Wearable human body cooling device

By designing a wearable human body cooling device, and utilizing components such as semiconductor cooling chips and fans, the problem of inconvenient operation and poor effect of ice packs has been solved, achieving a convenient and efficient joint cooling effect.

CN224141024UActive Publication Date: 2026-04-21JINHU HUARUI MEDICAL INSTR CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-17
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing methods of applying ice are inconvenient to use and have poor effects when cooling joints, making it difficult to continuously and effectively reduce joint temperature.

Method used

A wearable human body cooling device was designed, which includes a support component and a control component. It utilizes components such as a semiconductor cooling chip, a fan and a heat sink to conduct cold air to the joints through a silicone pad. Combined with a temperature sensor and a controller, the cooling temperature and time are automatically set.

Benefits of technology

It enables convenient and efficient continuous cooling of joints, avoiding cold burns and improving cooling effect and ease of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a wearing type human body cooling device relates to wearing type human body cooling equipment field, including support subassembly and control subassembly, the support subassembly includes support plate and support, the two support is connected through rotating shaft movable connection, the support plate is located between the two support, the support plate is located between the two support, and the control subassembly is located between the support plate and the support. A cooling assembly is installed on the surface of the supporting plate and comprises a protective cover, a top cover, a silica gel pad, a cooling fin, a fan, a semiconductor refrigeration sheet and a conduction sheet. By arranging the supporting assembly, the cooling assembly can be worn on the knee joint, the knee joint can be effectively cooled through the cooling assembly, the knee joint can be cooled through cooperation of a protective cover, a top cover, a silica gel pad, a cooling fin, a fan, a semiconductor refrigeration sheet and a conduction sheet, and the cooling effect is good. The semiconductor refrigeration sheet transmits cold air to the knee joint through the conduction sheet and the silica gel pad, so that physical cooling can be realized.
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Description

Technical Field

[0001] This utility model belongs to the field of wearable human body cooling devices, specifically a wearable human body cooling device. Background Technology

[0002] Wearable body cooling devices are devices used to lower body temperature, especially suitable for high-temperature environments or occasions where it is necessary to keep the body cool for a long time. Joint cooling is a method to relieve joint inflammation, pain and swelling. By lowering the temperature of the joints, it can reduce the inflammatory response, relieve pain and promote joint recovery. In particular, after high-intensity training and exercise, it is necessary to use cooling devices to cool the joints.

[0003] Applying ice is one of the most common methods for cooling joints. Applying an ice pack or ice towel to the joint can quickly lower the joint temperature and reduce inflammation and pain. The application time is generally 15-20 minutes and needs to be repeated every few hours. Although this method can achieve the effect of cooling, it is relatively inconvenient to use, as it requires the preparation of ice cubes or ice packs, and the cooling effect is relatively poor.

[0004] In summary, this utility model provides a wearable human body cooling device to solve the above problems. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A wearable human body cooling device includes a support assembly and a control assembly. The support assembly includes a support plate and a bracket, with two brackets movably connected by a pivot. The support plate is located between the two brackets. A cooling assembly is mounted on the surface of the support plate. The cooling assembly includes a protective cover, a top cover, a silicone pad, a heat sink, a fan, a thermoelectric cooler, and a conductive plate. The silicone pad is located on the back of the support plate. The protective cover is fixed to the surface of the support plate. The heat sink, fan, thermoelectric cooler, and conductive plate are all installed in the inner cavity of the protective cover. Two sides of the conductive plate are fixedly connected to the cooling surface of the thermoelectric cooler and the silicone pad, respectively. The top cover is located on the surface of the protective cover. The control assembly is used to set the cooling temperature.

[0007] Furthermore, in this invention, the fan is fixedly connected to the heat sink, the heat dissipation surface of the semiconductor cooling chip is fixedly connected to the heat sink, and the fan is fixedly connected to the inner wall of the protective cover.

[0008] Furthermore, in this utility model, the surface of the support plate is provided with a through hole, the conductive sheet is located in the through hole, and the surface of the top cover is provided with a through groove.

[0009] Furthermore, in this utility model, the control component includes a control host, a control sub-unit, and a temperature sensor. The temperature sensor is fixed at the center of the back of the support plate, and the control sub-unit is embedded in the surface of the support plate.

[0010] Furthermore, in this invention, the output terminal of the temperature sensor is connected to the input terminal of the control sub-machine, the control host and the control sub-machine are connected via a USB cable, and the output terminal of the control sub-machine is connected to the input terminal of the semiconductor refrigeration chip.

[0011] Furthermore, in this utility model, the support assembly also includes a fixed belt, a movable belt, a socket, a buckle, a slide, a limiting rod, and an elastic belt. The support plate and the bracket are fixedly connected by the elastic belt, and the bracket is movably connected to the fixed belt by a movable pin. The movable belt is located in the inner cavity of the fixed belt and is movably connected to the inner cavity of the fixed belt.

[0012] Furthermore, in this utility model, the buckle is fixedly connected to the movable belt on one side, the insertion hole is fixedly connected to the movable belt on the other side, the buckle is inserted into the insertion hole, the surface of the fixed belt is provided with a sliding groove, and a limiting rod is fixedly connected to one end of the movable belt located in the inner cavity of the fixed belt. One end of the limiting rod extends into the inner cavity of the sliding groove and is slidably connected to the inner cavity of the sliding groove.

[0013] Beneficial effects: This utility model has the following beneficial effects:

[0014] This invention achieves the effect of wearing the cooling component on the knee joint by setting a support component, thereby enabling the cooling component to effectively cool the knee joint. Through the cooperation of the protective cover, top cover, silicone pad, heat sink, fan, semiconductor cooling chip and conductive plate, the knee joint can be cooled. The semiconductor cooling chip transmits cold air to the knee joint through the conductive plate and silicone pad, thereby achieving physical cooling. The cooling temperature and cooling time can be set by the control component, thereby improving the usage effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the connection structure between the support component and the cooling component of this utility model;

[0017] Figure 3 This is a rear view structural schematic diagram of the support plate of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the heat sink, fan, semiconductor cooling chip, and conductive plate of this utility model in a separated state;

[0019] Figure 5 This is a schematic diagram of the working process of this utility model.

[0020] In the picture:

[0021] 1. Support Components; 101. Support Plate; 102. Bracket; 103. Fixing Strap; 104. Movable Strap; 105. Insert Hole; 106. Buckle; 107. Slide Track; 108. Limiting Rod; 109. Elastic Band; 2. Cooling Components; 201. Protective Cover; 202. Top Cover; 203. Silicone Pad; 204. Heat Sink; 205. Fan; 206. Semiconductor Cooling Chip; 207. Conductive Plate; 3. Control Components; 301. Control Main Unit; 302. Control Sub-Unit; 303. Temperature Sensor. Detailed Implementation

[0022] To better understand the technical content of this utility model, specific embodiments are described below in conjunction with the accompanying drawings. Various aspects of this utility model are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily defined to include all aspects of this utility model. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in this utility model are not limited to any particular implementation. Furthermore, some aspects of this utility model can be used alone or in any suitable combination with other aspects disclosed in this utility model.

[0023] Example 1

[0024] like Figure 1-5 As shown, this is the first embodiment of the present invention. This embodiment provides a wearable human body cooling device, including a support component 1 and a control component 3. The support component 1 includes a support plate 101 and a bracket 102. The two brackets 102 are movably connected by a rotating shaft. The support plate 101 is located between the two brackets 102. A cooling component 2 is installed on the surface of the support plate 101. The cooling component 2 includes a protective cover 201, a top cover 202, a silicone pad 203, a heat sink 204, a fan 205, a semiconductor cooling chip 206, and a conductive plate 207. The silicone pad 203 is located on the back of the support plate 101. The protective cover 201 is fixed to the surface of the support plate 101. The heat sink 204, the fan 205, the semiconductor cooling chip 206, and the conductive plate 207 are all installed in the inner cavity of the protective cover 201. The two sides of the conductive plate 207 are fixedly connected to the cooling surface of the semiconductor cooling chip 206 and the silicone pad 203, respectively. The top cover 202 is located on the surface of the protective cover 201. The control component 3 is used to set the cooling temperature.

[0025] like Figure 1-5As shown, the bracket 102 provides support for the support plate 101, which is then placed over the knee joint, allowing the silicone pad 203 to contact the skin of the knee joint. The cooling temperature is then set by the control component 3, which activates the thermoelectric cooler 206 for cooling. The cooling surface of the thermoelectric cooler 206 transmits cold air to the silicone pad 203 via the conductive plate 207, and then conducts it to the knee joint. The silicone pad 203 and the conductive plate 207 prevent the thermoelectric cooler 206 from directly contacting the skin and causing cold burns. The heat emitted by the thermoelectric cooler 206 is conducted through the heat sink 204, and the centrifugal force generated by the high-speed rotation of the fan 205 dissipates the heat through the slots on the surface of the top cover 202, thus enabling the thermoelectric cooler 206 to operate stably and providing stable cooling to the joint, thereby improving the cooling effect.

[0026] Example 2

[0027] Reference Figure 1-5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0028] In this embodiment, the fan 205 is fixedly connected to the heat sink 204, the heat dissipation surface of the semiconductor cooling chip 206 is fixedly connected to the heat sink 204, and the fan 205 is fixedly connected to the inner wall of the protective cover 201.

[0029] The surface of the support plate 101 has a through hole, the conductive sheet 207 is located in the through hole, and the surface of the top cover 202 has a through groove.

[0030] The control component 3 includes a control host 301, a control sub-unit 302, and a temperature sensor 303. The temperature sensor 303 is fixed at the center of the back of the support plate 101, and the control sub-unit 302 is embedded in the surface of the support plate 101.

[0031] The output terminal of the temperature sensor 303 is connected to the input terminal of the control sub-unit 302. The control host 301 and the control sub-unit 302 are connected via a USB cable. The output terminal of the control sub-unit 302 is connected to the input terminal of the semiconductor cooling chip 206.

[0032] like Figure 1-5As shown, the control host 301 integrates auxiliary components such as a charging power supply, CPU, and output / input interfaces. The control host 301 and the control slave 302 are connected via a USB cable. The control host 301 can interconnect with the control slave 302 and also improve power consumption. The control slave 302 is equipped with a power management module, which provides power to the thermoelectric cooler 206, temperature sensor 303, and fan 205 to ensure stable operation. The temperature sensor 303 is used to monitor the temperature of the joint area and send the data to the control slave 302. The control slave 302 transmits the data to the control host 301. The cooling temperature can be set by the control host 301. The control host 301 sends a command to the control slave 302, and the control slave 302 starts the thermoelectric cooler 206 to begin cooling.

[0033] Example 3

[0034] Reference Figure 1 and 2 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0035] In this embodiment, the support assembly 1 further includes a fixed belt 103, a movable belt 104, an insertion hole 105, a buckle 106, a slide groove 107, a limiting rod 108, and an elastic belt 109. The support plate 101 and the bracket 102 are fixedly connected by the elastic belt 109. The bracket 102 is movably connected to the fixed belt 103 by a movable pin. The movable belt 104 is located in the inner cavity of the fixed belt 103 and is movably connected to the inner cavity of the fixed belt 103.

[0036] The buckle 106 is fixedly connected to the movable belt 104 on one side, and the insertion hole 105 is fixedly connected to the movable belt 104 on the other side. The buckle 106 is inserted into the insertion hole 105. The surface of the fixed belt 103 is provided with a sliding groove 107. One end of the movable belt 104 located in the inner cavity of the fixed belt 103 is fixedly connected to a limiting rod 108. One end of the limiting rod 108 extends into the inner cavity of the sliding groove 107 and is slidably connected to the inner cavity of the sliding groove 107.

[0037] like Figure 1 and 2 As shown, the support plate 101 is placed over the knee joint, so that the silicone pad 203 contacts the skin of the knee joint. Then, the insertion hole 105 and the buckle 106 are pulled. When the insertion hole 105 and the buckle 106 are pulled, the movable belt 104 moves outward of the fixed belt 103. When the movable belt 104 moves, the limiting rod 108 slides along the inner cavity of the slide groove 107. The slide groove 107 and the limiting rod 108 cooperate to limit the movement trajectory of the movable belt 104. The buckle 106 is inserted into the inner cavity of the insertion hole 105 to fix the support plate 101.

[0038] In use, the support plate 101 is placed over the knee joint, allowing the silicone pad 203 to contact the knee skin. Then, the insertion hole 105 and the buckle 106 are pulled. Pulling the insertion hole 105 and the buckle 106 causes the movable belt 104 to move outwards from the fixed belt 103. As the movable belt 104 moves, the limiting rod 108 slides along the inner cavity of the slide groove 107. The slide groove 107 and the limiting rod 108 work together to limit the movement trajectory of the movable belt 104. The buckle 106 is then inserted into the inner cavity of the insertion hole 105 to fix the support plate 101. The cooling temperature is set and controlled by the control unit 301. The main unit 301 sends a command to the control unit 302, which then activates the thermoelectric cooler 206 to begin cooling. The cooling surface of the thermoelectric cooler 206 transmits cold air to the silicone pad 203 via the conductive plate 207, and then conducts it to the knee joint via the silicone pad 203. The silicone pad 203 and the conductive plate 207 prevent the thermoelectric cooler 206 from directly contacting the skin and causing cold burns. The heat emitted by the thermoelectric cooler 206 is conducted through the heat sink 204, and the centrifugal force generated by the high-speed rotation of the fan 205 dissipates the heat through the slots on the surface of the top cover 202.

[0039] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Since this application is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail in this application.

[0040] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A wearable human body cooling device comprising a support assembly (1) and a control assembly (3), characterized in that: The support assembly (1) includes a support plate (101) and brackets (102). The two brackets (102) are movably connected by a pivot. The support plate (101) is located between the two brackets (102). A cooling assembly (2) is installed on the surface of the support plate (101). The cooling assembly (2) includes a protective cover (201), a top cover (202), a silicone pad (203), a heat sink (204), a fan (205), a semiconductor cooling chip (206), and a conductive plate (207). The silicone pad (205) is... 3) Located on the back of the support plate (101), the protective cover (201) is fixed to the surface of the support plate (101). The heat sink (204), fan (205), semiconductor cooling chip (206) and conductive plate (207) are all installed in the inner cavity of the protective cover (201). The two sides of the conductive plate (207) are fixedly connected to the cooling surface of the semiconductor cooling chip (206) and the silicone pad (203) respectively. The top cover (202) is located on the surface of the protective cover (201). The control component (3) is used to set the cooling temperature.

2. The wearable body cooling device of claim 1, wherein: The fan (205) is fixedly connected to the heat sink (204), the heat dissipation surface of the semiconductor cooling chip (206) is fixedly connected to the heat sink (204), and the fan (205) is fixedly connected to the inner wall of the protective cover (201).

3. The wearable body cooling device of claim 1, wherein: The surface of the support plate (101) has a through hole, the conductive sheet (207) is located in the through hole, and the surface of the top cover (202) has a through groove.

4. The wearable body cooling device of claim 1, wherein: The control component (3) includes a control host (301), a control sub-unit (302), and a temperature sensor (303). The temperature sensor (303) is fixed at the center of the back of the support plate (101), and the control sub-unit (302) is embedded in the surface of the support plate (101).

5. The wearable body cooling device of claim 4, wherein: The output of the temperature sensor (303) is connected to the input of the control unit (302). The control host (301) and the control unit (302) are connected via a USB cable. The output of the control unit (302) is connected to the input of the semiconductor cooling chip (206).

6. The wearable body cooling device of claim 1, wherein: The support assembly (1) further includes a fixed belt (103), a movable belt (104), a socket (105), a buckle (106), a slide (107), a limiting rod (108), and an elastic belt (109). The support plate (101) and the bracket (102) are fixedly connected by the elastic belt (109). The bracket (102) is movably connected to the fixed belt (103) by a movable pin. The movable belt (104) is located in the inner cavity of the fixed belt (103) and is movably connected to the inner cavity of the fixed belt (103).

7. The wearable body cooling device of claim 6, wherein: The buckle (106) is fixedly connected to the movable belt (104) on one side, and the insertion hole (105) is fixedly connected to the movable belt (104) on the other side. The buckle (106) is inserted into the insertion hole (105). The surface of the fixed belt (103) is provided with a sliding groove (107). One end of the movable belt (104) located in the inner cavity of the fixed belt (103) is fixedly connected to a limiting rod (108). One end of the limiting rod (108) extends into the inner cavity of the sliding groove (107) and is slidably connected to the inner cavity of the sliding groove (107).