Glue injection structure of semiconductor packaging mold

Abstract

The utility model relates to the technical field of glue injection structures, and discloses a glue injection structure of a semiconductor packaging mold, which comprises a mounting rack and is characterized in that one side of the mounting rack is fixedly connected with a material storage barrel, the upper end of the material storage barrel is fixedly connected with a fixing rack, one side of the fixing rack is fixedly connected with a first electric push rod, and the other side of the fixing rack is fixedly connected with a second electric push rod. And a piston push plate is slidably connected to the upper portion of the interior of the material storage barrel, the output end of the first electric push rod penetrates through the upper end of the material storage barrel to be fixedly connected with the upper end of the piston push plate, a buckle frame is fixedly connected to the middle of the interior of the material storage barrel, and a mounting plate is connected to the interior of the buckle frame in a clamped mode. When the device is used, impurities in glue in the storage barrel can be filtered through the filter plate before the glue is input into the glue injection mechanism, the condition that a glue injection nozzle of the glue injection mechanism is blocked by the impurities can be effectively reduced, and the device is more convenient and stable to use.

Description

Technical Field

[0001] This utility model relates to the field of injection molding structure technology, and in particular to an injection molding structure for a semiconductor packaging mold. Background Technology

[0002] Semiconductor packaging molds are key tools used in the manufacture of semiconductor devices, playing a crucial role in the semiconductor industry chain. One step in the semiconductor packaging process involves applying adhesive to the semiconductor, which requires the use of an adhesive application structure.

[0003] A search revealed that Chinese Patent Publication No. CN218132936U discloses a continuous dispensing structure for semiconductor packaging molds. The structure includes a feeding hopper with a metering feeding assembly inside. The metering feeding assembly includes a material cylinder with compression springs fixedly connected to both sides of its bottom. The bottom ends of the compression springs are fixedly connected to the bottom of the inner wall of the feeding hopper. T-shaped rods are fixedly connected to both sides of the bottom of the material cylinder, between the two compression springs. A trigger switch is fixedly installed on both sides of the bottom of the inner wall of the material cylinder, between the two compression springs. An electric telescopic rod is mounted on one side of the material cylinder via a mounting bracket. This device can quantitatively add dispensing material into the material cylinder. By quantitatively inputting dispensing material, it not only ensures the quality of the dispensing process and reduces waste, but also shortens the production cycle and ensures the normal operation of the dispensing process, thus providing great convenience for users.

[0004] However, in the existing technology, the glue injection material needs to be fed into the barrel during the glue injection process, but the barrel is not equipped with a filtration mechanism, which makes it easy for impurities to be mixed into the glue injection material. These impurities can easily clog the glue injection nozzle, causing the device to fail to complete the glue injection work smoothly. A solution is proposed to solve the problems mentioned in the background technology. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a dispensing structure for a semiconductor packaging mold, aiming to improve the problem that when the dispensing process requires inputting dispensing material into a barrel, but the barrel is not equipped with a filtration mechanism, the dispensing material is prone to being mixed with impurities, which can easily clog the dispensing nozzle and prevent the device from completing the dispensing work smoothly.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: It includes a mounting frame, characterized in that: a storage cylinder is fixedly connected to one side of the mounting frame; a fixing frame is fixedly connected to the upper end of the storage cylinder; a first electric push rod is fixedly connected to one side of the fixing frame; a piston push plate is slidably connected to the upper part of the storage cylinder; the output end of the first electric push rod passes through the upper end of the storage cylinder and is fixedly connected to the upper end of the piston push plate; a snap-fit ​​frame is fixedly connected to the middle part of the storage cylinder; a mounting plate is snapped into the inside of the snap-fit ​​frame; a filter plate is snapped into the inside of the mounting plate; and an inlet pipe is fixedly connected to one side of the storage cylinder.

[0007] As a further description of the above technical solution: After the glue is injected into the storage cylinder through the feed pipe, the piston push plate inside the storage cylinder can be moved down by starting the No. 1 electric push rod. The piston push plate can push the glue in the storage cylinder through the filter plate. After being filtered by the filter plate, the impurities contained in the glue will be intercepted by the filter plate. The glue will pass through the filter plate to the bottom of the storage cylinder. At this time, the glue can be drawn into the glue injection mechanism by the conveying pump below for glue injection work.

[0008] Preferably, a mounting groove is provided on one side of the storage cylinder, and the outer surface of the mounting plate is slidably connected to the interior of the mounting groove.

[0009] As a further description of the above technical solution: the mounting groove can be used to insert a mounting plate to fix the filter plate inside the storage cylinder.

[0010] Preferably, a limit frame is fixedly connected to one side of the mounting plate, and a buckle ring is fixedly connected to both sides of one side of the storage cylinder.

[0011] As a further description of the above technical solution: the limiting frame is fixed to one side of the mounting plate and can be used to limit the mounting plate inserted into the storage cylinder.

[0012] Preferably, locking rods are slidably connected to both sides inside the limiting frame, and lead screws are rotatably connected to both sides inside the limiting frame.

[0013] As a further description of the above technical solution: the locking lever can be pulled out or inserted into the buckle ring when it is moved, in order to fix the position of the mounting plate.

[0014] Preferably, the outer surfaces of the two lead screws are respectively threaded to the internal threads of the two locking rods, and a first bevel gear is fixedly connected to one end of each of the two lead screws. A second bevel gear is rotatably connected to the middle of the inside of the limiting frame.

[0015] As a further description of the above technical solution: the No. 2 bevel gear can drive the No. 1 bevel gear to rotate after rotation, thereby driving the lead screw to rotate.

[0016] Preferably, the outer surfaces of the two first bevel gears mesh with the outer surface of the second bevel gear, a knob is fixedly connected to one side of the second bevel gear through one side of the limiting frame, and the outer surfaces of the two locking rods are respectively inserted into the interior of the two buckle rings.

[0017] As a further description of the above technical solution: the locking rod can limit the position of the limit frame and the mounting plate after its end is inserted into the buckle ring.

[0018] Preferably, a sliding frame is slidably connected to the lower side of one side of the mounting frame, a second electric push rod is fixedly connected to one side of the mounting frame, the output end of the second electric push rod is fixedly connected to the upper end of the sliding frame, a spring is fixedly connected to the lower end of the sliding frame, and the lower end of the spring is fixedly connected to the lower side of one side of the mounting frame.

[0019] As a further description of the above technical solution: the No. 2 electric push rod can drive the sliding frame to slide under the mounting frame, thereby driving the glue injection mechanism to move. The spring can be compressed or stretched after the sliding frame moves, making the movement of the sliding frame more stable and smooth.

[0020] Preferably, the lower end of the storage cylinder is fixedly connected to a conveying pump, the output end of the conveying pump is fixedly connected to a conveying hose, one end of the sliding frame is fixedly connected to a glue injection mechanism, and one end of the conveying hose is fixedly connected to the upper end of the glue injection mechanism.

[0021] As a further description of the above technical solution: the delivery pump can be used to pump the glue in the storage cylinder to the glue injection mechanism.

[0022] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0023] In this invention, the glue in the storage cylinder can be filtered by a filter plate before being fed into the glue dispensing mechanism, which can effectively reduce the situation of impurities clogging the glue dispensing nozzle of the glue dispensing mechanism, making the device more convenient and stable to use. Attached Figure Description

[0024] Figure 1 This is a perspective view of the injection molding structure of a semiconductor packaging mold proposed in this utility model;

[0025] Figure 2 This is a three-dimensional structural diagram of the other side of the injection structure of a semiconductor packaging mold proposed in this utility model;

[0026] Figure 3 This is a three-dimensional structural diagram of the material storage cylinder section in the dispensing structure of a semiconductor packaging mold proposed in this utility model;

[0027] Figure 4 This is a three-dimensional cross-sectional view of the material storage cylinder section in the dispensing structure of a semiconductor packaging mold proposed in this utility model;

[0028] Figure 5 This is a three-dimensional cross-sectional view of the limiting frame portion in the glue injection structure of a semiconductor packaging mold proposed in this utility model.

[0029] Legend:

[0030] 1. Mounting bracket; 2. Storage cylinder; 3. Fixing bracket; 4. Electric push rod No. 1; 5. Feed pipe; 6. Mounting groove; 7. Limiting bracket; 9. Conveying hose; 10. Conveying pump; 11. Glue injection mechanism; 12. Sliding bracket; 13. Electric push rod No. 2; 14. Spring; 15. Snap ring; 16. Piston push plate; 17. Snap bracket; 18. Mounting plate; 19. Filter plate; 20. Lead screw; 21. Bevel gear No. 1; 22. Bevel gear No. 2; 23. Knob; 24. Locking rod. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1 to 5 As shown, one embodiment of this utility model includes a mounting frame 1, a storage cylinder 2 fixedly connected to one side of the mounting frame 1, a fixing frame 3 fixedly connected to the upper end of the storage cylinder 2, a first electric push rod 4 fixedly connected to one side of the fixing frame 3, a piston push plate 16 slidably connected to the upper part of the inside of the storage cylinder 2, the output end of the first electric push rod 4 passes through the upper end of the storage cylinder 2 and is fixedly connected to the upper end of the piston push plate 16, a snap-fit ​​frame 17 is fixedly connected to the middle part of the inside of the storage cylinder 2, an mounting plate 18 is snapped into the inside of the snap-fit ​​frame 17, a filter plate 19 is snapped into the inside of the mounting plate 18, and an inlet pipe 5 is fixedly connected to one side of the storage cylinder 2.

[0033] In this embodiment, after the glue is injected into the storage cylinder 2 through the feed pipe 5, the piston push plate 16 inside the storage cylinder 2 can be moved down by activating the first electric push rod 4. The piston push plate 16 can push the glue in the storage cylinder 2 through the filter plate 19. After being filtered by the filter plate 19, the impurities contained in the glue will be intercepted by the filter plate 19. The glue will pass through the filter plate 19 to the bottom of the storage cylinder 2. At this time, the glue can be drawn into the glue injection mechanism 11 by the delivery pump 10 below for glue injection. In this way, when the device is in use, the glue in the storage cylinder 2 can be filtered by the filter plate 19 before entering the glue injection mechanism 11, which can effectively reduce the situation of impurities clogging the glue injection nozzle of the glue injection mechanism 11, making the device more convenient and stable to use.

[0034] Example 2, as Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, a mounting groove 6 is provided on one side of the storage cylinder 2. The outer surface of the mounting plate 18 is slidably connected to the interior of the mounting groove 6. A limit frame 7 is fixedly connected to one side of the mounting plate 18. Clip rings 15 are fixedly connected to both sides of one side of the storage cylinder 2. Locking rods 24 are slidably connected to both sides of the interior of the limit frame 7. Lead screws 20 are rotatably connected to both sides of the interior of the limit frame 7. The outer surfaces of the two lead screws 20 are respectively threaded into the interior of the two locking rods 24. A first bevel gear 21 is fixedly connected to one end of each of the two lead screws 20. A second bevel gear 22 is rotatably connected to the middle of the interior of the limit frame 7. The outer surfaces of the two first bevel gears 21 mesh with the outer surfaces of the second bevel gear 22. One side of the second bevel gear 22... A knob 23 is fixedly connected to one side of the limiting frame 7. The outer surfaces of the two locking rods 24 are respectively inserted into the interior of the two buckle rings 15. A sliding frame 12 is slidably connected to the lower side of one side of the mounting frame 1. A second electric push rod 13 is fixedly connected to one side of the mounting frame 1. The output end of the second electric push rod 13 is fixedly connected to the upper end of the sliding frame 12. A spring 14 is fixedly connected to the lower end of the sliding frame 12. The lower end of the spring 14 is fixedly connected to the lower side of one side of the mounting frame 1. A conveying pump 10 is fixedly connected to the lower end of the storage cylinder 2. A conveying hose 9 is fixedly connected to the output end of the conveying pump 10. A glue injection mechanism 11 is fixedly connected to one end of the sliding frame 12. One end of the conveying hose 9 is fixedly connected to the upper end of the glue injection mechanism 11.

[0035] In this embodiment, when the filter plate 19 needs to be replaced, the second bevel gear 22 can be rotated by turning the knob 23, which in turn drives the first bevel gear 21 meshing with it to rotate. At this time, the lead screw 20 fixedly connected to it can rotate, thereby driving the locking rods 24 on both sides to move, so that the ends of the locking rods 24 are pulled out of the buckle ring 15. Then, the mounting plate 18 can be pulled outward to remove the filter plate 19 that is clipped inside. After replacing it with a new filter plate 19, the above operation is repeated in reverse to complete the replacement of the filter plate 19. This method can effectively improve the replacement efficiency of the filter plate 19, making it more convenient to disassemble and install the filter plate 19 in the future.

[0036] Working Principle: During operation, the sliding frame 12 can be pushed by the second electric push rod 13 to slide below the mounting frame 1, thereby driving the glue injection mechanism 11 to move up and down for smooth glue injection. As the sliding frame 12 moves, the spring 14 below it compresses and extends, making its movement more stable and smooth. After the glue is injected into the storage cylinder 2 through the feed pipe 5, the piston push plate 16 inside the storage cylinder 2 can be moved down by activating the first electric push rod 4. The piston push plate 16 pushes the glue in the storage cylinder 2 through the filter plate 19. After filtration by the filter plate 19, impurities in the glue are intercepted, and the remaining glue passes through the filter plate 19 to the bottom of the storage cylinder 2. At this point, the glue can be drawn into the glue injection mechanism 11 by the lower delivery pump 10 for glue injection. This method ensures that the storage of the glue in the device is stable during operation. Before being fed into the glue injection mechanism 11, the glue in cylinder 2 can be filtered by the filter plate 19 to remove impurities. This effectively reduces the likelihood of impurities clogging the glue injection nozzle of the glue injection mechanism 11, making the device more convenient and stable to use. When the filter plate 19 needs to be replaced, the knob 23 can be turned to rotate the second bevel gear 22, which in turn rotates the first bevel gear 21 that meshes with it. At this time, the screw 20 fixedly connected to it can rotate, thereby moving the locking rods 24 on both sides, so that the ends of the locking rods 24 can be pulled out of the buckle ring 15. Then, the mounting plate 18 can be pulled outward to remove the filter plate 19 that is clipped inside. After replacing it with a new filter plate 19, the above operation is repeated in reverse to complete the replacement of the filter plate 19. This method can effectively improve the replacement efficiency of the filter plate 19, making it more convenient to disassemble and install the filter plate 19 in the future.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A glue injection structure of a semiconductor package mold, comprising a mounting frame (1), characterized in that: A storage cylinder (2) is fixedly connected to one side of the mounting frame (1). A fixing frame (3) is fixedly connected to the upper end of the storage cylinder (2). A first electric push rod (4) is fixedly connected to one side of the fixing frame (3). A piston push plate (16) is slidably connected to the upper part of the storage cylinder (2). The output end of the first electric push rod (4) passes through the upper end of the storage cylinder (2) and is fixedly connected to the upper end of the piston push plate (16). A buckle frame (17) is fixedly connected to the middle part of the storage cylinder (2). An installation plate (18) is snapped into the inside of the buckle frame (17). A filter plate (19) is snapped into the inside of the installation plate (18). An inlet pipe (5) is fixedly connected to one side of the storage cylinder (2).

2. The glue injection structure of a semiconductor package mold according to claim 1, wherein: The storage cylinder (2) has an installation groove (6) on one side, and the outer surface of the mounting plate (18) is slidably connected to the inside of the installation groove (6).

3. The glue injection structure of a semiconductor package mold according to claim 2, wherein: A limit frame (7) is fixedly connected to one side of the mounting plate (18), and a buckle ring (15) is fixedly connected to both sides of one side of the storage cylinder (2).

4. The glue injection structure of a semiconductor package mold according to claim 3, wherein: The limiting frame (7) is slidably connected to two sides of the inside, and the limiting frame (7) is rotat ... rod (20).

5. The glue injection structure of a semiconductor package mold according to claim 4, wherein: The outer surfaces of the two lead screws (20) are respectively connected to the internal threads of the two locking rods (24). One end of each of the two lead screws (20) is fixedly connected to a first bevel gear (21), and a second bevel gear (22) is rotatably connected to the middle of the inside of the limiting frame (7).

6. The glue injection structure of a semiconductor package mold according to claim 5, wherein: The outer surfaces of the two first bevel gears (21) mesh with the outer surface of the second bevel gear (22), and a knob (23) is fixedly connected to one side of the second bevel gear (22) through the side of the limiting frame (7). The outer surfaces of the two locking rods (24) are respectively inserted into the interior of the two buckle rings (15).

7. The injection molding structure of a semiconductor packaging mold according to claim 1, characterized in that: A sliding frame (12) is slidably connected to the lower side of one side of the mounting frame (1). A second electric push rod (13) is fixedly connected to one side of the mounting frame (1). The output end of the second electric push rod (13) is fixedly connected to the upper end of the sliding frame (12). A spring (14) is fixedly connected to the lower end of the sliding frame (12). The lower end of the spring (14) is fixedly connected to the lower side of one side of the mounting frame (1).

8. The glue injection structure of a semiconductor package mold according to claim 7, wherein: The lower end of the storage cylinder (2) is fixedly connected to a conveying pump (10), the output end of the conveying pump (10) is fixedly connected to a conveying hose (9), one end of the sliding frame (12) is fixedly connected to an injection mechanism (11), and one end of the conveying hose (9) is fixedly connected to the upper end of the injection mechanism (11).

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