Wave-shaped micro-channel cooling device with wing-shaped fins

Abstract

The invention discloses a wave-shaped micro-channel cooling device with wing-shaped fins, and relates to the technical field of micro-channel heat dissipation, the wave-shaped micro-channel cooling device comprises a base plate, the base plate is provided with a cooling channel and heat exchange channels penetrating from the front end to the rear end, the heat exchange channels are evenly and parallelly arranged close to the cooling channel, the heat exchange channels are symmetrical wave-shaped channels, and the wing-shaped fins are arranged in the cooling channel. And all wing-shaped fins are sequentially arranged in the heat exchanger from the front end to the rear end. While the wing-shaped fins in the heat exchange channel increase the effective heat exchange area, the streamline profile generates moderate turbulent flow when fluid flows to continuously disturb the boundary layer of the wall surface, so that the heat exchange strength between the fluid and the wall surface is enhanced, and the heat exchange effect of the cooling device is effectively improved; the collaborative configuration of the wing-shaped fins and the symmetrical waveform channels promotes fluid boundary layers to be separated, vortexes are formed in the flow channels, meanwhile, the fluid is guided to generate secondary flow and chaotic advection, the heat exchange effect is remarkably enhanced, and the purpose of improving the heat exchange efficiency is achieved.

Description

Technical Field

[0001] This invention relates to the field of microchannel heat dissipation technology, and more specifically to a microchannel cooling device for heat dissipation of microelectronic devices. Background Technology

[0002] Microelectronic devices have permeated all aspects of human production and daily life. With their continuous miniaturization and rapid increase in operating heat flux density, temperature has an increasingly significant impact on the performance and service life of microelectronic devices. Existing research confirms that for every 10°C increase in temperature, the lifespan of electronic devices is reduced to half; within the temperature range of 70°C-80°C, the reliability of electronic devices decreases by 5% for every 1°C increase in temperature.

[0003] However, traditional heat dissipation methods such as fan cooling and metal fin cooling, limited by their own heat exchange capacity, can no longer meet the high heat dissipation requirements of current microelectronic devices. How to improve the heat exchange performance of electronic devices and develop efficient heat dissipation technologies has become a key challenge in the field of electronic device thermal management. Microchannels, with their small size, large heat exchange area, excellent cooling performance, and low cooling medium consumption, have been widely studied and applied in the field of thermal engineering, alleviating the heat dissipation pressure of electronic devices to some extent.

[0004] However, existing microchannel structures still have many shortcomings and cannot fully meet practical needs: in conventional linear microchannels, fluids easily form obvious flow boundary layers and thermal boundary layers, significantly weakening heat transfer performance; although wavy microchannels can enhance mixing by inducing eddies, they easily lead to a surge in pressure drop, making it difficult to control the balance between heat transfer and energy consumption; manifold-type microchannels face the dilemma of unbalanced flow field distribution, complex manufacturing processes, and high costs; reinforced structures with ribs, fins, or cavities can interrupt the boundary layer, but they significantly increase flow resistance and may also create flow dead zones; porous microchannels can reduce pressure drop, but they introduce additional thermal resistance and are prone to blockage; secondary channel structures suffer from flow separation at interfaces and difficulties in parameter optimization. To address these issues, we propose a wavy microchannel cooling device with airfoil fins. By optimizing the channel configuration to disturb fluid flow and enhance heat transfer within the channel, it better meets the high heat dissipation requirements of microelectronic devices. Summary of the Invention

[0005] To avoid the shortcomings of the prior art, the present invention provides a wave-shaped microchannel cooling device with airfoil fins.

[0006] The present invention adopts the following technical solution to solve the technical problem: a wave-shaped microchannel cooling device with airfoil fins, comprising a substrate, wherein a cooling channel and a heat exchange channel are formed on the substrate from the front end to the rear end, the heat exchange channels are arranged uniformly and parallel to each other close to the cooling channel, and the direction of the arrangement of the heat exchange channels is the direction of fluid flow, and airfoil fins are arranged sequentially from the front end to the rear end in the heat exchange channel.

[0007] When the cooling medium flows through the airfoil, it forms a secondary flow and vortex under the guidance of the airfoil, which disrupts the stable thermal boundary layer and allows the medium to exchange heat fully with the airfoil and the substrate.

[0008] Furthermore, the heat exchange channel is a symmetrical wave channel formed by sequentially connecting symmetrical wave units, and each symmetrical wave unit has an airfoil at its widest point.

[0009] Furthermore, the wavy profile of the symmetrical wavy channel is derived using trigonometric functions. The formation of this structure causes the heat exchange channel to form a periodic contraction and expansion structure, which forces the fluid velocity and pressure to fluctuate alternately, continuously breaking the velocity and thermal boundary layer on the wall, further enhancing boundary layer renewal, and fundamentally avoiding heat transfer attenuation caused by boundary layer thickening. At the same time, the local high and low pressure gradients formed by the periodic contraction and expansion structure will generate natural flow driving force, further promoting radial mixing of the fluid and accelerating fluid renewal near the wall, ultimately achieving stable maintenance of a high heat transfer coefficient.

[0010] Among them, the core parameters of the trigonometric function include amplitude and wavelength, which can be adjusted according to the cooling power requirements in practical applications: amplitude determines the height of the convex structure, which directly affects the intensity of fluid disturbance; wavelength determines the wave period, which, when matched with the spacing of the airfoil, can avoid mutual interference of vortices and ensure heat transfer uniformity.

[0011] Furthermore, the airfoil is one or more of the following: hydrofoil, arc-shaped fish wing, or bird wing, and its thickness is gradually varied along the fluid flow direction.

[0012] Furthermore, the hydrofoil-shaped fins have a spindle shape with rounded ends at the front end, and smoothly converge in a symmetrical outward convex arc shape from the middle to the rear end.

[0013] Furthermore, one side of the arc-shaped fish wing is the windward side, which is convex arc-shaped from the front end to the rear end, and the other side is the leeward side, which is convex arc-shaped at the front end. Together with the front end of the windward side, they form a cylindrical structure, and the middle to the rear end smoothly converges towards the windward side, imitating the streamlined arc-shaped contour of a fish wing.

[0014] The arc-shaped fish wing fins utilize biomimetic principles to mimic the structural advantages of efficient fluid interaction during fish swimming. Their continuous and smooth arc-shaped contours guide the fluid to form a stable "boundary layer peeling-reattachment" cycle along the fin surface, further enhancing turbulent disturbance and increasing the contact area and heat transfer coefficient between the fluid and the fins. Compared to traditional straight or angular fins, their windward side is smooth and has no obvious abrupt structural changes, which can effectively reduce fluid friction loss during the process of fluid flowing through the windward side.

[0015] Furthermore, one side of the bird wing-shaped fin is the windward side, which has a smooth outward convex arc shape from the front end to the rear end, and the other side is the leeward side, which has an outward convex arc shape at the front end. Together with the front end of the windward side, they form an elliptical cylindrical structure, and the middle to the rear end smoothly converges towards the windward side, imitating the streamlined arc contour of a bird wing.

[0016] When the airfoil is an arc-shaped fish wing fin or a bird wing fin, the windward sides of each airfoil fin are staggered and arranged on both sides of the heat exchange channel.

[0017] Furthermore, each of the heat exchange channels is arranged in a row below the cooling channel, and within the heat exchange channel, each of the airfoil fins is arranged at equal intervals along the centerline of the heat exchange channel.

[0018] Furthermore, the airfoil is made of a metal material such as copper alloy or aluminum, which has good thermal conductivity.

[0019] It is preferably made of metallic copper, which has excellent thermal conductivity and can quickly conduct the heat transferred from the substrate to the cooling medium, thus balancing heat exchange efficiency and process feasibility.

[0020] Furthermore, the fluid flow directions in the cooling channel and the heat exchange channel are opposite, which facilitates increasing the heat exchange time by counter-flow, prolonging the heat exchange duration of the hot and cold fluids, ensuring sufficient heat transfer, maintaining a large average heat transfer temperature difference throughout the channel, avoiding the problem of end temperature difference decay in co-current heat exchange, and significantly improving the overall heat exchange efficiency.

[0021] This invention provides a wave-shaped microchannel cooling device with airfoil fins, which has the following beneficial effects: 1. The airfoil fins in the heat exchange channel of the present invention increase the effective heat exchange area, while the streamlined profile generates moderate turbulence when the fluid flows, continuously disturbing the boundary layer of the wall, enhancing the heat exchange intensity between the fluid and the wall, and effectively improving the heat exchange effect of the cooling device.

[0022] 2. This invention utilizes the synergistic configuration of airfoil fins and symmetrical waveform channels to promote fluid boundary layer separation and form vortices within the flow channel. At the same time, it guides the fluid to generate secondary flow and chaotic advection, significantly enhancing the heat transfer effect and achieving the goal of improving heat transfer efficiency.

[0023] 3. The airfoil of the present invention is located at the widest part of the symmetrical wave unit, which reduces or even eliminates the low-velocity vortex and flow separation phenomenon at the wave crest, avoids the generation of heat transfer dead zone, and improves the effectiveness of flow field.

[0024] 4. The symmetrical wave-shaped channel of the present invention disrupts and suppresses the periodic changes in the channel cross-section that cause the fluid velocity and pressure to change alternately, continuously breaking the velocity boundary layer and thermal boundary layer at the wall surface, avoiding heat transfer attenuation caused by boundary layer thickening, and maintaining a high heat transfer coefficient.

[0025] 5. This invention utilizes pressure gradients to promote flow, disturbing local high and low pressure regions within the symmetrical wavy channel to generate natural fluid flow driving force, promoting radial mixing of fluid within the channel, and especially enhancing the fluid renewal rate near the wall, thereby improving heat exchange efficiency. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the present invention.

[0027] Figure 2 This is a schematic diagram of the main structure of the present invention.

[0028] Figure 3 This is a cross-sectional view of section AA of the present invention.

[0029] Figure 4 This is a cross-sectional view of the structure at BB in this invention.

[0030] Figure 5 This is a schematic diagram of the structure of the hydrofoil-shaped fin of the present invention.

[0031] Figure 6 This is a schematic diagram of the structure of the arc-shaped fish wing blade of the present invention.

[0032] Figure 7 This is a schematic diagram of the structure of the bird wing-shaped wing of the present invention.

[0033] Figure 8 This is a cross-sectional structural diagram of Embodiment 1 of the present invention.

[0034] Numbering on the map: 1. Substrate; 2. Airfoil fins; 3. Heat exchange channel; 4. Symmetrical wave-shaped unit; 5. Cooling channel. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Comparative Example 1 This comparative example provides a rectangular channel cooling device, which includes a substrate 1 made of copper and has dimensions of 11.4 mm in length, 5 mm in width, and 0.8 mm in height. A heat exchange channel 3 is provided on the substrate 1, and the cooling heat exchange channel 3 extends from the front end to the rear end of the substrate 1.

[0037] The heat exchange channel 3 is a rectangular channel, and a total of 10 channels are provided. The 10 heat exchange channels 3 are arranged in a row above the substrate 1, and the spacing between adjacent heat exchange channels 3 is 0.2mm. The inlet length and width of the heat exchange channel 3 are both 0.3mm, and the inlet hydraulic diameter is 0.3mm.

[0038] Comparative Example 2 This comparative example provides a rectangular microchannel cooling device (double-layer), including a substrate 1 made of copper with dimensions of 11.4 mm in length, 5 mm in width, and 0.8 mm in height. Cooling channels 5 and heat exchange channels 3 are formed on the substrate 1, both extending from the front end to the rear end. The heat exchange channels 3 are evenly and parallel to each other, arranged close to the cooling channels 5. The inlet dimensions of the cooling channel 5 are 4.8 mm in length and 0.3 mm in height.

[0039] The heat exchange channel 3 is composed of 10 symmetrical wave-shaped units 4 connected sequentially. These 10 channels are arranged in a row below the cooling channel 5, with a spacing of 0.2 mm between adjacent channels. The inlet length and width of each heat exchange channel 3 are 0.3 mm, and the inlet hydraulic diameter is also 0.3 mm. The wave-shaped profile is generated using trigonometric functions, and its key geometric parameter is the amplitude. ,wavelength The wavy channel is 10 mm long, with rectangular channels of 0.8 mm in length running through its front and rear ends. The fluid flow directions in cooling channel 5 and heat exchange channel 3 are opposite.

[0040] Comparative Example 3 This comparative example provides a symmetrical wave-shaped microchannel cooling device, including a substrate 1 made of copper with dimensions of 11.4 mm in length, 5 mm in width, and 0.8 mm in height. Cooling channels 5 and heat exchange channels 3 are formed on the substrate 1, both extending from the front end to the rear end. The heat exchange channels 3 are evenly and parallel to each other, arranged close to the cooling channels 5. The inlet dimensions of the cooling channels 5 are 4.8 mm in length and 0.3 mm in height.

[0041] The heat exchange channel 3 is composed of 10 symmetrical wave-shaped units 4 connected sequentially. These 10 channels are arranged in a row below the cooling channel 5, with a spacing of 0.2 mm between adjacent channels. The inlet length and width of each heat exchange channel 3 are 0.3 mm, and the inlet hydraulic diameter is also 0.3 mm. The wave-shaped profile is generated using trigonometric functions, and its key geometric parameter is the amplitude. ,wavelength The wavy channel is 10 mm long, with rectangular channels of 0.8 mm in length running through its front and rear ends. The fluid flow directions in cooling channel 5 and heat exchange channel 3 are opposite.

[0042] Example 1 This embodiment provides a symmetrical wave-shaped microchannel cooling device, such as... Figure 8 As shown, the substrate includes a base plate 1, which is made of copper and has dimensions of 11.4 mm in length, 5 mm in width, and 0.8 mm in height. Cooling channels 5 and heat exchange channels 3 are formed on the base plate 1, both extending from the front end to the rear end. The heat exchange channels 3 are evenly and parallel to each other, arranged close to the cooling channels 5. The inlet dimensions of the cooling channels 5 are 4.8 mm in length and 0.3 mm in height.

[0043] The heat exchange channel 3 is composed of 10 symmetrical wave-shaped units 4 connected sequentially. These 10 channels are arranged in a row below the cooling channel 5, with a spacing of 0.2 mm between adjacent channels. The inlet length and width of each heat exchange channel 3 are 0.3 mm, and the inlet hydraulic diameter is also 0.3 mm. The wave-shaped profile is generated using trigonometric functions, and its key geometric parameter is the amplitude. ,wavelength The corrugated channel is 10mm long, with rectangular channels of 0.8mm length running through its front and rear ends. Within the heat exchange channel 3, an airfoil fin 2 is positioned at the widest point of each symmetrical corrugated unit 4 along the centerline. The airfoil fin 2 is a hydrofoil type, model NACA0030, with each fin being 0.2mm long and made of copper, and 0.3mm high. The fluid flow direction within the cooling channel 5 is opposite to that within the heat exchange channel 3.

[0044] Example 2 Numerical simulation experiments were conducted on Comparative Example 1, Comparative Example 2, Comparative Example 3, and Example 1 using the ANSYS FLUENT computational fluid dynamics simulation platform. Using Reynolds number Re as a variable parameter, the Nusselt number Nu, average friction coefficient f, and comprehensive performance index PEC of Examples 1 to 3 were compared within the range of Reynolds number variation. The Reynolds number Re ranges from 100 to 500, with a step size of 100; Comparative Example 1 serves as the benchmark for the comprehensive performance index PEC.

[0045] The experimental results are shown in the table below: Table 1. Variation of Nu with Re for Each Example Table 2. Variation of f with Re for each example Table 3. Variation of PEC with Re in each case Comparative Example 1 is a single-layer rectangular heat exchange channel structure without cooling channels, serving as the benchmark for performance comparison. Its heat transfer and flow characteristics directly reflect the basic performance of conventional rectangular microchannels. As shown in Table 1-3, with the increase of the Reynolds number Re, the Nusselt number Nu exhibits a monotonically increasing trend, ranging from 5.29 to 8.08. When Re increases from 100 to 500, Nu increases by 52.7%. The average friction coefficient f exhibits a monotonically decreasing trend, ranging from 0.159 to 0.039. When Re increases to 500, f decreases by 75.5%. The comprehensive performance index PEC remains constant at 1.00, consistent with the calculation logic of PEC based on Comparative Example 1.

[0046] Core mechanism: As Re increases, the fluid flow velocity increases, the disturbance between the fluid and the channel wall intensifies, the boundary layer thickness decreases, and the heat transfer capacity increases accordingly, manifested as a monotonically increasing Nu. Simultaneously, the fluid turbulence intensifies, the proportion of viscous resistance decreases, leading to a continuous decrease in the friction coefficient f. This structure lacks additional heat transfer enhancement design, has a limited heat transfer area, and relatively weak fluid disturbance; therefore, the overall Nu value is low, providing a benchmark for performance comparisons of subsequent optimized structures.

[0047] Comparative Example 2 features a double-layer structure (cooling channel + rectangular heat exchange channel). Compared to the single-layer rectangular channel of Comparative Example 1, its core structural optimization lies in increasing the number of cooling channels. Data shows that within the Re range of 100–500, Nu exhibits a significant increasing trend, ranging from 10.02 to 14.35. Compared to Comparative Example 1, Nu increases by 90.9%–77.6% at the same Re. f decreases with increasing Re, ranging from 0.159 to 0.039, essentially the same as Comparative Example 1 (maximum deviation only 0.000038). PEC decreases slowly with increasing Re, ranging from 1.89 to 1.78, generally remaining above 1.78, higher than the baseline group.

[0048] Performance optimization and mechanism analysis: The double-layer channel structure enables counter-current fluid flow (the fluid flow direction is opposite to that in the cooling channel and the heat exchange channel), forming counter-current heat exchange, increasing the heat transfer temperature difference, and enhancing the heat exchange driving force; PEC shows a slight decrease, the core reason being that the increase in Nu gradually slows down as Re increases (from Re from 100 to 500, Nu increases by 43.2%, which is lower than the Nu increase in Comparative Example 1), while the flow resistance does not change significantly, resulting in a weakening of the overall performance improvement effect, but it is still significantly better than the benchmark group overall, proving the initial enhanced heat exchange effect of the double-layer structure.

[0049] Comparative Example 3 is a double-layer symmetrical wave-shaped microchannel structure, consistent with Comparative Example 2, except that the key geometric parameters (amplitude and wavelength) of the wave profile are specified. Its performance difference stems from the standardized design of the wave structure parameters, making it more suitable for practical engineering applications. Data shows that Nu significantly increases with Re in the range of 100–500, ranging from 10.46 to 18.54, representing an improvement of 97.7%–129.5% compared to Comparative Example 1 and 4.4%–29.2% compared to Comparative Example 2. f decreases with increasing Re, ranging from 0.191 to 0.054, showing an increase compared to both Comparative Example 1 and Comparative Example 2 (the maximum increase at the same Re is 20.6%). PEC increases with increasing Re, ranging from 1.86 to 2.06, reaching its maximum at Re=500, representing an improvement of 3.6%–16.0% compared to Comparative Example 2.

[0050] Performance Optimization and Mechanism Analysis: Compared to Comparative Example 2, Comparative Example 3 shows further improvement in Nu and continuous optimization in PEC. The core reason is that the standardized wave profile parameters (amplitude, wavelength) make the fluid disturbance more regular, enhancing boundary layer disturbance while improving fluid flow uniformity, thus further improving heat transfer efficiency. The increase in f is because the contour undulations of the standardized wave structure better match the fluid flow characteristics. While this increases the contact area and disturbance intensity between the fluid and the channel wall, it also leads to a slight increase in local flow resistance, which is a "reasonable increase in resistance accompanying enhanced heat transfer." The increasing trend of PEC indicates that the increase in Nu is greater than the increase in flow resistance, achieving synergistic optimization of "heat transfer-resistance." This proves that the standardized wave structure has better overall heat transfer performance than the non-standardized wave structure, further verifying the key role of the wave structure in enhancing heat transfer.

[0051] Example 1 is a double-layer symmetrical wave-shaped microchannel structure with NACA0030 hydrofoil-shaped fins, which is the core optimized structure of this invention. Compared with Comparative Example 3, it features an additional airfoil-shaped fin reinforcement design. Data shows that within the Re range of 100~500, Nu exhibits a significant increasing trend, with values ​​ranging from 15.41 to 26.89, representing an improvement of 191.2%~232.8% compared to Comparative Example 1 and 47.4%~45.1% compared to Comparative Example 3. f decreases with increasing Re, ranging from 0.476 to 0.147, showing a significant increase compared to the previous three (the maximum increase at the same Re is 149.1%). PEC steadily increases with increasing Re, ranging from 2.02 to 2.14, reaching its maximum value at Re=500, representing an improvement of 8.0%~4.0% compared to Comparative Example 3, and is generally superior to all comparative groups.

[0052] Core Optimization and Mechanism Analysis: The core highlight of this optimization is the addition of NACA0030 hydrofoil fins within the corrugated channel. This performance improvement stems from a triple synergistic effect: First, the fins increase the heat transfer area. The high thermal conductivity of the copper fins allows for rapid heat transfer from the channel walls, enhancing basic heat exchange capacity. Second, the NACA0030 hydrofoil's streamlined structure adapts to fluid flow characteristics, strengthening disturbance while avoiding excessive resistance loss. Positioned at the widest point of the corrugated unit, the fins can specifically disturb the core area with lower flow velocity within the channel, breaking the boundary layer thickening and enhancing convective heat transfer. Third, the fins synergize with the corrugated channel and the double-layer counter-flow structure. Multiple disturbances are generated as the fluid flows through the fins and corrugated profile, further improving fluid mixing uniformity and maximizing heat exchange efficiency.

[0053] Regarding the rationality of the significant increase in f: Increased flow resistance is an inevitable consequence of enhanced heat transfer. The streamlined design of the NACA0030 hydrofoil has minimized the increase in resistance. Compared to the significant increase in Nu (more than 45% higher than Comparative Example 3 at the same Re), the increase in resistance is within a reasonable range. Furthermore, the continuous increase in PEC, reaching a peak of 2.14, indicates that the improvement in heat transfer performance far exceeds the increase in flow resistance, achieving an optimal balance between "high-efficiency heat transfer and reasonable resistance." This fully demonstrates that the optimized scheme of adding hydrofoil fins in this invention has significant technical advantages, resulting in a substantial improvement in overall heat transfer performance compared to conventional rectangular channels and double-layer corrugated channels.

[0054] Based on the above analysis, the overall performance ranking of the four structures is: Example 1 > Comparative Example 3 > Comparative Example 2 > Comparative Example 1. The gradual optimization of the double-layer counter-flow structure, the corrugated channel structure, and the hydrofoil fins can all effectively improve the heat transfer performance of the microchannel cooling device. Among them, the synergistic optimization effect of the hydrofoil fins with the corrugated channel and the double-layer counter-flow structure is the most significant, increasing PEC to 2.14 and Nu by a maximum of 232.8%. This invention, by adding NACA0030 hydrofoil fins, solves the technical problems of low heat transfer efficiency and difficulty in balancing heat transfer and resistance in conventional microchannels, possessing outstanding enhanced heat transfer effect and engineering application value. In summary, this invention utilizes the symmetrical waveform channel configuration of the airfoil fins 2 and the heat exchange channel 3, so that when the fluid flows through the heat exchange channel 3, the boundary layer no longer adheres tightly to the wall of the heat exchange channel 3. The fluid forms strong vortices and secondary flows within the heat exchange channel 3, disrupting the originally stable thermal boundary layer. The periodic contraction-expansion structure of the heat exchange channel 3 further enhances the aforementioned effect, allowing the cooling medium to contact the airfoil fins 2 and the substrate 1 more uniformly. The streamlined configuration and precise placement of the airfoil fins 2 guide the flow, reducing or even eliminating ineffective vortices and avoiding localized heat exchange dead zones. The excellent thermal conductivity of the airfoil fins 2 allows for rapid heat transfer from the substrate 1 to the cooling medium. Simultaneously, the cooling channel 5 and the heat exchange channel 3 employ a counter-flow design with opposite fluid flow directions, effectively increasing the heat exchange time between the hot and cold fluids and further improving the heat exchange effect. The cooling device of this invention not only enhances fluid disturbance and optimizes flow resistance but also accelerates heat transfer, ultimately achieving efficient and stable heat dissipation. It also avoids the deterioration of heat exchange effect due to fluid flow separation or boundary layer thickening.

[0055] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0056] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wave-shaped microchannel cooling device with wing-shaped fins, comprising a substrate (1), wherein a cooling channel (5) and a heat exchange channel (3) extending from the front end to the rear end are formed on the substrate (1), characterized in that: Each heat exchange channel (3) is arranged evenly and parallel to each other close to the cooling channel (5), and each airfoil (2) is arranged sequentially from the front end to the rear end in the heat exchange channel (3).

2. The wave-shaped microchannel cooling device with airfoil fins according to claim 1, characterized in that: The heat exchange channel (3) is a symmetrical wave channel formed by sequentially connecting each symmetrical wave unit (4), and each symmetrical wave unit (4) has an airfoil (2) at its widest point.

3. The wave-shaped microchannel cooling device with airfoil fins according to claim 2, characterized in that: The wavy profile of the symmetrical wavy channel is derived using trigonometric functions. generate.

4. A wave-shaped microchannel cooling device with airfoil fins according to any one of claims 1 to 3, characterized in that: The airfoil (2) is one or more of the following: hydrofoil, arc-shaped fish wing, or bird wing, and its thickness is gradually set along the direction of fluid flow.

5. The wave-shaped microchannel cooling device with airfoil fins according to claim 4, characterized in that: The hydrofoil-shaped fins have a spindle shape with rounded ends at the front end, and smoothly converge in a symmetrical outward convex arc shape from the middle to the rear end.

6. The wave-shaped microchannel cooling device with airfoil fins according to claim 4, characterized in that: One side of the arc-shaped fish wing is the windward side, which is convex and arc-shaped from the front end to the rear end. The other side is the leeward side, which is convex and arc-shaped at the front end. Together with the front end of the windward side, they form a cylindrical structure, and the middle and rear ends smoothly converge towards the windward side.

7. The wave-shaped microchannel cooling device with airfoil fins according to claim 4, characterized in that: The bird-wing-shaped wing has one windward side, which is a smooth, outwardly convex arc shape from the front end to the rear end, and the other side is the leeward side, with the front end also being an outwardly convex arc shape. Together with the front end of the windward side, they form an elliptical cylindrical structure, which smoothly converges towards the windward side from the middle to the rear end.

8. The wave-shaped microchannel cooling device with airfoil fins according to claim 1, characterized in that: Each of the heat exchange channels (3) is arranged in a row below the cooling channel (5), and each of the airfoil fins (2) is arranged at equal intervals along the centerline of the heat exchange channel (3).

9. A wave-shaped microchannel cooling device with airfoil fins according to claim 1, characterized in that: The airfoil (2) is made of copper alloy or aluminum.

10. A wave-shaped microchannel cooling device with airfoil fins according to claim 1, characterized in that: The directions of fluid flow in the cooling channel (5) and the heat exchange channel (3) are opposite.

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