Glue vibrating device for glue filling treatment of electronic products

Abstract

The utility model discloses a glue vibrating device for glue filling treatment of electronic products, which relates to the technical field of glue filling treatment of electronic products and comprises a rack and a vibrating frame fixedly arranged at the top end of the rack, the vibrating frame is of a hollow structure, a bearing table is arranged in the vibrating frame, and the bearing table is arranged on the top end of the rack. A plurality of guide mechanisms and buffer mechanisms are arranged between the vibration frame and the bearing table, and a vibration motor is arranged at the bottom end of the vibration frame. The glue pouring device has the beneficial effects that vibration is generated through the vibration motor, glue is promoted to flow in an electronic product, the problem that glue is difficult to flow through the interior of the product is effectively solved, uniform glue pouring is achieved, and the glue pouring quality of the product is improved. Meanwhile, the acting force generated in the vibration process is utilized, bubbles in the glue gradually float upwards and are discharged under the vibration effect, the purpose of removing the bubbles is achieved, the bonding strength of the glue and the stability of a product are greatly improved, and the product quality problem caused by the bubbles is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electronic product potting technology, specifically to a vibrating adhesive device for electronic product potting. Background Technology

[0002] In the potting process of electronic products, common problems include the glue failing to completely flow throughout the product and the presence of air bubbles within the glue. Uneven glue distribution can lead to insufficient protection in certain areas of the product, affecting its stability and reliability; while air bubbles within the glue can form voids after curing, reducing the adhesive strength and potentially causing product performance failures.

[0003] Currently, traditional potting methods are insufficient to effectively address these issues, resulting in inconsistent product quality and impacting the overall quality and market competitiveness of electronic products.

[0004] Therefore, it is urgent to develop a vibratory glue dispensing device that can achieve uniform glue dispensing and effectively remove air bubbles. Utility Model Content

[0005] To address the problems in related technologies, the purpose of this utility model is to propose a vibrating glue device for electronic product potting, which is used for post-potting processing of electronic products to solve the problems of glue not flowing throughout the product and containing air bubbles, thereby achieving uniform potting, removing air bubbles, and improving product quality.

[0006] The technical solution of this utility model is implemented as follows:

[0007] A vibratory adhesive application device for electronic product potting includes: a frame and a vibratory frame fixedly mounted on the top of the frame, wherein the vibratory frame has a hollow structure, a support platform is provided inside the vibratory frame, and a plurality of guiding mechanisms and buffering mechanisms are provided between the vibratory frame and the support platform, and a vibratory motor is provided at the bottom of the vibratory frame.

[0008] Furthermore, the guiding mechanism includes a guide rod fixedly disposed within the vibration frame, the guide rod being movably sleeved with a guide sleeve, and the guide sleeve being fixedly connected to the bottom end of the vibration frame.

[0009] Furthermore, there are at least four sets of guiding mechanisms, and the four sets of guiding mechanisms are arranged in a ring at equal intervals within the vibration frame.

[0010] Furthermore, the buffer mechanism includes a limiting sleeve fixedly disposed within the vibration frame, a spring being snapped into the limiting sleeve, and the end of the spring being fixedly connected to the bottom end of the vibration frame.

[0011] Furthermore, the buffer mechanism comprises at least four sets, and the four sets of guide mechanisms are arranged equidistantly in a ring within the vibration frame.

[0012] Furthermore, a gap is left between the vibration frame and the support platform.

[0013] Furthermore, the support platform is provided with several assembly holes.

[0014] Furthermore, the frame is equipped with a loading plate.

[0015] Furthermore, the bottom of the frame is provided with several rollers.

[0016] The beneficial effects of this utility model are:

[0017] This invention, through the design of a guiding mechanism and a buffer mechanism, ensures the stability of the support platform during vibration, preventing damage to electronic products caused by vibration. It also improves the service life and reliability of the adhesive dispensing device. The vibration generated by the motor promotes the flow of adhesive inside the electronic product, effectively solving the problem of adhesive difficulty in spreading throughout the product, achieving uniform dispensing and improving the dispensing quality. Simultaneously, the force generated during vibration causes air bubbles in the adhesive to gradually rise and be expelled, achieving the purpose of removing air bubbles, greatly improving the adhesive strength and product stability, and reducing product quality problems caused by air bubbles.

[0018] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the adhesive-removing device for potting electronic products according to an embodiment of the present utility model;

[0022] Figure 2 This is a schematic diagram of the vibration motor of the vibrating glue device for potting electronic products according to an embodiment of the present utility model;

[0023] Figure 3This is a schematic diagram of the vibrating frame of the vibrating adhesive device for electronic product potting according to an embodiment of the present utility model.

[0024] In the picture:

[0025] 1. Frame; 2. Vibration frame; 3. Support platform; 4. Guide mechanism; 5. Buffer mechanism; 6. Vibration motor; 7. Assembly hole; 8. Loading plate; 9. Rollers;

[0026] 41. Guide rod; 42. Guide sleeve;

[0027] 51. Limiting sleeve; 52. Spring. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art are within the protection scope of the present utility model.

[0029] According to an embodiment of the present invention, a vibrating adhesive device for potting electronic products is provided.

[0030] like Figures 1-3 As shown, a vibrating adhesive device for potting electronic products includes: a frame 1 and a vibrating frame 2 fixedly mounted on the top of the frame 1. The vibrating frame 2 has a hollow structure, and a support platform 3 is provided inside the vibrating frame 2. Several guiding mechanisms 4 and buffering mechanisms 5 are provided between the vibrating frame 2 and the support platform 3. A vibrating motor 6 is provided at the bottom of the vibrating frame 2.

[0031] A gap is left between the vibration frame 2 and the support platform 3. The support platform 3 is provided with several assembly holes 7.

[0032] This technical solution, by leaving a gap, avoids direct contact and friction / collision between the vibration frame 2 and the support platform 3 during vibration. It also provides sufficient space for the support platform 3 to vibrate freely under the action of the guide mechanism 4 and the buffer mechanism 5. Simultaneously, the mounting hole 7 can be used to install positioning clamps or other auxiliary fixing devices, facilitating the secure fixing of electronic products of different shapes and sizes onto the support platform 3, thus improving the versatility and applicability of the vibrating adhesive device.

[0033] With the help of the above-mentioned scheme, the guide mechanism 4 can ensure that the support platform 3 moves smoothly along a specific direction during vibration, preventing the support platform 3 from shifting or shaking, and ensuring the stability of the electronic product during vibration; the buffer mechanism 5 can effectively reduce the impact of vibration on the support platform 3, avoiding damage to the electronic product due to excessive vibration. At the same time, the vibration motor 6, as the power source of the adhesive vibration device, generates high-frequency vibration to promote the flow of adhesive inside the electronic product and expel air bubbles.

[0034] In addition, the guiding mechanism 4 includes a guide rod 41 fixedly installed inside the vibration frame 2, and a guide sleeve 42 movably sleeved on the guide rod 41. The guide sleeve 42 is fixedly connected to the bottom end of the vibration frame 2. There are at least four sets of guiding mechanisms 4, and the four sets of guiding mechanisms 4 are arranged in a ring at equal intervals inside the vibration frame 2.

[0035] In this technical solution, the guide sleeve 42 slides along the guide rod 41, thereby precisely guiding the vibration direction of the support platform 3 and ensuring its stability and accuracy during vibration. Simultaneously, the annular equidistant layout guides the support platform 3 from multiple directions, making the force more evenly distributed during vibration and preventing tilting or swaying, thus better ensuring the placement stability of electronic products.

[0036] In addition, the buffer mechanism 5 includes a limiting sleeve 51 fixedly installed inside the vibration frame 2, and a spring 52 is snapped into the limiting sleeve 51. The end of the spring 52 is fixedly connected to the bottom end of the vibration frame 2. There are at least four sets of buffer mechanisms 5, and the four sets of guide mechanisms 4 are arranged in a ring at equal intervals inside the vibration frame 2.

[0037] In this technical solution, the limiting sleeve 51 can position and protect the spring 52, preventing it from shifting or twisting during compression and extension. The spring 52, utilizing its elasticity, absorbs and buffers vibration energy during vibration, reducing the impact of vibration on the electronic products on the support platform 3. Simultaneously, the layout of the buffer mechanism 5 and the guiding mechanism 4, with multiple sets of buffer mechanisms 5, can uniformly buffer vibration from different positions, ensuring that the support platform 3 remains stable during vibration and providing a stable support environment for the electronic products.

[0038] In addition, a loading plate 8 is provided inside the frame 1. Several rollers 9 are provided at the bottom of the frame 1.

[0039] Specifically, the support plate 8 can be used to place tools, spare glue, or other items related to glue application, allowing operators to easily access the necessary items while using the vibrating glue device, thus improving work efficiency. The rollers 9 facilitate the movement of the vibrating glue device, allowing operators to easily move it to a suitable position according to actual work needs, enhancing the equipment's flexibility.

[0040] Using the above technical solution, during use, the glued electronic product is first securely fixed to the support platform 3 using suitable clamps or fixing devices and the mounting holes 7 on the support platform 3. Then, the power supply to the vibration motor 6 is turned on, and the vibration motor 6 starts working, generating high-frequency vibration. The vibration of the vibration motor 6 is transmitted to the vibration frame 2, which drives the support platform 3 to vibrate together under the action of vibration. During the vibration, the guide sleeve 42 in the guide mechanism 4 slides along the guide rod 41, ensuring that the support platform 3 vibrates smoothly in a specific direction without deviation or shaking. At the same time, the spring 52 in the buffer mechanism 5, under the restriction of the limiting sleeve 51, buffers the vibration, reduces the impact of vibration on the support platform 3, and protects the electronic product from excessive vibration. As the vibration continues, the glue flows inside the electronic product, gradually spreading to all corners of the product, achieving uniform glue application; at the same time, air bubbles in the glue gradually rise and are expelled under the action of vibration, achieving the purpose of removing air bubbles. During operation, the operator can place tools, spare glue, and other items on the loading plate 8 inside the frame 1 for easy access. If it is necessary to move the vibrating adhesive device, the operator can push the frame 1 and use the rollers 9 at the bottom of the frame 1 to move the vibrating adhesive device to the desired position.

[0041] In summary, the above-mentioned technical solution of this utility model achieves the following effects: The design of the guiding mechanism and buffer mechanism ensures the stability of the support platform during vibration, preventing damage to electronic products caused by vibration. It also improves the service life and reliability of the adhesive dispensing device. The vibration generated by the vibrating motor promotes the flow of adhesive inside the electronic product, effectively solving the problem of adhesive difficulty in spreading throughout the product, achieving uniform dispensing, and improving the dispensing quality. Simultaneously, the force generated during vibration causes air bubbles in the adhesive to gradually rise and be expelled, achieving the purpose of removing air bubbles, greatly improving the adhesive strength and product stability, and reducing product quality problems caused by air bubbles.

[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A glue-shaking device for glue pouring treatment of electronic products, characterized in that, include: The frame (1) and the vibration frame (2) fixed at the top of the frame (1) are provided. The vibration frame (2) has a hollow structure. A support platform (3) is provided inside the vibration frame (2). Several guide mechanisms (4) and buffer mechanisms (5) are provided between the vibration frame (2) and the support platform (3). A vibration motor (6) is provided at the bottom of the vibration frame (2).

2. The glue shaking device for glue pouring processing of electronic products according to claim 1, characterized in that, The guiding mechanism (4) includes a guide rod (41) fixedly installed inside the vibration frame (2), and a guide sleeve (42) is movably sleeved on the guide rod (41). The guide sleeve (42) is fixedly connected to the bottom end of the vibration frame (2).

3. The glue shock device for glue pouring of an electronic product according to claim 2, characterized in that, The guide mechanism (4) consists of at least four sets, and the four sets of guide mechanisms (4) are arranged in a ring at equal intervals within the vibration frame (2).

4. The glue shaking device for glue pouring processing of electronic products according to claim 1, characterized in that, The buffer mechanism (5) includes a limiting sleeve (51) fixedly installed inside the vibration frame (2), and a spring (52) is snapped into the limiting sleeve (51). The end of the spring (52) is fixedly connected to the bottom end of the vibration frame (2).

5. The glue shaking device for glue pouring processing of electronic products according to claim 4, characterized in that, The buffer mechanism (5) consists of at least four sets, and the four sets of guide mechanisms (4) are arranged in a ring at equal intervals within the vibration frame (2).

6. The glue shaking device for glue pouring processing of electronic products according to claim 1, characterized in that, There is a gap between the vibration frame (2) and the support platform (3).

7. The glue shock device for glue pouring of an electronic product according to claim 6, characterized in that, The support platform (3) is provided with several assembly holes (7).

8. The glue shaking device for glue pouring processing of electronic products according to claim 1, characterized in that, The frame (1) is equipped with a loading plate (8).

9. The glue shock device for glue pouring of an electronic product according to claim 8, characterized in that, The bottom of the frame (1) is provided with several rollers (9).

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