and worm gear transmission systems to achieve angle adjustment and fixation of the support table, the problem of insufficient adjustment and stability in semiconductor processing is solved, thus improving the processing effect.

CN224139447UActive Publication Date: 2026-04-17HENGYIDA INTELLIGENT EQUIP (SUZHOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HENGYIDA INTELLIGENT EQUIP (SUZHOU) CO LTD
Filing Date
2025-05-26
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing semiconductor processing equipment has shortcomings in adjusting angles and maintaining stability, resulting in poor processing results.

Method used

A semiconductor processing clamping device including an adjustment mechanism and a positioning mechanism was designed. The angle of the support platform is adjusted by a servo motor and a worm gear transmission system, and the support platform is fixed by the cooperation of a servo cylinder and a clamping plate.

Benefits of technology

It improves the ease of adjustment and stability of semiconductor processing, and enhances the processing effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor processing clamping device convenient to adjust, and relates to the technical field of semiconductor processing, the semiconductor processing clamping device comprises a bottom plate, the top surface of the bottom plate is fixedly provided with two supporting plates which are distributed in an opposite supporting mode, a supporting table is jointly and rotatably installed between the two supporting plates, the top surface of the supporting table is fixedly provided with a clamp, and the clamp is fixedly provided with a clamping groove. Wherein one side of one supporting plate is provided with an adjusting mechanism, one side of the other supporting plate is provided with a positioning mechanism, the adjusting mechanism comprises a supporting shell, the supporting table can be adjusted through the adjusting mechanism, and therefore the clamp and a semiconductor on the clamp can be adjusted; therefore, the semiconductor can be conveniently processed in different directions, the practicability is improved, the supporting table can be fixed through the positioning mechanism, the movement condition of the supporting table is reduced, the stability of the supporting table is improved, and the processing effect on the semiconductor is improved.
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Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to an easily adjustable semiconductor processing clamping device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.

[0003] Regarding the aforementioned technologies, the inventors believe the following problems still exist:

[0004] First, during the semiconductor processing, the angle of the semiconductor needs to be adjusted. However, the small size of the semiconductor makes it difficult to adjust, thus reducing the processing efficiency.

[0005] Secondly, during the semiconductor processing, it is necessary to keep the semiconductor stable. However, some existing semiconductor fixtures tend to wobble after the angle is adjusted, which reduces the stability of the semiconductor.

[0006] To address the aforementioned problems, the inventors propose an easily adjustable semiconductor processing clamping device to solve these issues. Utility Model Content

[0007] In order to improve the problem that some existing devices are not easy to adjust the angle, the purpose of this utility model is to provide a semiconductor processing clamping device that is easy to adjust.

[0008] To address the aforementioned problems, this utility model provides the following solution: an easily adjustable semiconductor processing clamping device, comprising a base plate, on the top surface of which two opposing support plates are fixedly mounted, and a support platform is rotatably mounted between the two support plates. A clamp is fixedly mounted on the top surface of the support platform. An adjustment mechanism is provided on one side of one of the support plates, and a positioning mechanism is provided on one side of the other support plate. The adjustment mechanism includes a support shell, which is fixedly mounted on the side of the support plate facing away from the support platform. A servo motor is fixedly mounted on one side of the support shell, and a worm gear is fixedly mounted on the output end of the servo motor. A worm wheel is meshed with the outer surface of the worm gear, and the worm wheel is rotatably mounted on the inner wall of one side of the support shell. A rotating rod is fixedly mounted in the middle of the worm wheel, and one end of the rotating rod movably passes through the support plate and is fixedly connected to one side of the support platform.

[0009] Preferably, the positioning mechanism includes a fixing block, which is fixedly installed on the side of the support plate facing away from the support platform. A servo cylinder is fixedly installed on the upper part of one side of the support plate. A clamping plate is fixedly installed on the telescopic end of the servo cylinder. The clamping plate slides on one side of the support plate. The clamping plate and the side opposite to the fixing block are provided with grooves that cooperate with the rotating rod.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0011] 1. This utility model, by setting an adjustment mechanism, can adjust the support platform, thereby adjusting the fixture and the semiconductor on the fixture, thus facilitating the processing of the semiconductor in different directions and improving its practicality.

[0012] 2. By setting a positioning mechanism, the support platform can be fixed, reducing the movement of the support platform and thus improving the stability of the support platform and the processing effect of semiconductors. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the adjustment mechanism of this utility model.

[0016] Figure 3 This is a schematic diagram of the positioning mechanism of this utility model.

[0017] Figure 4 This is a schematic diagram of the fixture structure of this utility model.

[0018] In the diagram: 1. Base plate; 11. Support plate; 12. Processing plate; 13. Support platform; 14. Electric telescopic rod; 15. Clamping block; 16. Baffle; 2. Positioning mechanism; 21. Fixing block; 22. Slider; 23. Slide groove; 24. Servo cylinder; 25. Clamping plate; 26. Friction pad; 27. Groove; 3. Adjustment mechanism; 30. Support; 31. Servo motor; 32. Worm gear; 33. Rotating rod; 34. Circular groove; 35. Support shell; 36. Worm wheel. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: Figure 1-4 As shown, this utility model provides an easily adjustable semiconductor processing clamping device, including a base plate 1, which is used as a support member. Two opposing support plates 11 are fixedly installed on the top surface of the base plate 1. The two support plates 11 can support the support platform 13. The support platform 13 is rotatably installed between the two support plates 11 to prevent the support platform 13 from falling off. A clamp is fixedly installed on the top surface of the support platform 13, which can fix the semiconductor.

[0021] One of the support plates 11 is provided with an adjustment mechanism 3 on one side, which can adjust the support platform 13. The other support plate 11 is provided with a positioning mechanism 2 on one side, which can fix the support platform 13.

[0022] The adjustment mechanism 3 includes a support shell 35, which serves as a support component. The support shell 35 is fixedly installed on the side of the support plate 11 facing away from the support platform 13 to prevent the support platform 13 from falling off.

[0023] A servo motor 31 is fixedly installed on one side of the support shell 35, and a support 30 is fixedly installed on one side of the support plate 11. The support 30 is fixedly connected to the servo motor 31 and can support the servo motor 31.

[0024] A worm gear 32 is fixedly installed at the output end of the servo motor 31. A circular groove 34 is provided on one side of the support housing 35. The worm gear 32 moves through the circular groove 34, and the circular groove 34 can support the worm gear 32.

[0025] A worm wheel 36 is meshed with the outer surface of the worm 32. The worm wheel 36 is rotatably mounted on the inner wall of one side of the support housing 35. A rotating rod 33 is fixedly mounted in the middle of the worm wheel 36, so that the worm wheel 36 and the worm 32 cooperate to drive the rotating rod 33 for transmission.

[0026] One end of the rotating rod 33 movably passes through the support plate 11 and is fixedly connected to one side of the support platform 13, so that the rotating rod 33 drives the support platform 13 to rotate.

[0027] The positioning mechanism 2 includes a fixing block 21, which is used as a support member. The fixing block 21 is fixedly installed on the side of the support plate 11 facing away from the support platform 13 to prevent the fixing block 21 from falling off.

[0028] The rotating rod 33 is located inside the lower groove 27, which facilitates the clamping plate 25 to fix the rotating rod 33.

[0029] A servo cylinder 24 is fixedly installed on the upper part of one side of the support plate 11. A clamping plate 25 is fixedly installed on the telescopic end of the servo cylinder 24, so that the servo cylinder 24 drives the clamping plate 25 to move. The clamping plate 25 slides on one side of the support plate 11. A slider 22 is fixedly installed on one side of the clamping plate 25. A groove 23 that cooperates with the slider 22 is opened on one side of the support plate 11, so that the clamping plate 25 slides through the slider 22 and the groove 23.

[0030] The clamping plate 25 and the fixed block 21 are respectively provided with grooves 27 that cooperate with the rotating rod 33. A friction pad 26 is fixedly installed inside the groove 27. The friction pad 26 can increase the friction between the clamping plate 25 and the rotating rod 33.

[0031] The fixture includes an electric telescopic rod 14, which is fixedly installed on one side of the top surface of the support platform 13. A clamping block 15 is fixedly installed at the telescopic end of the electric telescopic rod 14. The electric telescopic rod 14 pushes the clamping block 15 to fix the semiconductor. A processing plate 12 is fixedly installed on the top surface of the support platform 13. A baffle 16 is fixedly installed on the side of the processing plate 12 away from the clamping block 15, so that the clamping block 15 and the baffle 16 cooperate to fix the semiconductor.

[0032] Working principle: First, the device can be fixed using the base plate 1. Then, the semiconductor is placed on the top surface of the processing plate 12. The electric telescopic rod 14 is activated, which drives the clamping block 15 to move. The clamping block 15 cooperates with the baffle 16 to fix the semiconductor.

[0033] When adjustments to the semiconductor are required, the servo motor 31 is activated, causing the servo motor 31 to drive the worm gear 32 to rotate. The worm gear 32 rotates within the circular groove 34 on one side of the support housing 35, thereby driving the worm wheel 36 to rotate. The worm wheel 36 drives the rotating rod 33 to rotate, which in turn drives the support platform 13 to rotate, thus enabling adjustments.

[0034] After the adjustment is completed, the positioning mechanism 2 can be used to make the support platform 13 more stable. The servo cylinder 24 is activated, and the servo cylinder 24 drives the clamping plate 25 to move. The clamping plate 25 slides in the groove 23 on one side of the support plate 11 through the slider 22, thereby cooperating with the fixing block 21. The rotating rod 33 is clamped by the groove 27 and the internal friction pad 26, thereby making the support platform 13 more stable.

[0035] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A semiconductor processing clamping device for easy adjustment, comprising a base plate (1), characterized in that: The top surface of the base plate (1) is fixedly installed with two opposing support plates (11), and a support platform (13) is rotatably installed between the two support plates (11). A clamp is fixedly installed on the top surface of the support platform (13). An adjustment mechanism (3) is provided on one side of one of the support plates (11), and a positioning mechanism (2) is provided on one side of the other support plate (11). The adjustment mechanism (3) includes a support shell (35), which is fixedly installed on the side of the support plate (11) facing away from the support platform (13). A servo motor (31) is fixedly installed on one side of the support shell (35). A worm gear (32) is fixedly installed at the output end of the servo motor (31). A worm wheel (36) is meshed with the outer surface of the worm gear (32). The worm wheel (36) is rotatably installed on the inner wall of one side of the support shell (35). A rotating rod (33) is fixedly installed in the middle of the worm wheel (36). One end of the rotating rod (33) movably passes through the support plate (11) and is fixedly connected to one side of the support platform (13).

2. A semiconductor processing clamp assembly for ease of adjustment as defined in claim 1, wherein: The positioning mechanism (2) includes a fixing block (21), which is fixedly installed on the side of the support plate (11) facing away from the support platform (13). A servo cylinder (24) is fixedly installed on the upper part of one side of the support plate (11). A clamping plate (25) is fixedly installed on the telescopic end of the servo cylinder (24). The clamping plate (25) slides on one side of the support plate (11). The clamping plate (25) and the fixing block (21) opposite to each other are provided with grooves (27) that cooperate with the rotating rod (33).

3. A semiconductor processing clamp assembly for facilitating adjustment as recited in claim 1, further comprising: The clamp includes an electric telescopic rod (14), which is fixedly installed on one side of the top surface of the support platform (13). A clamping block (15) is fixedly installed at the telescopic end of the electric telescopic rod (14). A processing plate (12) is fixedly installed on the top surface of the support platform (13). A baffle (16) is fixedly installed on the side of the processing plate (12) away from the clamping block (15).

4. The adjustable semiconductor processing clamp of claim 1, wherein: A support (30) is fixedly installed on one side of the support plate (11), and the support (30) is fixedly connected to the servo motor (31).

5. A semiconductor processing clamp assembly for ease of adjustment as defined in claim 1, wherein: A circular groove (34) is provided on one side of the support shell (35), and the worm gear (32) moves through the circular groove (34).

6. A semiconductor processing clamp assembly for ease of adjustment as defined in claim 2, wherein: A friction pad (26) is fixedly installed inside the groove (27).

7. The easily adjustable semiconductor processing clamping device according to claim 2, characterized in that: A slider (22) is fixedly installed on one side of the clamping plate (25), and a groove (23) is provided on one side of the support plate (11) to cooperate with the slider (22).

8. A semiconductor processing clamp assembly for ease of adjustment as defined in claim 2, wherein: The rotating rod (33) is located inside the groove (27) of the fixed block (21).