Water cooling plate heat dissipation structure

Abstract

The utility model provides a water cooling plate heat radiation structure, comprising a bottom plate, the central area of the bottom plate is provided with a pin turbulent flow structure which is circularly arranged and is used for enhancing the fluid disturbance of the central area; a multi-channel concentric-square-shaped flow channel is arranged around the outer side of the pin turbulent flow structure, an inlet of the concentric-square-shaped flow channel is communicated with the cooling liquid inlet, and an outlet of the concentric-square-shaped flow channel is communicated with the cooling liquid outlet; the flow direction of the cooling liquid inlet is set to vertically impact the pin turbulent flow structure, a heat boundary layer is directly destroyed by vertically impacting a high-temperature area in the center of the chip in the direction of the cooling liquid inlet, and a convective heat transfer coefficient is increased by inducing a secondary vortex in combination with the circular array pins; cooling liquid spirally flows from the center to the outside along the multiple layers of concentric annular flow channels, the flowing path is dynamically matched with the temperature gradient of the chip, the low-temperature cooling liquid in the center efficiently absorbs heat of hot spots, the temperature-rising cooling liquid on the periphery takes away waste heat in a balanced mode, and therefore the temperature of the chip is more uniform.

Description

Technical Field

[0001] This utility model relates to the field of water-cooled plate technology, and more specifically, to a water-cooled plate heat dissipation structure. Background Technology

[0002] With the trend towards higher performance and miniaturization in electronic devices, chip power density continues to rise, making heat dissipation a core challenge restricting device reliability and lifespan. Water-cooled plates, due to their efficient heat conduction capabilities, are widely used in the active cooling of high-power chips (such as GPUs, CPUs, and power modules).

[0003] Traditional water-cooled plates improve heat dissipation efficiency by incorporating fins, pins, and other structures below the heat source to increase the contact area between the fluid and the solid. However, with chip power exceeding 500W / cm², [further improvements are needed]. 2 At this scale, traditional heat dissipation structures face the following bottlenecks:

[0004] Limited improvement in heat dissipation efficiency: Traditional finned or pin structures rely on passively expanding the heat dissipation area, and their thermal boundary layer gradually thickens along the flow direction, leading to a decrease in the local convective heat transfer coefficient. For high-power chips, such structures struggle to exceed the heat flux density threshold, limiting the potential for improving heat dissipation efficiency.

[0005] Uneven temperature distribution causes thermal stress: In traditional flow channel designs (such as parallel flow and serpentine flow), the coolant flow path does not match the heat source distribution, causing high-temperature hotspots (temperature differences of up to 15°C or more) to form in the central area of ​​the chip, while the peripheral area dissipates heat excessively. This temperature gradient can induce thermal stress, causing chip warping or even cracking, seriously affecting device lifespan.

[0006] The dilemma of balancing flow resistance and heat dissipation performance: To improve heat dissipation efficiency, existing technologies often enhance disturbance by increasing pin density or reducing flow channel cross-sectional area. However, such designs significantly increase flow resistance (pressure drop exceeding 50 kPa), leading to a surge in pump power demand and a decrease in system energy efficiency ratio.

[0007] To address the aforementioned issues, existing improvement solutions often focus on local optimizations. For example, non-uniform pin arrangement can be used to match the heat source distribution, but this results in high processing complexity and poor adaptability. Adding turbulence columns or fin microstructures within the flow channel has limited boundary layer disruption effects and significantly increases pressure drop. Introducing a multi-stage coolant distribution system requires an additional power unit, making it difficult to balance cost and reliability.

[0008] Therefore, there is an urgent need for a new type of water-cooled plate heat dissipation structure that can break through the traditional heat dissipation logic that relies on area expansion and achieve the dual goals of efficient heat dissipation and temperature balance through the coordinated design of flow path and turbulence mechanism. Utility Model Content

[0009] In view of this, the present invention proposes a water-cooled plate heat dissipation structure, comprising: a base plate 10, wherein a circularly arranged pin-shaped flow disturbance structure 40 is provided in the central region of the base plate 10 to enhance the fluid disturbance in the central region; a multi-channel loop flow channel 50 is provided around the outer side of the pin-shaped flow disturbance structure 40, wherein the inlet of the loop flow channel 50 is connected to the coolant inlet 20 and the outlet is connected to the coolant outlet 30; the flow direction of the coolant inlet 20 is set to vertically impact the pin-shaped flow disturbance structure 40, thereby directly destroying the thermal boundary layer by vertically impacting the high-temperature region in the center of the chip 60 through the coolant inlet 20, and combined with the secondary eddy current induced by the circular array of pins, thereby improving the convective heat transfer coefficient; the coolant flows spirally from the center outward along the multi-layer concentric annular flow channel, and the flow path is dynamically matched with the temperature gradient of the chip 60, wherein the low-temperature coolant in the center efficiently absorbs the heat from the hot spots, and the heated coolant in the outer periphery evenly removes the excess heat, thereby making the temperature of the chip 60 more uniform.

[0010] A water-cooled plate heat dissipation structure is characterized by comprising: a base plate 10, wherein a circularly arranged pin-shaped flow disturbance structure 40 is provided in the central region of the base plate 10 to enhance fluid disturbance in the central region; a multi-channel loop flow channel 50 is provided around the outer side of the pin-shaped flow disturbance structure 40, wherein the inlet of the loop flow channel 50 is connected to the coolant inlet 20 and the outlet is connected to the coolant outlet 30; the flow direction of the coolant inlet 20 is set to vertically impact the pin-shaped flow disturbance structure 40, and the vertical impact flow forms a high-speed jet that directly acts on the high-temperature region in the center of the base plate 10, forcibly breaking the stable development of the thermal boundary layer, significantly reducing the boundary layer thickness, and the turbulence effect of the impact flow enhances the momentum exchange between the fluid and the base plate 10, thereby increasing the convective heat transfer coefficient in the central region.

[0011] Furthermore, the loop channel 50 is a multi-layered concentric annular channel, enabling the coolant to diffuse and flow layer by layer.

[0012] Furthermore, the coolant inlet 20 is aligned with the axis of the pin-shaped flow deflection structure 40.

[0013] Furthermore, the cross-sectional area of ​​the coolant inlet 20 is smaller than the total cross-sectional area of ​​the loop channel 50 to form a flow velocity gradient.

[0014] Furthermore, the coolant outlet 30 is located at the end of the outermost annular channel of the loop channel 50, and the outlet cross-sectional area gradually increases to reduce flow resistance.

[0015] Furthermore, the flow area of ​​the loop channel 50 is smaller than that of the pin turbulence area, which is used to increase the coolant flow rate and enhance the heat exchange efficiency.

[0016] In some embodiments, the pin height, diameter, and spacing of the pin-shaped flow-disrupting structure 40 are optimized based on the target heat dissipation power and fluid resistance.

[0017] In some embodiments, the chip 60 is located under the base plate 10. Through the flow path of the coolant from the center outward through the loop channel 50, the coolant preferentially contacts the highest temperature area in the center of the chip 60 (usually the core of the heat source). The high flow rate carries away the concentrated heat, avoids the accumulation of central temperature, and makes the temperature gradient of the coolant match the temperature gradient of the chip 60 to balance the overall temperature distribution of the chip 60.

[0018] In some embodiments, a cover plate 70 is provided on the upper part of the base plate 10, and the base plate 10 and the cover plate 70 are sealed together by a brazing process.

[0019] In some embodiments, the base plate 10, the pin-shaped flow structure 40, and the loop-shaped flow channel 50 are integrally formed structures.

[0020] The beneficial effects of this utility model are as follows: This utility model proposes a water-cooled plate heat dissipation structure, including: a base plate 10, the central area of ​​which is provided with a circularly arranged pin-shaped flow structure 40 to enhance the fluid turbulence in the central area; a multi-channel loop flow channel 50 is provided around the outer side of the pin-shaped flow structure 40, the inlet of the loop flow channel 50 is connected to the coolant inlet 20, and the outlet is connected to the coolant outlet 30; the flow direction of the coolant inlet 20 is set to vertically impact the pin-shaped flow structure 40, and the coolant inlet 20 vertically impacts the high-temperature area in the center of the chip 60, directly destroying the thermal boundary layer, and combined with the secondary eddy current induced by the circular array of pins, the convective heat transfer coefficient is improved; the coolant flows spirally from the center outward along the multi-layer concentric annular flow channel, and the flow path is dynamically matched with the temperature gradient of the chip 60. The low-temperature coolant in the center efficiently absorbs the heat from the hot spots, and the heated coolant in the outer area evenly removes the excess heat, thereby making the temperature of the chip 60 more uniform. Attached Figure Description

[0021] Figure 1 This is an exploded view of the water-cooled plate heat dissipation structure of this utility model.

[0022] Figure 2 This is a structural diagram of the base plate of the water-cooled plate heat dissipation structure of this utility model.

[0023] Explanation of symbols for key components.

[0024] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model.

[0025] Base plate 10, coolant inlet 20, coolant outlet 30, pin turbulence structure 40, loop flow channel 50, chip 60, cover plate 70. Detailed Implementation

[0026] Example 1:

[0027] like Figure 1-2 As shown, a water-cooled plate heat dissipation structure includes: a base plate 10, the central region of which is provided with a circularly arranged pin-shaped flow disturbance structure 40 to enhance fluid disturbance in the central region; a multi-channel loop-shaped flow channel 50 is provided around the outer side of the pin-shaped flow disturbance structure 40, the loop-shaped flow channel 50 being a multi-layered concentric annular channel to achieve layer-by-layer diffusion flow of coolant; the inlet of the loop-shaped flow channel 50 is connected to the coolant inlet 20, the cross-sectional area of ​​the coolant inlet 20 being smaller than the total cross-sectional area of ​​the loop-shaped flow channel 50 to form a velocity gradient, and the outlet is connected to the coolant outlet 30; the cooling... The liquid outlet 30 is located at the end of the outermost annular channel of the loop flow channel 50, and the outlet cross-sectional area is gradually increased to reduce flow resistance. The flow direction of the coolant inlet 20 is set to vertically impact the pin-shaped turbulence structure 40, and the coolant inlet 20 is aligned with the axis of the pin-shaped turbulence structure 40. The vertical impact flow forms a high-speed jet that directly acts on the high-temperature region in the center of the base plate 10, forcibly breaking the stable development of the thermal boundary layer, significantly reducing the boundary layer thickness. The turbulence effect of the impact flow enhances the momentum exchange between the fluid and the base plate 10, thereby increasing the convective heat transfer coefficient in the central region.

[0028] The flow area of ​​the loop channel 50 is smaller than that of the pin turbulence area, which is used to increase the coolant flow rate and enhance the heat exchange efficiency. The pin height, diameter and spacing of the pin turbulence structure 40 are optimized according to the target heat dissipation power and fluid resistance.

[0029] The chip 60 is located at the bottom of the base plate 10. Through the flow path of the coolant from the center outward through the loop channel 50, the coolant preferentially contacts the highest temperature area in the center of the chip 60 (usually the core of the heat source). The high flow rate carries away the concentrated heat, avoids the accumulation of central temperature, and makes the temperature gradient of the coolant match the temperature gradient of the chip 60 to balance the overall temperature distribution of the chip 60.

[0030] The base plate 10 is provided with a cover plate 70 on its upper part. The base plate 10 and the cover plate 70 are sealed together by brazing. The base plate 10, the pin turbulence structure 40 and the loop flow channel 50 are integrally formed structures.

[0031] The beneficial effects of this utility model are as follows: This utility model proposes a water-cooled plate heat dissipation structure, including: a base plate 10, the central area of ​​which is provided with a circularly arranged pin-shaped flow structure 40 to enhance the fluid turbulence in the central area; a multi-channel loop flow channel 50 is provided around the outer side of the pin-shaped flow structure 40, the inlet of the loop flow channel 50 is connected to the coolant inlet 20, and the outlet is connected to the coolant outlet 30; the flow direction of the coolant inlet 20 is set to vertically impact the pin-shaped flow structure 40, and the coolant inlet 20 vertically impacts the high-temperature area in the center of the chip 60, directly destroying the thermal boundary layer, and combined with the secondary eddy current induced by the circular array of pins, the convective heat transfer coefficient is improved; the coolant flows spirally from the center outward along the multi-layer concentric annular flow channel, and the flow path is dynamically matched with the temperature gradient of the chip 60. The low-temperature coolant in the center efficiently absorbs the heat from the hot spots, and the heated coolant in the outer area evenly removes the excess heat, thereby making the temperature of the chip 60 more uniform.

[0032] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A water-cooled plate heat dissipation structure, characterized in that, include: The base plate (10) has a circularly arranged pin-needle turbulence structure (40) in the central region to enhance the fluid turbulence in the central region; A multi-channel loop flow channel (50) is provided on the outside of the pin needle turbulence structure (40). The inlet of the loop flow channel (50) is connected to the coolant inlet (20), and the outlet is connected to the coolant outlet (30). The flow direction of the coolant inlet (20) is set to vertically impact the pin needle turbulence structure (40).

2. The water-cooled plate heat dissipation structure as described in claim 1, characterized in that: The meander channel (50) is a multi-layered concentric annular channel that enables the coolant to diffuse and flow layer by layer.

3. The water-cooling plate heat dissipation structure according to claim 1, wherein: The coolant inlet (20) is aligned with the axis of the pin-shaped flow-disrupting structure (40).

4. The water-cooling plate heat dissipation structure according to claim 1, wherein: The cross-sectional area of ​​the coolant inlet (20) is smaller than the total cross-sectional area of ​​the loop channel (50) to form a velocity gradient.

5. The water-cooling plate heat dissipation structure according to claim 1, wherein: The coolant outlet (30) is located at the end of the outermost annular channel of the loop channel (50), and the outlet cross-sectional area gradually increases to reduce flow resistance.

6. The water-cooling plate heat dissipation structure according to claim 1, wherein: The flow area of ​​the loop channel (50) is smaller than the pin turbulence area.

7. The water-cooling plate heat dissipation structure according to claim 1, wherein: The chip (60) is located under the base plate (10) and flows through the coolant from the center outward through the loop channel (50).

8. The water-cooling plate heat dissipation structure according to claim 1, wherein: The bottom plate (10) is provided with a cover plate (70) on its upper part, and the bottom plate (10) and the cover plate (70) are sealed together by brazing.

9. The water-cooling plate heat dissipation structure according to claim 1, wherein: The base plate (10), pin-shaped flow structure (40), and loop-shaped flow channel (50) are integrally formed.

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