Sensor assembly, detector system, application-specific integrated circuit and medical imaging equipment

Abstract

The utility model discloses a sensor assembly, a detector system, a special integrated circuit and a medical imaging device, comprising a SiPM circuit board, a plurality of SiPM sensors arranged on the front side of the SiPM circuit board, each SiPM sensor coupled with at least one scintillation crystal of the detector; the first connecting boss is arranged on the back surface of the SiPM circuit board and is used for being fixedly connected with an external first application-specific integrated circuit; and a connection point on the contact surface of the SiPM circuit board is electrically connected with the first application-specific integrated circuit. According to the sensor assembly for the detector provided by the utility model, the SiPM circuit board and the connecting boss are processed into a whole, so that the advantage of tight connection between the application-specific integrated circuit and the SiPM circuit board is maintained, only the two circuit boards need to be welded, and the difficulty of welding processing is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of PET detector technology, and in particular to a sensor assembly, detector system, application-specific integrated circuit and medical imaging equipment. Background Technology

[0002] With the use of Application Specific Integrated Circuits (ASICs) in PET detectors, positron emission tomography (PET) detector modules can now utilize a greater number of silicon photomultiplier (SiPM) chips in the same unit area to form an array to receive photons emitted by the crystal array, compared to previous methods. Simultaneously, the high integration and modular design of PET detector modules have been achieved.

[0003] The connection between the ASIC chip and the SiPM chip is a critical aspect of detector design. To improve detector performance and reduce the impact of parasitic parameters, the closer the connection between the ASIC and SiPM, the better the performance of the PET detector. However, due to limitations such as the high power consumption of ASICs, the temperature sensitivity of SiPMs, and the need for resistors and capacitors on the back of the ASIC, it is not feasible to solder the ASIC chip and the SiPM chip onto the same circuit board. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the above-mentioned defects in the prior art and provide a sensor component, a detector system, an application-specific integrated circuit and a medical imaging device.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution:

[0006] This utility model provides a sensor assembly for a detector, comprising:

[0007] A SiPM circuit board, wherein a plurality of SiPM sensors are arranged on the front side of the SiPM circuit board, and each SiPM sensor is coupled to at least one scintillation crystal of the detector;

[0008] The first connecting boss is disposed on the back of the SiPM circuit board and is used for fixed connection with an external first application-specific integrated circuit.

[0009] The connection points on the contact surface of the SiPM circuit board are electrically connected to the first application-specific integrated circuit.

[0010] Preferably, the connection point includes a pad for soldering to a corresponding pad of the first application-specific integrated circuit;

[0011] Selected pins of the plurality of SiPM sensors are connected to the pads via traces on the SiPM circuit board and the first connecting boss.

[0012] Preferably, the first connecting boss is disposed along the edge of the SiPM circuit board; and / or,

[0013] Several first connecting bosses are distributed at predetermined positions on the back side of the SiPM circuit board.

[0014] Preferably, the back side of the SiPM circuit board also includes a resistor-capacitor region for mounting a number of resistors and / or capacitors.

[0015] This utility model also provides a PET detector system, including:

[0016] Multiple scintillator crystals form a crystal array;

[0017] A SiPM sensor is coupled to at least one scintillator crystal;

[0018] SiPM circuit board, the SiPM circuit board including a front side and a back side, the front side of the SiPM circuit board being coupled to the SiPM sensor;

[0019] The second application-specific integrated circuit is connected to the back of the SiPM circuit board via solder joints.

[0020] This utility model also provides a dedicated integrated circuit, comprising:

[0021] An ASIC circuit board, wherein multiple ASIC chips are arranged on the front side of the ASIC circuit board, and the ASIC chips are used to process the data transmitted by the SiPM sensor;

[0022] The second connecting boss is disposed on the back of the ASIC circuit board and is used for fixed connection with the SiPM circuit board.

[0023] The connection points on the contact surface of the ASIC circuit board are electrically connected to the SiPM circuit board.

[0024] Preferably, the connection point includes a pad for soldering to a corresponding pad on the SiPM circuit board;

[0025] Selected pins of the plurality of ASIC chips are connected to the pads via traces on the ASIC circuit board and the second connecting boss.

[0026] Preferably, the second connecting boss is disposed along the edge of the ASIC circuit board; and / or,

[0027] Several second connecting bosses are distributed at predetermined positions on the back of the ASIC circuit board.

[0028] Preferably, the back side of the ASIC circuit board also includes a resistor-capacitor area for mounting a number of resistors and / or capacitors.

[0029] This invention also provides a medical imaging device, including the PET detector system described above.

[0030] The positive and progressive effects of this utility model are as follows:

[0031] The sensor assembly for detectors provided by this utility model integrates the SiPM circuit board and the first connecting boss into a single unit, which maintains the advantage of a tight connection between the external first application-specific integrated circuit and the SiPM circuit board, while also requiring only the soldering of the two circuit boards, greatly reducing the difficulty of the soldering process. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0033] Figure 1 This is a first structural schematic diagram of the sensor assembly for the detector in Embodiment 1 of this utility model.

[0034] Figure 2A This is a second structural schematic diagram of the sensor assembly for the detector in Embodiment 1 of this utility model.

[0035] Figure 2B This is yet another schematic diagram of the second structure of the sensor assembly for the detector in Embodiment 1 of this utility model.

[0036] Figure 3 This is a third structural schematic diagram of the sensor assembly for the detector in Embodiment 1 of this utility model.

[0037] Figure 4 This is a first schematic diagram of the arrangement of the first connecting boss in Embodiment 1 of this utility model.

[0038] Figure 5This is a second schematic diagram of the arrangement of the first connecting boss in Embodiment 1 of this utility model.

[0039] Figure 6 This is a third schematic diagram illustrating the arrangement of the first connecting boss in Embodiment 1 of this utility model.

[0040] Figure 7 This is a schematic diagram of the PET detector system in Embodiment 2 of this utility model.

[0041] Figure 8 This is a schematic diagram of the structure of the application-specific integrated circuit in embodiment 3 of the present utility model. Detailed Implementation

[0042] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0043] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the document does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0044] It should be understood that the terms “device,” “system,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0045] As illustrated herein, unless the context clearly indicates otherwise, the words “a,” “an,” “an,” and / or “the” do not specifically refer to the singular and may also include the plural. Generally speaking, the terms “comprising” and “including” only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0046] The definitions used herein, such as the terms “having,” “may have,” “comprising,” or “may include,” indicate the presence of the corresponding function, operation, element, etc., and do not limit the presence of one or more other functions, operations, elements, etc. Furthermore, it should be understood that the terms “comprising” or “having” as used herein indicate the presence of the features, figures, steps, operations, elements, components, or combinations thereof described in the specification, without excluding the presence or addition of one or more other features, figures, steps, operations, elements, components, or combinations thereof.

[0047] Example 1

[0048] Please refer to Figure 1 and 2A , Figure 2B This is a first structural schematic diagram and a second structural schematic diagram of the sensor assembly used for the detector in this embodiment, as shown below. Figure 1 and 2A , Figure 2B As shown, the sensor assembly 100 for the detector includes:

[0049] SiPM circuit board 1, with multiple SiPM sensors 2 arranged on the front side of SiPM circuit board 1, each SiPM sensor 2 being coupled to at least one scintillation crystal of the detector;

[0050] The number and arrangement of scintillation crystals are unrestricted and can be set by those skilled in the art according to the actual required size of the PET detector. The crystal array formed by the number of scintillation crystals can be arranged in an 8*8, 8*9, or 8*19 pattern, with a beam-splitting structure between adjacent scintillation crystals. Different numbers of scintillation crystals correspond to different sizes of PET detectors. The material of the scintillation crystal can be at least one of the following: bismuth germanate, lutetium silicate, lutetium yttrium silicate, lutetium gadolinium silicate, gadolinium silicate, yttrium silicate, barium fluoride, sodium iodide, cesium iodide, lead tungstate, yttrium aluminate, lanthanum bromide, lanthanum chloride, lutetium aluminum pertitanium, lutetium pyrosilicate, lutetium aluminate, and lutetium iodide.

[0051] Gamma rays generated by coincidence events within the detected object excite photons within the scintillation crystal. During propagation, these photons are reflected when they encounter a beam-splitting structure, altering their propagation path. Therefore, photons excited within the scintillation crystal can enter the corresponding SiPM sensor 2 from the side of the scintillation crystal that defines the light-emitting surface, or from the side of an adjacent scintillation crystal that defines the light-emitting surface. The SiPM sensor 2 corresponding to the scintillation crystal and the SiPM sensor 2 corresponding to the adjacent scintillation crystal can be the same semiconductor sensor or different semiconductor sensors. In other words, one SiPM sensor 2 in the semiconductor sensor array can receive photons from the side of one scintillation crystal in the crystal array that defines the light-emitting surface, or from the sides of multiple scintillation crystals that each define the light-emitting surface.

[0052] The first connecting boss 3 is disposed on the back of the SiPM circuit board 1 and is used to fix it to the external application-specific integrated circuit 200. Preferably, the SiPM circuit board and the first connecting boss 3 are processed into a whole by using ceramic material.

[0053] Connection point 4 on the contact surface of SiPM circuit board 1 is electrically connected to the external first application-specific integrated circuit 200.

[0054] Please refer to Figure 3 This is a schematic diagram of the third structure of the sensor assembly used for the detector in this embodiment, as shown below. Figure 3 As shown, in one optional embodiment, connection point 4 includes pads for soldering to corresponding pads of the first application-specific integrated circuit 200. Specifically, the number and size of the pads on the SiPM board can be adjusted according to the number of SiPM sensors, power supply, heat dissipation, and other requirements. For example, the number of pads should be greater than or equal to the product of the number of SiPM sensors and the number of pins, or the size and distribution of the pads can be adjusted according to the heat dissipation requirements of the SiPM sensors.

[0055] Selected pins of multiple SiPM sensors 2 are connected to pads via traces on the SiPM circuit board 1 and the first connecting boss 3.

[0056] In another alternative embodiment, the first connecting boss 3 is arranged along the edge of the SiPM circuit board 1; or, a plurality of first connecting bosses 3 are distributed at predetermined positions on the back side of the SiPM circuit board 1.

[0057] Specifically, this embodiment does not limit the arrangement of the first connecting boss 3 on the back side of the SiPM circuit board 1. The connecting boss on the SiPM circuit board 1 can be of any shape, such as... Figure 4 As shown, the SiPM circuit board 1 only has first connecting bosses 3 on both sides, as... Figure 5 As shown, the SiPM circuit board 1 has a cross-shaped first connecting boss 3 in the middle, as... Figure 6 As shown, the SiPM circuit board 1 has multiple independent first connecting bosses 3 distributed in a dispersed manner.

[0058] In addition, the back side of the SiPM circuit board 1 also includes a resistor-capacitor region 5 for mounting several resistors and / or capacitors.

[0059] The sensor assembly for the detector provided in this embodiment uses ceramic material to process the SiPM circuit board and the first connecting boss 3, processing the SiPM circuit board and the first connecting boss 3 into a whole. This maintains the advantage of the tight connection between the external first application-specific integrated circuit 200 and the SiPM circuit board, while also requiring only the soldering of the two circuit boards, greatly reducing the difficulty of the soldering process.

[0060] Example 2

[0061] Please refer to Figure 7 This is a schematic diagram of the PET detector system in this embodiment, as shown below. Figure 7As shown, the PET detector system includes multiple detectors and a frame supporting the detectors. The multiple detectors are arranged circumferentially around the frame to form a detection cavity for accommodating the object to be detected. Optionally, the number of frames can be one or multiple frames connected sequentially along the axial direction. Each detector includes:

[0062] Multiple scintillator crystals 11 form a crystal array;

[0063] SiPM sensor 2 is coupled to at least one scintillator crystal 11;

[0064] SiPM circuit board 1, which includes a front side and a back side, with SiPM sensor 2 coupled to the front side of SiPM circuit board 1;

[0065] The second application-specific integrated circuit (ASIC) is connected to the back of the SiPM circuit board 1 via solder joints.

[0066] The PET detector system provided in this embodiment maintains the advantage of a tight connection between the second application-specific integrated circuit and the SiPM circuit board by setting solder joints on the back of the SiPM circuit board for soldering to the second application-specific integrated circuit, while only requiring soldering of the two circuit boards, greatly reducing the difficulty of soldering.

[0067] Example 3

[0068] Please refer to Figure 8 This is a schematic diagram of the structure of the application-specific integrated circuit in this embodiment, as shown below. Figure 8 As shown, an application-specific integrated circuit (ASIC) includes:

[0069] ASIC circuit board 6, with multiple ASIC chips 7 arranged on the front side of ASIC circuit board 6. ASIC chips 7 are used to process the data transmitted by SiPM sensor; FPGA (Field Programmable Gate Array) 9 can also be arranged on the front side of ASIC circuit board 6.

[0070] The second connecting boss 8 is disposed on the back of the ASIC circuit board 6 and is used to fix it to the SiPM circuit board 1. Preferably, the ASIC circuit board and the second connecting boss are processed into a whole by using ceramic material.

[0071] The connection points on the contact surface of the ASIC circuit board 6 are electrically connected to the SiPM circuit board 1.

[0072] In one optional implementation, the connection point includes a pad for soldering to a corresponding pad on the SiPM circuit board 1. Specifically, the number and size of the pads on the ASIC board can be adjusted according to the number of ASIC chips, power supply, heat dissipation, and other requirements. For example, the number of pads should be greater than or equal to the product of the number of ASIC chips and the number of pins, or the size and distribution of the pads can be adjusted according to the heat dissipation requirements of the ASIC chips.

[0073] Selected pins of multiple ASIC chips 7 are connected to pads via traces on the ASIC circuit board 6 and the second connecting boss 8.

[0074] In another alternative embodiment, the second connecting boss 8 is arranged along the edge of the ASIC circuit board 6; or, a plurality of second connecting bosses 8 are distributed at predetermined positions on the back side of the ASIC circuit board 6.

[0075] Specifically, this embodiment does not limit the way the connecting boss is set on the back of the ASIC circuit board. The second connecting boss 8 on the ASIC circuit board can be of any shape. For example, the ASIC circuit board can only set the second connecting boss 8 on both sides, or the ASIC circuit board can set the cross-shaped second connecting boss 8 in the middle. The ASIC circuit board can have multiple independent second connecting bosses 8 distributed in a dispersed manner.

[0076] In addition, the back of the ASIC circuit board 6 also includes a resistor-capacitor area for mounting several resistors and / or capacitors.

[0077] The application-specific integrated circuit provided in this embodiment uses ceramic materials to process the ASIC circuit board and the connecting boss, and processes the ASIC circuit board and the second connecting boss 8 into a whole. This not only maintains the advantage of tight connection between the application-specific integrated circuit and the SiPM circuit board, but also only requires soldering of the two circuit boards, which greatly reduces the difficulty of soldering.

[0078] Example 4

[0079] This embodiment provides a medical imaging device, which includes the PET detector system described in Embodiment 2. The medical imaging device can be a positron emission tomography / magnetic resonance imaging (PET-MR) system or a positron emission tomography / X-ray computed tomography (PET-CT) system.

[0080] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.

Claims

1. A sensor assembly for a probe, characterized by, include: SiPM circuit board (1), on the front side of which a plurality of SiPM sensors (2) are arranged, each of the SiPM sensors (2) being coupled to at least one scintillation crystal of the detector; The first connecting boss (3) is disposed on the back of the SiPM circuit board (1) and is used to fix it to the external first application-specific integrated circuit. The connection point (4) on the contact surface of the SiPM circuit board (1) is electrically connected to the first application-specific integrated circuit.

2. The sensor assembly for a probe of claim 1, wherein, The connection point (4) includes a pad for soldering to the corresponding pad of the first application-specific integrated circuit; Selected pins of the plurality of SiPM sensors (2) are connected to the pads via traces on the SiPM circuit board (1) and the first connecting boss (3).

3. The sensor assembly for a probe of claim 1, wherein, The first connecting boss (3) is arranged along the edge of the SiPM circuit board (1); and / or, Several first connecting bosses (3) are distributed at predetermined positions on the back side of the SiPM circuit board (1).

4. The sensor assembly for a probe of claim 1, wherein, The back side of the SiPM circuit board (1) also includes a resistor-capacitor region (5) for mounting several resistors and / or capacitors.

5. A PET detector system characterized in that, include: Multiple scintillator crystals (11) form a crystal array; SiPM sensor (2), coupled to at least one scintillator crystal; SiPM circuit board (1), the SiPM circuit board (1) includes a front side and a back side, the front side of the SiPM circuit board (1) is coupled to the SiPM sensor (2). The second application-specific integrated circuit is connected to the back of the SiPM circuit board (1) via solder joints.

6. An application specific integrated circuit, characterized by include: An ASIC circuit board (6) is provided with multiple ASIC chips (7) on its front side. The ASIC chips (7) are used to process the data transmitted by the SiPM sensor (2). The second connecting boss (8) is disposed on the back of the ASIC circuit board (6) and is used to fix it to the SiPM circuit board (1). The connection point on the contact surface of the ASIC circuit board (6) is electrically connected to the SiPM circuit board (1).

7. The application-specific integrated circuit of claim 6, wherein, The connection point (4) includes a pad for soldering to the corresponding pad of the SiPM circuit board (1); Selected pins of the plurality of ASIC chips (7) are connected to the pads via traces on the ASIC circuit board (6) and the second connecting boss (8).

8. The application-specific integrated circuit of claim 6, wherein, The second connecting boss (8) is arranged along the edge of the ASIC circuit board (6); and / or, Several second connecting bosses (8) are distributed at predetermined positions on the back side of the ASIC circuit board (6).

9. The application specific integrated circuit of claim 6, wherein, The back side of the ASIC circuit board (6) also includes a resistor-capacitor area for mounting several resistors and / or capacitors.

10. A medical imaging apparatus, characterized by, Including the PET detector system as described in claim 5.

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