An evaporator for an adsorption refrigeration machine and the adsorption refrigeration machine itself.

Abstract

This invention discloses an evaporator for an adsorption refrigeration machine and the adsorption refrigeration machine itself, comprising: a cooling medium inlet and a cooling medium outlet; a liquid refrigerant inlet and a gaseous refrigerant outlet; at least one cooling medium flow plate for supplying cooling medium flow, each cooling medium flow plate being connected to both the cooling medium inlet and the cooling medium outlet; and at least one refrigerant flow plate for supplying refrigerant flow, each refrigerant flow plate being connected to both the liquid refrigerant inlet and the gaseous refrigerant outlet. The refrigerant flow plates and cooling medium flow plates are alternately stacked. This evaporator is a plate evaporator. By alternately stacking the cooling medium flow plates and refrigerant flow plates, plate cavities are formed between any adjacent cooling medium flow plates and refrigerant flow plates, creating alternating cooling medium flow spaces and refrigerant flow spaces. This achieves interactive heat exchange between the refrigerant and the cooling medium, resulting in a cooling effect. It has a high heat transfer coefficient, low thermal resistance, and high evaporation efficiency.

Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and more specifically, to an evaporator for an adsorption refrigeration machine. Furthermore, this invention also relates to an adsorption refrigeration machine comprising the aforementioned evaporator. Background Technology

[0002] In adsorption chillers, the evaporator, as the heat exchange component, significantly impacts the overall heat transfer performance of the chiller. In adsorption chillers, the liquid refrigerant inside the evaporator is adsorbed by the adsorbent, evaporating and absorbing heat to achieve cooling.

[0003] In the process of developing this application, the inventors discovered that the prior art has at least the following problems:

[0004] In related technologies, the evaporator used in adsorption refrigeration machines is a shell-and-tube evaporator. The heat transfer tube bundle of the shell-and-tube evaporator is submerged in liquid refrigerant. Due to the presence of hydrostatic pressure, it is difficult for boiling evaporation to occur outside the heat transfer tube bundle, resulting in a low boiling heat transfer coefficient of the refrigerant pool inside the shell, which leads to low efficiency of the shell-and-tube evaporator.

[0005] Therefore, how to improve the heat exchange efficiency of the evaporator in an adsorption chiller is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] In view of this, the purpose of the present invention is to provide an evaporator for an adsorption refrigeration machine with high heat exchange efficiency.

[0007] Another object of the present invention is to provide an adsorption refrigerator including the evaporator of the above-mentioned adsorption refrigerator, wherein the heat exchange efficiency of the evaporator of the adsorption refrigerator is high.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] An evaporator for an adsorption refrigeration machine, the evaporator comprising:

[0010] Cooling medium inlet, cooling medium outlet;

[0011] Liquid refrigerant inlet, gaseous refrigerant outlet;

[0012] At least one cooling medium flow plate is provided for the flow of cooling medium, and each of the cooling medium flow plates is connected to the cooling medium inlet and the cooling medium outlet;

[0013] At least one refrigerant flow plate is provided for refrigerant flow, each of the refrigerant flow plates is connected to the liquid refrigerant inlet and the gaseous refrigerant outlet, and the refrigerant flow plates and the cooling medium flow plates are stacked alternately.

[0014] Optionally, at least one of the refrigerant flow plate for refrigerant flow and the cooling medium flow plate facing the refrigerant is provided with a capillary structure.

[0015] Optionally, the capillary structure is a porous structure with capillary action.

[0016] Optionally, the thickness of the capillary structure ranges from 0.5 to 1.0 mm; and / or, the thickness of both the cooling medium flow plate and the refrigerant flow plate is ≤0.5 mm.

[0017] Optionally, the edges of both the refrigerant flow plate and the cooling medium flow plate are provided with warped portions that bend in the same direction.

[0018] Optionally, the cooling medium flow plate is provided with a first protruding ring at the position corresponding to the liquid refrigerant inlet and the gaseous refrigerant outlet, respectively, and the first protruding ring is in sealing contact with the refrigerant flow plate adjacent to the cooling medium flow plate in the first direction;

[0019] The refrigerant flow plate is provided with a second protruding ring at the position corresponding to the cooling medium inlet and the cooling medium outlet, respectively, and the second protruding ring is in sealing contact with the cooling medium flow plate adjacent to the refrigerant flow plate in the first direction.

[0020] Optionally, the cooling medium flow plate is provided with a third protruding ring that protrudes in a second direction at the positions corresponding to the cooling medium inlet and the cooling medium outlet, the second direction being the opposite direction to the first direction, and the third protruding ring is in sealing contact with the second protruding ring of the refrigerant flow plate adjacent to the cooling medium flow plate in the second direction.

[0021] The refrigerant flow plate is provided with a fourth protruding ring at the position corresponding to the liquid refrigerant inlet and the gaseous refrigerant outlet, respectively, which protrudes in the second direction. The fourth protruding ring is in sealing contact with the first protruding ring of the cooling medium flow plate adjacent to the refrigerant flow plate in the second direction.

[0022] Optionally, it also includes a top plate, which is located at the top of the stacked structure formed by the refrigerant flow plate and the cooling medium flow plate, and the cooling medium inlet, the cooling medium outlet, the liquid refrigerant inlet and the gaseous refrigerant outlet are all located on the top plate.

[0023] Optionally, it also includes a base plate, which is located at the bottom of the stacked structure formed by the refrigerant flow plate and the cooling medium flow plate.

[0024] An adsorption refrigeration unit includes an evaporator of any of the above-mentioned adsorption refrigeration units.

[0025] The evaporator of the adsorption refrigeration machine provided by the present invention has the following beneficial effects:

[0026] By using alternately stacked cooling medium and refrigerant flow plates, plate cavities are formed between any adjacent cooling medium and refrigerant flow plates, creating alternating cooling medium and refrigerant flow spaces. This achieves interactive heat exchange between the refrigerant and cooling medium, resulting in a cooling effect. Essentially, this proposes a plate evaporator for adsorption refrigeration machines. Compared to shell-and-tube evaporators, plate evaporators have a higher heat transfer coefficient and lower thermal resistance, allowing for more efficient heat exchange within a limited space, thus saving energy. Furthermore, compared to shell-and-tube evaporators, they also offer advantages such as smaller size, lighter weight, and easier processing and maintenance. Moreover, the cooling capacity of the plate heat exchanger can be adjusted by flexibly increasing or decreasing the number of cooling medium and refrigerant flow plates, allowing the evaporator to adapt to different cooling requirements.

[0027] Furthermore, in some preferred embodiments, at least one of the refrigerant flow plate for refrigerant flow and the cooling medium flow plate facing the refrigerant is provided with a capillary structure. That is, by providing a capillary structure on the side of the refrigerant flow plate and / or the cooling medium flow plate facing the refrigerant flow space, the capillary effect of the capillary structure allows the liquid refrigerant to spread rapidly in the capillary structure, which is beneficial to make the liquid refrigerant form a uniform distribution when flowing through the refrigerant flow plate, thereby improving the evaporation efficiency of the evaporator.

[0028] The adsorption refrigeration machine provided by the present invention includes the evaporator of the above-mentioned adsorption refrigeration machine, and at least includes the beneficial effects of the evaporator of the above-mentioned adsorption refrigeration machine. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0030] Figure 1 An exploded view of the evaporator of an adsorption refrigeration machine provided in a specific embodiment of the present invention;

[0031] Figure 2 for Figure 1 A schematic diagram of the assembled structure;

[0032] Figure 3 for Figure 2 A sectional view after being cut along the first diagonal;

[0033] Figure 4 for Figure 2 A sectional view after being cut along the second diagonal.

[0034] Figure label:

[0035] 1-Cooling medium inlet; 2-Cooling medium outlet; 3-Liquid refrigerant inlet; 4-Gaseous refrigerant outlet; 5-Cooling medium flow plate; 51-First raised ring; 52-Third raised ring; 6-Refrigerant flow plate; 61-Second raised ring; 62-Fourth raised ring; 7-Capillary structure; 8-Warped portion; 9-Top plate; 10-Bottom plate. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] The core of this invention is to provide an evaporator for an adsorption chiller with high heat exchange efficiency. Another core aspect of this invention is to provide an adsorption chiller including the aforementioned evaporator, wherein the evaporator of the adsorption chiller has high heat exchange efficiency.

[0038] Please refer to Figure 1 and Figure 2 This invention provides an evaporator for an adsorption refrigeration unit. The evaporator includes a cooling medium inlet 1, a cooling medium outlet 2, a liquid refrigerant inlet 3, a gaseous refrigerant outlet 4, a cooling medium flow plate 5, and a refrigerant flow plate 6. There are at least one cooling medium flow plate 5 and one refrigerant flow plate 6. The cooling medium flow plate 5 is used for cooling medium flow, and each cooling medium flow plate 5 is connected to both the cooling medium inlet 1 and the cooling medium outlet 2. The refrigerant flow plate 6 is used for refrigerant flow, and each refrigerant flow plate 6 is connected to both the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4. The refrigerant flow plate 6 and the cooling medium flow plate 5 are alternately stacked.

[0039] Understandably, the cooling medium inlet 1 is used to introduce the cooling medium into each cooling medium circulation plate 5, the cooling medium outlet 2 is used to allow the cooling medium to flow out from the evaporator, the liquid refrigerant inlet 3 is used to introduce the liquid refrigerant into each refrigerant circulation plate 6, and the gaseous refrigerant outlet 4 is used to allow the evaporated gaseous refrigerant to exit the evaporator. After the cooling medium enters each cooling medium circulation plate 5 from the cooling medium inlet 1, it flows along the surface of the cooling medium circulation plate 5. After the liquid refrigerant enters each refrigerant circulation plate 6 from the liquid refrigerant inlet 3, it flows along the surface of the refrigerant circulation plate 6. Since the refrigerant circulation plate 6 and the cooling medium circulation plate 5 are stacked alternately, when the cooling medium flows along the surface of the cooling medium circulation plate 5, it comes into contact with the non-circulation surface of the refrigerant circulation plate 6 adjacent to the cooling medium circulation plate 5. The other side of the refrigerant circulation plate 6 is the circulation surface, through which the refrigerant flows. The refrigerant comes into contact with the non-circulation surface of the cooling medium circulation plate 5 adjacent to the refrigerant circulation plate 6. The other side of the cooling medium circulation plate 5 is the circulation surface, through which the cooling medium flows. In this way, by stacking the refrigerant circulation plate 6 and the cooling medium circulation plate 5 alternately, it is equivalent to isolating the alternating cooling medium circulation space and the refrigerant circulation space, so that the cooling medium and the refrigerant flow in the alternating space. In an adsorption refrigeration unit, the pressure in the evaporator is relatively low, and the evaporation temperature of the refrigerant is lower than the temperature of the cooling medium flowing into the evaporator through the cooling medium inlet 1. Therefore, when the cooling medium and refrigerant flow in the alternating space, the heat of the cooling medium is rapidly transferred to the refrigerant flow space through the heat transfer between the cooling medium flow plate 5 and the refrigerant flow plate 6. This causes the liquid refrigerant to absorb heat and evaporate, forming refrigerant vapor. The refrigerant vapor leaves the evaporator from the gaseous refrigerant outlet 4. The refrigerant continuously absorbs heat and evaporates, carrying away the heat of the cooling medium, causing the temperature of the cooling medium to continuously decrease. The cooled cooling medium leaves the evaporator from the cooling medium outlet 2. That is, the temperature of the cooling medium flowing out from the cooling medium outlet 2 is lower than the temperature of the cooling medium entering the evaporator from the cooling medium inlet 1, thereby achieving a cooling effect.

[0040] As can be seen, the embodiments of the present invention, through the alternating stacking of cooling medium flow plates 5 and refrigerant flow plates 6, form plate cavities between any adjacent cooling medium flow plates 5 and refrigerant flow plates 6, thereby creating alternating cooling medium flow spaces and refrigerant flow spaces. This achieves interactive heat exchange between the refrigerant and the cooling medium, resulting in a cooling effect. Essentially, it proposes a plate evaporator for adsorption refrigeration machines. Compared to shell-and-tube evaporators, plate evaporators have a higher heat transfer coefficient and lower thermal resistance, allowing for more efficient heat exchange within a limited space, thus saving energy. Furthermore, compared to shell-and-tube evaporators, they also have advantages such as smaller size, lighter weight, and easier processing and maintenance. Moreover, the cooling capacity of the plate heat exchanger can be adjusted by flexibly increasing or decreasing the number of cooling medium flow plates 5 and refrigerant flow plates 6, allowing the evaporator to adapt to different cooling capacity requirements.

[0041] Furthermore, in some embodiments, at least one of the refrigerant flow plate 6 (the side for refrigerant flow) and the cooling medium flow plate 5 (the side facing the refrigerant) is provided with a capillary structure 7. That is, by providing a capillary structure 7 on the side of the refrigerant flow plate 6 and / or the cooling medium flow plate 5 facing the refrigerant flow space, this embodiment utilizes the capillary effect of the capillary structure 7 to allow the liquid refrigerant to spread rapidly within it. This facilitates a uniform distribution of the liquid refrigerant during flow through the refrigerant flow plate 6, thereby improving the evaporation efficiency of the evaporator. Moreover, by adjusting the pore size and thickness of the capillary structure 7 according to actual needs, the evaporator can be adapted to different operating conditions and requirements, further improving the efficiency and performance of the evaporator. It is understood that during use, the capillary structure 7 is in a saturated liquid absorption state, meaning that the pores of the capillary structure 7 are completely filled with liquid. This is beneficial for fully utilizing the capillary effect of the capillary structure 7.

[0042] It should be noted that this embodiment does not limit the specific distribution of the capillary structure 7. In some embodiments, the capillary structure 7 is a porous structure with capillary action. That is, in this embodiment, a porous structure can be laid on the side of the refrigerant flow plate 6 for refrigerant flow and / or the side of the cooling medium flow plate 5 facing the refrigerant, utilizing the pores of the porous structure to achieve capillary action. This structure occupies little space and is easy to implement.

[0043] It should be noted that this embodiment does not limit the specific method of forming the porous structure, as long as it can form a porous structure with capillary action. For example, in some embodiments, the porous structure is a mesh structure, that is, a porous structure is formed by a wire mesh, which is simple and easy to implement. Of course, in other embodiments, the porous structure can also be formed by the accumulation of particulate powder, or by laser-engraving a skeleton, etc.

[0044] In addition, it should be noted that the above embodiments do not limit the specific thickness of the capillary structure 7, as long as the capillary structure 7 has a capillary effect.

[0045] In some embodiments, the thickness of the capillary structure 7 ranges from 0.5 to 1.0 mm. This thickness range facilitates the rapid spread of refrigerant on the refrigerant flow plate 6 without occupying too much space between the refrigerant flow plate 6 and the cooling medium flow plate 5.

[0046] In addition, to improve the heat transfer effect of the cooling medium circulation plate 5 and the refrigerant circulation plate 6, in some embodiments, the thickness of both the cooling medium circulation plate 5 and the refrigerant circulation plate 6 is ≤0.5mm. That is to say, in this embodiment, both the cooling medium circulation plate 5 and the refrigerant circulation plate 6 are relatively thin, which is more conducive to heat transfer between the cooling medium and the refrigerant and helps to improve the heat transfer efficiency.

[0047] In addition, this embodiment does not specifically limit the materials of the cooling medium circulation plate 5 and the refrigerant circulation plate 6, as long as the cooling medium circulation plate 5 and the refrigerant circulation plate 6 can transfer heat. In some embodiments, the cooling medium circulation plate 5 and the refrigerant circulation plate 6 are both metal plates.

[0048] Additionally, please continue to refer to Figure 1 In some embodiments, the edges of both the refrigerant flow plate 6 and the cooling medium flow plate 5 are provided with warped portions 8 that bend in the same direction.

[0049] It is understandable that by providing warped portions 8 at the edges of both the refrigerant flow plate 6 and the cooling medium flow plate 5, it is beneficial to ensure that both the refrigerant flow plate 6 and the cooling medium flow plate 5 have a certain depth, thereby increasing the refrigerant flow space and the cooling medium flow space. Furthermore, when the refrigerant flow plate 6 and the cooling medium flow plate 5 are stacked, the corresponding warped portions 8 of the refrigerant flow plate 6 and the cooling medium flow plate 5 contact each other, facilitating connection and ensuring a sealed connection between the refrigerant flow plate 6 and the cooling medium flow plate 5.

[0050] In some embodiments, the warped portions 8 of the refrigerant flow plate 6 and the cooling medium flow plate 5 are welded together. That is, in this embodiment, the refrigerant flow plate 6 and the cooling medium flow plate 5 are welded together to form an integral laminated structure, which is simple in process and has good sealing performance.

[0051] Additionally, to prevent the cooling medium from entering the refrigerant flow plate 6 and to prevent the refrigerant from entering the cooling medium flow plate 5, please refer to [the relevant documentation]. Figure 1In some embodiments, the cooling medium circulation plate 5 is provided with a first protruding ring 51 protruding in a first direction at the positions corresponding to the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4, and the first protruding ring 51 is sealed and abutted against the refrigerant circulation plate 6 adjacent to the cooling medium circulation plate 5 in the first direction; the refrigerant circulation plate 6 is provided with a second protruding ring 61 protruding in a first direction at the positions corresponding to the cooling medium inlet 1 and the cooling medium outlet 2, and the second protruding ring 61 is sealed and abutted against the cooling medium circulation plate 5 adjacent to the refrigerant circulation plate 6 in the first direction.

[0052] In other words, in this embodiment, a first protruding ring 51 is respectively provided at the positions of the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4 on the cooling medium circulation plate 5. The first protruding ring 51 is sealed and abutted against the corresponding refrigerant circulation plate 6, thereby isolating the internal channel of the first protruding ring 51 from the cooling medium circulation space and preventing the refrigerant flowing through the internal channel of the first protruding ring 51 from entering the cooling medium circulation space. It can be understood that the internal channel of the first protruding ring 51 is used for the refrigerant to flow through, so as to realize the refrigerant flow between the two refrigerant circulation plates 6 separated by the cooling medium circulation plate 5.

[0053] Similarly, by setting second protruding rings 61 at the positions corresponding to the cooling medium inlet 1 and the cooling medium outlet 2 on the refrigerant circulation plate 6, the internal channels of the second protruding rings 61 are isolated from the refrigerant circulation space by sealing and abutting with the corresponding cooling medium circulation plates 5, thus preventing the cooling medium flowing through the internal channels of the second protruding rings 61 from entering the refrigerant circulation space. It can be understood that the internal channels of the second protruding rings 61 are used for the cooling medium to flow through, so as to realize the flow of the cooling medium between the two cooling medium circulation plates 5 separated by the refrigerant circulation plates 6.

[0054] For further information, please continue to refer to [link / reference]. Figure 1 In some embodiments, the cooling medium flow plate 5 is provided with a third protruding ring 52 protruding in a second direction at the positions corresponding to the cooling medium inlet 1 and the cooling medium outlet 2, respectively. The second direction is the opposite direction to the first direction. The third protruding ring 52 is in sealing contact with the second protruding ring 61 of the refrigerant flow plate 6 adjacent to the cooling medium flow plate 5 in the second direction. The refrigerant flow plate 6 is provided with a fourth protruding ring 62 protruding in a second direction at the positions corresponding to the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4, respectively. The fourth protruding ring 62 is in sealing contact with the first protruding ring 51 of the cooling medium flow plate 5 adjacent to the refrigerant flow plate 6 in the second direction.

[0055] In other words, this embodiment provides third protruding rings 52 at the positions corresponding to the cooling medium inlet 1 and the cooling medium outlet 2 on the cooling medium flow plate 5. These third protruding rings 52 and second protruding rings 61 form a sealed channel through a sealing contact. It can be understood that the protrusion directions of the third protruding ring 52 and the second protruding ring 61 are opposite. This channel is used for the passage of cooling medium, preventing it from entering the refrigerant flow space. This embodiment uses a sealing contact between the third protruding ring 52 and the second protruding ring 61, which improves sealing performance and facilitates connection. Furthermore, it can be understood that the side of the cooling medium flow plate 5 facing the first direction is the cooling medium flow side. Therefore, the third protruding ring 52 protruding in the second direction also helps to ensure that the cooling medium fully enters the cooling medium flow space. Figure 3 As shown.

[0056] Similarly, by setting fourth protruding rings 62 at the positions corresponding to the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4 on the refrigerant flow plate 6, and using the sealing contact between the fourth protruding rings 62 and the first protruding rings 51 to form a closed channel, it can be understood that the protrusion direction of the fourth protruding rings 62 and the first protruding rings 51 is opposite. The interior of this channel is used for refrigerant to pass through, preventing refrigerant from entering the cooling medium flow space. In this embodiment, the method of sealing contact between the fourth protruding rings 62 and the first protruding rings 51 is beneficial to improving the sealing performance and facilitating connection. In addition, it can be understood that the side of the refrigerant flow plate 6 facing the first direction is the refrigerant flow side. Therefore, the fourth protruding rings 62 protruding in the second direction is also beneficial to allow the refrigerant to fully enter the refrigerant flow space, such as... Figure 4 As shown.

[0057] Additionally, please continue to refer to Figure 1 In some embodiments, the evaporator of the adsorption chiller also includes a top plate 9, which is located at the top of the stacked structure formed by the refrigerant flow plate 6 and the cooling medium flow plate 5. The cooling medium inlet 1, the cooling medium outlet 2, the liquid refrigerant inlet 3 and the gaseous refrigerant outlet 4 are all located on the top plate 9.

[0058] In other words, this embodiment uses a top plate 9, which covers the top of the stacked structure. The top plate 9 forms the sidewall of the refrigerant flow space or cooling medium flow space at the top of the stacked structure, while simultaneously enclosing the top of the stacked structure. Furthermore, the cooling medium inlet 1, cooling medium outlet 2, liquid refrigerant inlet 3, and gaseous refrigerant outlet 4 are all located on the top plate 9, achieving integration of these components at the same end of the evaporator. This results in a simple structural layout and saves space.

[0059] It should be noted that this embodiment does not limit the specific distribution of the cooling medium inlet 1, cooling medium outlet 2, liquid refrigerant inlet 3, and gaseous refrigerant outlet 4 on the top plate 9. In some embodiments, the cooling medium inlet 1 and cooling medium outlet 2 are diagonally distributed, and the liquid refrigerant inlet 3 and gaseous refrigerant outlet 4 are distributed on the other diagonal. This facilitates the separate circulation of the cooling medium and refrigerant, and at the same time, makes the structure more symmetrical, resulting in a more uniform overall structural strength and weight distribution of the evaporator.

[0060] Additionally, please continue to refer to Figure 1 In some embodiments, the evaporator of the adsorption chiller also includes a base plate 10, which is located at the bottom of the stacked structure formed by the refrigerant flow plate 6 and the cooling medium flow plate 5.

[0061] In other words, this embodiment uses a base plate 10, which is located at the bottom of the stacked structure, to close the bottom of the stacked structure.

[0062] In addition to the evaporator of the adsorption chiller described above, this embodiment of the invention also provides an adsorption chiller that includes the evaporator of the adsorption chiller disclosed in the above embodiments. For the structure of other parts of the adsorption chiller, please refer to the relevant technology, which will not be repeated here.

[0063] The key point of this embodiment is that the adsorption refrigerator includes the evaporator of the adsorption refrigerator disclosed in any of the above embodiments. Therefore, the adsorption refrigerator has at least the beneficial effects of the evaporator of the above adsorption refrigerator, which will not be repeated here.

[0064] It should also be noted that, in this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0065] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

[0066] The evaporator of the adsorption chiller and the adsorption chiller provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make several improvements and modifications to this invention without departing from the principles of this invention, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. An evaporator for an adsorption refrigeration machine, characterized in that, The evaporator includes: Cooling medium inlet (1), cooling medium outlet (2); Liquid refrigerant inlet (3), gaseous refrigerant outlet (4); At least one cooling medium flow plate (5) is provided for the flow of cooling medium, and each of the cooling medium flow plates (5) is connected to the cooling medium inlet (1) and the cooling medium outlet (2); At least one refrigerant flow plate (6) is provided for refrigerant flow, each of the refrigerant flow plates (6) is connected to the liquid refrigerant inlet (3) and the gaseous refrigerant outlet (4), and the refrigerant flow plates (6) and the cooling medium flow plates (5) are stacked alternately.

2. The evaporator of the adsorption refrigeration machine according to claim 1, characterized in that, At least one of the refrigerant flow plate (6) for supplying the refrigerant and the cooling medium flow plate (5) facing the refrigerant is provided with a capillary structure (7).

3. The evaporator of the adsorption refrigeration machine according to claim 2, characterized in that, The capillary structure (7) is a porous structure with capillary action.

4. The evaporator of the adsorption refrigeration machine according to claim 2, characterized in that, The thickness of the capillary structure (7) is in the range of 0.5~1.0 mm; and / or the thickness of the cooling medium flow plate (5) and the refrigerant flow plate (6) is ≤0.5 mm.

5. The evaporator of the adsorption refrigeration machine according to any one of claims 1-4, characterized in that, The edges of both the refrigerant flow plate (6) and the cooling medium flow plate (5) are provided with warped portions (8) that bend in the same direction.

6. The evaporator of the adsorption refrigeration machine according to any one of claims 1-4, characterized in that, The cooling medium circulation plate (5) is provided with a first protruding ring (51) that protrudes in a first direction at the positions corresponding to the liquid refrigerant inlet (3) and the gaseous refrigerant outlet (4). The first protruding ring (51) is sealed and abuts against the refrigerant circulation plate (6) adjacent to the cooling medium circulation plate (5) in the first direction. The refrigerant flow plate (6) is provided with a second protruding ring (61) protruding in the first direction at the positions corresponding to the cooling medium inlet (1) and the cooling medium outlet (2). The second protruding ring (61) is in sealing contact with the cooling medium flow plate (5) adjacent to the refrigerant flow plate (6) in the first direction.

7. The evaporator of the adsorption refrigeration machine according to claim 6, characterized in that, The cooling medium flow plate (5) is provided with a third protruding ring (52) that protrudes in a second direction at the positions corresponding to the cooling medium inlet (1) and the cooling medium outlet (2), respectively. The second direction is the opposite direction of the first direction. The third protruding ring (52) is sealed and abuts against the second protruding ring (61) of the refrigerant flow plate (6) adjacent to the cooling medium flow plate (5) in the second direction. The refrigerant flow plate (6) is provided with a fourth protruding ring (62) that protrudes in the second direction at the positions corresponding to the liquid refrigerant inlet (3) and the gaseous refrigerant outlet (4). The fourth protruding ring (62) is in sealed contact with the first protruding ring (51) of the cooling medium flow plate (5) adjacent to the refrigerant flow plate (6) in the second direction.

8. The evaporator of the adsorption refrigeration machine according to any one of claims 1-4, characterized in that, It also includes a top plate (9), which is located at the top of the stacked structure formed by the refrigerant flow plate (6) and the cooling medium flow plate (5). The cooling medium inlet (1), the cooling medium outlet (2), the liquid refrigerant inlet (3) and the gaseous refrigerant outlet (4) are all located on the top plate (9).

9. The evaporator of the adsorption refrigeration machine according to any one of claims 1-4, characterized in that, It also includes a base plate (10), which is located at the bottom of the stacked structure formed by the refrigerant flow plate (6) and the cooling medium flow plate (5).

10. An adsorption-type refrigeration unit, characterized in that, Includes the evaporator of the adsorption refrigeration machine according to any one of claims 1-9.

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